ds XQE Torch

CLD-DS110 Rev 1D
Product family data sheet
Cree® XLamp® XQ-E Torch LEDs
Product Description
FEATURES
Table of Contents
The XLamp® XQ-E Torch LED provides
• Available in cool white
Characteristics.........................................2
lumen output 20% brighter than the
• Binned at 25 °C
Flux Characteristics.................................2
XLamp XP-C LED but in a package that
• 1050 mA maximum drive current
Relative Spectral Power Distribution......3
is 78% smaller. Together with a higher
• Low thermal resistance: 12.5 °C/W
Relative Flux vs. Junction Temperature.. 3
maximum current rating than XQ‑E and
• Viewing angle: 100°
Electrical Characteristics.........................4
simplified binning, the XLamp XQ‑E
• Reflow solderable - JEDEC
Relative Flux vs. Current..........................4
J-STD‑020C compatible
Typical Spatial Distribution......................5
Torch LED is fully optimized for a wide
range of mainstream portable lighting
applications.
• Unlimited floor life at
Thermal Design........................................5
≤ 30 °C/85% RH
Bin and Order Code Formats...................6
• RoHS‑compliant
Performance Groups - Chromaticity.......6
Cree ANSI White Bin Plotted on the
1931 CIE Color Space..............................7
Reflow Soldering Characteristics............8
Notes........................................................9
Mechanical Dimensions........................10
Tape and Reel.........................................11
www.cree.com/Xlamp
Packaging...............................................12
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are
registered trademarks and the Cree logo is a trademark of Cree, Inc.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
1
XLamp ® XQ-E Torch LED
Characteristics
Characteristics
Unit
Thermal resistance, junction to solder point
°C/W
12.5
degrees
100
mV/°C
-4
Viewing angle (FWHM)
Temperature coefficient of voltage
ESD withstand voltage (HBM per Mil-Std-883D)
Minimum
Typical
Maximum
V
8000
mA
1050
Reverse voltage
V
5
Forward voltage (@ 700 mA, 25 °C)
V
LED junction temperature
°C
DC forward current
3.45
3.9
150
Flux Characteristics (TJ = 25 °C)
The following table provides the order code for XLamp XQ-E Torch LEDs.
CCT Range
Luminous Flux (lm) @ 700 mA
Color
Cool White
Calculated
Minimum
Luminous Flux
(lm)*
Min.
Max.
Group
Min. Flux
(lm)
Typ. Flux
(lm)
1000 mA
6000 K
10,500 K
S7
190
216
239
Order Code
XQEATT-00-0000-000000A80
Notes:
• Cree maintains a tolerance of ±7% on flux and power measurements, ±0.005 on chromaticity (CCx, CCy) measurements and ±2 on
CRI measurements. See the Measurements section (page 9).
• Typical CRI for Cool White (6000 K – 10,500 K CCT) is 65.
* Calculated flux value at 1000 mA is for reference only.
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc.
2
XLamp ® XQ-E Torch LED
Relative Spectral Power
Relative Spectral Power Distribution
140%
Relative Radiant Power
120%
100%
80%
Cool White
60%
40%
20%
0%
380
430
480
530
580
630
680
730
780
Wavelength (nm)
Relative Flux Output vs. Junction Temperature
Relative Flux vs. Junction Temperature (IF = 700 mA)
100%
Relative Luminous Flux
80%
60%
40%
20%
0%
25
50
75
100
125
150
Junction Temperature (ºC)
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc.
3
XLamp ® XQ-E Torch LED
Electrical Characteristics (Tj = 85ºC)
Electrical Characteristics (TJ = 25 °C)
1200
Forward Current (mA)
1000
800
600
400
200
0
3.0
3.1
3.2
3.3
3.4
3.5
3.6
800
1000
1200
Forward Voltage (V)
Relative Intensity vs. Current
Relative Flux vs. Current (TJ = 25 °C)
140%
Relative Luminous Flux
120%
100%
80%
60%
40%
20%
0%
0
200
400
600
Forward Current (mA)
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc.
4
XLamp ® XQ-E Torch LED
Typical Spatial Radiation Pattern
Typical Spatial Distribution
100%
Relative Luminous Intensity
80%
60%
40%
20%
-90
-70
-50
-30
-10
0%
10
30
50
70
90
Angle (º)
Thermal Design
The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is crucial for the end
product to be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to optimize lamp life
Thermal Design
and optical characteristics.
1200
Maximum Current (mA)
1000
800
600
400
Rj-a = 15°C/W
Rj-a = 20°C/W
200
Rj-a = 25°C/W
Rj-a = 30°C/W
0
0
20
40
60
80
Ambient Temperature (ºC)
100
120
140
160
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc.
