IDT 874001AGI-05LF

ICS874001I-05
PCI EXPRESS™ JITTER ATTENUATOR
GENERAL DESCRIPTION
FEATURES
The ICS874001I-05 is a high performance Jitter
ICS
Attenuator designed for use in PCI Express™ sysHiPerClockS™ tems. In some PCI Express systems, such as those
found in desktop PCs, the PCI Express clocks are
generated from a low bandwidth, high phase noise
PLL frequency synthesizer. In these systems, a jitter
attenuator may be required to attenuate high frequency random
and deterministic jitter components from the PLL synthesizer
and from the system board. The ICS874001I-05 has a bandwidth
of 6MHz with <1dB peaking, easily meeting PCI Express Gen2
PLL requirements.
• One differential LVDS output pair
The ICS874001I-05 uses IDT’s 3rd Generation FemtoClock TM
PLL technology to achive the lowest possible phase noise.
The device is packaged in a small 20-pin TSSOP package,
making it ideal for use in space constrained applications such as
PCI Express add-in cards.
• 3.3V operating supply
• One differential clock input
• CLK and nCLK supports the following input types:
LVPECL, LVDS, LVHSTL, SSTL, HCSL
• Output frequency range: 98MHz - 640MHz
• Input frequency range: 98MHz - 128MHz
• VCO range: 490MHz - 640MHz
• Cycle-to-cycle jitter: 50ps (maximum)
• PCI Express (2.5Gb/s) and Gen 2 (5 Gb/s) jitter compliant
• -40°C to 85°C ambient operating temperature
• Available in lead-free (RoHS 6) package
PIN ASSIGNMENT
PLL_SEL
nc
nc
nc
MR
nc
F_SEL1
VDDA
F_SEL0
VDD
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
nc
VDDO
Q
nQ
nc
nc
GND
nCLK
CLK
OE
ICS874001I-05
20-Lead TSSOP
6.5mm x 4.4mm x 0.925mm package body
G Package
Top View
IDT™ / ICS™ PCI EXPRESS JITTER ATTENUATOR
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PCI EXPRESS™ JITTER ATTENUATOR
BLOCK DIAGRAM
PLL_SEL Pullup
0
CLK Pulldown
nCLK Pullup
VCO
490 - 640MHz
Phase
Detector
1
Output Divider
0 0 ÷5
0 1 ÷4
1 0 ÷2 (default)
1 1 ÷1
Q
nQ
Internal Feedback
÷5
MR
Pulldown
F_SEL[1:0] Pullup/Pulldown
2
OE Pullup
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TABLE 1. PIN DESCRIPTIONS
Number
Name
Type
1
PLL_SEL
Input
2, 3, 4, 6,
15, 16, 20
nc
Unused
5
MR
Input
7
F_SEL1
Input
8
VDDA
Power
Pullup
Description
PLL select pin. When LOW, bypasses the PLL. When HIGH selects the
PLL. LVCMOS/LVTTL interface levels. See Table 3B.
No connect.
Active High Master Reset. When logic HIGH, the internal dividers are reset
causing the true output Q to go LOW and the inver ted output nQ to go
Pulldown
HIGH. When logic LOW, the internal dividers and the outputs are enabled.
LVCMOS/LVTTL interface levels.
Pullup Frequency select pin. LVCMOS/LVTTL interface levels. See Table 3C.
Analog supply pin.
9
F_SEL0
Input
Pulldown Frequency select pin. LVCMOS/LVTTL interface levels. See Table 3C.
10
VDD
Power
11
OE
Input
12
CLK
Input
Core supply pin.
Output enable. When HIGH, outputs are enabled. When LOW, forces
Pullup
outputs to a high impedance state. See Table 3A.
LVCMOS/LVTTL interface levels.
Pulldown Non-inver ting differential clock input.
13
nCLK
Input
14
GND
Power
Pullup
Inver ting differential clock input.
Power supply ground.
17, 18
nQ, Q
Output
Differential output pair. LVDS interface levels.
19
VDDO
Power
Output supply pin.
NOTE: Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values.
