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MYXFC64GJDDN
MMC Controller and 64GB NAND Flash
Advanced information. Subject to change without notice.
Features
• Tin-lead ball metallurgy
• MultiMediaCard (MMC) controller and 64GB
NAND Flash
• VCC: 2.7–3.6V
• VCCQ (dual voltage): 1.65–1.95V; 2.7–3.6V
• Typical current consumption
ƒƒ Standby current: 160μA
ƒƒ Active current (RMS): 80mA
MMC - Specific Features
• JEDEC/MMC standard version 4.41-compliant (JEDEC
Standard No. 84-A441) - SPI mode not supported
(see www.jedec.org/sites/default/files/docs/JESD84-A441.pdf)
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Advanced 11-signal interface
x1, x4, and x8 I/Os, selectable by host
MMC mode operation
Command classes: class 0 (basic); class 2 (block read);
class 4 (block write); class 5 (erase); class 6 (write
protection); class 7 (lock card)
MMCplus™ and MMCmobile™ protocols
Temporary write protection
52 MHz clock speed (MAX)
Boot operation (high-speed boot)
Sleep mode
Replay-protected memory block (RPMB)
Secure erase and trim
Hardware reset signal
Multiple partitions with enhanced attribute
Permanent and power-on write protection
Double data rate (DDR) function
High-priority interrupt (HPI)
Enhanced reliable write
Configurable reliability settings
Background operation
Fully enhanced configurable
Table 1: MLC Partition Performance
Condition
MYXFC64GJDDN
Units
Sequential write
20
MB/s
Sequential read
44
MB/s
Rando write
90
IOPs
Random read
1100
IOPs
Note: Bus in x8 I/O mode. Sequential access of 1MB chunk; random
access of 4KB chunk. Additional performance data, such as power
consumption or timing for different device modes, will be provided in a
separate document upon customer request.
OptionsCode
• Package (Sn63 Pb37 solder)
ƒƒ 169-ball LFBGA
(14mm x 18mm x 1.4mm)
BG
• Operating Temperature
ƒƒ Industrial (-40°C ≤ TC ≤ +85°C)
IT
ƒƒ Backward-compatible with previous MMC modes
• ECC and block management implemented
Micron Part. No. MTFC64GJDDN-4M
October 21, 2014 • Revision 1.1
Micross US (Americas) 407.298.7100 • Micross UK (EMEA & ROW) +44 (0) 1603 788967 • [email protected] • www.micross.com
Form #: CSI-D-686 Document 004
MYXFC64GJDDN • MMC controller and 64GB NAND Flash
Advanced information. Subject to change without notice.
Figure 1: 169-Ball FBGA
(Top View, Ball Down)
Figure 2: 169-B all LFBGA
14.0mm x 18.00mm x 1.4mm
(Package Code: DN)
Notes: 1. All dimensions are in millimeters.
2. Solder ball material: Sn63/Pb37
3. Micron – MTFC64GJDDN-4M
October 21, 2014 • Revision 1.1
Micross US (Americas) • 407.298.7100
Micross UK (EMEA & ROW) • +44 (0) 1603 788967
[email protected]
www.micross.com
Form #: CSI-D-686 Document 004