ds XHB

Cree® XLamp® XH-B LED
PRODUCT DESCRIPTION
Unlike
common
plastic
packages,
XLamp XH LEDs use a ceramic package
®
FEATURES
Table of Contents
• Package size: 3.0 X 3.0 mm
Characteristics........................................ 2
• Available in white, 70-minimum CRI
Flux Characteristics................................ 3
to deliver the unique combination of high
cool white, 80-minimum CRI white
Relative Spectral Power Distribution..... 4
performance and reliability not available
and 85- and 90-minimum CRI warm
Relative Flux vs. Junction
elsewhere
white
Temperature............................................ 4
in
mid‑power
LEDs.
The
ceramic‑based XH LEDs are designed to
• 175 mA maximum drive current
Electrical Characteristics........................ 5
deliver the long L70 lifetimes of Cree’s
• Viewing angle: 130°
Relative Flux vs. Current......................... 5
other high‑power LEDs, such as XP or
• Reflow solderable - JEDEC
Typical Spatial Distribution..................... 6
XT LEDs, as well as industry‑leading LED
J‑STD‑020C compatible
Thermal Design....................................... 6
efficacy levels.
• Unlimited floor life at
Optimized for fluorescent replacement
• RoHS and REACh compliant
Mechanical Dimensions......................... 9
lighting applications, such as troffers
• UL recognized component
Tape and Reel........................................10
≤ 30 °C/85% RH
and panel lights, where high efficacy,
®
(E349212)
Reflow Soldering Characteristics........... 7
Notes....................................................... 8
Packaging..............................................11
long lifetime and smooth appearance
are critical, the XH LEDs allow lighting
manufacturers to offer products that
meet the lifetime expectations of LED
www.cree.com/Xlamp
technology.
Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are
registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
1
CLD-DS70 Rev 3E
Product family data sheet
XLamp ® XH-B LED
Characteristics
Characteristics
Unit
Thermal resistance, junction to solder point
°C/W
45
degrees
130
mV/°C
-2
Viewing angle (FWHM)
Temperature coefficient of voltage
ESD withstand voltage (HBM per Mil-Std-883D)
Minimum
Typical
Maximum
V
8000
mA
175
Reverse voltage
V
-5
Forward voltage (@ 65 mA, 25 °C)
V
LED junction temperature
°C
DC forward current
3.1
3.6
150
Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
2
XLamp ® XH-B LED
Flux Characteristics (TJ = 25 °C)
The following table provides several base order codes for XLamp XH-B LEDs. It is important to note that the base order codes listed here
are a subset of the total available order codes for the product family. For more order codes, as well as a complete description of the ordercode nomenclature, please consult the XLamp XH LED Family Binning and Labeling document.
Color
CCT Range
Minimum Luminous Flux
@ 65 mA
Calculated
Minimum
Luminous Flux
(lm)*
Order Code
Minimum
Maximum
Group
Flux (lm)
125 mA
Cool White
5000 K
8300 K
J3
26.8
46.0
XHBAWT-00-0000-00000LX51
Neutral White
3700 K
5000 K
J2
23.5
40.4
XHBAWT-00-0000-00000LWE5
Warm White
2600 K
3700 K
J2
23.5
40.4
XHBAWT-00-0000-00000LWE7
5000 K
8300 K
J3
26.8
46.0
XHBAWT-00-0000-00000BX51
3700 K
5000 K
J2
23.5
40.4
XHBAWT-00-0000-00000BWE5
2600 K
3700 K
J2
23.5
40.4
XHBAWT-00-0000-00000BWE7
5000 K
8300 K
J3
26.8
46.0
XHBAWT-00-0000-00000HX51
3700 K
5000 K
J2
23.5
40.4
XHBAWT-00-0000-00000HWE5
2600 K
3700 K
J2
23.5
40.4
XHBAWT-00-0000-00000HWE7
85-CRI White
2600 K
3200 K
H0
18.1
31.1
XHBAWT-00-0000-00000PVE7
90-CRI White
2600 K
3200 K
H0
18.1
31.1
XHBAWT-00-0000-00000UVE7
70-CRI White
80-CRI White
Notes:
• Cree maintains a tolerance of ±7% on flux and power measurements, ±0.005 on chromaticity (CCx, CCy) measurements and ±2 on CRI
measurements. See the Measurements section (page 8).
• Typical CRI for Neutral White, 3700 K - 5000 K CCT is 75.
• Typical CRI for Warm White, 2600 K - 3700 K CCT is 80.
• Minimum CRI for 70-CRI Minimum Cool White is 70.
• Minimum CRI for 80-CRI Minimum White is 80.
• Minimum CRI for 85-CRI Minimum White is 85.
• Minimum CRI for 90-CRI Minimum White is 90.
* Calculated flux values at 125 mA are for reference only.
Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
3
XLamp ® XH-B LED
Relative Spectral Power
Relative Spectral Power Distribution
Relative Radiant Power (%)
100
80
60
Cool White
Warm White
40
20
0
380
430
480
530
580
630
680
730
780
Wavelength (nm)
Relative Flux Output vs. Junction Temperature
Relative Flux vs. Junction Temperature (IF = 65 mA)
100
90
Relative Luminous Flux (%)
80
70
60
50
40
30
20
10
0
25
50
75
100
125
150
Junction Temperature (ºC)
Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
4
XLamp ® XH-B LED
Electrical Characteristics (Tj = 25°C)
Electrical Characteristics (TJ = 25 °C)
175
Forward Current (mA)
150
125
100
75
50
25
2.8
2.9
3.0
3.1
3.2
3.3
3.4
3.5
3.6
Forward Voltage (V)
Relative Intensity vs. Current (Tj = 25°C)
Relative Flux vs. Current (TJ = 25 °C)
225
Relative Luminous Flux (%)
200
175
150
125
100
75
50
25
0
25
50
75
100
125
150
175
Forward Current (mA)
Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
5
XLamp ® XH-B LED
Typical Spatial Radiation Pattern
smoothed curve using trendline
Typical Spatial Distribution
100
Relative Luminous Intensity (%)
90
80
70
60
50
40
30
20
10
-90
-70
-50
-30
-10
0
10
30
50
70
90
Angle (º)
Thermal Design
Thermal Design
The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is crucial for the end
product to be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to optimize lamp life
and optical characteristics.
200
Maximum Current (mA)
175
150
125
100
75
Rj-a = 50 °C/W
50
Rj-a = 60 °C/W
Rj-a = 70 °C/W
25
Rj-a = 80 °C/W
0
0
20
40
60
80
100
120
140
160
Ambient Temperature (ºC)
Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
6
XLamp ® XH-B LED
Reflow Soldering Characteristics
In testing, Cree has found XLamp XH-B LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general
guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of the solder paste used.
Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment.
tP
TP
Critical Zone
TL to TP
Temperature
Ramp-up
TL
tS
Tsmax
Tsmin
Ramp-down
ts
Preheat
25
t 25˚C to Peak
IPC/JEDEC J-STD-020C
Time
Profile Feature
Average Ramp-Up Rate (Tsmax to Tp)
Lead-Free Solder
1.2 °C/second
Preheat: Temperature Min (Tsmin)
120 °C
Preheat: Temperature Max (Tsmax)
170 °C
Preheat: Time (tsmin to tsmax)
Time Maintained Above: Temperature (TL)
Time Maintained Above: Time (tL)
Peak/Classification Temperature (Tp)
65-150 seconds
217 °C
45-90 seconds
235 - 245 °C
Time Within 5 °C of Actual Peak Temperature (tp)
20-40 seconds
Ramp-Down Rate
1 - 6 °C/second
Time 25 °C to Peak Temperature
4 minutes max.
Note: All temperatures refer to topside of the package, measured on the package body surface.
Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
7
XLamp ® XH-B LED
Notes
Measurements
The luminous flux, radiant power, chromaticity and CRI measurements in this document are binning specifications only and solely
represent product measurements as of the date of shipment. These measurements will change over time based on a number of factors
that are not within Cree’s control and are not intended or provided as operational specifications for the products. Calculated values are
provided for informational purposes only and are not intended as specifications.
Pre‑Release Qualification Testing
Please read the LED Reliability Overview for details of the qualification process Cree applies to ensure long-term reliability for XLamp
LEDs and details of Cree’s pre-release qualification testing for XLamp LEDs.
Lumen Maintenance
Cree now uses standardized IES LM-80-08 and TM-21-11 methods for collecting long-term data and extrapolating LED lumen maintenance.
For information on the specific LM-80 data sets available for this LED, refer to the public LM-80 results document.
Please read the Long-Term Lumen Maintenance application note for more details on Cree’s lumen maintenance testing and forecasting.
Please read the Thermal Management application note for details on how thermal design, ambient temperature, and drive current affect
the LED junction temperature.
Moisture Sensitivity
Cree recommends keeping XLamp LEDs in the provided, resealable moisture-barrier packaging (MBP) until immediately prior to soldering.
Unopened MBPs that contain XLamp LEDs do not need special storage for moisture sensitivity.
Once the MBP is opened, XLamp XH-B LEDs may be stored as MSL 1 per JEDEC J-STD-033, meaning they have unlimited floor life in
conditions of ≤ 30 ºC/85% relative humidity (RH). Regardless of storage condition, Cree recommends sealing any unsoldered LEDs in the
original MBP.
