SKiiP 31 NAB 06 Absolute Maximum Ratings Symbol Inverter VCES VGES IC ICM IF = –IC IFM = –ICM Conditions 1) Values Units Theatsink = 25 / 80 °C tp < 1 ms; Theatsink = 25 / 80 °C Theatsink = 25 / 80 °C tp < 1 ms; Theatsink = 25 / 80 °C 600 ± 20 50 / 35 100 / 70 57 / 38 114 / 76 V V A A A A 800 25 370 680 – 40 . . . + 150 – 40 . . . + 125 2500 V A A A2s °C °C V Bridge Rectifier VRRM ID Theatsink = 80 °C tp = 10 ms; sin. 180 °, Tj = 25 °C IFSM I2t tp = 10 ms; sin. 180 °, Tj = 25 °C Tj Tstg Visol AC, 1 min. MiniSKiiP 3 SEMIKRON integrated intelligent Power SKiiP 31 NAB 06 3-phase bridge rectifier + braking chopper + 3-phase bridge inverter Case M3 Characteristics Symbol Conditions 1) IGBT - Inverter VCEsat IC = 50 A Tj = 25 (125) °C VCC = 300 V; VGE = ± 15 V td(on) tr IC = 50 A; Tj = 125 °C Rgon = Rgoff = 22 Ω td(off) tf inductive load Eon + Eoff Cies VCE = 25 V; VGE = 0 V, 1 MHz per IGBT Rthjh min. typ. max. Units – – – – – – – – V 2,1(2,2) 2,7(2,8) ns 120 60 ns 160 80 ns 500 330 ns 830 550 mJ – 7,3 nF – 2,8 K/W 1,0 – IGBT - Chopper * VCEsat IC = 30 A Tj = 25 (125) °C VCC = 300 V; VGE = ± 15 V td(on) tr IC = 30 A; Tj = 125 °C Rgon = Rgoff = 33 Ω td(off) tf inductive load Eon + Eoff Cies VCE = 25 V; VGE = 0 V, 1 MHz per IGBT Rthjh – – – – – – – – V 2,1(2,2) 2,7(2,8) ns 100 50 ns 160 80 ns 370 250 ns 750 500 mJ – 4,0 nF – 1,6 K/W 1,4 – Diode 2) - Inverter & Chopper VF = VEC IF = 50 A Tj = 25 (125) °C VTO Tj = 125 °C rT Tj = 125 °C IF = 50 A, VR = – 300 V IRRM diF/dt = – 800 A/µs Qrr Eoff VGE = 0 V, Tj = 125 °C per diode Rthjh – – – – – – – V 1,45(1,4) 1,7(1,7) V 0,9 0,85 mΩ 16 11 – A 50 – µC 5,0 – mJ 1,5 1,2 K/W – Diode - Rectifier VF IF = 25 A, Tj = 25 °C per diode Rthjh – – • Temperature Sensor RTS T = 25 / 100 °C Mechanical Data M1 case to heatsink, SI Units Case mechanical outline see page B 16 – 9 UL recognized file no. E63532 1,2 – – 2,6 – M3 Options • also available with faster IGBTs (type ... 063), data sheet on request 1) 2) Theatsink = 25 °C, unless otherwise specified CAL = Controlled Axial Lifetime Technology (soft and fast recovery) V K/W Ω 1000 / 1670 2 • specification of temperature sensor see part A common characteristics see page B16–3 2,5 * For diagrams of the Chopper IGBT please refer to SKiiP 22 NAB 06 © by SEMIKRON 0898 Nm B 16 – 31 Fig. 1 Typ. output characteristic, tp = 80 µs; 25 °C Fig. 2 Typ. output characteristic, tp = 80 µs; 125 °C Tj = 125 °C VCE = 300 V VGE = ± 15 V RG = 22 Ω Fig. 3 Turn-on /-off energy = f (IC) Tj = 125 °C VCE = 300 V VGE = ± 15 V IC = 50 A Fig. 4 Turn-on /-off energy = f (RG) ICpuls = 50 A Fig. 5 Typ. gate charge characteristic B 16 – 32 VGE = 0 V f = 1 MHz Fig. 6 Typ. capacitances vs. V CE 0698 © by SEMIKRON 2. Common characteristics of MiniSKiiP MiniSKiiP 600 V ICop / IC 1.2 Mini0607 Tj = 150 °C VGE = ≥ 15 V 1.0 0.8 0.6 0.4 0.2 0 0 25 50 75 100 125 150 Th [°C] Fig. 7 Rated current of the IGBT ICop / IC = f (Th) Tj = ≤ 150 °C VGE = ± 15 V tsc = ≤ 10 µs Lext < 25 nH Tj = ≤ 150 °C VGE = ± 15 V Fig. 9 Turn-off safe operating area (RBSOA) of the IGBT Fig. 10 Safe operating area at short circuit of the IGBT Fig. 11 Typ. freewheeling diode forward characteristic Fig. 12 Forward characteristic of the input bridge diode © by SEMIKRON 0698 B 16 – 3 MiniSKiiP 3 SKiiP 30 NAB 06 SKiiP 31 NAB 06 SKiiP 32 NAB 06 SKiiP 30 NAB 12 SKiiP 31 NAB 12 SKiiP 32 NAB 12 Circuit Case M3 Layout and connections for the customer’s printed circuit board