CS4350 192-kHz Stereo DAC with Integrated PLL Features Advanced multibit delta-sigma architecture 109-dB dynamic range -91-dB THD+N Popguard® technology for control of clicks and pops Hardware popguard disable for fast startups Supports all standard serial audio formats 24-bit conversion including time-division multiplexed (TDM) Supports audio sample rates up to 192 kHz +1.5- to 5.0-V logic supplies for serial port Low-latency digital filtering +3.3- to 5.0-V control port interface Single-ended or differential analog output Control Port Mode Features architecture Integrated PLL locks to incoming left-right clock – Eliminates the need for external masterclock routing – Reduces interference and jitter sensitivity – No external loop filter components required Automatic sample-rate range detection SPI™ and I²C Modes ATAPI mixing Mute control for individual channels Digital volume control with soft ramp – – – 127.5-dB attenuation 0.5-dB step size Zero-crossing click-free transitions 3.3 V to 5.0 V Reset PCM Serial Interface LRCK Recovered MCLK Level Translator 1.5 V to 5.0 V Serial Audio Input Register/ Hardware Configuration Interpolation Filter with Volume Control Multibit Modulator DAC Amp + Filter Left Channel Output Interpolation Filter with Volume Control Multibit Modulator DAC Amp + Filter Right Channel Output External Mute Control Left and Right Mute Controls RMCK Hardware or I2C/ SPI Control Data Level Translator 3.3 V to 5.0 V RMCK Phase Locked Loop Internal Voltage Reference and Regulation Copyright Cirrus Logic, Inc. 2006–2015 (All Rights Reserved) http://www.cirrus.com SEPT ‘15 DS691F3 CS4350 Description The CS4350 is a complete stereo digital-to-analog system including PLL-based master clock derivation, digital interpolation, 5th-order multibit delta-sigma digital-to-analog conversion, digital de-emphasis, volume control, channel mixing, and analog filtering. The advantages of this architecture include ideal differential linearity, no distortion mechanisms due to resistor matching errors, no linearity drift over time and temperature, high tolerance to clock jitter, and a minimal set of external components. The CS4350 supports all standard digital audio interface formats, including TDM. The CS4350 is available in a 24-pin QFN package in Commercial grade (-40° to +85°C). The CS4350 is available in a 24-pin TSSOP package in both Commercial (-40° to +85°C) and Automotive grades (-40° to +105°C). The CDB4350 Customer Demonstration board is also available for device evaluation and implementation suggestions. Please refer to “Ordering Information” on page 41 for complete ordering information. These features are ideal for cost-sensitive, two-channel audio systems, including DVD players and recorders, settop boxes, digital TVs, mini-component systems, mixing consoles and automotive audio systems. 2 DS691F3 CS4350 TABLE OF CONTENTS 1 PIN DESCRIPTION................................................................................................................................... 6 1.1 TSSOP Pinout ................................................................................................................................. 6 1.2 QFN Pinout ...................................................................................................................................... 6 2 CHARACTERISTICS AND SPECIFICATIONS........................................................................................ 8 2.1 Recommended Operating Conditions ............................................................................................. 8 2.2 Absolute Maximum Ratings ............................................................................................................. 8 2.3 DAC Analog Characteristics - Commercial (-CZZ,-CNZ)................................................................. 9 2.4 DAC Analog Characteristics - Automotive (-DZZ) ......................................................................... 10 2.5 Combined Interpolation and On-Chip Analog Filter Response...................................................... 12 2.6 Switching Specifications - Serial Audio Interface........................................................................... 13 2.7 Switching Characteristics - Control Port - I²C Format.................................................................... 14 2.8 Switching Characteristics - Control Port - SPI Format................................................................... 15 2.9 Digital Characteristics .................................................................................................................... 16 2.10 Power and Thermal Characteristics............................................................................................. 16 3 TYPICAL CONNECTION DIAGRAM ................................................................................................... 17 4 APPLICATIONS ..................................................................................................................................... 18 4.1 Sample Rate Range and Oversampling Mode Detect................................................................... 18 4.1.1 Sample Rate Auto-Detect .................................................................................................... 18 4.2 System Clocking ............................................................................................................................ 18 4.2.1 Recovered Master Clock (RMCK)........................................................................................ 18 4.3 Digital Interface Format ................................................................................................................. 19 4.3.1 Time-Division Multiplex (TDM) Mode ................................................................................... 20 4.4 De-Emphasis ................................................................................................................................. 21 4.5 Mute Control .................................................................................................................................. 21 4.6 Recommended Power-Up Sequence ............................................................................................ 21 4.6.1 Stand-Alone Mode ............................................................................................................... 21 4.6.2 Control Port Mode ................................................................................................................ 22 4.7 Popguard Transient Control .......................................................................................................... 22 4.7.1 Power-Up ............................................................................................................................. 22 4.7.2 Power-Down......................................................................................................................... 22 4.7.3 Discharge Time .................................................................................................................... 22 4.8 Analog Output and Filtering ........................................................................................................... 23 4.9 Grounding and Power Supply Arrangements ................................................................................ 23 4.9.1 Capacitor Placement............................................................................................................ 23 5 STAND-ALONE OPERATION................................................................................................................ 24 5.1 Serial Port Format Selection.......................................................................................................... 24 5.2 De-Emphasis Control .................................................................................................................... 24 5.3 Popguard Transient Control .......................................................................................................... 24 6 CONTROL PORT OPERATION ............................................................................................................. 24 6.1 MAP Auto Increment ..................................................................................................................... 24 6.2 I²C Mode ........................................................................................................................................ 24 6.2.1 I²C Write ............................................................................................................................... 25 6.2.2 I²C Read............................................................................................................................... 25 6.3 SPI Mode ....................................................................................................................................... 26 6.3.1 SPI Write .............................................................................................................................. 26 6.3.2 SPI Read.............................................................................................................................. 26 6.4 Memory Address Pointer (MAP) ................................................................................................... 27 6.4.1 INCR (Auto Map Increment Enable) .................................................................................... 27 6.4.2 MAP (Memory Address Pointer) .......................................................................................... 27 7 REGISTER QUICK REFERENCE .......................................................................................................... 28 8 REGISTER DESCRIPTION .................................................................................................................... 