ds XBH

CLD-DS90 Rev 1E
Product family data sheet
Cree® XLamp® XB-H LEDs
Product Description
The
XLamp®
breakthrough
XB-H
LED
combination
delivers
of
a
lumen
FEATURES
Table of Contents
• Available in white, outdoor white
Characteristics.........................................2
and 80-, 85- and 90-CRI white
Flux Characteristics.................................3
output and efficacy in a small package.
• ANSI-compatible chromaticity bins
Relative Spectral Power Distribution......4
Delivering more than 500 lumens at
• Binned at 85 °C
Relative Flux vs. Junction
1.5 A, 25 °C in a 2.45 mm package, the
• Maximum drive current: 1500 mA
Temperature ............................................4
Cree XB-H LED offers triple the lumen
• Low thermal resistance: 4 °C/W
Electrical Characteristics.........................5
density of competing high‑power LEDs
• Wide viewing angle: 110°
Relative Flux vs. Current..........................5
to significantly increase the performance
• Unlimited floor life at
Relative Chromaticity vs Current and
2
of today’s lighting designs. The XB-H LED
joins a new generation of directionally
optimized LEDs that offers the industry’s
≤ 30 ºC/85% RH
• Reflow solderable - JEDEC
J‑STD‑020C
Temperature.............................................6
Typical Spatial Distribution......................7
Thermal Design........................................7
highest optical control factor (OCF),
• Electrically neutral thermal path
Reflow Soldering Characteristics............8
a measurement of how LED size and
• RoHS‑ and REACh‑compliant
Notes........................................................9
performance benefit directional lighting
• UL recognized component
Mechanical Dimensions........................11
applications.
High‑OCF
LEDs
enable
lighting manufacturers to improve the
®
(E349212)
Tape and Reel.........................................12
Packaging...............................................13
performance of any lighting design, create
smaller and less expensive systems, and
develop new lighting solutions that were
www.cree.com/Xlamp
previously not possible.
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are
registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
1
XLamp ® XB-H LED
Characteristics
Characteristics
Unit
Thermal resistance, junction to solder point
°C/W
4
degrees
110
mV/°C
-2.2
Viewing angle (FWHM)
Temperature coefficient of voltage
ESD withstand voltage (HBM per Mil-Std-883D)
Minimum
Typical
Maximum
V
8000
mA
1500
Reverse voltage
V
5
Forward voltage (@ 700 mA, 85 °C)
V
2.9
Forward voltage (@ 1000 mA, 85 °C)
V
3.0
Forward voltage (@ 1500 mA, 85 °C)
V
3.15
LED junction temperature
°C
DC forward current
3.3
150
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
2
XLamp ® XB-H LED
Flux Characteristics (TJ = 85 °C)
The following table provides several base order codes for XLamp XB-H LEDs. It is important to note that the base order codes listed here
are a subset of the total available order codes for the product family. For more order codes, as well as a complete description of the
order‑code nomenclature, please consult the XLamp XB LED Family Binning and Labeling document.
CCT Range
Minimum Luminous Flux
@ 700 mA
Color
Min.
Cool White
Outdoor White
Neutral White
80-CRI Minimum
White
Warm White
85-CRI Minimum
White
90-CRI Minimum
White
5000 K
3200 K
3700 K
2600 K
2600 K
2600 K
2600 K
Max.
8300 K
5300 K
5300 K
4300 K
3700 K
3200 K
3200 K
Calculated
Minimum
Luminous Flux
(lm)**
@ 85 °C
Order Code
Group
Flux (lm)
@ 85 °C
Flux
(lm) @
25 °C*
1.0 A
1.5 A
T6
280
322
372
499
XBHAWT-00-0000-000LT60E1
T5
260
299
345
463
XBHAWT-00-0000-000LT50E1
T4
240
276
318
428
XBHAWT-00-0000-000LT40E1
T3
220
253
292
392
XBHAWT-00-0000-000LT30E1
T6
280
322
372
499
XBHAWT-00-0000-0000T60E3
T5
260
299
345
463
XBHAWT-00-0000-0000T50E3
T4
240
276
318
428
XBHAWT-00-0000-0000T40E3
T3
220
253
292
392
XBHAWT-00-0000-0000T30E3
T5
260
299
345
463
XBHAWT-00-0000-000LT50E4
T4
240
276
318
428
XBHAWT-00-0000-000LT40E4
T3
220
253
292
392
XBHAWT-00-0000-000LT30E4
T4
240
276
318
428
XBHAWT-00-0000-000HT40E5
T3
220
253
292
392
XBHAWT-00-0000-000HT30E5
T4
240
276
318
428
XBHAWT-00-0000-0000T40E7
T3
220
253
292
392
XBHAWT-00-0000-0000T30E7
T2
200
230
265
356
XBHAWT-00-0000-0000T20E7
T2
200
230
265
356
XBHAWT-00-0000-000PT20E7
S6
182
209
242
324
XBHAWT-00-0000-000PS60E7
S5
172
198
228
306
XBHAWT-00-0000-000PS50E7
S6
182
209
242
324
XBHAWT-00-0000-000US60E7
S5
172
198
228
306
XBHAWT-00-0000-000US50E7
S4
164
186
218
292
XBHAWT-00-0000-000US40E7
Notes:
• Cree maintains a tolerance of ±7% on flux and power measurements, ±0.005 on chromaticity (CCx, CCy) measurements and ±2 on
CRI measurements. See the Measurements section (page 9).