5
XLamp ® XQ-E Torch LED
Bin and Order Code Formats
Bin codes and order codes are configured as follows.
Order CodeBin Code
Series
XQE = XQ-E
Series
XQE = XQ-E
Configuration
B = Internal code
D = Reel size
Internal code
Color specification
0 = No minimum CRI
Color specification
0 = No minimum CRI
Luminous flux group
SSSCCC-B-WWW-FFF-VR-AAAA
Internal code
Chromaticity kit
SSSCCC-BD-HHHH-NNNNVRFGG
Voltage performance group
Flux
Chromaticity bin
T10 = Default
Voltage specification
Color
ATT = Torch
Internal code
Color
ATT = Torch
Performance Groups - Chromaticity (Tj = 25 °C)
XLamp XQ-E Torch LEDs are tested for chromaticity and placed into the bin defined by the following bounding coordinates.
Bin
T1
x
y
0.302
0.33
0.318
0.33
0.295
0.28
0.282
0.28
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc.
6
XLamp ® XQ-E Torch LED
Cree ANSI White Bin Plotted on the 1931 CIE Color Space (Tj = 25 °C)
0.40
0.39
4500 K
5000 K
0.38
5700 K
0.37
6350 K
0.36
7000 K
CCy
0.35
0.34
8300 K
0.33
0.32
10000 K
0.31
0.30
0.29
0.28
0.37
0.36
0.35
0.34
0.33
0.32
0.31
0.30
0.29
0.28
0.27
0.26
0.27
CCx
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc.
7
XLamp ® XQ-E Torch LED
Reflow Soldering Characteristics
In testing, Cree has found XLamp XQ-E Torch LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a
general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of the solder
paste used.
Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment.
tP
TP
Critical Zone
TL to TP
Temperature
Ramp-up
TL
tS
Tsmax
Tsmin
Ramp-down
ts
Preheat
25
t 25˚C to Peak
IPC/JEDEC J-STD-020C
Time
Profile Feature
Average Ramp-Up Rate (Tsmax to Tp)
Lead-Free Solder
1.2 °C/second
Preheat: Temperature Min (Tsmin)
120 °C
Preheat: Temperature Max (Tsmax)
170 °C
Preheat: Time (tsmin to tsmax)
Time Maintained Above: Temperature (TL)
Time Maintained Above: Time (tL)
Peak/Classification Temperature (Tp)
65-150 seconds
217 °C
45-90 seconds
235 - 245 °C
Time Within 5 °C of Actual Peak Temperature (tp)
20-40 seconds
Ramp-Down Rate
1 - 6 °C/second
Time 25 °C to Peak Temperature
4 minutes max.
Note: All temperatures refer to topside of the package, measured on the package body surface.
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc.
8
XLamp ® XQ-E Torch LED
Notes
Measurements
The luminous flux, radiant power, chromaticity and CRI measurements in this document are binning specifications only and solely
represent product measurements as of the date of shipment. These measurements will change over time based on a number of factors
that are not within Cree’s control and are not intended or provided as operational specifications for the products. Calculated values are
provided for informational purposes only and are not intended as specifications.
Pre‑Release Qualification Testing
Please read the LED Reliability Overview for details of the qualification process Cree applies to ensure long-term reliability for XLamp
LEDs and details of Cree’s pre-release qualification testing for XLamp LEDs.
Moisture Sensitivity
Cree recommends keeping XLamp LEDs in the provided, resealable moisture-barrier packaging (MBP) until immediately prior to soldering.
Unopened MBPs that contain XLamp LEDs do not need special storage for moisture sensitivity.
Once the MBP is opened, XLamp XQ-E Torch LEDs may be stored as MSL 1 per JEDEC J-STD-033, meaning they have unlimited floor life
in conditions of ≤ 30 ºC/85% relative humidity (RH). Regardless of the storage condition, Cree recommends sealing any unsoldered LEDs
in the original MBP.
RoHS Compliance
The levels of RoHS restricted materials in this product are below the maximum concentration values (also referred to as the threshold
limits) permitted for such substances, or are used in an exempted application, in accordance with EU Directive 2011/65/EC (RoHS2), as
implemented January 2, 2013. RoHS Declarations for this product can be obtained from your Cree representative or from the Product
Documentation sections of www.cree.com.
Vision Advisory
WARNING: Do not look at exposed lamp in operation. Eye injury can result. For more information about LEDs and eye safety, please refer
to the LED Eye Safety application note.
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc.
9
XLamp ® XQ-E Torch LED
6
5
5
6
5
E NOTICE
NOTICE
FIDENTIAL.
THIS
PLOT
AND
THE
INFORMATION
L.