29 8.1 Device and Revision ID - Register 01h.......................................................................................... 29 DS691F3 3 CS4350 8.2 Mode Control - Register 02h ......................................................................................................... 29 8.2.1 Digital Interface Format (DIF[2:0]) Bits 6-4 .......................................................................... 29 8.2.2 De-Emphasis Control (DEM[1:0]) Bits 3-2 ........................................................................... 30 8.2.3 Functional Mode (FM[1:0]) Bits 1-0...................................................................................... 30 8.3 Volume Mixing and Inversion Control - Register 03h .................................................................... 30 8.3.1 Channel A Volume = Channel B Volume (VOLB=A) Bit 7 ................................................... 30 8.3.2 Invert Signal Polarity (INVERT_A) Bit 6 ............................................................................... 30 8.3.3 Invert Signal Polarity (INVERT_B) Bit 5 ............................................................................... 31 8.3.4 ATAPI Channel Mixing and Muting (ATAPI[3:0]) Bits 3-0 .................................................... 31 8.4 Mute Control - Register 04h .......................................................................................................... 32 8.4.1 Auto-Mute (AMUTE) Bit 7 .................................................................................................... 32 8.4.2 AMUTEC = BMUTEC (MUTEC A=B) Bit 5 .......................................................................... 32 8.4.3 Channel A Mute (MUTE_A) Bit 4 & Channel B Mute (MUTE_B) Bit 3................................. 32 8.5 Channel A & B Volume Control - Register 05h & 06h ................................................................... 33 8.6 Ramp and Filter Control - Register 07h ......................................................................................... 33 8.6.1 Soft Ramp and Zero Cross Control (SZC[1:0]) Bits 7-6 ....................................................... 33 8.6.2 Soft Volume Ramp-Up after Error (RMP_UP) Bit 5 ............................................................. 34 8.6.3 Soft Ramp-Down before Filter Mode Change (RMP_DN) Bit 4 ........................................... 34 8.6.4 Interpolation Filter Select (FILT_SEL) Bit 2.......................................................................... 34 8.7 Misc. Control - Register 08h .......................................................................................................... 34 8.7.1 Power Down (PDN) Bit 7...................................................................................................... 34 8.7.2 Freeze Controls (FREEZE) Bit 5.......................................................................................... 35 8.7.3 Popguard Enable (POPG_EN) Bit 4 .................................................................................... 35 8.7.4 RMCK control (RMCK_CTRL[1:0]) Bits 3:2 ......................................................................... 35 8.7.5 RMCK Ratio Select (R_SELECT[1:0]) Bits 2:1 .................................................................... 35 9 FILTER PLOTS ................................................................................................................................... 36 10 PARAMETER DEFINITIONS................................................................................................................ 37 11 PACKAGE DIMENSIONS .................................................................................................................... 38 11.1 24L TSSOP (4.4 mm body) Package Drawing ............................................................................ 38 11.2 24L QFN (4.00 mm BODY) PACKAGE DRAWING..................................................................... 39 12 THERMAL CHARACTERISTICS ......................................................................................................... 39 12.1 QFN Thermal Pad ....................................................................................................................... 40 13 ORDERING INFORMATION ................................................................................................................ 41 14 REVISION HISTORY ........................................................................................................................... 41 4 DS691F3 CS4350 LIST OF FIGURES Figure 1. Equivalent Output Load .............................................................................................................. 11 Figure 2. Maximum Loading....................................................................................................................... 11 Figure 3. THD+N vs Output Amplitude for VA = 5.0 V ............................................................................... 11 Figure 4. THD+N vs Output Amplitude for VA = 3.3 V ............................................................................... 11 Figure 5. THD+N vs Output Amplitude for VA = 3.14 V ............................................................................. 11 Figure 6. Serial Port Timing, Non-TDM Mode............................................................................................ 14 Figure 7. Serial Port Timing, TDM Mode.................................................................................................... 14 Figure 8. Control Port Timing - I²C Format................................................................................................. 14 Figure 9. Control Port Timing - SPI Mode .................................................................................................. 15 Figure 10. Typical Connection Diagram..................................................................................................... 17 Figure 11. Left-Justified up to 24-Bit Data.................................................................................................. 19 Figure 12. I²S, up to 24-Bit Data ................................................................................................................ 19 Figure 13. Right-Justified Data................................................................................................................... 19 Figure 14. TDM Mode Connection Diagram .............................................................................................. 20 Figure 15. TDM Mode Timing .................................................................................................................... 20 Figure 16. De-Emphasis Curve.................................................................................................................. 21 Figure 17. Differential to Single-Ended Output Filter ................................................................................. 23 Figure 18. Passive Single-Ended Output Filter .......................................................................................... 23 Figure 19. Control Port Timing, I²C Mode .................................................................................................. 26 Figure 20. Control Port Timing, SPI Mode ................................................................................................. 27 Figure 21. De-Emphasis Curve.................................................................................................................. 30 Figure 22. ATAPI Block Diagram ............................................................................................................... 31 Figure 23. Stopband Rejection (fast), all Modes ........................................................................................ 36 Figure 24. Stopband Rejection (slow), all Modes....................................................................................... 36 Figure 25. Single-Speed (fast) Passband Detail ........................................................................................ 36 Figure 26. Single-Speed (slow) Passband Detail....................................................................................... 36 Figure 27. Double-Speed (fast) Passband Detail....................................................................................... 36 Figure 28. Double-Speed (slow) Passband Detail ..................................................................................... 36 Figure 29. Quad-Speed (fast) Passband Detail ......................................................................................... 37 Figure 30. Quad-Speed (slow) Passband Detail........................................................................................ 37 LIST OF TABLES Table 1. Recommended Operating Conditions ............................................................................................ 8 Table 2. Absolute Maximum Ratings ........................................................................................................... 8 Table 3. DAC Analog Characteristics - Commercial (-CZZ,-CNZ) ............................................................... 9 Table 4. DAC Analog Characteristics - Automotive (-DZZ)........................................................................ 10 Table 5. Combined Interpolation and On-Chip Analog Filter Response .................................................... 12 Table 6. Switching Specifications - Serial Audio Interface ......................................................................... 13 Table 7. Switching Characteristics - Control Port - I²C Format .................................................................. 14 Table 8. Switching Characteristics - Control Port - SPI Format ................................................................. 15 Table 9. Digital Characteristics .................................................................................................................. 