• Typical CRI for Cool White (5000 K - 8300 K CCT) is 70.
• Typical CRI for Neutral White (3700 K - 5300 K CCT) is 75.
• Typical CRI for Warm White (2600 K - 3700 K CCT) is 80.
* Flux values @ 25 °C are calculated and for reference only.
** Calculated flux values at 1 A and 1.5 A are for reference only.
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
3
XLamp ® XB-H LED
Relative Spectral Power
Relative Spectral Power Distribution
100%
Relative Radiant Power
80%
60%
Cool White
Warm White
40%
20%
0%
380
430
480
530
580
630
680
730
780
Wavelength (nm)
Relative Flux Output vs. Junction Temperature
Relative Flux vs. Junction Temperature (IF = 700 mA)
120%
Relative Luminous Flux
100%
80%
60%
40%
20%
0%
25
50
75
100
125
150
Junction Temperature (ºC)
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
4
XLamp ® XB-H LED
Electrical Characteristics (Tj = 25ºC)
Electrical Characteristics (TJ = 85 °C)
1500
Forward Current (mA)
1200
900
600
300
0
2.50
2.75
3.00
3.25
Forward Voltage (V)
Relative Intensity vs. Current (Tj = 25ºC)
Relative Flux vs. Current (TJ = 85 °C)
180%
160%
Relative Luminous Flux
140%
120%
100%
80%
60%
40%
20%
0%
0
300
600
900
1200
1500
Forward Current (mA)
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
5
XLamp ® XB-H LED
Delta CCT vs. Current
Relative Chromaticity vs Current and Temperature (Warm White*)
0.006
0.004
0.002
ΔCCx
0.000
ΔCCy
-0.002
-0.004
Delta CCT vs Temp
-0.006
100
300
500
700
900
1100
1300
1500
Current (mA)
0.006
0.004
0.002
ΔCCx
0.000
ΔCCy
-0.002
-0.004
-0.006
25
50
75
100
125
150
Tsp (°C)
*
Warm White XLamp XB-H LEDs have a typical CRI of 80.
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
6
XLamp ® XB-H LED
Typical Spatial Radiation Pattern
Typical Spatial Distribution
100%
Relative Luminous Intensity
80%
60%
40%
20%
-90
-60
0%
-30
0
30
60
90
Angle (º)
Thermal Design
The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is crucial for the end
Thermal Design
product to be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to optimize lamp life
and optical characteristics.
1600
Maximum Current (mA)
1400
1200
1000
800
600
Rj-a = 10 °C/W
400
Rj-a = 15 °C/W
Rj-a = 20 °C/W
200
Rj-a = 25 °C/W
0
0
20
40
60
80
100
120
140
160
Ambient Temperature (ºC)
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
7
XLamp ® XB-H LED
Reflow Soldering Characteristics
In testing, Cree has found XLamp XB-H LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general
guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of the solder paste used.
Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment.
tP
TP
Critical Zone
TL to TP
Temperature
Ramp-up
TL
tS
Tsmax
Tsmin
Ramp-down
ts
Preheat
25
t 25˚C to Peak
IPC/JEDEC J-STD-020C
Time
Profile Feature
Average Ramp-Up Rate (Tsmax to Tp)
Lead-Free Solder
1.2 °C/second
Preheat: Temperature Min (Tsmin)
120 °C
Preheat: Temperature Max (Tsmax)
170 °C
Preheat: Time (tsmin to tsmax)
Time Maintained Above: Temperature (TL)
Time Maintained Above: Time (tL)
Peak/Classification Temperature (Tp)
65-150 seconds
217 °C
45-90 seconds
235 - 245 °C
Time Within 5 °C of Actual Peak Temperature (tp)
20-40 seconds
Ramp-Down Rate
1 - 6 °C/second
Time 25 °C to Peak Temperature
4 minutes max.
