APW7137

APW7137
1MHz, High Efficiency, Step-Up Converter with Internal FET Switch
Features
General Description
•
Wide 2.5V to 6V Input Voltage Range
•
Built-in 0.6Ω N-Channel MOSFET
The APW7137 is a fixed switching frequency (1MHz
typical), current-mode, step-up regulator with an inte-
•
Built-in Soft-Start
•
High Efficiency up to 90%
•
<1µA Quiescent Current During Shutdown
•
Current-Mode Operation
grated N-channel MOSFET. The device allows the usage
of small inductors and output capacitors for portable
devices. The current-mode control scheme provides fast
transient response and good output voltage accuracy.
The APW7137 includes under-voltage lockout, currentlimit, and over-temperature shutdown preventing dam-
- Stable with Ceramic Output Capacitors
- Fast Transient Response
age in the event of an output overload.
•
Current-Limit Protection
•
Over-Temperature Protection with Hysteresis
•
Available in a Tiny 5-Pin SOT-23 and TSOT-23
90
Packages
80
Lead Free and Green Devices Available
70
Efficiency, η (%)
•
100
(RoHS Compliant)
Applications
VIN=5V
60
VIN=3.3V
50
40
30
•
Cell Phone and Smart Phone
20
•
PDA, PMP, MP3
10
•
Digital Camera
0
•
Boost Regulators
VOUT=12V
0.1
1
Pin Configuration
5 VIN
1000
10µH
C1
4.7µF
4 EN
5 VIN
2
SOT-23-5 / TSOT-23-5
(Top View)
ON
OFF
VOUT
L1
5V
GND 2
FB 3
100
Simplified Application Circuit
VIN
LX 1
10
Output Current, IOUT (mA)
4
12V
LX 1
R1
1.2MΩ
C2
4.7µF
GND
APW7137
EN
FB 3
R2
137kΩ
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Mar., 2013
1
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APW7137
Ordering and Marking Information
Package Code
B : SOT-23-5 BT : TSOT-23-5
Operating Ambient Temperature Range
I : -40 to 85 oC
Handling Code
TR : Tape & Reel
Assembly Material
G : Halogen and Lead Free Device
APW7137
Assembly Material
Handling Code
Temperature Range
Package Code
APW7137 B :
W37X
X - Date Code
APW7137 BT :
37WX
X - Date Code
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Absolute Maximum Ratings
Symbol
(Note 1)
Parameter
Rating
Unit
VIN
VIN Pin to GND
-0.3 to 7
V
VLX
LX Pin to GND
-0.3 to 40
V
VEN
EN Pin to GND
-0.3 to VIN
V
TJ
Maximum Junction Temperature
TSTG
Storage Temperature Range
TSDR
Maximum Lead Soldering Temperature, 10 Seconds
150
°C
-65 to 150
°C
260
°C
Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device
reliability.
Thermal Characteristics
Symbol
θJA
Parameter
Typical Value
Junction to Ambient Thermal Resistance (Note 2)
SOT-23-5
260
TSOT-23-5
220
Note 2: θJA is measured with the component mounted on a high effective thermal conductivity test board in free air.
Unit
°C/W
Recommended Operating Conditions (Note 3)
Symbol
VIN
Parameter
VIN Input Voltage
Range
Unit
2.5 ~ 6
V
VLX
LX to GND Voltage
-0.3 ~ 36
V
VOUT
Converter Output Voltage
VIN ~ 35
V
2.2 ~
µF
CIN
COUT
Input Capacitor
2.2 ~
µF
TA
Ambient Temperature
Output Capacitor
-40 ~ 85
°C
TJ
Junction Temperature
-40 ~ 125
°C
Note 3: Please refer to the typical application circuit.
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Mar., 2013
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APW7137
Electrical Characteristics
Refer to the typical application circuits. These specifications apply over. VIN=3.6V, IOUT=0mA, TA=-40°C to 85°C, unless
otherwise noted. Typical values are at TA=25°C.
Symbol
Parameter
APW7137
Test Conditions
Unit
Min.
