HMC1058

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HMC1058
v01.0413
MIXERS - SUB HARMONIC - CHIP
GaAs MMIC SUB HARMONIC
MIXER, 71 - 86 GHz
Typical Applications
Features
The HMC1058 is ideal for:
Passive: No DC Bias Required
• E-Band Communications Systems
Low LO Power: 9 dBm
• Test Equipment & Sensors
High LO/RF Isolation: 28 dB
• Military End-Use
High 2LO/RF Isolation: 43 dB
• Automotive Radar
Wide IF Bandwidth: DC to 12 GHz
Upconversion & Downconversion Applications
Die Size: 1.15 x 0.97 x 0.1 mm
Functional Diagram
General Description
The HMC1058 is a sub-harmonically pumped
MMIC mixer. It can be used as an upconverter or a
downconverter, with DC to 12 GHz at the IF port and
71 to 86 GHz at the RF port. This passsive MMIC mixer
is fabricated with GaAs Shottky diode technology. All
bond pads and the die backside are Ti/Au metallized
and the Shottky devices are fully passivated for
reliable operation. All data shown herein is measured
with the chip in a 50 Ohm environment and contacted
with RF probes.
Electrical Specifications, TA = +25° C, IF = 4 GHz, LO = +9 dBm, USB [1]
Parameter
Min.
Typ.
Max.
Units
RF Frequency Range
71 - 86
GHz
IF Frequency Range
DC - 12
GHz
LO Frequency Range
29 - 43
GHz
Conversion Loss
-11
dB
2LO to RF Isolation
43
dB
LO to RF Isolation
28
dB
LO to IF Isolation
20
dB
RF to IF Isolation
18
dB
6
dBm
IP3 (Input)
[2]
-14
[1] Unless otherwise noted , all measurements performed as an downconverter with LO = +9 dBm.
[2] Upconverter performance.
1
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
HMC1058
v01.0413
GaAs MMIC SUB HARMONIC
MIXER, 71 - 86 GHz
-5
-5
-10
-10
-15
-20
-25
-30
60
65
70
75
80
85
-15
-20
-25
-30
90
60
RF FREQUENCY (GHz)
+25 C
+85 C
-55 C
75
+25 C
80
85
90
+85 C
-55 C
Conversion Gain vs. Temperature
IF= 12 GHz, USB
-5
-10
-10
CONVERSION GAIN (dB)
-5
-15
-20
-25
-30
-15
-20
-25
-30
60
65
70
75
80
85
90
60
65
RF FREQUENCY (GHz)
+25 C
70
75
80
85
90
RF FREQUENCY (GHz)
+85 C
+25 C
-55 C
+85 C
-55 C
Conversion Gain vs. LO Power
IF= 4 GHz, USB
Conversion Gain vs. LO Power
IF= 2 GHz, USB
-5
-5
-10
-10
CONVERSION GAIN (dB)
CONVERSION GAIN (dB)
70
RF FREQUENCY (GHz)
Conversion Gain vs. Temperature
IF= 8 GHz, USB
CONVERSION GAIN (dB)
65
MIXERS - SUB HARMONIC - CHIP
Conversion Gain vs. Temperature
IF= 4 GHz, USB
CONVERSION GAIN (dB)
CONVERSION GAIN (dB)
Conversion Gain vs. Temperature
IF= 2 GHz, USB
-15
-20
-25
-30
-15
-20
-25
-30
60
65
70
75
80
85
RF FREQUENCY (GHz)
7 dBm
90
60
65
70
75
80
85
90
RF FREQUENCY (GHz)
9 dBm
7 dBm
9 dBm
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
2
HMC1058
v01.0413
GaAs MMIC SUB HARMONIC
MIXER, 71 - 86 GHz
-5
-5
-10
-10
CONVERSION GAIN (dB)
CONVERSION GAIN (dB)
Conversion Gain vs. LO Power
IF= 12 GHz, USB
-15
-20
-25
-30
-15
-20
-25
-30
60
65
70
75
80
85
90
60
65
RF FREQUENCY (GHz)
7 dBm
70
75
80
85
90
RF FREQUENCY (GHz)
9 dBm
7 dBm
Conversion Gain vs. LO Power
IF= 2 GHz, LSB
9 dBm
Conversion Gain vs. LO Power
IF= 4 GHz, LSB
-5
-5
-10
-10
CONVERSION GAIN (dB)
CONVERSION GAIN (dB)
MIXERS - SUB HARMONIC - CHIP
Conversion Gain vs. Lo Power
IF= 8 GHz, USB
-15
-20
-25
-30
-35
-15
-20
-25
-30
-35
-40
-40
60
65
70
75
80
85
90
60
65
RF FREQUENCY (GHz)