16 Table 10. Power and Thermal Characteristics ........................................................................................... 16 Table 11. CS4350 Auto-Detect .................................................................................................................. 18 Table 12. Digital Interface Format - Stand-Alone Mode............................................................................. 24 Table 13. Digital Interface Formats ............................................................................................................ 29 Table 14. ATAPI Decode ........................................................................................................................... 31 Table 15. Example Digital Volume Settings ............................................................................................... 33 Table 16. Thermal Characteristics ............................................................................................................. 39 DS691F3 5 CS4350 1 PIN DESCRIPTION TSSOP Pinout DIF2(AD1/CDOUT) 1 24 RST DEM(AD0/CS) 2 23 AOUTB- DIF0(SDA/CDIN) 3 22 AOUTB+ DIF1(SCL/CCLK) 4 21 BMUTEC VLC 5 20 VQ VD_FILT 6 19 GND GND 7 18 VA RMCK 8 17 VBIAS+ 16 AMUTEC SCLK 9 10 15 AOUTA+ SDIN 11 14 AOUTA- LRCK 12 13 TSTO VLS 6 DEM(AD0/CS) DIF2(AD1/CDOUT) RST AOUTB– AOUTB+ QFN Pinout DIF0(SDA_CDIN) 24 23 22 21 20 19 DIF1(SCL/CCLK) 1 18 BMUTEC VLC 2 17 VQ VD_FILT 3 16 GND GND 4 15 VA RMCK 5 14 VBIAS+ VLS 6 13 TSTO Thermal Pad Thermal Pad 7 8 9 10 11 12 LRCK AOUTA– AOUTA+ AMUTEC Top-Down (Through Package) View 24-Pin QFN Package SDIN 1.2 SCLK 1.1 DS691F3 CS4350 Pin Name TSSOP QFN Pin Description # # VLC 5 2 Control Interface Power (Input) - Positive power for the hardware/software control interface VD_FILT 6 3 Regulator Voltage (Output) - Filter connection for internal voltage regulator 7, 19 4,16 RMCK 8 5 Recovered Master Clock (Output) - Outputs a master clock derived from LRCK VLS 9 6 Serial Audio Interface Power (Input) - Positive power for the serial audio interface SCLK 10 7 Serial Clock (Input) - Serial bit-clock for the serial audio interface SDIN 11 8 Serial Audio Data Input (Input) - Input for two’s complement serial audio data LRCK 12 9 Left/Right Clock (Input) - Determines which channel, Left or Right, is currently active on the serial audio data line TSTO 13 13 Test Output - These pins need to be floating and not connected to any trace or plane. GND Ground (Input) - Ground reference AOUTA+,AOUTB+,- 14, 15, 11, 10 Differential Analog Outputs (Output) - The full-scale differential output level is specified in “DAC Ana22, 23 19, 20 log Characteristics - Commercial (-CZZ,-CNZ)” on page 9. AMUTEC BMUTEC 16, 21 12 18 Mute Control (Output) - Control signals for optional mute circuit. VBIAS+ 17 14 Positive Voltage Reference (Output) - Positive reference voltage for the internal DAC VA 18 15 Analog Power (Input) - Positive power supply for the analog section VQ 20 17 Quiescent Voltage (Output) - Filter connection for internal quiescent voltage RST 24 21 Reset (Input) - When pulled low, device will power down and reset all internal registers to their default settings. Control Port Definitions AD1/CDOUT 1 22 Address Bit 1/Serial Control Data Out (I/O) - Chip address bit 1 in I²C Mode or data output in SPI Mode AD0/CS 2 23 Address Bit 0/Chip Select (Input) - Chip address bit 0 in I²C Mode or Chip Select in SPI Mode SDA/CDIN 3 24 Serial Control Data In (I/O) - Input/Output for I²C data. Input for SPI data SCL/CCLK 4 1 Serial Control Port Clock (Input) - Serial clock for the control port interface Stand-Alone Definitions DIF0 DIF1 DIF2 1 3 4 24 1 22 Digital Interface Format (Input) - Defines the required relationship between the Left Right Clock, Serial Clock, and Serial Audio Data DEM 2 23 De-emphasis (Input) - Selects the standard 15 s/50 s digital de-emphasis filter response for 44.1 kHz sample rates Thermal Pad (QFN package only) Thermal Pad DS691F3 n/a — Thermal relief pad for optimized heat dissipation. See “QFN Thermal Pad” on page 39 for more information. 7 CS4350 2 CHARACTERISTICS AND SPECIFICATIONS 2.1 Recommended Operating Conditions GND = 0 V; all voltages with respect to ground. Table 1. Recommended Operating Conditions Parameters Symbol Min Typ Max Units VA 4.75 3.14 5.0 3.3 5.25 3.46 V V Serial Audio Interface power(Note 1) VLS 1.35 3.3 5.25 V Control Interface power Ambient Operating Temperature (Power Applied) Commercial (-CZZ,-CNZ) Automotive (-DZZ) VLC 3.14 3.3 5.25 V TA TA -40 -40 - +85 +105 °C °C DC Power Supply Analog power Notes: 1. RMCK output frequency is dependent on VLS. See Table 6 for supported RMCK frequencies with respect to VLS. 2.2 Absolute Maximum Ratings GND = 0 V; all voltages with respect to ground (Note 2). Table 2. Absolute Maximum Ratings Parameters DC Power Supply Analog power Serial Audio Interface power Control Interface power (Note 3) Serial Audio Interface Input Current Digital Input Voltage Control Interface Ambient Operating Temperature (power applied) Storage Temperature Symbol Min Max Units VA VLS -0.3 -0.3 6.0 6.0 V V VLC -0.3 6.0 V Iin VIN-LS VIN-LC TA Tstg -0.3 -0.3 -55 -65 ±10 VLS+ 0.4 VLC+ 0.4 125 150 mA V V °C °C Notes: 2. Operation beyond these limits may result in permanent damage to the device. Normal operation is not guaranteed at these extremes. 3. Any pin except supplies. 8 DS691F3 CS4350 2.3 DAC Analog Characteristics - Commercial (-CZZ,-CNZ) Test conditions (unless otherwise specified): VLS = VLC = 3.3 V; TA = 25° C; Input test signal is a 997 Hz sine wave; Valid with the recommended capacitor values on VD_FILT, VQ, VBIAS (as shown in the typical connection diagram in Figure 10) and output circuits as shown in Figure 17 and Figure 18; Fs = 48 kHz, 96 kHz, and 192 kHz; measurement bandwidth 10 Hz to 20 kHz. Table 3. DAC Analog Characteristics - Commercial (-CZZ,-CNZ) Parameter Symbol Min VA= 5.0 V Dynamic Range (Note 4) Total Harmonic Distortion + Noise (Note 4) 24-bit 16-bit 16-bit Unit 0 dB -20 dB -60 dB THD+N 0 dB -20 dB -60 dB 98/106 95/103 - 101/109 98/106 95/96 92/93 - dB dB dB dB - -91 -78/-86 -38/-46 -90 -72/-73 -32/-33 -86/-87 -35/-43 - dB dB dB dB dB dB VA= 3.3 V 24-bit Max Single-ended/Differential 24-bit A-Weighted unweighted 16-bit A-Weighted unweighted Dynamic Range (Note 4) Typ Single-ended/Differential A-Weighted unweighted A-Weighted unweighted Total Harmonic Distortion + Noise (Note 4) 24-bit 16-bit 98/106 95/103 - 101/109 98/106 95/96 92/93 - dB dB dB dB 0 dB -2 dB -20 dB THD+N -60 dB 0 dB -20 dB -60 dB - -86 -91/-93 -78/-86 -38/-46 -83 -72/-73 -32/-33 -77 -35/-43 - dB dB dB dB dB dB dB (1 kHz) - 100 - dB VA= 3.3 to 5.0 V Interchannel Isolation DC Accuracy Interchannel Gain Mismatch - 0.1 0.25 dB Gain Drift - -400 - ppm/°C Analog Output Full Scale Output Voltage - Single Ended 2.45 2.59 2.91 Vpp Full Scale Output Voltage - Differential 4.90 5.18 5.82 Vpp Quiescent Voltage Max DC Current draw from an AOUT pin Max Current draw from VQ VQ - 0.5•VA - VDC IOUTmax - 10 - A IQmax - 100 - A Max AC-Load Resistance (Note 5) RL - 3 - k Max Load Capacitance (Note 5) CL - 100 - pF ZOUT - 100 - Output Impedance Notes: 4. One LSB of triangular PDF dither is added to data 5. RL and CL represent the minimum resistance and maximum capacitance required for the CS4350’s internal op-amp to remain stable. See Figure 1 and Figure 2 for more details. DS691F3 9 CS4350 2.4 DAC Analog Characteristics - Automotive (-DZZ) Test conditions (unless otherwise specified): VLS = 1.35 V to 5.25 V, VLC = 3.14 V to 5.25 V, TA = -40° C to 105° C, input test signal is a 997 Hz sine wave; Valid with the recommended capacitor values on VFILT, VQ, VBIAS (as shown in the typical connection diagram in Figure 10) and output circuits as shown in Figure 17 and Figure 18; Fs = 48 kHz, 96 kHz, and 192 kHz; Measurement bandwidth 10 Hz to 20 kHz. Table 4. DAC Analog Characteristics - Automotive (-DZZ) Parameter Symbol Min VA= 4.75 V to 5.25 V Dynamic Range (Note 4) 24-bit 16-bit 16-bit 24-bit 16-bit 0 dB -20 dB -60 dB THD+N 0 dB -20 dB -60 dB 101/109 98/106 95/96 92/93 - dB dB dB dB - -91 -78/-86 -38/-46 -90 -72/-73 -32/-33 -85 -32/-40 - dB dB dB dB dB dB Single-ended/Differential A-Weighted unweighted A-Weighted unweighted Total Harmonic Distortion + Noise (Note 6) 24-bit 16-bit Unit 95/103 92/100 - VA= 3.14 V to 3.46 V Dynamic Range (Note 4) Max Single-ended/Differential A-Weighted unweighted A-Weighted unweighted Total Harmonic Distortion + Noise (Note 4) 24-bit Typ 94/103 91/100 - 101/109 98/106 95/96 92/93 - dB dB dB dB -1 dB -2 dB -20 dB THD+N -60 dB 0 dB -20 dB -60 dB - -89 -91/-93 -78/-86 -38/-46 -83 -72/-73 -32/-33 -83 -31/-40 - dB dB dB dB dB dB dB (1 kHz) - 100 - dB VA= 3.14 to 5.25 V Interchannel Isolation DC Accuracy Interchannel Gain Mismatch - 0.1 0.25 dB Gain Drift - -400 - ppm/°C Analog Output Full Scale Output Voltage - Single Ended 2.55 2.78 3.03 Vpp Full Scale Output Voltage - Differential 5.10 5.56 6.06 Vpp Quiescent Voltage Max DC Current draw from an AOUT pin Max Current draw from VQ Max AC-Load Resistance (Note 5) Max Load Capacitance (Note 5) Output Impedance Note: 10 VQ - 0.5•VA - VDC IOUTmax - 10 - A IQmax - 100 - A RL - 3 - k CL - 100 - pF ZOUT - 100 - 6. One-half LSB of triangular PDF dither is added to data. Also, see Figure 3, Figure 4, and Figure 5 for more details on the CS4350-DZZ THD+N performance with 0dB input signal. DS691F3 CS4350 Capacitive Load -- C L (pF) 125 CS4350 AOUTx 3.3 µF + Analog Output RL CL 100 75 Safe Operating Region 50 25 GND 2.5 3 Figure 1. Equivalent Output Load 5 10 15 20 Resistive Load -- RL (k ) Figure 2. Maximum Loading Figures 3 through 5 show typical THD+N performance for CS4350 devices that exhibit the maximum full scale output voltages as specified in the DAC Analog Characteristics tables (see page 9 and 10). With decreasing VA, THD+N performance is increasingly affected by the full scale output voltage and temperature, with higher full scale output voltage and lower temperatures corresponding to lower