Typ.
Max.
2.5
-
6
V
VFB = 1.0V, switching
-
1
2
mA
EN = GND
-
0.1
1
µA
VIN Rising
2.0
2.2
2.4
V
50
100
150
mV
TA = 25°C
1.212
1.23
1.248
TA = -40 ~ 85°C
1.205
-
1.255
-50
-
50
nA
SUPPLY VOLTAGE AND CURRENT
VIN
IDD
Input Voltage Range
Input DC Bias Current
ISD
TA = -40 ~ 85°C, TJ = -40 ~ 125°C
UNDER-VOLTAGE LOCKOUT
UVLO Threshold Voltage
UVLO Hysteresis Voltage
REFERENCE AND OUTPUT VOLTAGES
VREF
IFB
Regulated Feedback Voltage
FB Input Current
V
INTERNAL POWER SWITCH
FSW
Switching Frequency
0.8
1.0
1.2
MHz
RON
Power Switch On Resistance
-
0.6
-
Ω
ILIM
Power Switch Current Limit
1
1.3
1.6
A
LX Leakage Current
DMAX
VFB=1.1V
VEN=0V, VLX=0V or 5V, VIN = 5V
LX Maximum Duty Cycle
-1
-
1
µA
92
95
98
%
SOFT-START AND SHUTDOWN
TSS
Soft-Start Duration (Note 4)
VTEN
EN Voltage Threshold
-
2
3
ms
0.4
0.7
1
V
-
0.1
-
V
VEN=5V, VIN = 5V
-1
±0.5
1
µA
TJ Rising
-
150
-
°C
-
40
-
°C
VEN Rising
EN Voltage Hysteresis
ILEN
EN Leakage Current
OVER-TEMPERATURE PROTECTION
TOTP
Over-Temperature Protection (Note 4)
Over-Temperature Protection
Hysteresis (Note 4)
Note 4: Guaranteed by design, not production tested.
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Mar., 2013
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APW7137
Typical Operating Characteristics
(Refer to the section “Typical Application Circuits”, VIN=3.6V, TA=25oC, unless otherwise specified)
Reference Voltage vs.
Junction Temperature
Switching Current vs. Supply Voltage
1.28
1.2
Reference Voltage, VREF (%)
Switching Current, IDD (mA)
1.27
1
0.8
0.6
0.4
0.2
VFB=1.0V
0
2.5
3
3.5
4
4.5
5
5.5
1.26
1.25
1.24
1.23
1.22
1.21
1.20
1.19
1.18
-50
6
-25
Supply Voltage, V IN (V)
75
100
125
Supply Voltage
100
0.8
Maximum Duty Cycle, DMAX (%)
Switch ON Resistance, RON (Ω)
50
Maximum Duty Cycle vs.
Junction temperature
0.7
0.6
VIN=2.7V
0.5
0.4
VIN=3.6V
0.3
VIN=5V
0.2
-50
-25
0
25
50
75
100
90
80
70
60
50
40
125
2.5
3
3.5
Junction Temperature, T J (°C)
4.5
5
5.5
6
Switching Frequency vs.
Junction Temperature
1.2
Switching Frequency, FSW (MHz)
1.2
1.1
1
0.9
0.8
0.7
0.6
0.5
0.4
2.5
4
Supply Voltage, V IN (V)
Switching Frequency vs.
Supply Voltage
Switching Frequency, FSW (MHz)
25
Junction Temperature, T J (°C)
Switch ON Resistance vs.
0.9
0
3
3.5
4
4.5
5
5.5
1
0.9
0.8
0.7
0.6
0.5
0.4
-50
6
Supply Voltage, V IN (V)
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Mar., 2013
1.1
-25
0
25
50
75
100
125
Junction Temperature, T J (°C)
4
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APW7137
Typical Operating Characteristics (Cont.)