7 dBm
70
75
80
85
90
RF FREQUENCY (GHz)
9 dBm
7 dBm
Conversion Gain vs. LO Power
IF= 8 GHz, LSB
9 dBm
Conversion Gain vs. LO Power
IF= 12 GHz, LSB
-5
-5
CONVERSION GAIN (dB)
CONVERSION GAIN (dB)
-10
-15
-20
-25
-30
-10
-15
-20
-25
-35
-40
-30
60
65
70
75
80
85
RF FREQUENCY (GHz)
7 dBm
3
90
60
65
70
75
80
85
90
RF FREQUENCY (GHz)
9 dBm
7 dBm
9 dBm
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
HMC1058
v01.0413
GaAs MMIC SUB HARMONIC
MIXER, 71 - 86 GHz
-5
-5
-10
-10
-15
-20
-25
-30
-15
-20
-25
-30
0
1.5
3
4.5
6
7.5
9
10.5
12
0
1.5
3
IF FREQUENCY (GHz)
7 dBm
9 dBm
6
9
10.5
12
9 dBm
Conversion Gain, Upconverter,
LO=9dBm, IF= 4 GHz, LSB
-5
-5
CONVERSION GAIN (dB)
-10
-15
-20
-25
-30
-10
-15
-20
-25
-30
60
65
70
75
80
85
90
60
65
70
75
80
85
90
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
CG
CG
Input IP3, Upconverter, LO= 9dBm,
IF=4 GHz, USB
10
Input IP3, Upconverter, LO= 9dBm,
IF=4 GHz, LSB
8
8
6
IP3 (dBm)
IP3 (dBm)
7.5
7 dBm
Conversion Gain, Upconverter,
LO=9dBm, IF= 4 GHz, USB
CONVERSION GAIN (dB)
4.5
IF FREQUENCY (GHz)
MIXERS - SUB HARMONIC - CHIP
Conversion Gain IFBW vs. LO Power
Downconverter, LO=37.25 GHz, USB
CONVERSION GAIN (dB)
CONVERSION GAIN (dB)
Conversion Gain IFBW vs. LO Power
LO=31.25 GHz, USB
6
4
4
2
2
0
0
60
65
70
75
80
RF FREQUENCY (GHz)
IP3
85
90
60
65
70
75
80
85
90
RF FREQUENCY (GHz)
IP3
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
4
HMC1058
v01.0413
GaAs MMIC SUB HARMONIC
MIXER, 71 - 86 GHz
IF Return Loss
RF Return Loss
0
-5
RETURN LOSS (dB)
RETURN LOSS (dB)
-5
-10
-15
-10
-15
-20
-25
-30
-20
-35
50
55
60
65
70
75
80
85
90
95
0
100
5
10
15
RF-RL
25
30
85
90
IF-RL
LO Return Loss
RF/IF Isolation
5
0
0
-10
ISOLATION (dB)
-5
-10
-15
-20
-20
-30
-25
-40
-30
2
6
10
14
18
22
26
30
34
38
42
46
50
60
65
70
75
RF/IF Isolation
LO-RL
LO/IF Isolation vs. LO Drive
LO/RF isolation
40
40
30
30
ISOLATION (dB)
ISOLATION (dB)
80
RF FREQUENCY (GHz)
LO FREQUENCY (GHz)
20
20
10
10
0
0
30
32
34
36
38
40
42
7 dBm
44
30
32
34
36
38
40
42
44
LO FREQUENCY (GHz)
LO FREQUENCY (GHz)
5
20
IF FREQUENCY (GHz)
RF FREQUENCY (GHz)
RETURN LOSS (dB)
MIXERS - SUB HARMONIC - CHIP
0
9 dBm
LO/RF
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
HMC1058
v01.0413
GaAs MMIC SUB HARMONIC
MIXER, 71 - 86 GHz
2LO/RF Isolation
ISOLATION (dB)
50
40
30
20
10
0
28
30
32
34
36
38
40
42
44
LO FREQUENCY (GHz)
2XLO/RF
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
MIXERS - SUB HARMONIC - CHIP
60
6
HMC1058
v01.0413
GaAs MMIC SUB HARMONIC
MIXER, 71 - 86 GHz
MIXERS - SUB HARMONIC - CHIP
Table 1. Absolute Maximum Ratings
RF Input (LO = +9 dBm)
+5 dBm
LO Drive
+20 dBm
IF Input
+3 dBm
Maximum Junction Temperature
170 °C
Thermal Resistance (RTH)
(junction to die bottom)
555 °C/W
Operating Temperature
-55 to +85 °C
Storage Temperature
-65 to 150 °C
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Outline Drawing
Table 2. Die Packaging Information
Standard
Alternate
GP-2 (Gel Pack)
[2]
[1]
[1] For more information refer to the “Packaging
information” Document in the Product Support Section of
our website.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
7
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM].