Note: All temperatures refer to topside of the package, measured on the package body surface.
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
8
XLamp ® XB-H LED
Notes
Measurements
The luminous flux, radiant power, chromaticity and CRI measurements in this document are binning specifications only and solely
represent product measurements as of the date of shipment. These measurements will change over time based on a number of factors
that are not within Cree’s control and are not intended or provided as operational specifications for the products. Calculated values are
provided for informational purposes only and are not intended as specifications.
Pre‑Release Qualification Testing
Please read the LED Reliability Overview for details of the qualification process Cree applies to ensure long-term reliability for XLamp
LEDs and details of Cree’s pre-release qualification testing for XLamp LEDs.
Lumen Maintenance
Cree now uses standardized IES LM-80-08 and TM-21-11 methods for collecting long-term data and extrapolating LED lumen maintenance.
For information on the specific LM-80 data sets available for this LED, refer to the public LM-80 results document.
Please read the Long-Term Lumen Maintenance application note for more details on Cree’s lumen maintenance testing and forecasting.
Please read the Thermal Management application note for details on how thermal design, ambient temperature, and drive current affect
the LED junction temperature.
Moisture Sensitivity
Cree recommends keeping XLamp LEDs in the provided, resealable moisture-barrier packaging (MBP) until immediately prior to soldering.
Unopened MBPs that contain XLamp LEDs do not need special storage for moisture sensitivity.
Once the MBP is opened, XLamp XB-H LEDs may be stored as MSL 1 per JEDEC J-STD-033, meaning they have unlimited floor life in
conditions of ≤ 30 ºC/85% relative humidity (RH). Regardless of storage condition, Cree recommends sealing any unsoldered LEDs in the
original MBP.
RoHS Compliance
The levels of RoHS restricted materials in this product are below the maximum concentration values (also referred to as the threshold
limits) permitted for such substances, or are used in an exempted application, in accordance with EU Directive 2011/65/EC (RoHS2), as
implemented January 2, 2013. RoHS Declarations for this product can be obtained from your Cree representative or from the Product
Documentation sections of www.cree.com.
REACh Compliance
REACh substances of very high concern (SVHCs) information is available for this product. Since the European Chemical Agency (ECHA)
has published notice of their intent to frequently revise the SVHC listing for the foreseeable future, please contact a Cree representative to
insure you get the most up-to-date REACh SVHC Declaration. REACh banned substance information (REACh Article 67) is also available
upon request.
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
9
XLamp ® XB-H LED
Notes - Continued
UL® Recognized Component
Level 4 enclosure consideration. The LED package or a portion thereof has been investigated as a fire and electrical enclosure per ANSI/
UL 8750.
Vision Advisory
WARNING: Do not look at exposed lamp in operation. Eye injury can result. For more information about LEDs and eye safety, please refer
to the LED Eye Safety application note.
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
10
XLamp ® XB-H LED
6
5
6
5
NOTICE
NOTICE
CREE CONFIDENTIAL.
THIS
PLOT
AND THE INFORMATION
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THIS PLOT AND
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MAY NOT BE COPIED,
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OR DISCLOSED
TO
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PERSON
THE
WITHOUT
WRITTEN CONSENT
UNAUTHORIZED
PERSON
THE
WITHOUT
WRITTEN
CONSENT
Mechanical
Dimensions
CREE INC.
OF CREE INC. OF
4
4
3
3
REV
Thermal vias, if present, are not shown on these drawings.
All measurements are ±.13 mm unless 2.29
otherwise indicated.
2.29
D
D
2.28
2.28
2.45
2.45
6
5
6
5
NOTICE
CREE CONFIDENTIAL.
NOTICE THIS PLOT AND THE INFORMATION
CONTAINED
WITHIN ARE
PROPRIETARY
AND
CREE
CONFIDENTIAL.
THISTHE
PLOT
AND
THE
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CONFIDENTIAL
INFORMATION
OF
CREE,
INC.