TABLE 2. PIN CHARACTERISTICS
Symbol
Parameter
CIN
Input Capacitance
Test Conditions
4
pF
RPULLUP
Input Pullup Resistor
51
kΩ
RPULLDOWN
Input Pulldown Resistor
51
kΩ
TABLE 3A. OUTPUT ENABLE FUNCTION TABLE
Inputs
Outputs
OE
Q , nQ
0
High-Impedance
1 (default)
Enabled
Minimum
Typical
Maximum
Units
TABLE 3B. PLL _SEL CONTROL TABLE
0 = Bypass
1 = VCO (default)
TABLE 3C. F_SELX FUNCTION TABLE
Inputs
F_SEL1
0
Output Frequency Range
(MHz)
98 - 128
F_SEL0
0
Output Divider
5
0
1
4
122.5 - 160
1
0
2
245 - 320 (default)
1
1
1
490 - 640
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ABSOLUTE MAXIMUM RATINGS
Supply Voltage, VDD
4.6V
Inputs, VI
-0.5V to VDD + 0.5 V
Outputs, IO
Continuous Current
10mA
Surge Current
NOTE: Stresses beyond those listed under Absolute
Maximum Ratings may cause permanent damage to the
device. These ratings are stress specifications only. Functional operation of product at these conditions or any conditions beyond
those listed in the DC Characteristics or AC Characteristics is not
implied. Exposure to absolute maximum rating conditions for extended periods may affect product reliability.
15mA
Package Thermal Impedance, θJA 86.7°C/W (0 mps)
Storage Temperature, TSTG
-65°C to 150°C
TABLE 4A. POWER SUPPLY DC CHARACTERISTICS, VDD = VDDO = 3.3V ± 0.3V, TA = -40°C TO 85°C
Symbol
Parameter
VDD
Core Supply Voltage
Test Conditions
Minimum
Typical
Maximum
Units
3.0
3.3
3.6
V
VDDA
Analog Supply Voltage
VDD – 0.13
3.3
VDD
V
VDDO
Output Supply Voltage
3.0
3.3
3.6
V
IDD
Power Supply Current
75
mA
IDDA
Analog Supply Current
13
mA
IDDO
Output Supply Current
25
mA
TABLE 4B. LVCMOS/LVTTL DC CHARACTERISTICS, VDD = VDDO = 3.3V ± 0.3V, TA = -40°C TO 85°C
Symbol Parameter
Maximum
Units
VIH
Input High Voltage
Test Conditions
2
VDD + 0.3
V
VIL
Input Low Voltage
-0.3
0.8
V
IIH
Input
High Current
F_SEL1, OE, PLL_SEL
VDD = VIN = 3.6V
5
µA
F_SEL0, MR
VDD = VIN = 3.6V
150
µA
IIL
Input
Low Current
F_SEL0, MR
F_SEL1, OE, PLL_SEL
Minimum Typical
VDD = 3.6V, VIN = 0V
-150
µA
VDD = 3.6V, VIN = 0V
-5
µA
TABLE 4C. DIFFERENTIAL DC CHARACTERISTICS, VDD = VDDO = 3.3V ± 0.3V, TA = -40°C TO 85°C
Symbol Parameter
Maximum
Units
CLK
Test Conditions
VDD = VIN = 3.6V
150
µA
nCLK
VDD = VIN = 3.6V
5
µA
IIH
Input High Current
IIL
Input Low Current
VPP
Peak-to-Peak Input Voltage; NOTE 1
Minimum
Typical
CLK
VDD = 3.6V, VIN = 0V
-5
µA
nCLK
VDD = 3.6V, VIN = 0V
-150
µA
VCMR
Common Mode Input Voltage; NOTE 1, 2
NOTE 1: VIL must be less than -0.3V.
NOTE 2: Common mode voltage is defined as VIH.
