256Mb MYX28F256J3F95A Parallel NOR StrataFlash Embedded Memory Advanced information. Subject to change without notice. Features Block erase/program lockout during power transition • Tin Lead solder alloy Sn63Pb37 Password Access feature • Power One-Time Programmable Register: Core voltage: 2.7V to 3.6V I/O voltage: 2.7V to 3.6V 64 OTP bits, programmed with unique information by Numonyx Standby current: 65μA (TYP) 64 OTP bits, available for customer programming Erase & Program Current: 35 mA (TYP) Page Read: 12 mA (TYP) • Architecture Multi-Level Cell Technology: Highest Density at Lowest Cost • Software 20 μs (Typ) program suspend 20 μs (Typ) erase suspend Numonyx™ Flash Data Integrator (FDI) Common Flash Interface (CFI) Compatible 256 symmetrically-sized blocks of 128 Kbytes • Performance 95 ns initial access time for Easy BGA 105 ns initial accsss time for TSOP 25 ns 16-word Asynchronous page-mode reads 512-Word Buffer Programming at 1.46MByte/s (TYP) • Quality and Reliability 100K Minimum erase cycles per block 65 nm Numonyx™ ETOX™ X Process technology OptionsCode • Package (Sn63 Pb37 solder) BG 64-ball Easy BGA (10mm x 13mm) PC • Operating Temperature Enhanced (-40°C ≤ Ta ≤ +85°C) IT • Part Marking Label (L), Dot (D) • Security Enhanced security options for code protection Absolute protection with VPEN = GND Individual block locking August 13, 2015 • Revision 1.0 Micron Part No. 256Mb MYX28F256J3F95A Micross US (Americas) 407.298.7100 • Micross UK (EMEA & ROW) +44 (0) 1603 788967 • [email protected] • www.micross.com Form #: CSI-D-686 Document 018 3.0 Ballout MYX28F256J3F95A • Parallel NOR StrataFlash Embedded Memory Advanced information. Subject to change without notice. J3-65nm is available in two package types. All densities of the J3-65nm devices are supported on both 64-ball Easy BGA and 56-lead Thin Small Outline Package (TSOP) packages. The figures below show the ballouts. 3.1 Easy BGA Ballout Figure 1: Easy BGA Ballout Figure 4: Easy BGA Ballout 1 2 3 4 5 6 7 8 8 7 5 6 4 2 3 1 A A A1 A6 A8 VPEN A13 VCC A18 A22 A22 A18 VCC A13 A6 A8 VPEN A1 B B A2 VSS A9 CE0 A14 RFU A19 CE1 CE1 A19 RFU A14 A9 CE0 VSS A2 C C A3 A7 A10 A4 A5 A11 A12 A15 RFU A20 A21 A21 A17 A17 A20 RFU A15 A12 A10 A7 A3 RFU RP# A11 A5 A4 D D RP# RFU RFU A16 A16 RFU E E DQ8 DQ1 DQ9 DQ3 DQ4 RFU DQ15 STS STS DQ15 RFU DQ4 DQ3 DQ9 DQ1 DQ8 F F BYTE# DQ0 DQ10 DQ11 DQ12 RFU RFU OE# OE# RFU RFU DQ12 DQ11 DQ10 DQ0 BYTE# G G A23 A0 DQ2 VCCQ DQ5 DQ6 DQ14 WE# WE# DQ14 DQ6 DQ5 VCCQ DQ2 A0 A23 CE2 RFU VCC VSS DQ13 VSS DQ7 A24 A24 DQ7 VSS DQ13 VSS VCC RFU CE2 H H Easy BGA Top View – Ball Side Down Easy BGA Bottom View – Ball Side Up August 13, 2015 • Revision 1.0 Micross US (Americas) • 407.298.7100 Micross UK (EMEA & ROW) • +44 (0) 1603 788967 [email protected] www.micross.com Form #: CSI-D-686 Document 018 MYX28F256J3F95A • Parallel NOR StrataFlash Embedded Memory 2.2 Advanced information. Subject to change without notice. Easy BGA Package, 256-Mbit 3: Easy BGA Mechanical Specifications Figure 2:Figure Easy BGA Mechanical Specifications Ball A1 Corner Ball A1 Corner D 1 2 3 4 S1 5 6 7 8 8 A A B B C C D 7 6 5 4 3 2 1 S2 D E E E F F G G H H e b Bottom View - Ball Side Up Top View - Plastic Backside Complete Ink Mark Not Shown A1 A2 A Y Seating Plane 3: Package Easy BGA Package Dimensions Table Table 1: Table Easy BGA Dimensions Table Millimeters Parameter Parameter Symbol Symbol Package Height (256 Mbit) MinA Ball Height Package Height (256 Mbit) A A1 Ball Height Package Body Thickness (256 Mbit) A1 A2 0.250 Ball (Lead) Width Millimeters Min Nom Nom Inches Max Max 1.200 1.200 0.250 0.780 b 0.330 0.430 D 9.900 Min Nom Min Inches Max Nom 0.0472 Max 0.0472 0.0098 0.00980.0307 0.530 0.0130 0.0169 10.000 10.100 0.3898 0.3937 0.430 13.000 12.900 0.530 13.100 0.01300.5118 0.5079 0.0169 0.5157 0.0209 A2 Ball (Lead) Width Package Body Length b 0.330 E Pitch Package Body Width D e 9.900 10.000 1.000 10.100 0.38980.0394 0.3937 0.3976 Ball (Lead) Count Package Body Length E N 12.900 13.000 64 13.100 0.5079 64 0.5118 0.5157 Package Body Width Pitch Seating Plane Coplanarity e Corner to Ball A1 Distance Along D (256 Mb) Ball (Lead) Corner Count to Ball A1 Distance Along E (256N Mb) Y 0.780 0.0209 Package Body Thickness (256 Mbit) 1.000 0.100 0.0307 0.3976 0.0039 S1 1.400 1.500 1.600 0.0551 0.0591 S2 64 3.000 2.900 3.100 0.1142 0.1181 0.0394 0.0630 64 0.1220 Seating Plane Coplanarity Y 0.100 0.0039 Corner to Ball A1 Distance Along D (256 Mb) S1 1.400 1.500 1.600 0.0551 0.0591 0.0630 Corner to Ball A1 Distance Along E (256 Mb) S2 2.900 3.000 3.100 0.1142 0.1181 0.1220 December 2008 319942-02 Datasheet 11 August 13, 2015 • Revision 1.0 Micross US (Americas) • 407.298.7100 Micross UK (EMEA & ROW) • +44 (0) 1603 788967 [email protected] www.micross.com Form #: CSI-D-686 Document 018