THIS PLOT
CONTAINED
WITHIN
ARE
THE PROPRIETARY
AND
MAY
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BE
COPIED,
REPRODUCED
OR
DISCLOSED
TO ANY
CONFIDENTIAL
INFORMATION
OF CREE,CONSENT
INC. THIS PLOT
UNAUTHORIZED
PERSON
THE
WITHOUT
WRITTEN
MAY
NOT
BE
COPIED,
REPRODUCED
OR
DISCLOSED
TO ANY
OF CREE INC. PERSON
UNAUTHORIZED
THE
WITHOUT
WRITTEN CONSENT
2.45
2.45INC.
OF CREE
4
3
4
3
2.29
2.28
C
C
Anode
D
2.29
2.29
0.92
0.36
2.29
R1.53
0.92
R1.53
0.36
2.29
2.29
2.29
0.85REF.
2.29
0.85
2.29 REF.
0.39
0.92
0.92
Anode
2.29
PRIMARY
D
PRIMARY
0.39
0.36
0.36
0.85
6
0.85
2.29
0.25
Recommended
PCB Solder Pad0.25
0.17
2.29
2.29
5
5
1.95
1.95
1.95
Alternate Bottom View
2.29
ALTENATIVE
2.29
0.85
0.85
C
0.25
0.25
0.17
0.39
0.39
0.17
ALL DIMENS
UNL
UNLESS OTHERWISE
DIMENSIONS ARED
2.29
RECOMMENDED
RECOMMENDED PCB
SOLDER PADPCB SOLDER PAD
0.85
0.39
0.39
2.29
2.29
6
2.29
2.29
ALTENATIVE
PRIMARY
0.92
0.92
0.85
0.92
2.29
2.29
0.92
2.29
PRIMARY
2.29
2.29
A
DATE APP'D
PRIMARY
C PRIMARY
0.85
0.85
Bottom View
2.29
1
0.36
0.92
9
2.29 REF.
B
B
B
B A
REVISONS
BY DATE APP'D2.29BY
DESCRIPTION
2.29
0.33
0.33
0.65
0.36
0.65
0.36
0.92
Side View
0.33
0.36
0.65
2.45
2.45
2.29
1
2
REVISONS
DESCRIPTION
REV
2.29 REF.
2.29
0.33
2.28
0.65
2
R1.53
R1.53
Top View
3
3
REV
REV
2.28
2.28
2.45
2.45
C
C
0.36
0.36
4
4
REV
MATION D
PLOT D
D TO ANY
0.33
0.33
0.65
0.65
0.85
MILL
RECOMMENDED
STENCIL
PATTERN MILLIMETERS AND
AF
RECOMMENDED STENCIL
PATTERN
TOLE
TOLERANCE UNLESS
AREA0.85
IS OPENING)
(HATCHED AREA (HATCHED
IS OPENING)
.XX ± .25
.XXX± .125
1.95
X° ± .5°
THIRD
ANGLE PROJECTIO
THIRD ANGLE
PROJECTION
1.95 FOR
FOR
SHEET
PA
B
B.X ± METAL
1.5
0.25
.XX ± .75
.XXX± .25
0.17 0.25
X° ± .5°
0.17
1.6 SUR
SURFACE FINISH:
4
3
4
3
1.95
ALL DIMENSI
ALL DIMENSIO
Recommended Stencil Pattern
(Hatched
Area is
Opening)
RECOMMENDED
STENCIL
PATTERN
UNLESS OTHERWISE SD
D
DIMENSIONS
ARESP
IN
UNLESS
OTHERWISE
MILLIMETERS
DIMENSIONSAND
AREAFT
INDC
TOLERANCEAND
UNLESS
S
C
MILLIMETERS
AFTER
RECOMMENDED
STENCIL
PATTERN
(HATCHED AREA
IS OPENING)
.XX ±UNLESS
.25 SPA
TOLERANCE
(HATCHED
AREA
IS ®OPENING)
.XXX
± .25
.125 A
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice.
Cree® and
XLamp
are registered trademarks and the Cree logo is a trademark
of
.XX
±
X° ±± .125
.5°
ALL DIMENSIONS AREALL
± DIMENSIONS
.13MM UNLESS
NOTED THIRD
.XXX
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
ANGLE
PROJECTION
AREOTHERWISE
± .13MM UNLESS
OTHERWISE
NOTED
FOR SHEET
PAM
X° ± METAL
.5°
THIRD ANGLE PROJECTION
M
.X
±
1.5 PART
FOR SHEET METAL
± 1.5
.75
.X.XX
±11
DATE
DRAWN
BY
.XXX
±
.25
F
.XX
DATE
DRAWN BY
UNLESS OTHERWISE UNLESS
SPECIFIED
4600 Silicon Drive
X° ±±± .75
.5°
OTHERWISE
CRONIN
11/20/13SPECIFIED
.25
FI
DIMENSIONS ARE IND.