2. DIE THICKNESS IS 0.004”
3. BOND PADS 1, 2 & 3 are 0.0059” [0.150] X 0.0039” [0.099].
4. BACKSIDE METALLIZATION: GOLD.
5. BOND PAD METALLIZATION: GOLD.
6. BACKSIDE METAL IS GROUND.
7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
8. Overall die size ± 0.002
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
HMC1058
v01.0413
GaAs MMIC SUB HARMONIC
MIXER, 71 - 86 GHz
Table 3. Pad Descriptions
Function
Description
1
RF
This pad is matched to 50 Ohms.
2
LO
This pad is AC coupled
and Matched to 50 Ohms.
3
IF
This pad is AC coupled
and Matched to 50 Ohms.
Die Bottom
GND
Die bottom must be connected to RF/DC ground
Pad Schematic
Assembly Diagram
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
MIXERS - SUB HARMONIC - CHIP
Pad Number
8
HMC1058
v01.0413
GaAs MMIC SUB HARMONIC
MIXER, 71 - 86 GHz
Mounting & Bonding Techniques for Millimeterwave GaAs MMICs
MIXERS - SUB HARMONIC - CHIP
The die should be attached directly to the ground plane eutectically or with
conductive epoxy (see HMC general Handling, Mounting, Bonding Note).
50 Ohm Microstrip transmission lines on 0.127mm (5 mil) thick alumina
thin film substrates are recommended for bringing RF to and from the chip
(Figure 1). One way to accomplish this is to attach the 0.102mm (4 mil)
thick die to a 0.150mm (6 mil) thick molybdenum heat spreader (molytab) which is then attached to the ground plane (Figure 2). Microstrip
substrates should be located as close to the die as possible in order to
minimize bond wire length. Typical die-to-substrate spacing is 0.076mm to
0.152 mm (3 to 6 mils).
0.102mm (0.004”) Thick GaAs MMIC
Wire Bond
0.076mm
(0.003”)
RF Ground Plane
Handling Precautions
0.127mm (0.005”) Thick Alumina
Thin Film Substrate
Follow these precautions to avoid permanent damage.
Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective bag for shipment.
Once the sealed ESD protective bag has been opened, all die should be
stored in a dry nitrogen environment.
Cleanliness: Handle the chips in a clean environment. DO NOT attempt
to clean the chip using liquid cleaning systems.
Figure 1.
0.102mm (0.004”) Thick GaAs MMIC
Wire Bond
0.076mm
(0.003”)
Static Sensitivity: Follow ESD precautions to protect against > ± 250V
ESD strikes.
Transients: Suppress instrument and bias supply transients while bias is
applied. Use shielded signal and bias cables to minimize inductive pickup.
General Handling: Handle the chip along the edges with a vacuum collet
or with a sharp pair of bent tweezers. The surface of the chip may have
fragile air bridges and should not be touched with vacuum collet, tweezers,
or fingers.
RF Ground Plane
0.150mm (0.005”) Thick
Moly Tab
0.254mm (0.010”) Thick Alumina
Thin Film Substrate
Figure 2.
Mounting
The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy.
The mounting surface should be clean and flat.
Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 °C and a tool
temperature of 265 °C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 °C. DO
NOT expose the chip to a temperature greater than 320 °C for more than 20 seconds. No more than 3 seconds of
scrubbing should be required for attachment.
Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed
around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule.
Wire Bonding
Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage
temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on
the chip and terminated on the package or substrate. All bonds should be as short as possible <0.31mm (12 mils).
9
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
HMC1058
v01.0413
GaAs MMIC SUB HARMONIC
MIXER, 71 - 86 GHz
MIXERS - SUB HARMONIC - CHIP
Notes:
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
10