(Refer to the section “Typical Application Circuits”, VIN=3.6V, TA=25oC, unless otherwise specified)
Output Voltage vs. Output Current
Efficiency vs. Output Current
100
12.20
VIN=5V
90
12.15
Output Voltage, VOUT(V)
Efficiency, η (%)
80
70
60
VIN=3.3V
50
40
30
20
10
12.10
VIN=5V
12.05
12.00
11.95
VIN=3.3V
11.90
11.85
VOUT=12V
0
11.80
0.1
1
10
100
1000
0.1
Output Current, I OUT (mA)
1
10
100
1000
Output Current, IOUT (mA)
Output Voltage vs. Supply Voltage
12.20
Output Voltage, VOUT(V)
12.15
12.10
12.05
12.00
11.95
11.90
11.85
11.80
2.5
3
3.5
4
4.5
5
5.5
6
Supply Voltage, VIN (V)
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Mar., 2013
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APW7137
Operating Waveforms
(Refer to the section “Typical Application Circuits”, VIN=3.6V, TA=25oC, unless otherwise specified)
Start-up
Start-up
VEN, 1V/Div, DC
1
VEN, 1V/Div, DC
1
VOUT, 5V/Div, DC
2
VOUT, 5V/Div, DC
2
VIN=3.6V
IOUT=1mA
IIN, 100mA/Div
IIN, 100mA/Div
3
3
Time: 0.5ms/Div
Time: 0.5ms/Div
CH1: VEN, 1V/Div, DC
CH2: VOUT, 5V/Div, DC
CH3: IIN, 100mA/Div, DC
Time: 0.5ms/Div
VIN=3.6V
IOUT=100mA
CH1: VEN, 1V/Div, DC
CH2: VOUT, 5V/Div, DC
CH3: IIN, 100mA/Div, DC
Time: 0.5ms/Div
Normal Operation
Normal Operation
VLX, 10V/Div
VLX, 10V/Div
1
1
VOUT, 50mV/Div
VOUT, 50mV/Div
2
2
IL, 100mA/Div
IL, 100mA/Div
Time: 1µs/Div
3
VIN=3.3V
IOUT=80mA
3
CH1: V LX, 10V/Div, DC
CH2: V OUT, 50mV/Div, AC
CH3: I L, 100mA/Div, DC
Time: 1µs/Div
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Mar., 2013
Time: 1µs/Div
VIN=5V
IOUT=80mA
CH1: VLX, 10V/Div, DC
CH2: VOUT, 50mV/Div, AC
CH3: IL, 100mA/Div, DC
Time: 1µs/Div
6
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APW7137
Operating Waveforms (Cont.)
(Refer to the section “Typical Application Circuits”, VIN=3.6V, TA=25oC, unless otherwise specified)
Load Transient Response
Load Transient Response
VOUT, 200mV/Div, AC
1
30mA
VOUT, 200mV/Div, AC
1
IOUT, 50mA/Div
1mA
2
Time: 0.2ms/Div
Time: 0.5ms/Div
CH1: VOUT, 200mV/Div, AC
CH2: IOUT, 50mA/Div, DC
Time: 0.5ms/Div
Load Transient Response
Load Transient Response
VOUT, 200mV/Div, AC
30mA
IOUT, 50mA/Div
1mA
2
VIN=3.3V
VOUT=12V
CH1: VOUT, 200mV/Div, AC
CH2: IOUT, 50mA/Div, DC
Time: 0.2ms/Div
1
VIN=3.3V
VOUT=12V
30mA
IOUT, 50mA/Div
Time: 0.2ms/Div
2
VIN=5V
VOUT=12V
1mA
IOUT, 50mA/Div
Time: 0.5ms/Div
CH1: VOUT, 200mV/Div, AC
CH2: IOUT, 50mA/Div, DC
Time: 0.5ms/Div
CH1: VOUT, 200mV/Div, AC
CH2: IOUT, 50mA/Div, DC
Time: 0.2ms/Div
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Mar., 2013
VIN=5V
VOUT=12V
30mA
1mA
2
VOUT, 200mV/Div, AC
1
7
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APW7137
Operating Waveforms (Cont.)