THIS
PLOT
AND
THE
INFORMATION
E CONFIDENTIAL. THIS PLOT AND THE INFORMATION
D
WITHIN
ARE THE
PROPRIETARY
AND AND
ARE
THEWITHIN
PROPRIETARY
TAINED
ARE
THEAND
PROPRIETARY
TIAL
INFORMATION
OF CREE,
INC.
RMATION
OF
CREE, INC.
THIS
PLOTTHIS
FIDENTIAL
INFORMATION
OF CREE,
INC.PLOT
THIS PLOT
BE
COPIED,
REPRODUCED
ORDimensions
DISCLOSED
TO ANY
D,
REPRODUCED
OR
DISCLOSED
TO
Mechanical
NOT
BE COPIED,
REPRODUCED
ORANY
DISCLOSED
TO ANY
RIZED
PERSON
THE
WITHOUT
WRITTEN
CONSENT
SON
THE
WITHOUT
WRITTEN
CONSENT
UTHORIZED PERSON
THE
WITHOUT
WRITTEN CONSENT
NC.
REE INC.
4
4
3
3
4
2
3
REV
A
REV
A
2
1
2
REVISONS REVISONS
REVISONS
BY
BY DATE APP
DESCRIPTION
DESCRIPTION
REV
DESCRIPTION
DDS
DDS 7/19/13
Initial Release
Initial
Release
A
Initial Release
All dimensions in mm.
Measurement tolerances unless indicated otherwise: ±.13
mm
1.60
1.60
1.60
1.60
1.60
1.60
.375
.375
.063
.063
.063
.063
1.500
.65
.65
.30
1.60
.30
1.500
3.300
1.60
1.60
1.60
3.300
1.500
.30
3.300
1.60
1.60
1.60
RECOMMENDED
PC BOARD
PAD Recommended
NDED
PC RECOMMENDED
BOARD SOLDER
PAD
PC SOLDER
BOARD SOLDER
PAD
.300
PAD
SOLDER PADSOLDERSOLDER
PAD
REFERENCE REFERENCE
REFERENCE
3.300
1.60
SOLDER PADSOLDER PAD
REFERENCEREFERENCE
3.300
1.60
PCB solder pad
DATE
DRAWN BY
DATE
DRAWN BY
DATE
DRAWN BY
UNLESSUNLESS
OTHERWISE
SPECIFIED
UNLESS OTHERWISE
SPECIFIED
OTHERWISE
SPECIFIED
4600 Silicon4
D.
Seibel
7/19/13
D. Seibel
7/19/13
Seibel 7/19/13
ARE IN
DIMENSIONSDIMENSIONS
ARE INDIMENSIONS
ARE
IN D.DATE
Durham, N.CD
CHECK
CHECK
DATE
MILLIMETERS
AND
AFTER
FINISH.
MILLIMETERS
AND
AFTER
FINISH.
CHECK
MILLIMETERS AND AFTER FINISH. DATE
Phone (919)P
3.300
3.300
UNLESS
SPECIFIED:
--- -- SPECIFIED:
TOLERANCETOLERANCE
UNLESSTOLERANCE
SPECIFIED:
-- --UNLESS
Fax (919) 31F
± .25
.XX ± .25 .XX APPROVED
DATE DATE
APPROVED
RECOMMENDED
TRACE LAYOUT
RECOMMENDED
TRACE
LAYOUT
.XX ± DATE
.25
APPROVED
RECOMMENDED
TRACE LAYOUT
TITLE
TITLE
.XXX± .125 .XXX±J. .125
TITLE
.XXX
±
.125
J.
Nevins
7/19/13
Nevins
7/19/13
J.
Nevins
7/19/13
X° ± .5°
X
°
±
.5°
X° layout
± .5°
THIRD
ANGLE
PROJECTION
THIRD ANGLE
PROJECTION
Recommended
trace
XQE OUTLINE
XQE OUTLINE
THIRD
ANGLE
PROJECTION
MATERIAL
MATERIAL
XQE OU
MATERIAL
FOR SHEET
METAL
PARTS
ONLY
FOR
SHEET
METAL
PARTS
ONLY
RECOMMENDED
TRACE
LAYOUT
FOR
SHEET
METAL
PARTS
ONLY
RECOMMENDED
TRACE
LAYOUT
.X ± 1.5 .X ± 1.5
.X
±
1.5
RE
DRAWING
NO
DRAWING
NO.
