ds XPE2 Torch

CLD-DS101 Rev 2C
Product family data sheet
Cree® XLamp® XP-E2 Torch LEDs
Product Description
FEATURES
Table of Contents
The XLamp® XP-E2 Torch LED provides
• Available in cool white
Characteristics........................................ 2
lumen output similar to the XLamp XP-G
• Binned at 25 °C
Flux Characteristics................................ 2
LED but in the smaller optical source of
• Maximum drive current: 1.5 A
Relative Spectral Power Distribution..... 3
the XP-E2 LED. Together with a higher
• Low thermal resistance: 9°C/W
Relative Flux vs. Junction
maximum current rating than XP‑E2
• Wide viewing angle: 125°
Temperature............................................ 3
and simplified color binning, the XLamp
• Unlimited floor life at
Electrical Characteristics........................ 4
XP‑E2 Torch LED is fully optimized for
a wide range of mainstream portable
lighting applications.
≤ 30 °C/85% RH
Relative Flux vs. Current......................... 4
• Reflow solderable - JEDEC
Typical Spatial Distribution..................... 5
J-STD‑020C compatible
Thermal Design....................................... 5
• Electrically neutral thermal path
Performance Groups - Brightness......... 6
• RoHS-compliant
Performance Groups - Chromaticity...... 6
Cree ANSI White Bin Plotted on the
1931 CIE Color Space............................. 6
Bin and Order Code Formats.................. 7
Reflow Soldering Characteristics........... 8
Notes....................................................... 9
Mechanical Dimensions....................... 10
Tape and Reel........................................ 11
www.cree.com/Xlamp
Packaging.............................................. 12
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are
registered trademarks and the Cree logo is a trademark of Cree, Inc.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
1
XLamp ® XP-E2 Torch LED
Characteristics
Characteristics
Unit
Thermal resistance, junction to solder point
°C/W
9
degrees
125
mV/°C
-3.9
Viewing angle (FWHM)
Temperature coefficient of voltage
ESD withstand voltage (HBM per Mil-Std-883D)
Minimum
Typical
Maximum
V
8000
mA
1500
Reverse voltage
V
5
Forward voltage (@ 1050 mA, 25 °C)
V
LED junction temperature
°C
DC forward current
3.5
3.9
150
Flux Characteristics (TJ = 25 °C)
The following table provides order codes for XLamp XP-E2 Torch LEDs.
Color
CCT Range
Min.
Cool White
6000 K
Max.
10,500 K
Minimum Luminous Flux
(lm) @ 1050 mA
Calculated Minimum
Luminous Flux (lm) *
Order Code
Group
Flux (lm)
1.5 A
T6
280
355
XPEBTT-01-0000-00T80
U2
300
380
XPEBTT-01-0000-00U80
U3
320
405
XPEBTT-01-0000-00V80
U4
340
431
XPEBTT-01-0000-00W80
U5
360
456
XPEBTT-01-0000-00Y80
Notes:
• Cree maintains a tolerance of ±7% on flux and power measurements, ±0.015 on chromaticity (CCx, CCy) measurements and ±2 on
CRI measurements. See the Measurements section (page 9).
• Typical CRI for Cool White (6000 K – 10,500 K CCT) is 65.
* Calculated flux values at 1.5 A are for reference only.
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc.
2
XLamp ® XP-E2 Torch LED
Relative Spectral Power
Relative Spectral Power Distribution
100%
Relative Radiant Power
80%
60%
Cool White
40%
20%
0%
380
430
480
530
580
630
680
730
780
Wavelength (nm)
Relative Flux Output vs. Junction Temperature
Relative Flux vs. Junction Temperature (IF = 1050 mA)
120%
Relative Luminous Flux
100%
80%
60%
40%
20%
0%
25
50
75
100
125
150
Junction Temperature (ºC)
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc.
3
XLamp ® XP-E2 Torch LED
Electrical Characteristics (Tj = 25ºC)
Electrical Characteristics (TJ = 25 °C)
1500
1400
1300
Forward Current (mA)
1200
1100
1000
900
800
700
600
500
400
300
200
100
0
3.0
3.1
3.2
3.3
3.4
3.5
3.6
Forward Voltage (V)
Relative Intensity vs. Current (Tj = 25ºC)
Relative Flux vs. Current (TJ = 25 °C)
140%
Relative Luminous Flux
120%
100%
80%
60%
40%
20%
0%
0
100
200
300
400
500
600
700
800
900 1000 1100 1200 1300 1400 1500
Forward Current (mA)
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc.
4
XLamp ® XP-E2 Torch LED
Typical Spatial Radiation Pattern
Typical Spatial Distribution
100%
Relative Luminous Intensity
80%
60%
40%
20%
-90
-70
-50
-30
-10
0%
10
30
50
70
90
Angle (º)
Thermal
Design
Thermal Design
Cool
White forward current is determined by the thermal resistance between the LED junction and ambient. It is crucial for the end
The maximum
product to be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to optimize lamp life
and optical characteristics.