0.15
1.3
V
GND + 0.5
VDD - 0.85
V
TABLE 4D. LVDS DC CHARACTERISTICS, VDD = VDDO = 3.3V ± 0.3V, TA = -40°C TO 85°C
Symbol
Parameter
VOD
Differential Output Voltage
Δ VOD
VOD Magnitude Change
VOS
Offset Voltage
Δ VOS
VOS Magnitude Change
IDT™ / ICS™ PCI EXPRESS JITTER ATTENUATOR
Test Conditions
Minimum
Typical
Maximum
Units
275
375
485
mV
50
mV
1.20
4
1.35
1.50
V
50
mV
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TABLE 5. AC CHARACTERISTICS, VDD = VDDO = 3.3V ± 0.3V, TA = -40°C TO 85°C
Symbol
Parameter
fMAX
Output Frequency
Cycle-to-Cycle Jitter,
NOTE 1
tjit(cc)
Tj
TREFCLK_HF_RMS
TREFCLK_LF_RMS
tR / tF
odc
Phase Jitter Peak-to-Peak;
NOTE 2, 4
Phase Jitter RMS;
NOTE 3, 4
Phase Jitter RMS;
NOTE 3, 4
Output Rise/Fall Time
Output Duty Cycle
Test Conditions
Minimum
Typical
Maximum
Units
640
MHz
50
ps
98
100MHz output,
Evaluation Band: 0Hz - Nyquist
(clock frequency/2)
125MHz output,
Evaluation Band: 0Hz - Nyquist
(clock frequency/2)
250MHz output,
Evaluation Band: 0Hz - Nyquist
(clock frequency/2)
500MHz, (1.2MHz –21.9MHz),
Evaluation Band: 0Hz - Nyquist
(clock frequency/2)
100MHz output,
High Band: 1.5MHz - Nyquist
(clock frequency/2)
125MHz output,
High Band: 1.5MHz - Nyquist
(clock frequency/2)
250MHz output,
High Band: 1.5MHz - Nyquist
(clock frequency/2)
500MHz output,
High Band: 1.5MHz - Nyquist
(clock frequency/2)
100MHz output,
Low Band: 10kHz - 1.5MHz
125MHz output,
Low Band: 10kHz - 1.5MHz
250MHz output,
Low Band: 10kHz - 1.5MHz
500MHz output,
Low Band: 10kHz - 1.5MHz
20% to 80%
200
600
ps
F_SEL[10] ≠ 11
48
52
%
16.14
ps
15.64
ps
13.16
ps
12.17
ps
1.4
ps
1.39
ps
1.18
ps
1.11
ps
0.33
ps
0.22
ps
0.22
ps
0.22
ps
F_SEL[10] = 11
42
58
%
NOTE: Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the
device is mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after
thermal equilibrium has been reached under these conditons.
NOTE 1: This parameter is defined in accordance with JEDEC Standard 65.
NOTE 2: Peak-to-peak jitter after system transfer function for the Common Clock Architecture. Maximum limit for PCI Express Gen 1
is 86ps peak-to-peak for a sample size of 106 clock periods. See IDT Application Note,PCI Express Reference Clock Requirements
and also the PCI Express Application section of this datasheet which show each individual transfer function and the overall
composite transfer function.
NOTE 3: RMS jitter after applying the two evaluation bands to the two transfer functions defined in the Common Clock Architecture
and repor ting the worst case results for each evaluation band. Maximum limit for PCI Express Generation 2 is 3.1ps rms for
tREFCLK_HF_RMS (High Band) and 3.0ps RMS for tREFCLK_LF_RMS (Low Band). See IDT Application Note,PCI Express Reference Clock
Requirements and also the PCI Express Application section of this datasheet which show each individual transfer function and the
overall composite transfer function.
NOTE 4: Guaranteed only when input clock source is PCI Express and PCI Express Gen 2 compliant.
IDT™ / ICS™ PCI EXPRESS JITTER ATTENUATOR
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PARAMETER MEASUREMENT INFORMATION
VDD
SCOPE
3.3V±0.3V
POWER SUPPLY
+ Float GND –
VDD,
VDDO
nCLK
Qx
VDDA
V
V
Cross Points
PP
LVDS
CMR
CLK
nQx
GND
3.3V LVDS OUTPUT LOAD AC TEST CIRCUIT
DIFFERENTIAL INPUT LEVEL
nQ
nQ
Q
Q
odc =
➤
t
PERIOD
t PW
tcycle n
➤
t PW
➤
tcycle n+1
➤
tjit(cc) = |tcycle n – tcycle n+1|
1000 Cycles
x 100%
t PERIOD
OUTPUT DUTY CYCLE/PULSE WIDTH/PERIOD
CYCLE-TO-CYCLE JITTER
VDD
80%
DC Input
VOD
100
tR
out
tF
OUTPUT RISE/FALL TIME
IDT™ / ICS™ PCI EXPRESS JITTER ATTENUATOR
➤
VOD/Δ VOD
20%
20%
Q
LVDS
➤
80%
➤
out
nQ
DIFFERENTIAL OUTPUT VOLTAGE SETUP
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PARAMETER MEASUREMENT INFORMATION, CONTINUED
VDD
out
LVDS
➤
DC Input
out
➤
VOS/Δ VOS
➤
OFFSET VOLTAGE SETUP
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APPLICATION INFORMATION
POWER SUPPLY FILTERING TECHNIQUES
As in any high speed analog circuitry, the power supply pins are
vulnerable to random noise. To achieve optimum jitter performance, power supply isolation is required. The ICS874001I-05
provides separate power supplies to isolate any high switching
noise from the outputs to the internal PLL. VDD, VDDA and VDDO
should be individually connected to the power supply
plane through vias, and 0.01µF bypass capacitors should be used
for each pin. Figure 1 illustrates this for a generic VCC pin and also
shows that V DDA requires that an additional10Ω resistor
along with a 10µF bypass capacitor be connected to the VDDA pin.
