Micross-RetailPlus-Flyer-MYX4DDR264M16HW 2016-03 Rev2-6

MYX4DDR264M16HW
1Gb - 64M x 16 DDR2 SDRAM
Advanced information. Subject to change without notice.
Features
• Tin-lead ball metalurgy
Options
• VDD = 1.8V ±0.1V, VDDQ = 1.8V ±0.1V
Code
• Configuration
• JEDEC-standard 1.8V I/O (SSTL_18-compatible)
ƒƒ 64M x 16 (8M x 16 x 8 banks)
• Differential data strobe (DQS, DQS#) option
• Package: FBGA (Sn63 Pb37)
• 4n-bit prefetch architecture
ƒƒ 84-ball FBGA (8mm x 12.5mm)
Die Rev :H
ƒƒ 84-ball FBGA (8mm x 12.5mm)
Die Rev :M
• Duplicate output strobe (RDQS) option for x8
• DLL to align DQ and DQS transitions with CK
• 8 internal banks for concurrent operation
• Programmable CAS latency (CL)
64M16
BG
HR
NF
• Timing - cycle time
• Posted CAS additive latency (AL)
ƒƒ 2.5ns @ CL = 5 (DDR2-800)
• WRITE latency = READ latency - 1 tCK
• Selectable burst lengths (BL): 4 or 8
-25E
• Self refresh
• Adjustable data-output drive strength
ƒƒ Standard
ƒƒ Low-power
• 64ms, 8192-cycle refresh
• On-die termination (ODT)
None
L
• Operating temperature
• Supports JEDEC clock jitter specification
ƒƒ Industrial (-40°C ≤ TC ≤ +95°C;
-40°C ≤ TA ≤ +85°C;)
ƒƒ Military (-55°C ≤ TC ≤ +125°C)
• 8D response time
IT
XT
• Part Marking: Label (L), Dot (D)
Table 1: Key Timing Parameters
Data Rate (MT/s)
Speed Grade
-25E
tRC
CL=3
CL=4
CL=5
CL=6
CL=7
400
533
800
800
n/a
(ns)
55
Micron Part No. MT47H64M16HR, Die Rev:H (NOTE: for IT Temp)
Micron Part No. MT47H64M16NF, Die Rev:M (NOTE: for XT Temp)
March 29, 2016 • Revision 2.6
Micross US (Americas) 407.298.7100 • Micross UK (EMEA & ROW) +44 (0) 1603 788967 • [email protected] • www.micross.com
Form #: CSI-D-686 Document 005
MYX4DDR264M16HW • 1Gb - 64M x 16 DDR2 SDRAM
Advanced information. Subject to change without notice.
1Gb: x4, x8, x16 DDR2 SDRAM
Ball Assignments and Descriptions
Figure 7: 84-Ball FBGA – x16 Ball Assignments
View)
Figure (Top
1: 84-Ball
FBGA - x16 Ball Assignments (Top View)
A
B
C
D
E
F
G
H
J
K
L
1
2
3
V DD
NC
DQ14
7
8
V SS
V SSQ
UDQS#/NU
V DDQ
V SSQ
UDM
UDQS
V SSQ
DQ15
V DDQ
DQ9
V DDQ
V DDQ
DQ8
V DDQ
DQ12
V SSQ
DQ11
DQ10
V SSQ
DQ13
V DD
NC
V SS
V SSQ
LDQS#/NU
V DDQ
DQ6
V SSQ
LDM
LDQS
V SSQ
DQ7
V DDQ
DQ1
V DDQ
V DDQ
DQ0
V DDQ
DQ4
V SSQ
DQ3
DQ2
V SSQ
DQ5
V DDL
V REF
V SS
V SSDL
CK
V DD
CKE
WE#
RAS#
CK#
ODT
BA0
BA1
CAS#
CS#
A10
A1
A2
A0
A3
A5
A6
A4
A7
A9
A11
A8
A12
RFU
RFU
RFU
BA2
4
5
6
9
M
N
P
V SS
R
V DD
V DD
V SS
March 29, 2016 • Revision 2.6
Micross US (Americas) • 407.298.7100
Micross UK (EMEA & ROW) • +44 (0) 1603 788967
[email protected]
www.micross.com
Form #: CSI-D-686 Document 005
Packaging
Package Dimensions
MYX4DDR264M16HW • 1Gb - 64M x 16 DDR2 SDRAM
Figure
8: 84-Ball
FBGA to
Package
x 12.5mm)
Advanced
information.