1600
Maximum Current (mA)
1400
1200
1000
800
600
Rj-a = 10°C/W
400
Rj-a = 15°C/W
Rj-a = 20°C/W
200
Rj-a = 25°C/W
0
0
20
40
60
80
100
120
140
160
Ambient Temperature (ºC)
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc.
5
XLamp ® XP-E2 Torch LED
Performance Groups - Brightness (Tj = 25 °C)
XLamp XP-E2 Torch LEDs are tested for luminous flux and placed into one of the following bins.
Group Code
Minimum Luminous Flux
Maximum Luminous Flux
T6
280
300
U2
300
320
U3
320
340
U4
340
360
U5
360
380
Performance Groups - Chromaticity (Tj = 25 °C)
XLamp XP-E2 Torch LEDs are tested for chromaticity and placed into the bin defined by the following bounding coordinates.
Bin
T1
x
y
0.302
0.33
0.318
0.33
0.295
0.28
0.282
0.28
Cree ANSI White Bin Plotted on the 1931 CIE Color Space (Tj = 25 °C)
0.40
0.39
4500 K
5000 K
0.38
5700 K
0.37
7000 K
CCy
0.35
WG
WJ
0.34
8300 K
WF
WD
0.33
0.32
WH
6350 K
0.36
WE
10000 K
0.31
WC
WN
WB
0.30
WM
WA
0.29
WP
WK
0.28
0.37
0.36
0.35
0.34
0.33
0.32
0.31
0.30
0.29
0.28
0.27
0.26
0.27
CCx
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc.
6
XLamp ® XP-E2 Torch LED
Bin and Order Code Formats
Bin codes and order codes are configured as follows.
Order CodeBin Code
Series
XPE = XP-E
Series
XPE = XP-E
Color specification
01 = No CRI minimum
Color specification
01 = No CRI minimum
Kit number
Luminous flux group
SSSCCC-BD-WWW-FF-G-AA
SSSCCC-BD-HHHH-GGNNN
Internal code
Internal code
Color
BTT = Torch
Chromaticity
Color
BTT = Torch
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc.
7
XLamp ® XP-E2 Torch LED
Reflow Soldering Characteristics
In testing, Cree has found XLamp XP-E2 Torch LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a
general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of the solder
paste used.
Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment.
tP
TP
Critical Zone
TL to TP
Temperature
Ramp-up
TL
tS
Tsmax
Tsmin
Ramp-down
ts
Preheat
25
t 25˚C to Peak
IPC/JEDEC J-STD-020C
Time
Profile Feature
Average Ramp-Up Rate (Tsmax to Tp)
Lead-Free Solder
1.2 °C/second
Preheat: Temperature Min (Tsmin)
120 °C
Preheat: Temperature Max (Tsmax)
170 °C
Preheat: Time (tsmin to tsmax)
Time Maintained Above: Temperature (TL)
Time Maintained Above: Time (tL)
Peak/Classification Temperature (Tp)
65-150 seconds
217 °C
45-90 seconds
235 - 245 °C
Time Within 5 °C of Actual Peak Temperature (tp)
20-40 seconds
Ramp-Down Rate
1 - 6 °C/second
Time 25 °C to Peak Temperature
4 minutes max.
Note: All temperatures refer to topside of the package, measured on the package body surface.
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc.
8
XLamp ® XP-E2 Torch LED
Notes
Measurements
The luminous flux, radiant power, chromaticity and CRI measurements in this document are binning specifications only and solely
represent product measurements as of the date of shipment. These measurements will change over time based on a number of factors
that are not within Cree’s control and are not intended or provided as operational specifications for the products. Calculated values are
provided for informational purposes only and are not intended as specifications.
Pre‑Release Qualification Testing
Please read the LED Reliability Overview for details of the qualification process Cree applies to ensure long-term reliability for XLamp
LEDs and details of Cree’s pre-release qualification testing for XLamp LEDs.
Moisture Sensitivity
Cree recommends keeping XLamp LEDs in the provided, resealable moisture-barrier packaging (MBP) until immediately prior to soldering.
Unopened MBPs that contain XLamp LEDs do not need special storage for moisture sensitivity.
Once the MBP is opened, XLamp XP-E2 Torch LEDs may be stored as MSL 1 per JEDEC J-STD-033, meaning they have unlimited floor life
in conditions of ≤ 30 ºC/85% relative humidity (RH). Regardless of the storage condition, Cree recommends sealing any unsoldered LEDs
in the original MBP.