3.3V
VDD
.01µF
10Ω
.01µF
10µF
VDDA
FIGURE 1. POWER SUPPLY FILTERING
WIRING THE DIFFERENTIAL INPUT TO ACCEPT SINGLE ENDED LEVELS
Figure 2 shows how the differential input can be wired
to accept single ended levels. The reference voltage
V_REF = VDD/2 is generated by the bias resistors R1, R2 and
C1. This bias circuit should be located as close as possible to
the input pin. The ratio of R1 and R2 might need to be adjusted
to position the V_REF in the center of the input voltage swing.
For example, if the input clock swing is only 2.5V and VDD =
3.3V, V_REF should be 1.25V and R2/R1 = 0.609.
VDD
R1
1K
Single Ended Clock Input
CLK
V_REF
nCLK
C1
0.1u
R2
1K
FIGURE 2. SINGLE ENDED SIGNAL DRIVING DIFFERENTIAL INPUT
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DIFFERENTIAL CLOCK INPUT INTERFACE
The CLK /nCLK accepts LVDS, LVPECL, LVHSTL, SSTL, HCSL
and other differential signals. Both signals must meet the VPP and
VCMR input requirements. Figures 3A to 3F show interface examples
for the HiPerClockS CLK/nCLK input driven by the most common
driver types. The input interfaces suggested here are examples
only. Please consult with the vendor of the driver component to
confirm the driver termination requirements. For example in Figure
3A, the input termination applies for IDT HiPerClockS open emitter
LVHSTL drivers. If you are using an LVHSTL driver from another
vendor, use their termination recommendation.
3.3V
3.3V
3.3V
1.8V
Zo = 50 Ohm
CLK
Zo = 50 Ohm
CLK
Zo = 50 Ohm
nCLK
Zo = 50 Ohm
LVPECL
nCLK
HiPerClockS
Input
LVHSTL
ICS
HiPerClockS
LVHSTL Driver
R1
50
R1
50
HiPerClockS
Input
R2
50
R2
50
R3
50
FIGURE 3A. HIPERCLOCKS CLK/nCLK INPUT
DRIVEN BY AN IDT OPEN EMITTER
HIPERCLOCKS LVHSTL DRIVER
FIGURE 3B. HIPERCLOCKS CLK/nCLK INPUT
DRIVEN BY A 3.3V LVPECL DRIVER
3.3V
3.3V
3.3V
3.3V
3.3V
R3
125
R4
125
Zo = 50 Ohm
LVDS_Driv er
Zo = 50 Ohm
CLK
CLK
R1
100
Zo = 50 Ohm
nCLK
LVPECL
R1
84
HiPerClockS
Input
nCLK
Receiv er
Zo = 50 Ohm
R2
84
FIGURE 3C. HIPERCLOCKS CLK/nCLK INPUT
DRIVEN BY A 3.3V LVPECL DRIVER
2.5V
FIGURE 3D. HIPERCLOCKS CLK/nCLK INPUT
DRIVEN BY A 3.3V LVDS DRIVER
2.5V
3.3V
3.3V
2.5V
*R3
33
R3
120
Zo = 50Ω
R4
120
Zo = 60Ω
CLK
CLK
Zo = 50Ω
Zo = 60Ω
nCLK
HCSL
*R4
33
R1
50
R2
50
nCLK
HiPerClockS
Input
HiPerClockS
SSTL
R1
120
R2
120
*Optional – R3 and R4 can be 0Ω
FIGURE 3F. HIPERCLOCKS CLK/nCLK INPUT
DRIVEN BY A 2.5V SSTL DRIVER
FIGURE 3E. HIPERCLOCKS CLK/nCLK INPUT
DRIVEN BY A 3.3V HCSL DRIVER
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RECOMMENDATIONS FOR UNUSED INPUT PINS
INPUTS:
LVCMOS CONTROL PINS
All control pins have internal pullups or pulldowns; additional
resistance is not required but can be added for additional
protection. A 1kΩ resistor can be used.
