MATERIAL DATA SHEET Material # CDBQR series (0402) (Halogen Free) Product Line SOD-923F Date 2012/3/26 Rev. H COMPONENT DETAILS No. 1 2 3 4 5 Construction element FR-4 Board Wafer Al wire Silver paste Molding Compound Material group Material weight (mg) Substrate/ Terminal Diode Conductor Welding Outer Total weight Comchip Technology CO., LTD. Material 0.001 0.005 0.511 Average mass (%) Copper 7440-50-8 43.00% Nickel 7440-02-0 3.677% Gold 7440-57-5 0.099% Continuous Filament Fiber Glass 65997-17-3 53.22% Silicon 7440-21-3 92.00% Aluminum 7429-90-5 1.30% Titanium 7440-32-6 0.20% Gold 7440-57-5 6.50% Aluminum 7429-90-5 99.00% Silicon 7440-21-3 1.00% Modified Epoxy Resin 29690-82-2 5~25% Silver 7440-22-4 76~85% Imidazole 827-43-0 1~4% 0.223 0.029 CAS if applicable Amide 461-58-5 1~4% Silica 60676-86-0 70~90% Epoxy Resin 29690-82-2 6~16% Phenolic Resin 9003-35-4 5~15% Carbon Black 1333-86-4 0.1~1% 0.769 www.comchiptech.com TE L: +886-2-86776675 FAX: +886-2-86776672 1/1 Sum(%) 29.0% 3.8% 0.1% 0.7% 66.4% Traces