Silicon.XXX
Drive
DIMENSIONS
ARE IND. CRONIN11/20/13 Durham, N.C 27703 4600
1.6
CHECK
DATE
± FINISH:
.5°
Durham,SURFACE
N.CX°27703
A
A
0.17
RECOMMENDED PCB SOLDER PAD
RECOMMENDED PCB SOLDER PAD
6
5
4
3
DETAIL B
SCALE 2 : 1
NOTICE
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
CONTAINED WITHIN ARE THE PROPRIETARY AND
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
UNAUTHORIZED PERSON WITHOUTTHE WRITTEN CONSENT
OF CREE INC.
2
1
REVISONS
REV
DESCRIPTION
BY
A
Released
DC
10/23/11 JL
B
ADDED CATHODE AND ANODE NOTE
DC
2/26/12
DATE
APP'D
C
CHANGED POCKET DIMS AND TOLERANCES
DC
8/3/12
XLamp ® XB-H LED
D
D
Tape and Reel
All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard.
Except as noted, all dimensions in mm.
C
1.50 +.10/-.00
C
1.75 ±.10
4.00 ±.10
CATHODE SIDE
2.00 ±.10
B
B
2.60+/-0.1mm
4°
1.5±.1
4.0±.1
10.25 ±.10
8.0±.1
1.75±.10
ANODE SIDE
2.5±.1
.30 ± .10
Cathode Side
8.00 ±.10
B
12.00 Nominal
12.30 Max
B
5.50 ±.10
1.00 ± .10
+.3
12.0
.0
2.05 +/-0.1
REFERENCE VENDOR PART NUMBER 020246
SECTION B-B
Anode Side
(denoted by + and circle)
2.60 +/-0.1
A
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN
MILLIMETERS AND AFTER FINISH.
TOLERANCE UNLESS SPECIFIED:
.XX ±
.25
.XXX ±
.125
X°
±
.5 °
DATE
DRAWN BY
D. CRONIN
4600 Silicon Drive
Durham, N.C 27703
10/23/11
CHECK
DATE
APPROVED
DATE
Phone (919) 313-5300
User Feed Direction
END
THIRD ANGLE PROJECTION
Notes:
1. 10 sprocket hole pitch cumulative tolerance ±
0.2mm
FOR SHEET METAL PARTS ONLY
.X
±
1.5
.XX ±
.75
.XXX ±
.25
X°
±
.5 °
5
Trailer
160mm (min) of
empty pockets
sealed with tape
(20 pockets min.)
4
Loaded Pockets
(1,000 Lamps)
A
START
Carrier Tape, 2525 HEW
MATERIAL
SIZE
FINAL PROTECTIVE FINISH
SCALE
SURFACE FINISH: 1.6
6
Fax (919) 313-5558
TITLE
3
C
REV.
DRAWING NO.
4.000
2
2402-00020
SHEET
C
OF
1 /1
1
Leader
400mm (min) of
empty pockets with
at least 100mm
sealed by tape
(50 empty pockets min.)
User Feed Direction
Cover Tape
Pocket Tape
13mm
7"
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
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XLamp ® XB-H LED
Packaging
Unpackaged Reel
Vacuum-Sealed
Vacuum-Sealed
Moisture
Barrier Bag
Moisture Barrier Bag
Label
CREE
Binwith
Code Cree Bin
&
Barcode
LabelLot #
Code,
Qty,
Label with Cree Bin Code,
Quantity, Reel ID
Label
with
Cree Bin
Label with
Customer
P/N, Qty,Qty,
Lot #, Lot
PO # #
Code,
Packaged Reel
Patent Label
Label with Customer Order
Label
with Cree Order Code,
Code, Qty, Reel ID, PO #
Quantity, Reel ID, PO #
Label with Cree Bin Code,
Quantity, Reel ID
Boxed Reel
Label with Cree Order Code,
Quantity, Reel ID, PO #
Label with Cree Bin Code,
Quantity, Reel ID
Patent Label
(on bottom of box)
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
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