RoHS Compliance
The levels of RoHS restricted materials in this product are below the maximum concentration values (also referred to as the threshold
limits) permitted for such substances, or are used in an exempted application, in accordance with EU Directive 2011/65/EC (RoHS2), as
implemented January 2, 2013. RoHS Declarations for this product can be obtained from your Cree representative or from the Product
Documentation sections of www.cree.com.
REACh Compliance
REACh substances of very high concern (SVHCs) information is available for this product. Since the European Chemical Agency (ECHA)
has published notice of their intent to frequently revise the SVHC listing for the foreseeable future, please contact a Cree representative to
insure you get the most up-to-date REACh SVHC Declaration. REACh banned substance information (REACh Article 67) is also available
upon request.
Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
8
XLamp ® XH-B LED
notes - continued
UL® Recognized Component
Level 4 enclosure consideration. The LED package or a portion thereof has been investigated as a fire and electrical enclosure per ANSI/
UL 8750.
Vision Advisory
5
3
6 Eye5injury4can result. For
5 more4information
WARNING:6 Do not look at exposed
lamp
in operation.
6
NOTICE
NOTICE
CREE CONFIDENTIAL. THIS PLOT ANDNOTICE
THE INFORMATION
CREE
CONFIDENTIAL.
THIS PLOT AND THE INFORMATION
to the LED
EyeARE
Safety
application note.
CREE
THIS
PLOT
AND
THE INFORMATION
CONTAINED
WITHIN
THE CONFIDENTIAL.
PROPRIETARY
AND
CONTAINED
WITHIN
ARE
AND
CONTAINED
WITHIN
THE
PROPRIETARY
ANDTHE PROPRIETARY
CONFIDENTIAL INFORMATION
OF CREE,
INC. ARE
THIS
PLOT
CONFIDENTIAL
INFORMATION
OF CREE, INC. THIS PLOT
CONFIDENTIAL
OF
CREE,
INC. THIS
PLOT
MAY NOT BE COPIED, REPRODUCED
OR INFORMATION
DISCLOSED
TO
ANY
MAY
NOT
BE
COPIED,
REPRODUCED
DISCLOSED TO ANY
MAY
NOT BE COPIED,
REPRODUCED
OR DISCLOSED
TO
ANY ORCONSENT
UNAUTHORIZED PERSON
THE
WITHOUT
WRITTEN
CONSENT
UNAUTHORIZED
PERSON
THE
WITHOUT
WRITTEN
OF CREE INC.
UNAUTHORIZED PERSON
THE
WITHOUT
WRITTEN
OF
CREE
INC. CONSENT
OF CREE INC.
D
Mechanical Dimensions
D
2
4
about LEDs
and
3 eye safety, please3refer 2
REV
B
C
D
1
REVISONS
BY DA
DESCRIPTION
REV
DESCR
DC 4/8
ADDED SOLDER PAD AND STENCIL
B
ADDED SOLDER
DC 11/
CHANGED SOLDERPAD/REORIENTED VIEWS
C
CHANGED SOLDERP
CHANGED STENCIL/UPDATED FORMATDC 8/3
D
CHANGED STENC
D
All dimensions are ±.13 mm unless otherwise indicated.
.6 ±.2 mm
3.00
3.00
.6 ±.2 mm
3.00
1.60
3.00
C
C
C
3.00
1.60
1.60
.50
.7 ±.2 mm
Top View
.50
B
1.70
.80
.50
B
1.70
.80
Side View
.50
1.70
1.35
.50
.70 .80
3.00
.333.002.70
.33
2.70
.70
.10
.7 ±.2 mm
.10
2.80
1.35
.70
1.20
2.70
ALL DIMENSIONS ARE ± .13mm UNLESS OTHERWISE NOTED
ALLUNLE
DIME
ALL DIMENSIONS ARE ± .13mm
.30
.30
DATE
DRAWN BY
1.34
1.34
UNLESS OTHERWISE SPECIFIED
UNLESS
OTH
DATE
DRAWN
BY
1.34
4600
12/20/12
UNLESS
OTHERWISE SPECIFIED
DIMENSIONS ARE IND. CRONIN
A
DIMENSIO
Durh
12/20/12
A
CHECK
DATE
ARE IND. CRONIN
MILLIMETERS AND AFTER
FINISH.DIMENSIONS
MILLIMETERS
Phon
CHECK
DATE
MILLIMETERS AND AFTER
FINISH.
TOLERANCE UNLESS SPECIFIED:
TOLERANCE
Fax (
TOLERANCE
.XX ± .25
DATE UNLESS SPECIFIED:
APPROVED
.XX ±
.XX ± TITLE
.25
.XXX± .125
DATE
APPROVED
.XXX±T
.XXX± .125
X° ± .5°
X
°
±
THIRD
ANGLE
PROJECTION
XH-G
Mechanical
Outline
X
°
±
.5°
MATERIAL
.25
.25
FOR SHEET
PARTS
ONLY THIRD ANGLE PROJECTION
FOR SHEET M
THIRDMETAL
ANGLE
PROJECTION
MATERIAL
.25
FOR SHEET METAL PARTS
ONLY
(RECOMMENDED STENCIL PAD)
± 1.5PAD)
(RECOMMENDED.XSTENCIL
.X ±
DRAWING NO.