3.3V LVDS DRIVER TERMINATION
A general LVDS interface is shown in Figure 4. In a 100Ω
differential transmission line environment, LVDS drivers
require a matched load termination of 100Ω across near
the receiver input. For a multiple LVDS outputs buffer, if only
partial outputs are used, it is recommended to terminate the
unused outputs.
3.3V
50Ω
3.3V
LVDS Driver
+
R1
100Ω
–
50Ω
100Ω Differential Transmission Line
FIGURE 4. TYPICAL LVDS DRIVER TERMINATION
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SCHEMATIC EXAMPLE
Figure 5 shows an example of ICS874001I-05 application
schematic. In this example, the device is operated at VDD =
3.3V. The decoupling capacitors should be located as close
as possible to the power pin. The input is driven by a 3.3V
LVPECL driver.
U1
VDDO = 3.3V
PLL_SEL
1
2
3
4
5
6
7
8
9
10
VDD = 3.3V
MR
F_SEL1
VDD
VDDA
F_SEL0
10
R2
C1
0.1u
C2
10u
PLL_SEL
nc
nc
nc
MR
nc
F_SEL1
VDDA
F_SEL0
VDD
nc
VDDO
Q
nQ
nc
nc
GND
nCLK
CLK
OE
20
19
18
17
16
15
14
13
12
11
VDDO
Zo = 50 Ohm
Q
nQ
Q
+
GND
R1
100
nCLK
CLK
OE
-
Zo = 50 Ohm
nQ
Zo = 50 Ohm
Zo = 50 Ohm
LVPECL Driv er
R6
50
R7
50
Zo = 50 Ohm
Q
Logic Control Input Examples
Set Logic
Input to '1'
VDD
RU1
1K
Set Logic
Input to '0'
VDD
VDDO (U1:19)
VDD(U1:10)
R4
50
R8
50
C5
.1uf
C6
10uf
+
C7
.1uf
RU2
Not Install
Zo = 50 Ohm
C3
0.1uF
R5
50
-
nQ
To Logic
Input
pins
RD1
Not Install
To Logic
Input
pins
Alternate
LVDS
Termination
RD2
1K
FIGURE 5. ICS874001I-05 SCHEMATIC LAYOUT
IDT™ / ICS™ PCI EXPRESS JITTER ATTENUATOR
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PCI EXPRESS APPLICATION NOTE
PCI Express jitter analysis methodology models the system
response to reference clock jitter. The below block diagram
shows the most frequently used Common Clock Architecture
in which a copy of the reference clock is provided ot both ends
of the PCI Express Link.
In order to generate time domain jitter numbers, an inverse
Fourier Transform is performed on X(s) * H3(s) * [H1(s) - H2(s)].
For PCI Express Gen 1, one transfer function is defined and
the evaluation is performed over the entire spectrum: DC to
Nyquist (e.g for a 100MHz reference clock: 0Hz to 50MHz) and
the jitter result is reported in peak-peak. For PCI Express Gen2,
two transfer functions are defined with 2 evaluation ranges and
the final jitter number is reported in rms. The two evaluation
ranges for PCI Express Gen 2 are 10kHz - 1.5MHz (Low Band)
and 1.5MHz - Nyquist (High Band). The below plots show the
individual transfer functions as function H1, F2 for H2, and f#
for H3. For a more thorough overivew of PCI Express jitter
analysis methodology, please refer to IDT Application Note, PCI
Express Reference Clock Requirements.
In the jitter analysis, the Tx and Rx serdes PLLs are modeled
as well as the phase interpolator in the receiver. These ransfer
functions are called H1, H2 and H3 respectively. The overall
system transfer function at the receiver is:
Ht(s) = H3(s) * [H1(s) - H2(s)]
The jitter spectrum seen by the receiver is the result of applying
this system transfer function to the clock spectrum X(s) and is:
Y(s) = X(s) * H3(s) * [H1(s) - H2(s)]
Tx Serdes
-
Y(s)
D
Q
Rx Serdes
2.5 GHz
Phase
Aligner
H3(s)
PLL
x25 Mult
H1(s)
PLL
x25 Mult
H2(s) 2.5 GHz
100 MHz
X(s)
100 MHz
X(s)
Reference
Clock
System Transfer Function, Ht(s) = H3(s) * [H1(s) - H2(s)]
Reference Clock Spectrum seen by Receiver Sample Latch, Y(s) = X(s) * Ht(s)
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PCIe GEN 1 MAGNITUDE OF TRANSFER FUNCTION
PCIe GEN 2A MAGNITUDE OF TRANSFER FUNCTION
IDT™ / ICS™ PCI EXPRESS JITTER ATTENUATOR
PCIe GEN 2B MAGNITUDE
13
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PCI EXPRESS™ JITTER ATTENUATOR
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS874001I-05.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS874001I-05 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for VDD = 3.3V + 0.3V = 3.6V, which gives worst case results.
