Retail+™ Product Line Reballed or Lead-Solder Exchanged and Screened MICROSS PART NUMBER DENSITY DESCRIPTION FLASH Memory MYXN25Q256A13ESFDG 256Mb Serial NOR Flash MYXN25Q512A13G12BG 512Mb Serial NOR Flash MYX25QL01GB8E12BG 1Gb Serial NOR Flash MYX28F256J3F95ABG 256Mb Parallel NOR Flash MYX28F00AP33EFABG 1Gb Parallel NOR Flash MYX29W640GB70ZABG 64Mb Parallel NOR Flash MYX28GU01GAAA2EGCBG 1Gb Parallel NOR Flash MYX28GU512AAA2EGCBG 512Mb Parallel NOR Flash MYX28GU256AAA2EGCBG 256Mb Parallel NOR Flash MYX29GL01GS11DPIV2BG 1Gb Parallel NOR Flash MYX28F00AM29EWHBG 1Gb Parallel NOR Flash MYXFC64GJDDNBG 64GB Parallel NAND Flash + Cnt'lr MYXFC32GJDDQBG 32GB Parallel NAND Flash + Cnt'lr Micross Components’ Retail+™ product line enables customers to use industry leading components that were not previously available for their hi-rel, long life applications. Micross purchases COTS components and enhances them for use in military, aerospace, transportation, industrial, and medical applications. Retail+™ products are converted from RoHS Pb-free solder metallurgies to tin-lead (SnPb 63/37) based metallurgies. Pb-free BGA packages are reballed and Pbfree leaded and non-leaded packages go through a solder dip exchange using our established processes that brings them up to standards for use in hi-rel applications. DDR Memory MYX4DDR264M16HWBG 1Gb DDR2 SDRAM MYX4DDR2128M16PKBG 2Gb DDR2 SDRAM MYX4DDR364M16JTBG 1Gb DDR3 SDRAM MYX4DDR3L128M16JTBG 2Gb DDR3L SDRAM MYX4DDR4256M16GEBG 4Gb DDR4 SDRAM FPGA MYXXC7Z035 ZYNQ-7000 AP SoCs Processors MYXE3845BG Baytrail SoC Power Management IC MYXPM6021BG Baytrail PMIC MYXPM9145QN Baytrail PMIC MYXLTM4644IY Quad DC-DC 4A Reg Module Miscellaneous MYXVSC3340(X and Y)JJ01 6.5Gbps 40x40 Async Crosspoint Switch MARCH 31, 2016 • Revision 2.0 Micross US (Americas) 407.298.7100 • Micross UK (EMEA & ROW) +44 (0) 1603 788967 • [email protected] • www.micross.com Form #: CSI-D-689 Document 001 Reballed & Screened Pb-free to SnPb Components Electrical Verification Micross performs the following electrical verification at 25°C on every device (100%): • ICC Static - Power is applied and all inputs pins/balls are configured in a known state. Overall current consumption is measured. • Leakage - Power is applied and all inputs are configured in a known state. Current consumption on each pin/ball is measured. • Continuity - This test is performed on each I/O pin/ball. VDD and VSS are all grounded. ~100uA of current is sinked and sourced across the protection diodes of every I/O pin/ball to test for opens and shorts. Figure 1 Ball Diameter & Ball Height Figure 2 True Position (Ball Offset) Product Validation Micross performs the following product validation on every device (100%): • Visual Inspection - per MIL-STD-883, Test Method 2009 • Automatic Optical Inspection (AOI) Ball Diameter & Ball Height - The ball width (WI) gives the diameter of the ball. It is calculated as the average of the horizontal and vertical ball diameters. See Figure 1. True Position (Ball Offset) - The X offset (XO) and the Y offset (YO) are measured. See Figure 2. Array (Ball) Pitch - The array pitch is the distance between the centers of neighboring balls. For each ball, the system reports the distance to the nearest ball in horizontal or vertical direction (or in diagonal direction for staggered grids). See Figure 3. Ball Coplanarity - Validate that all the balls lie in one plane. See Figure 4. Figure 3 Array (Ball) Pitch Figure 4 Ball Coplanarity Options Temperature Range Micross performs the following additional product validation tests on each product family: • XRF - Alloy verification • Ball Shear - Per JESD22-B117; evaluates quality of ball attachment • SonoScan - Package voiding • X-Ray - Solder voiding • Ionograph - Bulk ICE • MSL - J-STD-20 C, CT or blank = Commercial (0°C to +70°C) IT = Industrial (-40°C to +85°C) ET = Enhanced (-40°C to +105°C) AT = Automotive (-40°C to +125°C) XT & M = Extended & Military (-55°C to +125°C) Markings L = Label (default) D = Orange Dot Special ZZZ = Three-digit special flow requirement MFC = LMCO Missile Fire & Command MARCH 31, 2016 • Revision 2.0 Micross US (Americas) • 407.298.7100 Micross UK (EMEA & ROW) • +44 (0) 1603 788967 [email protected] www.micross.com Form #: CSI-D-689 Document 001