SIZE
SIZE
--DRAWI
SIZE
-.XX ± .75 .XX ± .75
.XX ± .75
± .25
.XXX± .25 .XXX
FINAL PROTECTIVE
FINISH
FINAL
PROTECTIVE
FINISH
2610-00035
.XXX
± .25
FINAL
FINISH
261
C
C PROTECTIVE
A
C 2610-0003
X° ± .5° X° ± .5°
X° ± .5°
SCALE
SCALE
SHEET
OF 1S
SCALE
1.6 --FINISH:
1.6
1.6
-- 45.000
45.000
SURFACE
FINISH:
/
SURFACE FINISH:
-45.000
SURFACE
3.300
3.300
3.300
RECOMMENDED
PC BOARD SOLDER
PADSOLDER PAD
RECOMMENDED
PC BOARD
.
6
6
5
5
.300
1.58 ±.08
1.500
.300
.300
.65
.30
.300
Bottom View
1.500
.300
.65
.30
1.58 ±.08
Side View
Top View
1.500
.300
.05 ± .05
1.635 ± .05 1.635 ± 1.635
.65
.600
1.50
1.500
.300
.600
NOTCH NOTCH
IS ON IS
NOTCH IS ON
SIDE
CATHODE(-) CATHODE(-)
SIDE CATHODE
1.60
1.60
1.500
.600
.600 .600
.600
R.936
R.936
.375
R .936 R .936
R .936
1.60
.375
.063
.063
.375
1.60
5
4
4
4
3
3
3
2
2
1
2
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc.
10
ODUCED OR DISCLOSED TO ANY
ITHOUT
WRITTEN CONSENT
XLamp ® XQ-E Torch LED
D
Tape and Reel
All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard.
Except as noted, all dimensions in mm.
Measurement tolerances unless indicated otherwise: .xx = .25 mm, .xxx = .125 mm
1.500
+.10
4.0 ±.1
-.00
4.000
1.5 ±.1
CATHODE SIDE
1.75 ±.10
8.0 ±.1
A
12.0
C
2.5 ±.1
1.750
1.70
Cathode Side
8.000
NOMINAL
8.30
MAX
+.3
.0
1.85
1.000
2.000
ANODE SIDE
A
3.50 ±.10
.30 ± .10
Anode Side
(denoted by + and circle)
B
User Feed Direction
END
START
Loaded Pockets
(2,000 Lamps)
Trailer
160 mm (min) of
empty pockets
sealed with tape
(20 pockets min.)
mulative tolerance±
0.2mm
5
4
REFERENCE VENDOR PART NUMBER 021142
Leader
DATE
DRAWN400
BY
mm (min) of
UNLESS OTHERWISE SPECIFIED
4600 Silicon Drive
5/31/12
DIMENSIONS ARE IND. CRONIN
Durham, N.C 27703
empty
pockets with
CHECK
MILLIMETERS AND AFTER FINISH. DATE
Phone (919) 313-5300
TOLERANCE UNLESS SPECIFIED:at least 100 mm
Fax (919) 313-5558
.XX ± .25
DATE
APPROVED
A
TITLE
.XXX± .125
sealed
by
tape
X° ± .5°
THIRD ANGLE PROJECTION
Carrier Tape, 1.7X1.7 XPQ
MATERIAL
FOR SHEET METAL PARTS
ONLY
(50 empty pockets min.)
.X ± 1.5
REV.
DRAWING NO.
SIZE
.XX ± .75
.XXX± .25
FINAL PROTECTIVE FINISH
2402-00023
C
A
X° ± .5°
SCALE
SHEET
OF 1/1
1.6
User
Feed
Direction
SURFACE
FINISH:
4.000
3
2
1
Cover Tape
Pocket Tape
13mm
7"
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc.
11
XLamp ® XQ-E Torch LED
Packaging
The diagrams below show the packaging and labels Cree uses to ship XLamp XQ-E Torch LEDs. XLamp XQ-E Torch LEDs are shipped in
tape loaded on a reel. Each box contains only one reel in a moisture barrier bag.
Unpackaged Reel
Vacuum-Sealed
Vacuum-Sealed
Moisture
Barrier Bag
Moisture Barrier Bag
Label
CREE
Binwith
Code Cree Bin
&
Barcode
LabelLot #
Code,
Qty,
Label with Cree Bin Code,
Quantity, Reel ID
Label
with
Cree Bin
Label with
Customer
P/N, Qty,Qty,
Lot #, Lot
PO # #
Code,
Packaged Reel
Patent Label
Label with Customer Order
Label
with Cree Order Code,
Code, Qty, Reel ID, PO #
Quantity, Reel ID, PO #
Label with Cree Bin Code,
Quantity, Reel ID
Boxed Reel
Label with Cree Order Code,
Quantity, Reel ID, PO #
Label with Cree Bin Code,
Quantity, Reel ID
Patent Label
(on bottom of box)
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc.
12