FORMS.1014 / Rev. 06 Power Modules: Variants Explanation www.semikron.com Content 1. General Information 2. MiniSKiiP® Lid Options FORMS.1014 / Rev. 06 3. Thermal Interface Materials Slide - 2 - 01/06/2015 www.semikron.com MiniSKiiP General Introduction | Rev. 4.8 Variants Explanation: General Information Online Shop Variants: Customers can choose from a range of product variants regarding: - Pressure lid type for MiniSKiiP® modules: standard or slim lids FORMS.1014 / Rev. 06 - Thermal interface materials: thermal paste or phase change material Code VARIANT DESCRIPTION M10 With Slim Lid (2.8 mm) M00 Power Module only M11 With Slim Lid and Thermal Paste P12 M01 With Thermal Paste P12 M20 With Standard Lid (6.5 mm) M04 With Phase Change Material HALA P8 M21 With Standard Lid and Thermal Paste P12 Slide - 3 - 15/12/2015 www.semikron.com Power Modules: Variants Explanation| Rev. 1.0 MiniSKiiP® Variants Explanation: Lid Options - Standard Lid: Standard Lid 6.5 mm Lid height of 6.5 mm. Ample space for SMD components (max. height 3.5 mm) - Slim Lid: Lid height of 2.8 mm. FORMS.1014 / Rev. 06 Slim solution for minimum height requirement Slim Lid 2.8 mm Slide - 4 - 15/12/2015 www.semikron.com Power Modules: Variants Explanation| Rev. 1.0 Variants Explanation: Thermal Interface Materials - With Thermal Paste (P12): For a fast and easy assembly of the module on the heat sink with an optimum thickness of thermal paste layer. FORMS.1014 / Rev. 06 - With Phase Change Material (HALA P8): PCM with excellent conductive property which is applied in a fluid state, it is solid at room temperature and is silicone free. Slide - 5 - 15/12/2015 www.semikron.com Power Modules: Variants Explanation| Rev. 1.0