(Refer to the section “Typical Application Circuits”, VIN=3.6V, TA=25oC, unless otherwise specified)
Load Transient Response
Load Transient Response
VOUT, 200mV/Div, AC
1
VOUT, 200mV/Div, AC
1
IOUT, 50mA/Div
150mA
150mA
30mA
IOUT, 50mA/Div
30mA
2
2
VIN=3.3V
VOUT=12V
Time: 0.1ms/Div
Time: 0.1ms/Div
CH1: VOUT, 200mV/Div, AC
CH2: IOUT, 50mA/Div, DC
Time: 0.1ms/Div
CH1: VOUT, 200mV/Div, AC
CH2: IOUT, 50mA/Div, DC
Time: 0.1ms/Div
Load Transient Response
Load Transient Response
VOUT, 200mV/Div, AC
1
VIN=3.3V
VOUT=12V
VOUT, 200mV/Div, AC
1
150mA
IOUT, 50mA/Div
150mA
IOUT, 50mA/Div
30mA
30mA
2
Time: 0.1ms/Div
2
VIN=5V
VOUT=12V
VIN=5V
VOUT=12V
CH1: VOUT, 200mV/Div, AC
CH2: IOUT, 50mA/Div, DC
Time: 0.1ms/Div
CH1: VOUT, 200mV/Div, AC
CH2: IOUT, 50mA/Div, DC
Time: 0.1ms/Div
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Mar., 2013
Time: 0.1ms/Div
8
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APW7137
Operating Waveforms (Cont.)
(Refer to the section “Typical Application Circuits”, VIN=3.6V, TA=25oC, unless otherwise specified)
Line Transient Response
Line Transient Response
VIN, 1V/Div, DC
VIN, 1V/Div, DC
5V
4.2V
3.2V
4V
VOUT, 0.2V/Div, AC
VOUT, 0.2V/Div, AC
2
2
1
1
Time: 0.2ms/Div
IOUT=40mA
VOUT=12V
Time: 0.2ms/Div
CH1: VIN, 1V/Div, DC
CH2: VOUT, 0.2/Div, AC
Time: 0.2ms/Div
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Mar., 2013
IOUT=40mA
VOUT=5V
CH1: VIN, 1V/Div, DC
CH2: VOUT, 0.2/Div, AC
Time: 0.2ms/Div
9
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APW7137
Pin Description
PIN.
FUNCTION
NO
NAME
1
LX
2
GND
3
FB
Feedback Input. The device senses feedback voltage via FB and regulate the voltage at 1.23V.
Connecting FB with a resistor-divider from the output that sets the output voltage in the range from
VIN to 30V.
4
EN
Enable Control Input. Forcing this pin above 1.0V enables the device. Forcing this pin below 0.4V to
shut it down. In shutdown, all functions are disabled to decrease the supply current below 1µA. Do
not left this pin floating.
5
VIN
Main Supply Pin. Must be closely decoupled to GND with a 2.2µF or greater ceramic capacitor.
Switch pin. Connect this pin to inductor/diode here.
Power and signal ground pin.
Block Diagram
VIN
UVLO
EN
LX
Gate Driver
Control Logic
Over-Temperature
Protection
Slop
Compensation
Current
Limit
Current Sense
Amplifier
Σ
Oscillator
Error
Amplifier
ICMP
GND
FB
COMP
EAMP
VREF
1.23V
Soft-Start
Copyright  ANPEC Electronics Corp.
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APW7137
Typical Application Circuits
VIN
L1
VOUT
10µH
5V
C1
4.7µF
5
2
ON
OFF
4
12V
LX
VIN
1
R1
1.2MΩ
C2
4.7µF
GND
APW7137
FB
EN
3
R2
137kΩ
Figure 1. Typical 5V to 12V Supply
VIN
VOUT
L1
4.7µH
3.3V
C1
4.7µF
5
2
ON
OFF
4
5V
LX
VIN
1
R1
430kΩ
C2
10µF
GND
APW7137
FB
EN
3
R2
140kΩ
Figure 2. Standard 3.3V to 5V Supply
L1
VIN
VOUT
22µH
C1
4.7µF
5
2
100Hz~300Hz
4
VIN
LX
1
C2
1µF
Up to 8
WLEDs
GND
APW7137
EN
FB
Duty=100%, ILED=20mA
3
R1
62Ω
Duty=0%, LED off
Figure 3. Brightness control using a PWM signal apply to EN
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Mar., 2013
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APW7137
Typical Application Circuits (Cont.)
