MYXN25Q512A13G12 Serial NOR Flash Memory 512Mb, 3V, Multiple I/O, 4KB Sector Erase Preliminary information. Subject to change without notice. Features • Tin-lead ball metallurgy • Stacked device (two 256Mb die) • SPI-compatible serial bus interface • Double transfer rate (DTR) mode • 2.7–3.6V single supply voltage • 108 MHz (MAX) clock frequency supported for all protocols in single transfer rate (STR) mode • 54 MHz (MAX) clock frequency supported for all protocols in DTR mode • Dual/quad I/O instruction provides increased throughput up to 54 MB/s • Supported protocols Extended SPI, dual I/O, and quad I/O DTR mode supported on all • Execute-in-place (XIP) mode for all three protocols Configurable via volatile or nonvolatile registers Enables memory to work in XIP mode directly after power-on • PROGRAM/ERASE SUSPEND operations • Available protocols Available READ operations Quad or dual output fast read Quad or dual I/O fast read • Flexible to fit application Configurable number of dummy cycles Output buffer configurable • Erase capability Subsector erase 4KB uniform granularity blocks Sector erase 64KB uniform granularity blocks Single die erase • Write protection Software write protection applicable to every 64KB sector via volatile lock bit Hardware write protection: protected area size defined by five nonvolatile bits (BP0, BP1, BP2, BP3, and TB) Additional smart protections, available upon request • Electronic signature JEDEC-standard 2-byte signature (BA20h) Unique ID code (UID): 17 read-only bytes, including: Two additional extended device ID bytes to identify device factory options; and customized factory data (14 bytes) • Minimum 100,000 ERASE cycles per sector • More than 20 years data retention Options Code • Packages T-PBGA-24b05/6mm x 8mm (also known as TBGA25), with Sn63/Pb37 ball metallurgy 12 • Temperature Ranges Industrial (-40°C to 85°C) IT Automotive (-40°C to 125°C) AT Military (-55°C to +125°C) XT • Part Marking: Label (L) or Dot (D) • 3-byte and 4-byte addressability mode supported 64-byte, user-lockable, one-time programmable (OTP) dedicated area • Software reset • Additional reset pin for selected part numbers Micron Part. No. N25Q512A13G1240E (NOTE: For IT, XT) Micron Part. No. N25Q512A13G12A0F (NOTE: For AT) April 26, 2016 • Revision 1.9 Micross US (Americas) 407.298.7100 • Micross UK (EMEA & ROW) +44 (0) 1603 788967 • [email protected] • www.micross.com Form #: CSI-D-686 Document 002 512Mb, Multiple I/O Serial Flash Memory Signal MYXN25Q512A13G12 • 512Mb, 3V, Multiple I/O, 4KB Sector EraseAssignments Advanced information. Subject to change without notice. Figure 4: 24-Ball TBGA (Balls Down) Figure 1: 24-Ball TBGA Top View (12) 1 2 3 4 5 A NC NC RESET/NC NC NC C VSS VCC NC NC S# NC W#/VPP/DQ2 NC NC DQ1 NC NC B C D 512Mb, Multiple I/O Serial Flash Memory DQ0 HOLD#/DQ3 NC Package Dimensions E NC NC NC 512Mb, Multiple I/O Serial Flash Me Package Dimen Figure 49: T-PBGA-24b05/6mm x 8mm Figure 49: T-PBGA-24b05/6mm x 8mm 1. See Part Number Ordering Information for complete package names and details. Ball A4 is NC except for part numbers N25Q512A83G1240X for which it is used as a RESET pin. 0.79 TYP Note: Figure 2: Seating plane T-PBGA 6mm x 8mm A 0.79 TYP 0.1 A Seating plane A 0.1 A 24X Ø0.40 ±0.05 Ball A1 ID 5 4 3 2 Ball A1 ID 1 Ball A1 ID 24X Ø0.40 ±0.05 5 4 3 2 Ball A1 ID 1 A B C 4.00 8 ±0.10 B D 1.00 TYP 4.00 A C E 8 ±0.10 D 1.00 TYP E 1.00 TYP 1.20 MAX 4.00 6 ±0.10 Notes: 0.20 MIN 1.00 TYP Notes: 1. All dimensions are in millimeters. 2. Solder ball material: Sn63/Pb37 1.20 MAX 3. Micron N25Q512A13G12 0.20 MIN 4.00 1. All dimensions are in millimeters. 2. See Part Number Ordering Information for complete package names and details. 6 ±0.10 April 26, 2016 • Revision 1.9 PDF: 09005aef84752721 n25q_512mb_1ce_3V_65nm.pdf - Rev. P 7/13 EN Notes: 1. All dimensions are in millimeters. 2. See Part Number Ordering Information for complete package names and details. Micross US (Americas) • Inc. 407.298.7100 Micron Technology, reserves the right to change products [email protected] specifications without notice. 9 © 2011 Micron Technology, Inc. All rights reserved. Micross UK (EMEA & ROW) • +44 (0) 1603 788967 www.micross.com Form #: CSI-D-686 Document 002