Cree® XLamp® XH-B LED PRODUCT DESCRIPTION Unlike common plastic packages, XLamp XH LEDs use a ceramic package ® FEATURES Table of Contents • Package size: 3.0 X 3.0 mm Characteristics........................................ 2 • Available in white, 70-minimum CRI Flux Characteristics................................ 3 to deliver the unique combination of high cool white, 80-minimum CRI white Relative Spectral Power Distribution..... 4 performance and reliability not available and 85- and 90-minimum CRI warm Relative Flux vs. Junction elsewhere white Temperature............................................ 4 in mid‑power LEDs. The ceramic‑based XH LEDs are designed to • 175 mA maximum drive current Electrical Characteristics........................ 5 deliver the long L70 lifetimes of Cree’s • Viewing angle: 130° Relative Flux vs. Current......................... 5 other high‑power LEDs, such as XP or • Reflow solderable - JEDEC Typical Spatial Distribution..................... 6 XT LEDs, as well as industry‑leading LED J‑STD‑020C compatible Thermal Design....................................... 6 efficacy levels. • Unlimited floor life at Optimized for fluorescent replacement • RoHS and REACh compliant Mechanical Dimensions......................... 9 lighting applications, such as troffers • UL recognized component Tape and Reel........................................10 ≤ 30 °C/85% RH and panel lights, where high efficacy, ® (E349212) Reflow Soldering Characteristics........... 7 Notes....................................................... 8 Packaging..............................................11 long lifetime and smooth appearance are critical, the XH LEDs allow lighting manufacturers to offer products that meet the lifetime expectations of LED www.cree.com/Xlamp technology. Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 1 CLD-DS70 Rev 3E Product family data sheet XLamp ® XH-B LED Characteristics Characteristics Unit Thermal resistance, junction to solder point °C/W 45 degrees 130 mV/°C -2 Viewing angle (FWHM) Temperature coefficient of voltage ESD withstand voltage (HBM per Mil-Std-883D) Minimum Typical Maximum V 8000 mA 175 Reverse voltage V -5 Forward voltage (@ 65 mA, 25 °C) V LED junction temperature °C DC forward current 3.1 3.6 150 Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 2 XLamp ® XH-B LED Flux Characteristics (TJ = 25 °C) The following table provides several base order codes for XLamp XH-B LEDs. It is important to note that the base order codes listed here are a subset of the total available order codes for the product family. For more order codes, as well as a complete description of the ordercode nomenclature, please consult the XLamp XH LED Family Binning and Labeling document. Color CCT Range Minimum Luminous Flux @ 65 mA Calculated Minimum Luminous Flux (lm)* Order Code Minimum Maximum Group Flux (lm) 125 mA Cool White 5000 K 8300 K J3 26.8 46.0 XHBAWT-00-0000-00000LX51 Neutral White 3700 K 5000 K J2 23.5 40.4 XHBAWT-00-0000-00000LWE5 Warm White 2600 K 3700 K J2 23.5 40.4 XHBAWT-00-0000-00000LWE7 5000 K 8300 K J3 26.8 46.0 XHBAWT-00-0000-00000BX51 3700 K 5000 K J2 23.5 40.4 XHBAWT-00-0000-00000BWE5 2600 K 3700 K J2 23.5 40.4 XHBAWT-00-0000-00000BWE7 5000 K 8300 K J3 26.8 46.0 XHBAWT-00-0000-00000HX51 3700 K 5000 K J2 23.5 40.4 XHBAWT-00-0000-00000HWE5 2600 K 3700 K J2 23.5 40.4 XHBAWT-00-0000-00000HWE7 85-CRI White 2600 K 3200 K H0 18.1 31.1 XHBAWT-00-0000-00000PVE7 90-CRI White 2600 K 3200 K H0 18.1 31.1 XHBAWT-00-0000-00000UVE7 70-CRI White 80-CRI White Notes: • Cree maintains a tolerance of ±7% on flux and power measurements, ±0.005 on chromaticity (CCx, CCy) measurements and ±2 on CRI measurements. See the Measurements section (page 8). • Typical CRI for Neutral White, 3700 K - 5000 K CCT is 75. • Typical CRI for Warm White, 2600 K - 3700 K CCT is 80. • Minimum CRI for 70-CRI Minimum Cool White is 70. • Minimum CRI for 80-CRI Minimum White is 80. • Minimum CRI for 85-CRI Minimum White is 85. • Minimum CRI for 90-CRI Minimum White is 90. * Calculated flux values at 125 mA are for reference only. Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 3 XLamp ® XH-B LED Relative Spectral Power Relative Spectral Power Distribution Relative Radiant Power (%) 100 80 60 Cool White Warm White 40 20 0 380 430 480 530 580 630 680 730 780 Wavelength (nm) Relative Flux Output vs. Junction Temperature Relative Flux vs. Junction Temperature (IF = 65 mA) 100 90 Relative Luminous Flux (%) 80 70 60 50 40 30 20 10 0 25 50 75 100 125 150 Junction Temperature (ºC) Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 4 XLamp ® XH-B LED Electrical Characteristics (Tj = 25°C) Electrical Characteristics (TJ = 25 °C) 175 Forward Current (mA) 150 125 100 75 50 25 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 Forward Voltage (V) Relative Intensity vs. Current (Tj = 25°C) Relative Flux vs. Current (TJ = 25 °C) 225 Relative Luminous Flux (%) 200 175 150 125 100 75 50 25 0 25 50 75 100 125 150 175 Forward Current (mA) Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 5 XLamp ® XH-B LED Typical Spatial Radiation Pattern smoothed curve using trendline Typical Spatial Distribution 100 Relative Luminous Intensity (%) 90 80 70 60 50 40 30 20 10 -90 -70 -50 -30 -10 0 10 30 50 70 90 Angle (º) Thermal Design Thermal Design The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is crucial for the end product to be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to optimize lamp life and optical characteristics. 200 Maximum Current (mA) 175 150 125 100 75 Rj-a = 50 °C/W 50 Rj-a = 60 °C/W Rj-a = 70 °C/W 25 Rj-a = 80 °C/W 0 0 20 40 60 80 100 120 140 160 Ambient Temperature (ºC) Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 6 XLamp ® XH-B LED Reflow Soldering Characteristics In testing, Cree has found XLamp XH-B LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of the solder paste used. Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment. tP TP Critical Zone TL to TP Temperature Ramp-up TL tS Tsmax Tsmin Ramp-down ts Preheat 25 t 25˚C to Peak IPC/JEDEC J-STD-020C Time Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Lead-Free Solder 1.2 °C/second Preheat: Temperature Min (Tsmin) 120 °C Preheat: Temperature Max (Tsmax) 170 °C Preheat: Time (tsmin to tsmax) Time Maintained Above: Temperature (TL) Time Maintained Above: Time (tL) Peak/Classification Temperature (Tp) 65-150 seconds 217 °C 45-90 seconds 235 - 245 °C Time Within 5 °C of Actual Peak Temperature (tp) 20-40 seconds Ramp-Down Rate 1 - 6 °C/second Time 25 °C to Peak Temperature 4 minutes max. Note: All temperatures refer to topside of the package, measured on the package body surface. Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 7 XLamp ® XH-B LED Notes Measurements The luminous flux, radiant power, chromaticity and CRI measurements in this document are binning specifications only and solely represent product measurements as of the date of shipment. These measurements will change over time based on a number of factors that are not within Cree’s control and are not intended or provided as operational specifications for the products. Calculated values are provided for informational purposes only and are not intended as specifications. Pre‑Release Qualification Testing Please read the LED Reliability Overview for details of the qualification process Cree applies to ensure long-term reliability for XLamp LEDs and details of Cree’s pre-release qualification testing for XLamp LEDs. Lumen Maintenance Cree now uses standardized IES LM-80-08 