+13V
C6
0.47µF
+9V
C4
0.47µF
C5
C9
0.1µF
0.1µF
C3
C7
0.1µF
0.1µF
-8V
C10
0.47µF
-4V
C8
0.47µF
VIN
C1
4.7µF
5
2
ON
OFF
4
L1
VOUT
4.7µH
5V
VIN
LX
1
R1
430kΩ
C2
10µF
GND
APW7137
EN
FB
3
R2
140kΩ
Figure 4. Multiple Output for TFT-LCD Power Supply
Copyright  ANPEC Electronics Corp.
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APW7137
Function Description
Main Control Loop
Over-Temperature Protection (OTP)
The APW7137 is a constant frequency and current-mode
The over-temperature circuit limits the junction tempera-
switching regulator. In normal operation, the internal Nchannel power MOSFET is turned on each cycle when the
ture of the APW7137. When the junction temperature exceeds 150 oC, a thermal sensor turns off the power
oscillator sets an internal RS latch, and then turned off
when an internal comparator (ICMP) resets the latch. The
MOSFET allowing the devices to cool. The thermal sensor allows the converters to start a soft-start process and
peak inductor current at which ICMP resets the RS latch
is controlled by the voltage on the COMP node which is
regulates the output voltage again after the junction temperature cools by 40oC. The OTP is designed with a 40oC
the output of the error amplifier (EAMP). An external resistive divider connected between VOUT and ground allows
hysteresis to lower the average Junction Temperature
(TJ) during continuous thermal overload conditions in-
the EAMP to receive an output feedback voltage VFB at FB
pin. When the load current increases, it causes a slightly
creasing the lifetime of the device.
Enable/Shutdown
to decrease in VFB associated with the 1.23V reference,
which in turn, it causes the COMP voltage to increase
Driving EN to the ground places the APW7137 in shut-
until the average inductor current matches the new load
current.
down mode. When in shutdown, the internal power
MOSFET turns off, all internal circuitry shuts down, and
the quiescent supply current reduces to 1µA maximum.
VIN Under-Voltage Lockout (UVLO)
The Under-Voltage Lockout (UVLO) circuit compares the
input voltage at VIN with the UVLO threshold to ensure
the input voltage is high enough for reliable operation.
The 100mV (typ) hysteresis prevents supply transients
from causing a restart. Once the input voltage exceeds
the UVLO rising threshold, startup begins. When the input voltage falls below the UVLO falling threshold, the
controller turns off the converter.
Soft-Start
The APW7137 has a built-in soft-start to control the output
voltage rise during start-up. During soft-start, an internal
ramp voltage, connected to the one of the positive inputs
of the error amplifier, raises up to replace the reference
voltage (1.23V typical) until the ramp voltage reaches the
reference voltage.
Current-Limit Protection
The APW7137 monitors the inductor current, flows through
the N-channel MOSFET, and limits the current peak at
current-limit level to prevent loads and the APW7137 from
damaging during overload or short-circuit conditions.
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Mar., 2013
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APW7137
Application Information
Input Capacitor Selection
The peak inductor current is calculated as the following
equation:
1 V ⋅ (VOUT − VIN )
IPEAK = IIN(MAX ) + ⋅ IN
2 VOUT ⋅ L ⋅ FSW
The input capacitor (CIN) reduces the ripple of the input
current drawn from the input supply and reduces noise
injection into the IC. The reflected ripple voltage will be
smaller when an input capacitor with larger capacitance
is used. For reliable operation, it is recommended to
VIN
select the capacitor with maximum voltage rating at least
1.2 times of the maximum input voltage. The capacitors
IL
IIN
LX
N-FET
CIN
IOUT
D1
VOUT
ESR
ISW
should be placed close to the VIN and the GND.