Subject
change(8mm
without
notice. – x16
0.155
Seating plane
A
1.8 CTR
0.12 A
Nonconductive
Figure 2: Package Dimensions 84-Ball FBGA Package (8mm
x 12.5mm) – x16; “HR” Die Rev:H
overmold
1Gb: x4,
x8,
x16 DDR2 SDRAM
84X
Ø0.45
Dimensions apply Packaging
to solder balls
post-reflow on
Ø0.35 SMD ball pads.
Packaging
9 8 7
3 2 1
Package Dimensions
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
Figure 8: 84-Ball FBGA Package (8mm x 12.5mm) – x16
12.5 ±0.1
0.155
11.2 CTR
Seating plane
A
1.8 CTR
Nonconductive
overmold
Ball A1 ID
Ball A1 ID
0.12 A
Packaging 0.8 TYP
1Gb: x8, x16 Automotive DDR2 SDRAM
Packaging
Package Dimensions
84X Ø0.45
Dimensions apply
to solder balls
post-reflow on
Ø0.35 SMD ball pads.
1.1 ±0.1
0.8 TYP
Ball A1 ID
9 8 7
Ball A1
ID
Figure 7: 84-Ball FBGA
Package
(8mm x 12.5mm) – x16; "NF" Die Rev :M
0.25 MIN
6.4 CTR
0.155
3 2 1
Exposed gold plated pad
1.0 MAX X 0.7 nominal.
8 ±0.1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
Notes:
Seating plane
1. All dimensions are in millimeters.
2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu) or leaded Eutectic (62% Sn,
36%Pb, 2% Ag).
A
0.12 A
1.8 CTR
Figure 3: Package Dimensions 84-Ball FBGA Package (8mm
x 12.5mm) – x16; “NF” Die Rev:M
12.5 ±0.1
11.2 CTR
Packaging 0.8 TYP
Nonconductive
overmold
84X Ø0.47
PDF: 09005aef821ae8bf
1Gb: x8, x16 Automotive
DDR2 SDRAM
1GbDDR2.pdf – Rev. X 10/11 EN
Dimensions apply
Packaging
to solder balls
19
post-reflow on
Ø0.42 SMD ball pads. 9 8 7
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
1.1 ±0.1
Figure 7: 84-Ball FBGA Package (8mm x 12.5mm) – x16; "NF" Die Rev :M
0.25 MIN
12.5 ±0.1
Exposed gold plated pad
8 ±0.1
1.0 MAX X 0.7 nominal.
11.2 CTR
Seating plane
1. All dimensions are in millimeters.
2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu) or leaded Eutectic (62% Sn,
36%Pb, 2% Ag).
A
0.12 A
1.8 CTR
0.8 TYP
Nonconductive
6.4 CTR
0.155
Notes:
overmold
84X Ø0.47
Dimensions apply
to solder balls
post-reflow on
Ø0.42 SMD ball pads. 9 8 7
19
DF: 09005aef821ae8bf
GbDDR2.pdf – Rev. X 10/11 EN
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2007 Micron Technology, Inc. All rights reserved.
6.4 CTR
3 2 1
11.2 CTR
March 29, 2016 • Revision 2.6
0.8 TYP
0.8 TYP
0.28 MIN
8 ±0.1
Notes: 1. All dimensions are in millimeters.
2. Solder ball material: Sn63/Pb37
12.5 ±0.1
1.1 ±0.1
0.8 TYP
Ball A1 ID
Ball A1 ID
(covered by SR)
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
Ball A1 ID
3 2 1
Package Dimensions
0.8 TYP
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2007 Micron Technology, Inc. All rights reserved.
Ball A1 ID
(covered by SR)
Notes:
PDF: 09005aef85a711f4
1gb_ddr2_ait-aat_u88b.pdf – Rev. B 10/14 EN
1. All dimensions are in millimeters.
2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu).
17
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2014 Micron Technology, Inc. All rights reserved.
Micross US (Americas) • 407.298.7100
Micross UK (EMEA & ROW) • +44 (0) 1603 788967
1.1 ±0.1
[email protected]
www.micross.com
Form #: CSI-D-686 Document 005