THD+N performance. -30 -30 TA = -40° C TA = 25° C TA = 85° C -40 -40 -50 THD+N (dB) THD+N (dB) -50 -60 -70 -60 -70 -80 -80 -90 -90 -100 0 TA = -40° C TA = 25° C TA = 85° C -0.5 -1 -1.5 -2 Output Amplitude(dB) -2.5 -3 Figure 3. THD+N vs Output Amplitude for VA = 5.0 V -30 -100 0 -0.5 -1 -1.5 -2 Output Amplitude(dB) -2.5 -3 Figure 4. THD+N vs Output Amplitude for VA = 3.3 V TA = -40° C TA = 25° C TA = 85° C -40 THD+N (dB) -50 -60 -70 -80 -90 -100 0 -0.5 -1 -1.5 -2 Output Amplitude(dB) -2.5 -3 Figure 5. THD+N vs Output Amplitude for VA = 3.14 V DS691F3 11 CS4350 2.5 Combined Interpolation and On-Chip Analog Filter Response The filter characteristics have been normalized to the sample rate (Fs) and is referenced to the desired sample rate by multiplying the given characteristic by Fs. Amplitude vs. Frequency plots of this data are available in the “Filter Plots” on page 36. Table 5. Combined Interpolation and On-Chip Analog Filter Response Parameter Min Typ Max Unit -0.01 dB corner (Single Speed) 0 - .454 Fs -0.1 dB corner (Double Speed) 0 - .42 Fs -0.2 dB corner (Quad Speed) 0 - .27 Fs -3 dB corner (All Speed Modes) 0 - .499 Fs Single Speed -0.01 - +0.01 dB Double Speed, Quad Speed -0.02 - +0.02 dB 0.547 - - Fs 102 - - dB TDM Slot 0 Channel B - 8.4/Fs - s All Other Interface Formats and TDM Slots/Channels - 9.4/Fs - s Intrachannel Phase Deviation - - ±0.56/Fs s Interchannel Phase Deviation - - 0 s Fast Roll-Off Passband (Note 7) Frequency Response 10 Hz to 20 kHz StopBand Stop-Band Attenuation (Note 8) Total Group Delay (Fs - Output Sample Rate) De-emphasis Error (Note 9) (Relative to 1 kHz) Fs = 32 kHz - - ±0.23 dB Fs = 44.1 kHz - - ±0.14 dB Fs = 48 kHz - - ±0.09 dB 0 - 0.417 Fs Slow Roll-Off (Note 10) Passband (Note 7) -0.01 dB corner (Single Speed) -0.1 dB corner (Double Speed) 0 - .37 Fs -0.2 dB corner (Quad Speed) 0 - .27 Fs -3 dB corner (All Speed Modes) Frequency Response 10 Hz to 20 kHz 0 - .499 Fs Single Speed -0.01 - +0.01 dB Double Speed, Quad Speed -0.02 - +0.02 dB .583 - - Fs 64 - - dB - 5.5/Fs - s StopBand Stop-Band Attenuation (Note 8) Total Group Delay (Fs - Output Sample Rate) TDM Slot 0 Channel B All Other Interface Formats and TDM Slots/Channels Intrachannel Phase Deviation Interchannel Phase Deviation De-emphasis Error (Note 9) (Relative to 1 kHz) Fs = 32 kHz - 6.5/Fs - s - - ±0.14/Fs s - - 0 s - - ±0.23 dB Fs = 44.1 kHz - - ±0.14 dB Fs = 48 kHz - - ±0.09 dB Notes: 7. Response is clock dependent. 8. The Measurement Bandwidth is from stopband to 3 Fs. 9. De-emphasis is available only in Single-Speed Mode; Only 44.1 kHz De-emphasis is available in StandAlone Mode. 10. Slow Roll-off interpolation filter is only available in Control Port Mode. 12 DS691F3 CS4350 2.6 Switching Specifications - Serial Audio Interface Inputs: Logic 0 = GND; Logic 1 = VLS; CL = 20 pF. Table 6. Switching Specifications - Serial Audio Interface Parameters RMCK Output Frequency (Note 11) Symbol VLS=1.5 V nominal Min Max Unsupported Units MHz VLS=1.62 V or above 7.680 16.896 MHz VLS=2.97 V or above 7.680 55.3 MHz 45 55 % 30 54 60 108 120 216 40 60 % 3.14 V VA 5.25 V and 1.35 V VLS 5.25 V RMCK Output Duty Cycle Input Sample Rate Single-Speed Mode Double-Speed Mode Fs Quad-Speed Mode LRCK Duty Cycle (Non-TDM Mode) kHz SDIN Setup Time Before SCLK Rising Edge tds 1 - ns SDIN Hold Time After SCLK Rising Edge tdh 8 - ns - 55.3 MHz 4.75 V VA 5.25 V and 3.14 V VLS 5.25 V SCLK Frequency SCLK High Time tsckh 6 - ns SCLK Low Time tsckl 6 - ns LRCK Edge to SCLK Rising Edge tlcks 11 - ns SCLK Rising Edge to LRCK Edge tlckd 1 - ns Non-TDM Mode (refer to Figure 6) TDM Mode (refer to Figure 7) tlrckh 20 - ns SCLK Rising to LRCK Falling Edge tfsh 3 - ns LRCK Rising Edge to SCLK Rising Edge tfss 1 - ns - 27.7 MHz tsckh 11 - ns tsckl 11 - ns LRCK Edge to SCLK Rising Edge tlcks 16 - ns SCLK Rising Edge to LRCK Edge tlckd 1 - ns tlrckh 25 - ns SCLK Rising to LRCK Falling Edge tfsh 8 - ns LRCK Rising Edge to SCLK Rising Edge tfss 1 - ns LRCK High Time 3.14 V VA < 4.75 V or 1.35 V VLS < 3.14 V SCLK Frequency SCLK High Time SCLK Low Time Non-TDM Mode (refer to Figure 6) TDM Mode (refer to Figure 7) LRCK High Time Note: 11. RMCK output frequency depends on the input LRCK frequency. See Section 4.1 and Section 4.2 for more details. DS691F3 13 CS4350 tlrckh LRCK (input) tlckd tlcks LRCK tsckl tsckh (Input) tfsh tfss tsckh tsckl SCLK SCLK (input) (Input) tds tdh SDIN tds MSB (input) SDIN MSB-1 MSB (Input) Figure 6. Serial Port Timing, Non-TDM Mode 2.7 tdh MSB-1 Figure 7. Serial Port Timing, TDM Mode Switching Characteristics - Control Port - I²C Format Inputs: Logic 0 = GND; Logic 1 = VLC; CL = 20 pF. Table 7. Switching Characteristics - Control Port - I²C Format Parameter Symbol Min Max Unit SCL Clock Frequency fscl - 100 kHz RST Rising Edge to Start tirs 500 - ns Bus Free Time Between Transmissions tbuf 4.7 - µs Start Condition Hold Time (prior to first clock pulse) thdst 4.0 - µs Clock Low time tlow 4.7 - µs Clock High Time thigh 4.0 - µs Setup Time for Repeated Start Condition tsust 4.7 - µs SDA Hold Time from SCL Falling (Note 12) thdd 0 - µs tsud 250 - ns Rise Time of SCL and SDA SDA Setup time to SCL Rising trc, trc - 1 µs Fall Time SCL and SDA tfc, tfc - 300 ns Setup Time for Stop Condition tsusp 4.7 - µs Acknowledge Delay from SCL Falling tack 300 1000 ns Note: 12. Data must be held for sufficient time to bridge the transition time, tfc, of SCL. RST t irs Stop R e p e ate d S ta rt S tart t rd t fd Stop SDA t buf t t hdst t high t fc hdst t susp SCL t lo w t hdd t sud t ack t sust t rc Figure 8. Control Port Timing - I²C Format 14 DS691F3 CS4350 2.8 Switching Characteristics - Control Port - SPI Format Inputs: Logic 0 = GND; Logic 1 = VLC; CL = 20 pF. Table 8. Switching Characteristics - Control Port - SPI Format Parameter Symbol Min Max Unit CCLK Clock Frequency fsclk - 6 MHz RST Rising Edge to CS Falling tsrs 500 - ns CCLK Edge to CS Falling (Note 13) tspi 500 - ns CS High Time Between Transmissions tcsh 1.0 - µs CS Falling to CCLK Edge tcss 20 - ns CCLK Low Time tscl 66 - ns CCLK High Time tsch 66 - ns CDIN to CCLK Rising Setup Time tdsu 40 - ns CCLK Rising to DATA Hold Time (Note 14) tdh 15 - ns Rise Time of CCLK and CDIN (Note 15) tr2 - 100 ns Fall Time of CCLK and CDIN (Note 15) tf2 - 100 ns Transition Time from CCLK to CDOUT Valid (Note 16) tscdov - 100 ns Time from CS rising to CDOUT High-Z tcscdo - 100 ns Notes: 13. tspi only needed before first falling edge of CS after RST rising edge. tspi = 0 at all other times. 14. Data must be held for sufficient time to bridge the transition time of CCLK. 15. For FSCK < 1 MHz. 16. CDOUT should not be sampled during this time. RST t srs CS t spi t css t scl t sch t csh CCLK t r2 t f2 CDIN t dsu t dh Hi-Impedance CDOUT t scdov t scdov t cscdo Figure 9. Control Port Timing - SPI Mode DS691F3 15 CS4350 2.9 Digital Characteristics Table 9. Digital Characteristics Parameters High-Level Input Voltage Symbol Min Typ Max Units VLC or VLS = 3.3 V VIH VIH 0.7•VL 2.0 - - V V VLS = 2.5 V VIH 1.7 - - V VLS = 1.5 V VLC or VLS = 5.0 V VIH 0.75•VL - - V VLC or VLS = 3.3 V VIL VIL - - 0.35•VL 0.8 V V VLS = 2.5 V VIL - - 0.7 V VLS = 1.5 V VIL - - 0.25•VL V Iin 8 - ±10 - A pF V VLC or VLS = 5.0 V Low-Level Input Voltage Input Leakage Current Input Capacitance High Level Output Voltage (RMCK) IO = 2 mA (VLS 3.0V) VOH VLS-1.0 Low Level Output Voltage (RMCK) IO = -2 mA (VLS 3.0V) VOL - - 0.4 V VOH VOL - 2 VA 0 10 - pF mA V V Symbol Min Typ Max Units IA IA ILS - 28 24 4 34 29 6 mA mA mA RMCK Output Load Drive Maximum MUTEC Drive Current MUTEC High-Level Output Voltage MUTEC Low-Level Output Voltage 2.10 Power and Thermal Characteristics Table 10. Power and Thermal Characteristics Parameters Power Supply Current - Normal Operation (Note 17) VA= 5.0 V VA= 3.3 V VLS = VLC =5.0 V (Note 18) VLS = VLC =3.3 V (Note 18) ILS - 2 5 mA VLS = VLC = 5.0 V (Note 19) ILC - 14 18 mA VLS = VLC = 3.3 V (Note 19) ILC - 14 18 mA Ipd - 100 - A - 230 132 290 171 mW mW - 0.5 0.33 60 50 - mW mW dB dB Power Supply Current - Power-Down State (Note 20) VA, VLS, VLC Power Dissipation - Normal Operation (Note 17) VA = VLC= VLS = 5.0 V VA = VLC= VLS = 3.3 V Power Dissipation - Power-Down State (Note 20) VA = VLC= VLS = 5.0 V VA = VLC= VLS = 3.3 V Power Supply Rejection Ratio (Note 21) (1 kHz) (60 Hz) PSRR PSRR Notes: 17. Current consumption increases with increasing Fs within the range of a speed mode. Variance between speed modes is small. Typ and Max values are based on Fs = 48 kHz. 18. ILS measured with no external loading on pin 7 (RMCK). 19. ILC measured with no external loading on pin 2 (SDA). 20. Power-down mode is defined as RST pin = Low with all clock and data lines held static. 21. Valid with the recommended capacitor values on VFILT, VQ, and VBIAS+ as shown in the typical connection diagram in Figure 10. 16 DS691F3 CS4350 3 TYPICAL CONNECTION DIAGRAM +3.3 V or +5 V + 0.1 µF VLS = PopGuard Enable GND = PopGuard Disable 10 µF VA + VBIAS+ 47 k RMCK Digital Audio Source 10 µF VD_FILT LRCK 0.1 µF + SCLK 10 µF SDIN +1.5 V to +5 V VLS AMUTEC 0.1 µF AOUTA+ AOUTA- CS4350 Differential or Singleended Output Filter AOUTA Differential or Singleended Output Filter AOUTB VLC +3.3 V to +5 V BMUTEC 0.1 µF AOUTB+ RST DIF1(SCL/CCLK) DIF0(SDA/CDIN) VQ DEM(AD0/CS) GN D TS TO DIF2(AD1/CDOUT) Thermal Pad (QFN only) GN D µ C/ Mode Configuration AOUTB- + 3.3 µF N.C. Figure 10. Typical Connection Diagram DS691F3 17 CS4350 4 APPLICATIONS 4.1 Sample Rate Range and Oversampling Mode Detect The device operates in one of three oversampling modes based on the input sample rate. In Control Port Mode, the allowed sample rate range in each mode will depend on how the FM[1:0] bits are configured. In Stand-Alone Mode, the sample rate range will be according to Table 11. 