COUT
Inductor Selection
IL
Selecting an inductor with low dc resistance reduces conduction losses and achieves high efficiency. The efficiency
ILIM
is moderated whilst using small chip inductor which op-
IPEAK
∆IL
erates with higher inductor core losses. Therefore, it is
necessary to take further consideration while choosing
IIN
an adequate inductor. Mainly, the inductor value determines the inductor ripple current: larger inductor value
ISW
results in smaller inductor ripple current and lower conduction losses of the converter. However, larger inductor
value generates slower load transient response. A reasonable design rule is to set the ripple current, ∆IL, to be
30% to 50% of the maximum average inductor current,
IL(AVG). The inductor value can be obtained as below,
 V
L ≥  IN
 VOUT
ID
2

VOUT − VIN
η
 ×
×
 F ⋅I


SW OUT (MAX )

 ∆IL 
 IL (AVG ) 


IOUT
Output Capacitor Selection
where
The current-mode control scheme of the APW7137 al-
VIN = input voltage
lows the usage of tiny ceramic capacitors. The higher
capacitor value provides good load transients response.
VOUT = output voltage
FSW = switching frequency in MHz
Ceramic capacitors with low ESR values have the lowest
output voltage ripple and are recommended. If required,
IOUT = maximum output current in amp.
η = Efficiency
tantalum capacitors may be used as well. The output ripple
is the sum of the voltages across the ESR and the ideal
∆IL /IL(AVG) = inductor ripple current/average current
output capacitor.
(0.3 to 0.5 typical)
To avoid the saturation of the inductor, the inductor should
be rated at least for the maximum input current of the
Δ VOUT = ΔVESR + ΔVCOUT
∆VCOUT ≈
converter plus the inductor ripple current. The maximum
input current is calculated as below:
IIN(MAX ) =
V
− VIN 

⋅  OUT

V
⋅
 OUT FSW 
∆VESR ≈ IPEAK ⋅ RESR
IOUT (MAX ) ⋅ VOUT
VIN ⋅ η
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Mar., 2013
IOUT
COUT
where IPEAK is the peak inductor current.
14
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APW7137
Application Information (Cont.)
4. A star ground connection or ground plane minimizes
ground shifts and noise is recommended.
Output Capacitor Selection (Cont.)
For ceramic capacitor application, the output voltage ripple
is dominated by the ∆VCOUT. When choosing the input and
output ceramic capacitors, the X5R or X7R with their good
VOUT
t e m p e r a t u r e an d v o l t a g e c h a r ac t e r i s t i c s a r e
recommended.
L1
D1
LX
C2
VIN
R1
The output voltage is set by a resistive divider. The external resistive divider is connected to the output which allows remote voltage sensing as shown in “Typical Application Circuits”. A suggestion of the maximum value of
R2
C1
Output Voltage Setting
VEN
Optimized APW7137 Layout
R1 is 2MΩ and R2 is 200kΩ for keeping the minimum
current that provides enough noise rejection ability through
the resistor divider. The output voltage can be calculated
as below:
R1 
R1 


VOUT = VREF ⋅  1 +
 = 1.23 1 +

 R2 
 R2 
Diode Selection
To achieve the high efficiency, a Schottky diode must be
used. The current rating of the diode must meet the peak
current rating of the converter.
Layout Consideration
For all switching power supplies, the layout is an important step in the design especially at high peak currents
and switching frequencies. If the layout is not carefully
done, the regulator might show noise problems and duty
cycle jitter.
1. The input capacitor should be placed close to the VIN
and the GND without any via holes for good input voltage filtering.
2. To minimize copper trace connections that can inject
noise into the system, the inductor should be placed as
close as possible to the LX pin to minimize the noise
coupling into other circuits.