•
•
Power (core)MAX = VDD_MAX * (IDD_MAX + IDDA_MAX) = 3.6V * (75mA + 13mA) = 316.8mW
Power (outputs)MAX = VDDO_MAX * IDDO_MAX = 3.6V * 25mA = 90mW
Total Power_MAX = 316.8mW + 90mW = 406.8mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockSTM devices is 125°C.
The equation for Tj is as follows: Tj = θJA * Pd_total + TA
Tj = Junction Temperature
θJA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θJA must be used. Assuming no air
flow and a multi-layer board, the appropriate value is 86.7°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.407W * 86.7°C/W = 120.3°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow, and
the type of board.
TABLE 6. THERMAL RESISTANCE θJA FOR 20-LEAD TSSOP, FORCED CONVECTION
θJA by Velocity (Meters per Second)
Multi-Layer PCB, JEDEC Standard Test Boards
IDT™ / ICS™ PCI EXPRESS JITTER ATTENUATOR
0
1
2.5
86.7°C/W
82.4°C/W
80.2°C/W
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RELIABILITY INFORMATION
TABLE 7. θJAVS. AIR FLOW TABLE
FOR
20 LEAD TSSOP
θJA by Velocity (Meters per Second)
Multi-Layer PCB, JEDEC Standard Test Boards
0
1
2.5
86.7°C/W
82.4°C/W
80.2°C/W
TRANSISTOR COUNT
The transistor count for ICS874001I-05 is: 1608
PACKAGE DIAGRAM
PACKAGE OUTLINE - G SUFFIX FOR 20 LEAD TSSOP
AND
DIMENSIONS
TABLE 8. PACKAGE DIMENSIONS
Millimeters
SYMBOL
MIN
N
A
MAX
20
--
1.20
A1
0.05
0.15
A2
0.80
1.05
b
0.19
0.30
c
0.09
0.20
D
6.40
6.60
E
E1
6.40 BASIC
4.30
e
4.50
0.65 BASIC
L
0.45
0.75
α
0°
8°
aaa
--
0.10
Reference Document: JEDEC Publication 95, MO-153
IDT™ / ICS™ PCI EXPRESS JITTER ATTENUATOR
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TABLE 9. ORDERING INFORMATION
Part/Order Number
Marking
Package
Shipping Packaging
Temperature
874001AGI-05LF
ICS4001AI05L
20 Lead "Lead-Free" TSSOP
tube
-40°C to 85°C
874001AGI-05LFT
ICS4001AI05L
20 Lead "Lead-Free" TSSOP
2500 tape & reel
-40°C to 85°C
NOTE: Par ts that are ordered with an "LF" suffix to the par t number are the Pb-Free configuration and are RoHS compliant.
While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology, Incorporated (IDT) assumes no responsibility for either its use or for
infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial and
industrial applications. Any other applications such as those requiring high reliability or other extraordinary environmental requirements are not recommended without additional processing by IDT. IDT
reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments.
IDT™ / ICS™ PCI EXPRESS JITTER ATTENUATOR
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PCI EXPRESS™ JITTER ATTENUATOR
Innovate with IDT and accelerate your future networks. Contact:
www.IDT.com
For Sales
For Tech Support
Corporate Headquarters
800-345-7015 (inside USA)
+408-284-8200 (outside USA)
Fax: 408-284-2775
www.IDT.com/go/contact IDT
[email protected]
+480-763-2056
Integrated Device Technology, Inc.
6024 Silver Creek Valley Road
San Jose, CA 95138
United States
800-345-7015 (inside USA)
+408-284-8200 (outside USA)
© 2009 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. IDT, the IDT logo, ICS and HiPerClockS are trademarks
of Integrated Device Technology, Inc. Accelerated Thinking is a service mark of Integrated Device Technology, Inc. All other brands, product names and marks are or may be
trademarks or registered trademarks used to identify products or services of their respective owners.
Printed in USA