4.1.1 Sample Rate Auto-Detect The Auto-Detect feature is enabled by default. In this state, the CS4350 will auto-detect the correct mode when the input sample rate (Fs), defined by the LRCK frequency, falls within one of the ranges shown in Table 11. Sample rates outside the specified range for each mode are not supported when Auto-Detect is enabled. Table 11. CS4350 Auto-Detect Input Sample Rate (Fs) Mode 30 kHz - 54 kHz 60 kHz - 108 kHz 120 kHz - 216 kHz Single-Speed Mode Double-Speed Mode Quad-Speed Mode In Control Port Mode, the Auto-Detect feature can be disabled by the Functional Mode (FM[1:0]) bits in the control port register 02h. In this state, the CS4350 will not auto-detect the correct mode based on the input sample rate (Fs). The operational mode must then be set manually according to one of the ranges referred to in Section 8.2.3. Sample rates outside the specified range for each mode are not supported. In Stand-Alone Mode it is not possible to disable auto-detect of sample rates. 4.2 System Clocking The device requires external generation of the left/right (LRCK) and serial (SCLK) clocks. The left/right clock frequency is equal to the input sample rate (Fs). Refer to Section 4.3 for the required SCLK-to-LRCK timing associated with the selected digital interface format, and “Switching Specifications - Serial Audio Interface” on page 13 for the maximum allowed clock frequencies. 4.2.1 Recovered Master Clock (RMCK) The CS4350 generates a high-frequency master clock (RMCK) which it derives from the LRCK input, available on the RMCK pin. In Stand-Alone Mode, the frequency of RMCK is equal to 256 x LRCK in Single-Speed and Double-Speed Mode; and 128 x LRCK in Quad-Speed Mode. In Control-Port Mode, the frequency of the RMCK signal can be selected through register 08h (see Section 8.7 on page 34 for more details). 18 DS691F3 CS4350 4.3 Digital Interface Format The device will accept audio samples in 1 of 8 digital interface formats, as shown in Table 12 on page 24 for Stand-Alone Mode and Table 13 on page 29 for Control Port Mode. The desired serial audio interface format is selected via the DIF[2:0] bits in Control Port Mode (see Section 8.2.1), or the DIF[2:0] pins in Stand-Alone Mode (see Section 5.1). For illustrations of the required relationship between LRCK, SCLK and SDIN, see Figures 11-13. For all formats, SDIN is valid on the rising edge of SCLK. For more information about serial audio formats, refer to the Cirrus Logic Application Note AN282, The 2-Channel Serial Audio Interface: A Tutorial, available at www.cirrus.com. LRCK Left Channel Right Channel SCLK SDIN MSB -1 -2 -3 -4 +5 -5 +4 +3 +2 +1 MSB LSB -1 -2 -3 +5 -4 +4 +3 +2 +1 LSB Figure 11. Left-Justified up to 24-Bit Data Right Channel Left Channel LRCK SCLK SDIN MSB -1 -2 -3 -4 +5 -5 +4 +3 +2 +1 LSB MSB -1 -2 -3 +5 -4 +4 +3 +2 +1 LSB Figure 12. I²S, up to 24-Bit Data LRCK Right Channel Left Channel SCLK SDIN LSB MSB -1 -2 -3 -4 -5 +7 +6 +5 +4 +3 +2 +1 LSB MSB -1 -2 -3 -4 -5 +7 +6 +5 +4 +3 +2 +1 LSB Figure 13. Right-Justified Data DS691F3 19 CS4350 4.3.1 Time-Division Multiplex (TDM) Mode Four TDM interface modes are available that allow the CS4350 to input stereo PCM data in one of 4 time “slots”. Figure 14 shows the serial port connections necessary to input 8-channel TDM data into four CS4350 devices, and the corresponding DIF[2:0] pin or register-bit settings required for each CS4350. Figure 15 shows the TDM data format for each of the four CS4350 devices shown in Figure 14. Note: The group delay for TDM slot 0 channel B differs from the group delay of all other interface formats and TDM slots/channels by one sample. Refer to the group delay specification in the combined interpolation and on-chip analog filter response specifications table. . LRCK CS43501 CS43502 CS43503 CS43504 DIF[2:0] = 100 DIF[2:0] = 101 DIF[2:0] = 110 DIF[2:0] = 111 LRCK ILRCK LRCK LRCK SCLK ISCLK SCLK SCLK SDIN SDIN SDIN SDIN SCLK TDM_OUT TDM Source Figure 14. TDM Mode Connection Diagram 256 clks LRCK SCLK SDIN1 MSB MSB MSB MSB MSB MSB MSB MSB Slot 0, ch A Slot 0, ch B Slot 1, ch A Slot 1, ch B Slot 2, ch A Slot 2, ch B Slot 3, ch A Slot 3, ch B 32 clks 32 clks 32 clks 32 clks 32 clks 32 clks 32 clks 32 clks Data MSB LSB zero Figure 15. TDM Mode Timing 20 DS691F3 CS4350 4.4 De-Emphasis The device includes on-chip digital de-emphasis. Figure 16 shows the de-emphasis curve for Fs equal to 44.1 kHz. The frequency response of the de-emphasis curve will scale proportionally with changes in sample rate, Fs. Gain dB T1=50 µs 0dB T2 = 15 µs -10dB F1 3.183 kHz F2 Frequency 10.61 kHz Figure 16. De-Emphasis Curve Note: 4.5 De-emphasis is only available in Single-Speed Mode. Mute Control The mute control pins (AMUTEC and BMUTEC) go active during power-up initialization, reset, muting (see Section 8.4.3), and loss of LRCK. These pins are intended to be used as control for external mute circuits to prevent the clicks and pops that can occur in any single-ended single-supply system. Use of the mute control function is not mandatory but recommended for designs requiring the absolute minimum in extraneous clicks and pops. Also, use of the Mute Control function can enable the system designer to achieve idle-channel noise and signal-to-noise ratios which are only limited by the external mute circuit. 4.6 Recommended Power-Up Sequence 4.6.1 Stand-Alone Mode 1. Hold RST low until the power supplies and configuration pins are stable and the left/right clock is fixed to the appropriate frequencies, as discussed in Section 4.2. In this state, the control port registers are reset to their default settings, VQ will remain low, and VBIAS will be connected to VA. 2. Bring RST high. The device will remain in a low power state with VQ low for approximately 192 LRCK cycles in Single-Speed Mode (384 LRCK cycles in Double-Speed Mode, and 768 LRCK cycles in Quad-Speed Mode). 3. The device will then initiate the power up sequence which lasts approximately 130 ms when the Popguard is disabled. If the Popguard is enabled, see Section 4.7 for a complete description of power-up timing. DS691F3 21 CS4350 4.6.2 Control Port Mode 1. Hold RST low until the power supply is stable and the left/right clock is fixed to the appropriate frequency, as discussed in Section 4.2. In this state, the control port is reset to its default settings, VQ will remain low, and VBIAS will be connected to VA. 2. Bring RST high. The device will remain in a low-power state with VQ low. 3. Perform a control port write to a valid register prior to the completion of approximately 192 LRCK cycles in Single-Speed Mode (384 LRCK cycles in Double-Speed Mode, and 768 LRCK cycles in Quad-Speed Mode). The desired register settings can be loaded while keeping the PDN bit set to 1. 4. Set the PDN bit to 0. This will initiate the power-up sequence, which lasts approximately 130 ms when the Popguard is disabled. If the Popguard is enabled, see Section 4.7 for a complete description of power-up timing. 4.7 Popguard Transient Control The CS4350 uses a novel technique to minimize the effects of output transients during power-up and powerdown. This technology, when used with external DC-blocking capacitors in series with the audio outputs, minimizes the audio transients commonly produced by single-ended single-supply converters. It is activated inside the DAC when the RST pin is toggled and requires no other external control, aside from choosing the appropriate DC-blocking capacitors. 4.7.1 Power-Up When the device is initially powered-up, the audio outputs, AOUTA and AOUTB, are clamped to GND. Following a delay of approximately 192 sample periods, each output begins to ramp toward the quiescent voltage. The amount of time it takes the outputs to ramp is related to the value of the DC-blocking capacitance and the output load. Using the example output circuit from Figure 18, the ramp up time will be approximately 0.25 seconds. When the ramp is complete, the outputs reach VQ and audio output begins. This gradual voltage ramping allows time for the external DC-blocking capacitors to charge to the quiescent voltage, minimizing audible power-up transients. Note the ramp up time will vary due to internal factors such as variance across device process, supply voltage, and die temperature corners as well as external output circuit component tolerances. 4.7.2 Power-Down To prevent audible transients at power-down, the device must first enter its power-down state. When this occurs, audio output ceases and the internal output buffers are disconnected from AOUTA and AOUTB. In their place, a soft-start current sink is substituted which allows the DC-blocking capacitors to slowly discharge. Once this charge is dissipated, the power to the device may be turned off, and the system is ready for the next power-on. 4.7.3 Discharge Time To prevent an audio transient at the next power-on, the DC-blocking capacitors must fully discharge before turning on the power or exiting the power-down state. If full discharge does not occur, a transient will occur when the audio outputs are initially clamped to GND. The time that the device must remain in the power-down state is related to the value of the DC-blocking capacitance and the output load. For example, with a 3.3 µF capacitor, the minimum power-down time will be approximately 0.2 seconds. 