RoHS Compliance
The levels of RoHS restricted materials in this product are below the maximum concentration values (also referred to as the threshold
limits) permitted for such substances, or are used in an exempted application, in accordance with EU Directive 2011/65/EC (RoHS2), as
implemented January 2, 2013. RoHS Declarations for this product can be obtained from your Cree representative or from the Product
Documentation sections of www.cree.com.
Vision Advisory
WARNING: Do not look at exposed lamp in operation. Eye injury can result. For more information about LEDs and eye safety, please refer
to the LED Eye Safety application note.
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
of Cree, Inc.
9
XLamp ® XP-E2 Torch LED
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DD
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2.30
3.30
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PCB
SOLDER
PAD
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PCB
SOLDER
PAD
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PATTERN
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1.01
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3.30
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UNLES
UNLESS
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DIME
MILLIM
MILLIMET
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TOLER
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TOLERAN
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ALL DIME
ALL DIMENSIONS ARE
3.30
Recommended Stencil Pattern
RECOMMENDED STENCIL PATTERN
(Hatched
Area
is PATTERN
Open)
RECOMMENDED
STENCIL
UNLESS
UNLESS OTHERWISE
DIMEN
DIMENSIONS
ARE
MILLIMET
MILLIMETERS
AND AF
.75
(HATCHED AREA IS OPENING)
TOLERAN
(HATCHED AREA IS OPENING)
TOLERANCE UNLESS
.X
RECOMMENDED
PCB
SOLDER PAD
.XX ± .25 .X
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in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
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of Cree, Inc.
THIRD ANGLE PROJECTION
X° ± FOR
.5°SHE
THIRD ANGLE PROJECTION
FOR SHEET METAL.X
P
1.01
ALL
DIMENSIONS
ARE
±
.13MM
UNLESS
OTHERWISE
NOTED
1.01
.X ± 1.5 .X
10
ALL DIMENSIONS ARE ± .13MM UNLESS OTHERWISE NOTED
2.30
.XX ± .75 .X
2.30
.XXX± .25 X°
X° ± .5°
3.30
A
A
.75
±0.
0
5
Y
5
E1
1.7
Do
DETAIL B
SCALE 2 : 1
REF
Bo LED
XLamp ® XP-E24.375
Torch
REF
4.375
Bo
SECTION Y-Y
REF
R0.2
TYPICAL to EIA-481D, Automated Component Handling Systems Standard.
All Cree carrier tapes conform
Y
Ko
P1
D1
1.5
MIN.
SECTION Y-Y
REF 0.59
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R
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CATHODE SIDE
Y
5
Bo
1.75±.10
3.70
Bo
Y 3.70
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2.40
1.5 MIN.
12.0
F
5.50
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P1
W
12.00
(I)
Cathode Side
+/- 0.1
2.2
P1
3.70
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Bo
Ko
F
3.70
2.40
5.50
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12.00
+/- 0.1
+0.0/-0.1
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(II)
ANODE SIDE
+/- 0.1
+0.0/-0.1
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R
(III)
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SECTION Y-Y
X
X
Ao
P1
W
W
8.0±.1
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TYPICAL
Ko
Ao
F(III)
SECTION X-X
1.5±.1
4.0±.1
4.375
E1
1.75 ±0.1
T 0.30 ±0.05
All dimensions in mm.
(IV)
+/- 0.1
+0.3/-0.1
Measured from centerline of sprocket hole
to centerline of pocket.
Cumulative tolerance of 10 sprocket
holes is ± 0.20.
Measured from centerline of sprocket
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Other material available.
+/- 0.1
+0.3/-0.1
Anode Side
(denoted
by + and circle)
SECTION X-X
User Feed Direction
END
Ao
(I)
3.70
+/- 0.1
(II)
3.70
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2.40
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5.50
+/- 0.05
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Cumulative tolerance of 10 sprocket
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Measured from centerline of sprocket
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1
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Cover Tape
D
C
D
C
16.40
Ø190
Ø61 ± 0.5
Pocket Tape
OD
7.5
C
12.40 +2.00
0
MEASURED AT HUB
''
C
B
B
13mm
Ø13
Ø61 ± 0.5
7"
OD
7.5
''
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MEASURED AT INSIDE EDGE
12.40 +2.00
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MEASURED AT HUB
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A
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DIMENSIONS ARE IN
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TOLERANCE UNLESS SPECIFIED:
.X ± 0.3
.XX ± .13
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X°
± 1°
DRAWN BY
LIUDEZHI
DATE
2012/5/25
CHECK
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APPROVED
DATE
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A
TITLE
MATERIAL
11
4600 Silicon Drive
Durham, N.C 27703
Reel,
7" x 12mm Wide
RE
Tape and Reel
R0.2
TYPICAL
Ko
X
X
F(III)
XLamp ® XP-E2 Torch LED
Packaging
Unpackaged Reel
Vacuum-Sealed
Vacuum-Sealed
Moisture
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Moisture Barrier Bag
Label
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Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark
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12