MYXFC64GJDDN MMC Controller and 64GB NAND Flash Advanced information. Subject to change without notice. Features • Tin-lead ball metallurgy • MultiMediaCard (MMC) controller and 64GB NAND Flash • VCC: 2.7–3.6V • VCCQ (dual voltage): 1.65–1.95V; 2.7–3.6V • Typical current consumption Standby current: 160μA Active current (RMS): 80mA MMC - Specific Features • JEDEC/MMC standard version 4.41-compliant (JEDEC Standard No. 84-A441) - SPI mode not supported (see www.jedec.org/sites/default/files/docs/JESD84-A441.pdf) Advanced 11-signal interface x1, x4, and x8 I/Os, selectable by host MMC mode operation Command classes: class 0 (basic); class 2 (block read); class 4 (block write); class 5 (erase); class 6 (write protection); class 7 (lock card) MMCplus™ and MMCmobile™ protocols Temporary write protection 52 MHz clock speed (MAX) Boot operation (high-speed boot) Sleep mode Replay-protected memory block (RPMB) Secure erase and trim Hardware reset signal Multiple partitions with enhanced attribute Permanent and power-on write protection Double data rate (DDR) function High-priority interrupt (HPI) Enhanced reliable write Configurable reliability settings Background operation Fully enhanced configurable Table 1: MLC Partition Performance Condition MYXFC64GJDDN Units Sequential write 20 MB/s Sequential read 44 MB/s Rando write 90 IOPs Random read 1100 IOPs Note: Bus in x8 I/O mode. Sequential access of 1MB chunk; random access of 4KB chunk. Additional performance data, such as power consumption or timing for different device modes, will be provided in a separate document upon customer request. OptionsCode • Package (Sn63 Pb37 solder) 169-ball LFBGA (14mm x 18mm x 1.4mm) BG • Operating Temperature Industrial (-40°C ≤ TC ≤ +85°C) IT Backward-compatible with previous MMC modes • ECC and block management implemented Micron Part. No. MTFC64GJDDN-4M October 21, 2014 • Revision 1.1 Micross US (Americas) 407.298.7100 • Micross UK (EMEA & ROW) +44 (0) 1603 788967 • [email protected] • www.micross.com Form #: CSI-D-686 Document 004 MYXFC64GJDDN • MMC controller and 64GB NAND Flash Advanced information. Subject to change without notice. Figure 1: 169-Ball FBGA (Top View, Ball Down) Figure 2: 169-B all LFBGA 14.0mm x 18.00mm x 1.4mm (Package Code: DN) Notes: 1. All dimensions are in millimeters. 2. Solder ball material: Sn63/Pb37 3. Micron – MTFC64GJDDN-4M October 21, 2014 • Revision 1.1 Micross US (Americas) • 407.298.7100 Micross UK (EMEA & ROW) • +44 (0) 1603 788967 [email protected] www.micross.com Form #: CSI-D-686 Document 004