22 DS691F3 CS4350 4.8 Analog Output and Filtering The Cirrus Application Note titled Design Notes for a 2-Pole Filter with Differential Input, available as AN48 at www.cirrus.com, discusses the second-order Butterworth filter and differential-to-single-ended converter that was implemented on the CS4350 evaluation board, CDB4350. Figure 17 illustrates this implementation. If only single-ended outputs from the CS4350 are required, the passive output filter shown in Figure 18 can be used. 5600 pF CS4350 4.02 k 1000 pF C0G 392 4.64 k AOUTx AOUTx + 1.62 k C0G + 221 Analog Output 47 k C0G 1.37 k C0G 562 2700 pF .015 F GND 22 F 22 F * See section 4.9 for ground connection details Figure 17. Differential to Single-Ended Output Filter CS4350 3.3 µF AOUTx + + 560 10 k Analog Output 2200 pF GND * See section 4.9 for ground connection details Figure 18. Passive Single-Ended Output Filter 4.9 Grounding and Power Supply Arrangements As with any high-resolution converter, the CS4350 requires careful attention to power supply and grounding arrangements if its potential performance is to be realized. Figure 10 shows the recommended power arrangements, with VA, VLC, and VLS connected to clean supplies. The use of split analog and digital ground planes is not recommended. However, if planes are split between digital ground and analog ground the GND pins of the CS4350 should be connected to the analog ground plane. All signals, especially clocks, should be kept away from the VBIAS, VFILT, and VQ pins in order to avoid unwanted coupling into the DAC. 4.9.1 Capacitor Placement Decoupling capacitors should be placed as close to the DAC as possible, with the low value ceramic capacitor being the closest. To further minimize impedance, these capacitors should be located on the same layer as the DAC. If desired, all supply pins may be connected to the same supply, but a decoupling capacitor should still be placed on each supply pin. Note: All decoupling capacitors should be referenced to GND. The CDB4350 evaluation board demonstrates the optimum layout and power supply arrangements. DS691F3 23 CS4350 5 STAND-ALONE OPERATION 5.1 Serial Port Format Selection The desired serial audio format is selected with the DIF2, DIF1 and DIF0 pins. For an explanation of the required relationship between the LRCK, SCLK and SDIN, see Figures 11-13. For all formats, SDIN is valid on the rising edge of SCLK. TDM Mode requires the selection of which stereo pair time “slot” is used to output data as shown in Table 12 and Figure 15. Note: The group delay for TDM slot 0 channel B differs from the group delay of all other interface formats and TDM slots/channels by one sample. Refer to the group delay specification in the combined interpolation and on-chip analog filter response specifications table. DIF2 DIF1 DIF0 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 DESCRIPTION Left-Justified, up to 24-bit data I²S, up to 24-bit data Right-Justified, 16-bit data Right-Justified, 24-bit data TDM slot 0 TDM slot 1 TDM slot 2 TDM slot 3 FORMAT FIGURE 0 1 2 3 4 5 6 7 12 11 13 13 15 15 15 15 Table 12. Digital Interface Format - Stand-Alone Mode 5.2 De-Emphasis Control When pulled to VLC, the DEM pin activates the 44.1 kHz de-emphasis filter. When pulled to GND, the DEM pin turns off the de-emphasis filter. 5.3 Popguard Transient Control In Stand-Alone Mode, Popguard is selected by placing a 47 k resistor between RMCK and VLS. Popguard is defeated in Stand-Alone Mode by placing a 47 k resistor between RMCK and ground. 6 CONTROL PORT OPERATION The control port is used to load all the internal register settings (see ”Register Description” on page 29). The operation of the control port may be completely asynchronous with the audio sample rate. However, to avoid potential interference problems, the control port pins should remain static if no operation is required. The control port can operate in I²C or SPI mode. 6.1 MAP Auto Increment The device has a MAP (memory address pointer) auto-increment capability enabled by the INCR bit (also the MSB) of the MAP. If INCR is set to 0, MAP will stay constant for consecutive writes or reads. If INCR is set to 1, MAP will auto increment after each byte is read or written, allowing block reads or writes of consecutive registers. 6.2 I²C Mode In the I²C Mode, data is clocked into and out of the bi-directional serial control data line, SDA, by the serial control port clock, SCL (see Figure 19 for the clock to data relationship). There is no CS pin. AD1 and AD0 24 DS691F3 CS4350 enable the user to alter the chip address (10010[AD1][AD0][R/W]) and should be tied to VLC or GND as required before powering up the device. SPI Mode will be selected if the device ever detects a high to low transition on the AD0/CS pin after power-up. 6.2.1 I²C Write To write to the device, follow the procedure below while adhering to the control port Switching Specifications in ”Switching Characteristics - Control Port - I²C Format” on page 14. 1. Initiate a START condition to the I²C bus followed by the address byte. The upper 5 bits must be 10010. The sixth and seventh bit must match the settings of the AD1 and AD0 pins respectively, and the eighth must be 0 (the eighth bit of the address byte is the R/W bit). 2. Wait for an acknowledge (ACK) from the part, then write to the memory address pointer, MAP. This byte points to the register to be written. 3. Wait for an acknowledge (ACK) from the part, then write the desired data to the register pointed to by the MAP. 4. If the INCR bit (see Section 6.1) is set to 1, repeat the previous step until all the desired registers are written, then initiate a STOP condition to the bus. 5. If the INCR bit is set to 0 and further I²C writes to other registers are desired, it is necessary to initiate a repeated START condition and follow the procedure detailed from step 1. If no further writes to other registers are desired, initiate a STOP condition to the bus. 6.2.2 I²C Read To read from the device, follow the procedure below while adhering to the control port switching specifications in ”Switching Characteristics - Control Port - I²C Format” on page 14. 1. Initiate a START condition to the I²C bus followed by the address byte. The upper 5 bits must be 10010. The sixth and seventh bits must match the setting of the AD1 and AD0 pins, respectively, and the eighth must be 1. The eighth bit of the address byte is the R/W bit. 2. After transmitting an acknowledge (ACK), the device will then transmit the contents of the register pointed to by the MAP. The MAP register will contain the address of the last register written to the MAP or the default address (see Section 6.4.2) if an I²C read is the first operation performed on the device. 3. Once the device has transmitted the contents of the register pointed to by the MAP, issue an ACK. 4. If the INCR bit is set to 1, the device will continue to transmit the contents of successive registers. Continue providing a clock and issue an ACK after each byte until all the desired registers are read; then initiate a STOP condition to the bus. 5. If the INCR bit is set to 0 and further I²C reads from other registers are desired, it is necessary to initiate a repeated START condition and follow the procedure detailed from steps 1 and 2 from the I²C Write instructions, followed by step 1 of the I²C Read section. If no further reads from other registers are desired, initiate a STOP condition to the bus. DS691F3 25 CS4350 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 24 25 26 27 28 SCL CHIP ADDRESS SDA 1 0 0 1 0 AD1 AD0 R/W MAP BYTE INC 6 ACK 5 4 3 2 1 0 7 6 1 ACK DATA +n DATA +1 DATA 0 7 6 1 0 7 6 1 ACK 0 ACK STOP START Figure 19. Control Port Timing, I²C Mode 6.3 SPI Mode In SPI Mode, data is clocked into the serial control data line, CDIN, by the serial control port clock, CCLK (see Figure 20 for the clock to data relationship). There are no AD0 or AD1 pins. Pin CS is the chip select signal and is used to control SPI writes to the control port. When the device detects a high-to-low transition on the AD0/CS pin after power-up, SPI Mode will be selected. All signals are inputs and data is clocked in on the rising edge of CCLK. 6.3.1 SPI Write To write to the device, follow the procedure below while adhering to the control port switching specifications in ”Switching Characteristics - Control Port - SPI Format” on page 15. 1. Bring CS low. 2. The address byte on the CDIN pin must then be 10011110 (R/W = 0). 3. Write to the memory address pointer, MAP. This byte points to the register to be written. 4. Write the desired data to the register pointed to by the MAP. 5. If the INCR bit (see Section 6.1) is set to 1, repeat the previous step until all the desired registers are written, then bring CS high. 6. If the INCR bit is set to 0 and further SPI writes to other registers are desired, it is necessary to bring CS high, and follow the procedure detailed from step 1. If no further writes to other registers are desired, bring CS high 6.3.2 SPI Read To read from the device, follow the procedure below while adhering to the values specified in ”Switching Characteristics - Control Port - SPI Format” on page 15. 1. Bring CS low. 2. The address byte on the CDIN pin must then be 10011111 (R/W = 1). 3. CDOUT pin will then output the data from the register pointed to by the MAP, which is set during the SPI write operation. 4. If the INCR bit (see Section 6.1) is set to 1, keep CS low and continue providing clocks on CCLK to read from multiple consecutive registers. Bring CS high when reading is complete. 