and TM-21-11 methods for collecting long-term data and extrapolating LED lumen maintenance. For information on the specific LM-80 data sets available for this LED, refer to the public LM-80 results document. Please read the Long-Term Lumen Maintenance application note for more details on Cree’s lumen maintenance testing and forecasting. Please read the Thermal Management application note for details on how thermal design, ambient temperature, and drive current affect the LED junction temperature. Moisture Sensitivity Cree recommends keeping XLamp LEDs in the provided, resealable moisture-barrier packaging (MBP) until immediately prior to soldering. Unopened MBPs that contain XLamp LEDs do not need special storage for moisture sensitivity. Once the MBP is opened, XLamp XH-B LEDs may be stored as MSL 1 per JEDEC J-STD-033, meaning they have unlimited floor life in conditions of ≤ 30 ºC/85% relative humidity (RH). Regardless of storage condition, Cree recommends sealing any unsoldered LEDs in the original MBP. RoHS Compliance The levels of RoHS restricted materials in this product are below the maximum concentration values (also referred to as the threshold limits) permitted for such substances, or are used in an exempted application, in accordance with EU Directive 2011/65/EC (RoHS2), as implemented January 2, 2013. RoHS Declarations for this product can be obtained from your Cree representative or from the Product Documentation sections of www.cree.com. REACh Compliance REACh substances of very high concern (SVHCs) information is available for this product. Since the European Chemical Agency (ECHA) has published notice of their intent to frequently revise the SVHC listing for the foreseeable future, please contact a Cree representative to insure you get the most up-to-date REACh SVHC Declaration. REACh banned substance information (REACh Article 67) is also available upon request. Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 8 XLamp ® XH-B LED notes - continued UL® Recognized Component Level 4 enclosure consideration. The LED package or a portion thereof has been investigated as a fire and electrical enclosure per ANSI/ UL 8750. Vision Advisory 5 3 6 Eye5injury4can result. For 5 more4information WARNING:6 Do not look at exposed lamp in operation. 6 NOTICE NOTICE CREE CONFIDENTIAL. THIS PLOT ANDNOTICE THE INFORMATION CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION to the LED EyeARE Safety application note. CREE THIS PLOT AND THE INFORMATION CONTAINED WITHIN THE CONFIDENTIAL. PROPRIETARY AND CONTAINED WITHIN ARE AND CONTAINED WITHIN THE PROPRIETARY ANDTHE PROPRIETARY CONFIDENTIAL INFORMATION OF CREE, INC. ARE THIS PLOT CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT CONFIDENTIAL OF CREE, INC. THIS PLOT MAY NOT BE COPIED, REPRODUCED OR INFORMATION DISCLOSED TO ANY MAY NOT BE COPIED, REPRODUCED DISCLOSED TO ANY MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY ORCONSENT UNAUTHORIZED PERSON THE WITHOUT WRITTEN CONSENT UNAUTHORIZED PERSON THE WITHOUT WRITTEN OF CREE INC. UNAUTHORIZED PERSON THE WITHOUT WRITTEN OF CREE INC. CONSENT OF CREE INC. D Mechanical Dimensions D 2 4 about LEDs and 3 eye safety, please3refer 2 REV B C D 1 REVISONS BY DA DESCRIPTION REV DESCR DC 4/8 ADDED SOLDER PAD AND STENCIL B ADDED SOLDER DC 11/ CHANGED SOLDERPAD/REORIENTED VIEWS C CHANGED SOLDERP CHANGED STENCIL/UPDATED FORMATDC 8/3 D CHANGED STENC D All dimensions are ±.13 mm unless otherwise indicated. .6 ±.2 mm 3.00 3.00 .6 ±.2 mm 3.00 1.60 3.00 C C C 3.00 1.60 1.60 .50 .7 ±.2 mm Top View .50 B 1.70 .80 .50 B 1.70 .80 Side View .50 1.70 1.35 .50 .70 .80 3.00 .333.002.70 .33 2.70 .70 .10 .7 ±.2 mm .10 2.80 1.35 .70 1.20 2.70 ALL DIMENSIONS ARE ± .13mm UNLESS OTHERWISE NOTED ALLUNLE DIME ALL DIMENSIONS ARE ± .13mm .30 .30 DATE DRAWN BY 1.34 1.34 UNLESS OTHERWISE SPECIFIED UNLESS OTH DATE DRAWN BY 1.34 4600 12/20/12 UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IND. CRONIN A DIMENSIO Durh 12/20/12 A CHECK DATE ARE IND. CRONIN MILLIMETERS AND AFTER FINISH.DIMENSIONS MILLIMETERS Phon CHECK DATE MILLIMETERS AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: TOLERANCE Fax ( TOLERANCE .XX ± .25 DATE UNLESS SPECIFIED: APPROVED .XX ± .XX ± TITLE .25 .XXX± .125 DATE APPROVED .XXX±T .XXX± .125 X° ± .5° X ° ± THIRD ANGLE PROJECTION XH-G Mechanical Outline X ° ± .5° MATERIAL .25 .25 FOR SHEET PARTS ONLY THIRD ANGLE PROJECTION FOR SHEET M THIRDMETAL ANGLE PROJECTION MATERIAL .25 FOR SHEET METAL PARTS ONLY (RECOMMENDED STENCIL PAD) ± 1.5PAD) (RECOMMENDED.XSTENCIL .X ± DRAWING NO. SIZE (RECOMMENDED STENCIL PAD) .X ± 1.5 .XX ± .75 .XX ±S (HATCHED AREA IS OPENING) IS OPENING) .XX ± FINISH .75 ± .25 FINAL PROTECTIVE 2610-00033 .XXX± F (HATCHED AREA IS OPENING)(HATCHED AREA.XXX C .XXX± .25 X° ± .5° FINAL PROTECTIVE X° ± RECOMMENDED PC BOARD SOLDER PAD RECOMMENDED PC BOARD SOLDER PAD X° ± SCALE .5°28.000 SHE 1.6 SURFACE FINISH: RECOMMENDED PC BOARD SOLDER PAD SURFACE FI S 1.6 SURFACE FINISH: 6 5 4 3 2 1 6 5 4 3 Recommended PC Board Solder Pad Recommended Metal Stencil 6 5 4 3 Mask 2 .30 A 2.80 .50 1.20 .33 .70 Bottom View .50 1.35 .50 .70 .7 ±.2 mm 2.80 1.20 3.00 NOTCH CATHO SIDE .10 3.00 .70 B NOTCH IS ON CATHODE (-) SIDE .10 .6 ±.2 mm (Hatched Area is Open) Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 9 XLamp ® XH-B LED Tape and Reel All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard. All dimensions are ±.13 mm unless otherwise indicated. 1.5±.1 CATHODE SIDE 4.0±.1 8.0±.1 1.75±.10 2.5±.1 Cathode Side 4.0 ±.1 8.0 ±.1 1.75 ±.10 +.3 12.0 .0 1.5 ±.1 2.5 ±.1 Cathode Side ANODE SIDE 12.0 +.3 .0 Anode Side (denoted by + and circle) Anode SideUser Feed Direction (denoted by + and circle) END START User Feed Direction END 4 START 3 2 1 Loaded Pockets (1,000 Lamps) Trailer 160mm (min) of Trailer empty pockets sealed with tape 160 mm (min) of (20 pockets min.) empty pockets Loaded Pockets (2,000 Lamps) D sealed with tape (20 pockets min.) 16.40 Leader 400mm (min) of Leader empty pockets with 400 mm (min) of at least 100mm empty sealed by tapepockets with at least 100 mm (50 empty pockets min.) sealed by tape (50 empty pockets min.) User Feed Direction User Feed Direction C Cover Tape Cover Tape Pocket TapePocket Tape 62 +0.20 12.40 0 MEASURED AT HUB B 13mm 7" 7" 13mm +3.20 12.40 0 MEASURED AT INSIDE EDGE Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. DRAWN BY UNLESS OTHERWISE SPECIFIED R.CHALOUPECKY DIMENSIONS ARE IN MILLIMETERS & BEFORE FINISH. CHECK TOLERANCE UNLESS SPECIFIED: APPROVED .X ± 0.3 .XX ± .13 THIRD ANGLE PROJECTION X° ± 1° MATERIAL DATE 6/25/08 4600 Silicon Drive Durham, N.C 27703 DATE Phone (919) 361-4770 A DATE TITLE Reel, 7" x 12mm Wide 10 XLamp ® XH-B LED Packaging The diagrams below show the packaging and labels Cree uses to ship XLamp XH-B LEDs. XLamp XH-B LEDs are shipped in tape loaded on a reel. Each box contains only one reel in a moisture barrier bag. Unpackaged Reel Vacuum-Sealed Vacuum-Sealed Moisture Barrier Bag Moisture Barrier Bag Label CREE Binwith Code Cree Bin & Barcode LabelLot # Code, Qty, Label with Cree Bin Code, Quantity, Reel ID Label with Cree Bin Label with Customer P/N, Qty,Qty, Lot #, Lot PO # # Code, Packaged Reel Patent Label Label with Customer Order Label with Cree Order Code, Code, Qty, Reel ID, PO # Quantity, Reel ID, PO # Label with Cree Bin Code, Quantity, Reel ID Boxed Reel Label with Cree Order Code, Quantity, Reel ID, PO # Label with Cree Bin Code, Quantity, Reel ID Patent Label (on bottom of box) Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 11