ROHM RSB39F2

Data Sheet
Bi direction ESD Protection Diode
RSB39F2
Applications
ESD Protection
Dimensions (Unit : mm)
Land size figure (Unit : mm)
1.3
2.0±0.2
0.3±0.1
2.1±0.1
1.25±0.1
0.65
0.9MIN.
Features
1)Small mold type. (UMD3)
2)High reliability.
3)Bi-directionality.
0.15±0.05
(3)
1.6
各リードとも
Each
lead has same dimension
同寸法
0.8MIN.
(2)
0.1Min
0~0.1
(1)
(0.65)
(0.65)
1.3±0.1
Constructions
Silicon epitaxial planer
UMD3
0.7±0.1
0.9±0.1
Structure
ROHM : UMD3
JEDEC : SOT-323
JEITA : SC-70
dot(year week factory)
Taping dimensions (Unit : mm)
φ1.55±0.05
2.0±0.05
0.3±0.1
Absolute maximum ratings (Ta=25°C)
Parameter
Symbol
Power dissipation (*)
Pd
Junction temperature
Tj
Storage temperature
Tstg
(*) Total two elements
Electrical characteristics (Ta=25°C)
Parameter
Symbol
VZ
Zener voltage
Reverse current
Junction capacitance
φ0.5±0.05
4.0±0.1
Limits
200
150
2.4±0.1
8.0±0.2
0~0.1
2.4±0.1
2.25±0.1
0
5.5±0.2
3.5±0.05
1.75±0.1
4.0±0.1
1.25±0.1
Unit
mW
°C
°C
−55 to +150
Min.
Typ.
Max.
Unit
35.1
-
42.9
V
IZ=1mA
VR=30V
VR=0V , f=1MHz
IR
-
-
0.1
μA
Ct
-
-
30
pF
Conditions
* Zener voltage (Vz) shall be measured at 40ms after loading current. Rating of per diode.
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© 2011 ROHM Co., Ltd. All rights reserved.
1/4
2011.11 - Rev.A
Data Sheet
RSB39F2
10
10
apply voltage
ZENER CURRENT:Iz(mA)
ZENER CURRENT:Iz(mA)
apply voltage
Ta=150°C
1
Ta=75°C
0.1
Ta=125°C
Ta=25°C
1
Ta=150°C
Ta=75°C
Ta=125°C
0.1
Ta=25°C
Ta=−25°C
Ta=−25°C
0.01
0.01
25
30
35
40
45
25
30
ZENER VOLTAGE:Vz(V)
Vz-Iz CHARACTERISTICS(1)
35
40
45
ZENER VOLTAGE:Vz(V)
Vz-Iz CHARACTERISTICS(2)
10000
apply voltage
10000
apply voltage
Ta=150°C
1000
REVERSE CURRENT:IR (nA)
REVERSE CURRENT:IR (nA)
1000
Ta=150°C
100
10
Ta=125°C
1
100
Ta=125°C
10
Ta=75°C
1
Ta=75°C
0.1
0.1
Ta=25°C
Ta=25°C
0.01
0.01
0
5
10
15
20
25
REVERSE VOLTAGE:VR(V)
VR-IR CHARACTERISTICS(1)
30
0
100
10
15
20
REVERSE VOLTAGE:VR(V)
VR-IR CHARACTERISTICS(2)
25
30
100
f=1MHz
f=1MHz
apply voltage
CAPACITANCE BETWEEN
TERMINALS:Ct(pF)
apply voltage
CAPACITANCE BETWEEN
TERMINALS:Ct(pF)
5
10
1
10
1
0
5
10
15
20
25
0
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© 2011 ROHM Co., Ltd. All rights reserved.
1
2
3
4
REVERSE VOLTAGE:VR(V)
VR-Ct CHARACTERISTICS(2)
REVERSE VOLTAGE:VR(V)
VR-Ct CHARACTERISTICS(1)
2/4
2011.11 - Rev.A
Data Sheet
RSB39F2
40
10
Ta=25°C
IZ=1mA
n=30pcs
ZENER VOLTAGE:Vz(V)
38
8
37
36
35
34
AVE:37.55V
AVE:35.59V
33
apply voltage
32
Ta=25°C
VR=30V
n=30pcs
9
REVERSE CURRENT:IR(nA)
39
apply voltage
7
apply voltage
5
AVE:2.15nA
4
AVE:0.84nA
3
2
31
1
30
0
IR DISPERSION MAP
Vz DISPERSION MAP
100000
Ta=25°C
f=1MHz
VR=0V
n=20pcs
9
apply voltage
DYNAMIC IMPEDANCE:Zz(Ω)
CAPACITANCE BETWEEN TERMINALS:Ct(pF)
10
8
7
6
AVE:8.55pF
AVE:8.53pF
apply voltage
apply voltage
10000
1000
100
10
1
5
0.1
1
ZENER CURRENT(mA)
Zz-Iz CHARACTERISTICS(1)
Ct DISPERSION MAP
10
1000
100000
On glass-epoxy substrate
TRANSIENT
THERMAL IMPEDANCE:Rth(°C/W)
apply voltage
DYNAMIC IMPEDANCE:Zz(Ω)
apply voltage
6
10000
1000
100
10
1
ZENER CURRENT(mA)
Zz-Iz CHARACTERISTICS(2)
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© 2011 ROHM Co., Ltd. All rights reserved.
10
3/4
Rth(j-c)
10
1
0.001
1
0.1
100
Rth(j-a)
0.01
0.1
1
10
TIME(s)
Rth-t CHARACTERISTICS
100
1000
2011.11 - Rev.A
Data Sheet
RSB39F2
30
30
No break at 30kV
No break at 30kV
25
AVE:25.5kV
20
15
10
AVE:6.1kV
apply voltage
ELECTROSTATIC
DISCHARGE TEST ESD [kV]
ELECTROSTATIC
DISCHARGE TEST ESD [kV]
25
5
0
20
15
10
AVE:6.9kV
apply voltage
5
C=200pF
R=0Ω
C=150pF
R=330Ω
C=100pF
R=1.5kΩ
0
ESD DISPERSION MAP(1)
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© 2011 ROHM Co., Ltd. All rights reserved.
C=200pF
R=0Ω
C=150pF
R=330Ω
C=100pF
R=1.5kΩ
ESD DISPERSION MAP(2)
4/4
2011.11 - Rev.A
Notice
Notes
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© 2011 ROHM Co., Ltd. All rights reserved.
R1120A