5. If the INCR bit is set to 0 and further SPI reads from other registers are desired, it is necessary to bring CS high, and follow the procedure detailed from step 1. If no further reads from other registers are desired, bring CS high. 26 DS691F3 CS4350 CS CCLK C H IP ADDRESS CDIN MAP 1001111 C H IP ADDRESS DATA LSB MSB R/W b y te 1 1001111 R/W b y te n High Impedance CDOUT MSB LSB MSB LSB MAP = Memory Address Pointer, 8 bits, MSB first Figure 20. Control Port Timing, SPI Mode 6.4 Memory Address Pointer (MAP) 7 INCR 0 6.4.1 6 Reserved 0 5 Reserved 0 4 Reserved 0 3 MAP3 0 2 MAP2 0 1 MAP1 0 0 MAP0 0 INCR (Auto Map Increment Enable) Default = ‘0’ 0 - Disabled 1 - Enabled 6.4.2 MAP (Memory Address Pointer) Default = ‘0000’ DS691F3 27 CS4350 7 REGISTER QUICK REFERENCE Addr Function 6 5 4 Device and RevID DeviceID4 DeviceID3 DeviceID2 DeviceID1 2h Mode Control 3h Volume, Mixing, and Inversion Control default default default 4h Mute Control default 5h Channel A Volume Control 6h Channel B Volume Control default default 7h Ramp and Filter Control default 8h Misc. Control default 28 7 1h 3 2 1 0 DeviceID0 RevID2 RevID1 RevID0 1 1 1 1 - - - - Reserved DIF2 DIF1 DIF0 DEM1 DEM0 FM1 FM0 0 0 0 0 0 0 0 0 VOLB=A INVERTA INVERTB Reserved ATAPI3 ATAPI2 ATAPI1 ATAPI0 0 0 0 0 1 0 0 1 AMUTE Reserved MUTEC A=B MUTE_A MUTE_B Reserved Reserved Reserved 1 0 0 0 0 0 0 1 VOL7 VOL6 VOL5 VOL4 VOL3 VOL2 VOL1 VOL0 0 0 0 0 0 0 0 0 VOL7 VOL6 VOL5 VOL4 VOL3 VOL2 VOL1 VOL0 0 0 0 0 0 0 0 0 SZC1 SZC0 RMP_UP RMP_DN Reserved FILT_SEL Reserved Reserved 1 0 1 1 0 0 0 1 PDN Reserved FREEZE POPG_EN RMCK_ CTRL1 RMCK_ CTRL0 0 0 0 1 0 0 R_ R_ SELECT1 SELECT0 0 0 DS691F3 CS4350 8 REGISTER DESCRIPTION Note: All register access is Read/Write unless specified otherwise 8.1 Device and Revision ID - Register 01h 7 Device4 1 6 Device3 1 5 Device2 1 4 Device1 1 3 Device0 - 2 Rev2 - 1 Rev1 - 0 Rev0 - 1 FM1 0 0 FM0 0 Function: This register is Read-Only. It is decoded as follows: 8.2 Rev Register 01h contents A 1111,0000 B 1111,0001 C2 1111,1111 Mode Control - Register 02h 7 Reserved 0 8.2.1 6 DIF2 0 5 DIF1 0 4 DIF0 0 3 DEM1 0 2 DEM0 0 Digital Interface Format (DIF[2:0]) Bits 6-4 Function: These bits select the interface format for the serial audio input. The required relationship between the Left/Right clock, serial clock and serial data is defined by the Digital Interface Format and the options are detailed in Figures 11-13. Note: The group delay for TDM slot 0 channel B differs from the group delay of all other interface formats and TDM slots/channels by one sample. Refer to the group delay specification in the combined interpolation and on-chip analog filter response specifications table. Table 13. Digital Interface Formats DS691F3 DIF2 DIF1 DIF0 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 Description Left-Justified, up to 24-bit data I²S, up to 24-bit data Right-Justified, 16-bit data Right-Justified, 24-bit data TDM slot 0 TDM slot 1 TDM slot 2 TDM slot 3 Format Figure 0 (Default) 1 2 3 4 5 6 7 11 12 13 13 15 15 15 15 29 CS4350 8.2.2 De-Emphasis Control (DEM[1:0]) Bits 3-2 Default = 0 00 - No De-emphasis 01 - 44.1 kHz De-emphasis 10 - 48 kHz De-emphasis 11 - 32 kHz De-emphasis Gain dB T1=50 µs 0dB T2 = 15 µs Function: -10dB Selects the appropriate digital filter to maintain the standard 15 s/50 s digital de-emphasis filter response at 32, 44.1 or 48 kHz sample rates. (See Figure 21) Note: 8.2.3 F1 3.183 kHz F2 Frequency 10.61 kHz Figure 21. De-Emphasis Curve De-emphasis is only available in Single-Speed Mode Functional Mode (FM[1:0]) Bits 1-0 Default = 00 00 - Auto speed mode detect 01 - Single-Speed Mode (30 to 54 kHz sample rates) 10 - Double-Speed Mode (50 to 108 kHz sample rates) 11 - Quad-Speed Mode (100 to 216 kHz sample rates) Function: Selects the required range of input sample rates or auto speed mode. 8.3 Volume Mixing and Inversion Control - Register 03h 7 VOLB=A 0 8.3.1 6 INVERT_A 0 5 INVERT_B 0 4 Reserved 0 3 ATAPI3 1 2 ATAPI2 0 1 ATAPI1 0 0 ATAPI0 1 Channel A Volume = Channel B Volume (VOLB=A) Bit 7 Function: When set to 0 (default), the AOUTA and AOUTB volume levels are independently controlled by the A and the B Channel Volume Control Bytes. When set to 1, the volume on both AOUTA and AOUTB are determined by the A Channel Attenuation and Volume Control Bytes, and the B Channel Bytes are ignored. 8.3.2 Invert Signal Polarity (INVERT_A) Bit 6 Function: When set to 1, this bit inverts the signal polarity of channel A. When set to 0 (default), this function is disabled. This function is only available for Left Justified, Right Justified 16, and Right Justified 24 data formats. 30 DS691F3 CS4350 8.3.3 Invert Signal Polarity (INVERT_B) Bit 5 Function: When set to 1, this bit inverts the signal polarity of channel B. When set to 0 (default), this function is disabled. This function is only available for Left Justified, Right Justified 16, and Right Justified 24 data formats. 8.3.4 ATAPI Channel Mixing and Muting (ATAPI[3:0]) Bits 3-0 Default = 1001 - AOUTA=aL, AOUTB=bR (Stereo) Function: The CS4350 implements the channel mixing functions of the ATAPI CD-ROM specification. Refer to Table 14 and Figure 22 for additional information. A Channel Volume Control Left Channel Audio Data MUTE AoutA MUTE AoutB B Channel Volume Control Right Channel Audio Data Figure 22. ATAPI Block Diagram Table 14. ATAPI Decode ATAPI_A ATAPI_A ATAPI_B ATAPI_B 1 0 1 0 DS691F3 AOUTA AOUTB 0 0 0 0 MUTE MUTE 0 0 0 1 MUTE bR 0 0 1 0 MUTE bL 0 0 1 1 MUTE b[(L+R)/2] 0 1 0 0 aR MUTE 0 1 0 1 aR bR 0 1 1 0 aR bL 0 1 1 1 aR b[(L+R)/2] 31 CS4350 Table 14. ATAPI Decode (Continued) ATAPI_A ATAPI_A ATAPI_B ATAPI_B 1 0 1 0 8.4 AOUTB 1 0 0 0 aL MUTE 1 0 0 1 aL bR 1 0 1 0 aL bL 1 0 1 1 aL b[(L+R)/2] 1 1 0 0 a[(L+R)/2] MUTE 1 1 0 1 a[(L+R)/2] bR 1 1 1 0 a[(L+R)/2] bL 1 1 1 1 a[(L+R)/2] b[(L+R)/2] Mute Control - Register 04h 7 AMUTE 1 8.4.1 AOUTA 6 Reserved 0 5 MUTEC A=B 0 4 MUTE_A 0 3 MUTE_B 0 2 Reserved 0 1 Reserved 0 0 Reserved 0 Auto-Mute (AMUTE) Bit 7 Function: When set to 1 (default), the Digital-to-Analog converter output will mute following the reception of 8192 consecutive audio samples of static 0 or -1. A single sample of non-static data will release the mute. Detection and muting is done independently for each channel. The quiescent voltage on the output will be retained and the Mute Control pin will go active during the mute period. When set to 0, this function is disabled 8.4.2 AMUTEC = BMUTEC (MUTEC A=B) Bit 5 Function: When set to 0 (default), the AMUTEC and BMUTEC pins operate independently. When set to 1, the individual controls for AMUTEC and BMUTEC are internally connected through an AND gate prior to the output pins. Therefore, the external AMUTEC and BMUTEC pins go active only when the requirements for both AMUTEC and BMUTEC are valid. 8.4.3 Channel A Mute (MUTE_A) Bit 4 & Channel B Mute (MUTE_B) Bit 3 Function: When set to 1, the Digital-to-Analog converter output will mute. The quiescent voltage on the output will be retained. The muting function is affected, similar to attenuation changes, by the Soft and Zero Cross bits in the Volume and Mixing Control register. The corresponding MUTEC pin will go active following any ramping due to the soft and zero cross function. When set to 0 (default), this function is disabled. 32 DS691F3 CS4350 8.5 Channel A & B Volume Control - Register 05h & 06h 7 VOL7 0 6 VOL6 0 5 VOL5 0 4 VOL4 0 3 VOL3 0 2 VOL2 0 1 VOL1 0 0 VOL0 0 Digital Volume Control (VOL[7:0]) Bits 7-0 Default = 00h (0 dB) Function: The Digital Volume Control registers allow independent control of the signal levels in 1/2 dB increments from 0 to -127.5 dB. Volume settings are decoded as shown in Table 15. The volume changes are implemented as dictated by the Soft and Zero Cross bits in the Power and Muting Control register. The actual attenuation is determined by taking the decimal value of the volume register and multiplying by 6.02/12. Table 15. Example Digital Volume Settings 8.6 Binary Code Decimal Value Volume Setting 00000000 00000001 00000110 11111111 0 1 6 255 0 dB -0.5 dB -3.0 dB -127.5 dB Ramp and Filter Control - Register 07h 7 SZC1 1 8.6.1 6 SZC0 0 5 RMP_UP 1 4 RMP_DN 1 3 Reserved 0 2 FILT_SEL 0 1 Reserved 0 0 Reserved 1 Soft Ramp and Zero Cross Control (SZC[1:0]) Bits 7-6 Default = 10 SZC1 SZC0 Description 0 0 Immediate Change 0 1 Zero Cross 1 0 Soft Ramp 1 1 Soft Ramp on Zero Crossings Function: Immediate Change When Immediate Change is selected, all level changes will take effect immediately in one step. Zero Cross Zero Cross Enable dictates that signal level changes, either by attenuation changes or muting, will occur on a signal zero crossing to minimize audible artifacts. The requested level change will occur after a timeout period between 512 and 1024 sample periods (10.7 ms to 21.3 ms at 48 kHz sample rate) if the signal does not encounter a zero crossing. The zero cross function is independently monitored and implemented for each channel. Soft Ramp PCM Soft Ramp allows level changes, both muting and attenuation, to be implemented by incrementally ramping, in 1/8 dB steps, from the current level to the new level at a rate of 1 dB per 8 left/right clock periods. DS691F3 33 CS4350 Soft Ramp and Zero Cross Soft Ramp and Zero Cross Enable dictate that signal level changes, either by attenuation changes or muting, will occur in 1/8 dB steps and be implemented on a signal zero crossing. The 1/8 dB level change will occur after a time-out period between 512 and 1024 sample periods (10.7 ms to 21.3 ms at 48 kHz sample rate) if the signal does not encounter a zero crossing. The zero cross function is independently monitored and implemented for each channel. 8.6.2 Soft Volume Ramp-Up after Error (RMP_UP) Bit 5 Function: When set to 1 (default), an un-mute will be performed after executing a filter mode change, after LRCK is lost, and after changing the Functional Mode. This un-mute is affected, similar to attenuation changes, by the Soft and Zero Cross bits in the Volume and Mixing Control register. When set to 0, an immediate un-mute is performed in these instances. Note: 8.6.3 For best results, it is recommended that this feature be used in conjunction with the RMP_DN bit. Soft Ramp-Down before Filter Mode Change (RMP_DN) Bit 4 Function: When set to 1 (default), a mute will be performed prior to executing a filter mode change. This mute is affected, similar to attenuation changes, by the Soft and Zero Cross bits in the Volume and Mixing Control register. When set to 0, an immediate mute is performed prior to executing a filter mode change. Note: 8.6.4 For best results, it is recommended that this feature be used in conjunction with the RMP_UP bit. Interpolation Filter Select (FILT_SEL) Bit 2 Function: When set to 0 (default), the Interpolation Filter has a fast roll off. When set to 1, the Interpolation Filter has a slow roll off. The specifications for each filter can be found in the ”Combined Interpolation and On-Chip Analog Filter Response” on page 12, and response plots can be found in Figures 25 through 30. 