SIZE
(RECOMMENDED
STENCIL
PAD)
.X
±
1.5
.XX
±
.75
.XX ±S
(HATCHED AREA IS OPENING)
IS OPENING)
.XX ± FINISH
.75
± .25
FINAL PROTECTIVE
2610-00033
.XXX± F
(HATCHED AREA IS OPENING)(HATCHED AREA.XXX
C
.XXX± .25
X° ± .5°
FINAL PROTECTIVE
X° ±
RECOMMENDED PC BOARD SOLDER PAD
RECOMMENDED
PC BOARD SOLDER PAD
X° ± SCALE
.5°28.000
SHE
1.6
SURFACE FINISH:
RECOMMENDED PC BOARD SOLDER
PAD
SURFACE
FI
S
1.6
SURFACE
FINISH:
6
5
4
3
2
1
6
5
4
3
Recommended
PC Board Solder Pad
Recommended
Metal Stencil
6
5
4
3 Mask
2
.30
A
2.80
.50
1.20
.33
.70
Bottom View
.50
1.35
.50
.70
.7 ±.2 mm 2.80
1.20
3.00
NOTCH
CATHO
SIDE
.10
3.00
.70
B
NOTCH IS ON
CATHODE (-)
SIDE
.10
.6 ±.2 mm
(Hatched Area is Open)
Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
9
XLamp ® XH-B LED
Tape and Reel
All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard.
All dimensions are ±.13 mm unless otherwise indicated.
1.5±.1
CATHODE SIDE
4.0±.1
8.0±.1
1.75±.10
2.5±.1
Cathode Side
4.0 ±.1
8.0 ±.1
1.75 ±.10
+.3
12.0
.0
1.5 ±.1
2.5 ±.1
Cathode Side
ANODE SIDE
12.0
+.3
.0
Anode Side
(denoted by + and circle)
Anode SideUser Feed Direction
(denoted by + and circle)
END
START
User Feed Direction
END
4
START
3
2
1
Loaded Pockets
(1,000 Lamps)
Trailer
160mm (min) of
Trailer
empty pockets
sealed with tape 160 mm (min) of
(20 pockets min.) empty pockets
Loaded Pockets
(2,000 Lamps)
D
sealed with tape
(20 pockets min.)
16.40
Leader
400mm (min) of
Leader
empty pockets with
400 mm (min) of
at least 100mm
empty
sealed by
tapepockets with
at least 100 mm
(50 empty pockets
min.)
sealed by tape
(50 empty pockets min.)
User Feed Direction
User Feed Direction
C
Cover Tape
Cover Tape
Pocket TapePocket Tape
62
+0.20
12.40
0
MEASURED AT HUB
B
13mm
7"
7"
13mm
+3.20
12.40
0
MEASURED AT INSIDE EDGE
Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
DRAWN BY
UNLESS OTHERWISE SPECIFIED
R.CHALOUPECKY
DIMENSIONS ARE IN
MILLIMETERS & BEFORE FINISH. CHECK
TOLERANCE UNLESS SPECIFIED:
APPROVED
.X ± 0.3
.XX ± .13
THIRD ANGLE PROJECTION
X°
± 1°
MATERIAL
DATE
6/25/08
4600 Silicon Drive
Durham, N.C 27703
DATE
Phone (919) 361-4770
A
DATE
TITLE
Reel,
7" x 12mm Wide
10
XLamp ® XH-B LED
Packaging
The diagrams below show the packaging and labels Cree uses to ship XLamp XH-B LEDs. XLamp XH-B LEDs are shipped in tape loaded
on a reel. Each box contains only one reel in a moisture barrier bag.
Unpackaged Reel
Vacuum-Sealed
Vacuum-Sealed
Moisture
Barrier Bag
Moisture Barrier Bag
Label
CREE
Binwith
Code Cree Bin
&
Barcode
LabelLot #
Code,
Qty,
Label with Cree Bin Code,
Quantity, Reel ID
Label
with
Cree Bin
Label with
Customer
P/N, Qty,Qty,
Lot #, Lot
PO # #
Code,
Packaged Reel
Patent Label
Label with Customer Order
Label
with Cree Order Code,
Code, Qty, Reel ID, PO #
Quantity, Reel ID, PO #
Label with Cree Bin Code,
Quantity, Reel ID
Boxed Reel
Label with Cree Order Code,
Quantity, Reel ID, PO #
Label with Cree Bin Code,
Quantity, Reel ID
Patent Label
(on bottom of box)
Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
11