8.7 Misc. Control - Register 08h 7 PDN 0 8.7.1 6 Reserved 0 5 FREEZE 0 4 POPG_EN 1 3 2 1 RMCK_CTRL1 RMCK_CTRL0 R_SELECT1 0 0 0 0 R_SELECT0 0 Power Down (PDN) Bit 7 Function: When set to 1 the entire device will enter a low-power state and the contents of the control registers will be retained. The power-down bit defaults to ‘0’ on power-up. 34 DS691F3 CS4350 8.7.2 Freeze Controls (FREEZE) Bit 5 Function: When set to 1, this function allows modifications to be made to the registers without the changes taking effect until FREEZE is set back to 0. To make multiple changes in the Control Port registers take effect simultaneously, enable the FREEZE bit, make all register changes, then disable the FREEZE bit. When set to 0 (default), register changes take effect immediately. 8.7.3 Popguard Enable (POPG_EN) Bit 4 Function: When set to 1, (default) the Device will initiate a ramping function as outlined in Section 4.7 on page 22. When set to 0, the outputs will step to VQ upon release of PDN. 8.7.4 RMCK control (RMCK_CTRL[1:0]) Bits 3:2 Default = 00 RMCK_CTRL1 RMCK_CTRL0 Mode 0 0 256x LRCK for 48 kHz and 96 kHz, 128x @ 192kHz 0 1 512x @ 48kHz, 256x @ 96 kHz, 128x @ 192kHz 1 0 Manual control (see RMCK Ratio Select) 1 1 RMCK pin driven low Function: These bits set the function of the RMCK pin with respect to the LRCK. 8.7.5 RMCK Ratio Select (R_SELECT[1:0]) Bits 2:1 Default = 00 Function: To select the RMCK-to-LRCK ratio. Note: DS691F3 R_SELECT1 R_SELECT0 RMCK/LRCK Ratio 0 0 512 0 1 256 1 0 128 1 1 64 RMCK_CTRL must be set to 10 to enable this function. Please note the maximum RMCK output frequency as specified in the ”Switching Specifications - Serial Audio Interface” on page 13. 35 CS4350 9 FILTER PLOTS 0 20 20 40 40 Amplitude (dB) Amplitude (dB) 0 60 80 80 100 100 120 0.4 0.5 0.6 0.7 0.8 Frequency(normalized to Fs) 0.9 120 1 0.4 0.5 0.6 0.7 0.8 Frequency(normalized to Fs) 0.9 1 0.02 0.02 0.015 0.015 0.01 0.01 0.005 0.005 Amplitude (dB) Figure 24. Stopband Rejection (slow), all Modes Amplitude (dB) Figure 23. Stopband Rejection (fast), all Modes 0 0 0.005 0.005 0.01 0.01 0.015 0.015 0.02 0 0.05 0.1 0.15 0.2 0.25 0.3 Frequency(normalized to Fs) 0.35 0.4 0.45 0.5 0.02 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.2 0.1 0.1 0 −0.1 −0.2 −0.2 −0.3 −0.3 −0.4 −0.4 0 0.05 0.1 0.15 0.2 0.25 0.3 Frequency (normalized to Fs) 0.35 0.4 0.45 0.05 0.1 0.15 0.2 0.25 0.3 Frequency(normalized to Fs) 0.35 0.4 0.45 0.5 0 −0.1 −0.5 0 Figure 26. Single-Speed (slow) Passband Detail Amplitude (dB) Amplitude (dB) Figure 25. Single-Speed (fast) Passband Detail 0.5 Figure 27. Double-Speed (fast) Passband Detail 36 60 −0.5 0 0.05 0.1 0.15 0.2 0.25 0.3 Frequency (normalized to Fs) 0.35 0.4 0.45 0.5 Figure 28. Double-Speed (slow) Passband Detail DS691F3 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.2 0.1 0.1 Amplitude (dB) Amplitude (dB) CS4350 0 −0.1 0 −0.1 −0.2 −0.2 −0.3 −0.3 −0.4 −0.4 −0.5 0 0.05 0.1 0.15 0.2 Frequency (normalized to Fs) 0.25 0.3 −0.5 Figure 29. Quad-Speed (fast) Passband Detail 0 0.05 0.1 0.15 0.2 Frequency (normalized to Fs) 0.25 0.3 Figure 30. Quad-Speed (slow) Passband Detail 10 PARAMETER DEFINITIONS Total Harmonic Distortion + Noise (THD+N) The ratio of the rms value of the signal to the rms sum of all other spectral components over the specified bandwidth (typically 10 Hz to 20 kHz), including distortion components. Expressed in decibels. Dynamic Range The ratio of the full-scale rms value of the signal to the rms sum of all other spectral components over the specified bandwidth. Dynamic range is a signal-to-noise measurement over the specified bandwidth made with a -60 dBFS signal. Then, 60 dB is added to the resulting measurement to refer the measurement to full scale. This technique ensures that the distortion components are below the noise level and do not affect the measurement. This measurement technique has been accepted by the Audio Engineering Society, AES171991, and the Electronic Industries Association of Japan, EIAJ CP-307. Interchannel Isolation A measure of crosstalk between the left and right channels. Measured for each channel at the converter's output with all zeros to the input under test and a full-scale signal applied to the other channel. Units in decibels. Interchannel Gain Mismatch The gain difference between left and right channels. Units in decibels. Gain Drift The change in gain value with temperature. Units in ppm/°C. Intrachannel Phase Deviation The deviation from linear phase within a given channel. Interchannel Phase Deviation The difference in phase between channels. DS691F3 37 CS4350 11 PACKAGE DIMENSIONS 11.1 24L TSSOP (4.4 mm BODY) PACKAGE DRAWING N D E11 A2 E A e b 2 SIDE VIEW A1 L END VIEW SEATING PLANE 1 2 3 TOP VIEW DIM MIN INCHES NOM A A1 A2 b D E E1 e L µ -0.002 0.03346 0.00748 0.303 0.248 0.169 -0.020 0° -0.004 0.0354 0.0096 0.307 0.2519 0.1732 0.026 BSC 0.024 4° MAX 0.043 0.006 0.037 0.012 0.311 0.256 0.177 -0.028 8° MIN MILLIMETERS NOM NOTE MAX -0.05 0.85 0.19 7.70 6.30 4.30 -0.50 0° --0.90 0.245 7.80 6.40 4.40 0.65 BSC 0.60 4° 1.10 0.15 0.95 0.30 7.90 6.50 4.50 -0.70 8° 2,3 1 1 JEDEC #: MO-153 Controlling Dimension is Millimeters. 1. D” and “E1” are reference datums and do not include mold flash or protrusions, but do include mold mismatch and are measured at the parting line, mold flash or protrusions shall not exceed 0.20 mm per side. 2. Dimension “b” does not include dambar protrusion/intrusion. Allowable dambar protrusion shall be 0.13 mm total in excess of “b” dimension at maximum material condition. Dambar intrusion shall not reduce dimension “b” by more than 0.07 mm at least material condition. 3. These dimensions apply to the flat section of the lead between 0.10 and 0.25 mm from lead tips. 38 DS691F3 CS4350 11.2 24L QFN (4.00 mm BODY) PACKAGE DRAWING D e b PIN #1 CORNER 1.00 REF 1.00 REF PIN #1 IDENTIFIER LASER MARKING E E2 A1 A TOP VIEW SIDE VIEW Dimension INCHES NOM MIN A A1 b D D2 e E E2 L D2 0.031 0.000 0.008 0.102 0.102 0.014 0.033 0.001 0.010 0.157 BSC 0.106 0.020 BSC 0.157 BSC 0.106 0.016 L BOTTOM VIEW MAX MILLIMETERS MIN NOM MAX 0.035 0.002 0.012 0.80 0.00 0.20 0.90 0.05 0.30 0.110 2.6 0.110 0.018 2.6 0.35 0.85 0.035 0.25 4.00 BSC 2.7 0.50 BSC 4.00 BSC 2.7 0.40 2.8 2.8 0.45 1. Controlling dimensions are in millimeters. 2. Compliant to JEDEC MO-220 VGGD. 3. Recommended reflow profile is per JEDEC/IPC J-STD-020. 12 THERMAL CHARACTERISTICS Table 16. Thermal Characteristics Parameters Package Thermal Resistance—TSSOP Package Thermal Resistance—QFN 12.1 Symbol Single-Layer PCB Multiple-Layer PCB Two-Layer PCB Multiple-Layer PCB Min JA - JA - Typ 70 105 130 53 Max Units - °C/Watt - °C/Watt QFN Thermal Pad The QFN package version of this device is designed to have the metal pad on the bottom of the device soldered directly to a metal plane on the PCB. To enhance the thermal dissipation capabilities of the system, this metal plane should be coupled with vias to a large metal plane on the backside (and inner ground layer, if applicable) of the PCB. DS691F3 39 CS4350 In either case, it is beneficial to use copper fill in any unused regions inside the PCB layout, especially those immediately surrounding the CS4350. In addition to improving in electrical performance, this practice also aids in heat dissipation. The heat dissipation capability required of the metal plane for a given output power can be calculated as follows: CA = [(TJ(MAX) - TA) / PD] - JC where, CA = Thermal resistance of the metal plane in °C/Watt TJ(MAX) = Maximum rated operating junction temperature in °C, equal to 150 °C TA = Ambient temperature in °C PD = RMS power dissipation of the device, equal to 0.176*PRMS-OUT (assuming 85% efficiency) JC = Junction-to-case thermal resistance of the device in °C/Watt 40 DS691F3 CS4350 13 ORDERING INFORMATION Product Description Package Pb-Free Grade Temp Range Commercial -40° to +85°C CS4350 192 kHz Stereo DAC with Integrated PLL 24-TSSOP Automotive -40° to +105°C 24-QFN CDB4350 Yes Evaluation Board for CS4350 Yes - Commercial -40° to +85°C - Container Order# Rail CS4350-CZZ Tape and Reel CS4350-CZZR Rail CS4350-DZZ Tape and Reel CS4350-DZZR Rail CS4350-CNZ Tape and Reel CS4350-CNZR - CDB4350 - 14 REVISION HISTORY Release Changes F2 APR ‘13 • Updated Total Group Delay typical values in the Combined Interpolation and On-Chip Analog Filter Response table in Section 2.5. • Updated RMCK connection in typical connection drawing, Figure 10. • Updated Figure 15 to show slot numbering from 0–3 rather than 1–4. • Removed reference to master clock in Step 1 in Section 4.6.1. • Updated timings in the recommended power-up sequences in Section 4.6.1 and Section 4.6.2. • Updated sample periods and latency in Section 4.7.1, Power-Up.” • Updated minimum power-down time in Section 4.7.3, Discharge Time.” • Updated description in Section 5.3 of how Popguard is selected/defeated in Stand-Alone Mode. • Added a note regarding differences in group delay for TDM slot 0 channel B to Section 4.3.1, Section 5.1, Section 8.2.1. F3 SEPT ‘15 DS691F3 • • • • • • • • • • • Added text describing QFN package availability to Description section on page 2. Added QFN pinout to Section 1.2. Noted presence of QFN thermal pad in QFN figure in Section 1.2. Updated full-scale output voltage in Table 3. Updated RMCK output frequency, SDIN hold time, and LRCK high time in Table 6. Corrected parameter definition in Table 9. Added QFN thermal pad detail to Figure 10. Added QFN package to Section 11.2. Added QFN thermal resistances to Section 12. Added QFN thermal pad Section 12.1. Added ordering information for QFN package to Section 13. 41 CS4350 Contacting Cirrus Logic Support For all product questions and inquiries, contact a Cirrus Logic Sales Representative. To find the one nearest you, go to www.cirrus.com. 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Cirrus Logic, Cirrus, the Cirrus Logic logo design, and SoundClear are among the trademarks of Cirrus Logic. Other brand and product names may be trademarks or service marks of their respective owners. Copyright © 2006–2015 Cirrus Logic, Inc. All rights reserved. SPI is a trademark of Motorola. 42 DS691F3