3. Since the feedback pin and network is a high impedance circuit the feedback network should be routed away
from the inductor. The feedback pin and feedback network should be shielded with a ground plane or trace to
minimize noise coupling into this circuit.
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Mar., 2013
15
www.anpec.com.tw
APW7137
Package Information
SOT-23-5
D
e
E
E1
SEE
VIEW A
b
c
0.25
A
L
0
GAUGE PLANE
SEATING PLANE
A1
A2
e1
VIEW A
S
Y
M
B
O
L
SOT-23-5
INCHES
MILLIMETERS
MIN.
MAX.
MIN.
MAX.
0.057
A
1.45
A1
0.00
0.15
0.000
0.006
A2
0.90
1.30
0.035
0.051
0.020
b
0.30
0.50
0.012
c
0.08
0.22
0.003
0.009
D
2.70
3.10
0.106
0.122
0.118
0.071
E
2.60
3.00
0.102
E1
1.40
1.80
0.055
e
0.95 BSC
e1
1.90 BSC
0.037 BSC
0.075 BSC
L
0.30
0.60
0
0°
8°
0.012
0°
0.024
8°
Note : 1. Follow JEDEC TO-178 AA.
2. Dimension D and E1 do not include mold flash, protrusions or gate
burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil
per side.
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Mar., 2013
16
www.anpec.com.tw
APW7137
Package Information
TSOT-23-5
D
e
E
E1
SEE VIEW A
b
c
0.25
A
GAUGE PLANE
SEATING PLANE
A1
A2
e1
L
VIEW A
TSOT-23-5
S
Y
M
B
O
L
MIN.
MAX.
MIN.
MAX.
A
0.70
1.00
0.028
0.039
MILLIMETERS
INCHES
A1
0.01
0.10
0.000
0.004
A2
0.70
0.90
0.028
0.035
b
0.30
0.50
0.012
0.020
c
0.08
0.22
0.003
0.009
D
2.70
3.10
0.106
0.122
E
2.60
3.00
0.102
0.118
E1
1.40
1.80
0.055
0.071
e
0.95 BSC
0.037 BSC
e1
1.90BSC
0.075 BSC
L
0.30
0.60
0
0°
8°
0.012
0°
0.024
8°
Note : 1. Followed from JEDEC TO-178 AA.
2. Dimension D and E1 do not include mold flash, protrusions or gate
burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per
side.
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Mar., 2013
17
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APW7137
Carrier Tape & Reel Dimensions
P0
P2
P1
A
B0
W
F
E1
OD0
K0
A0
A
OD1 B
B
T
SECTION A-A
SECTION B-B
H
A
d
T1
Application
SOT-23-5
TSOT-23-5
A
H
T1
C
d
D
W
E1
F
178.0±2.00
50 MIN.
8.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
8.0±0.30
1.75±0.10
3.5±0.05
P0
P1
P2
D0
D1
T
A0
B0
K0
4.0±0.10
4.0±0.10
2.0±0.05
1.5+0.10
-0.00
1.0 MIN.
0.6+0.00
-0.40
3.20±0.20
3.10±0.20
1.50±0.20
A
H
T1
C
d
D
W
E1
F
178.0±2.00
50 MIN.
8.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
8.0±0.30
1.75±0.10
3.5±0.05
P0
P1
P2
D0
D1
T
A0
B0
K0
2.0±0.05
1.5+0.10
-0.00
1.0 MIN.
0.6+0.00
-0.40
3.20±0.20
3.10±0.20
1.20±0.20
4.0±0.10
4.0±0.10
(mm)
Devices Per Unit
Package Type
Unit
Quantity
SOT-23-5
Tape & Reel
3000
TSOT-23-5
Tape & Reel
3000
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Mar., 2013
18
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APW7137
Taping Direction Information
SOT-23-5
USER DIRECTION OF FEED
TSOT-23-5
USER DIRECTION OF FEED
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Mar., 2013
19
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APW7137
Classification Profile
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Mar., 2013
20
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APW7137
Classification Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-120 seconds
3 °C/second max.
3°C/second max.
183 °C
60-150 seconds
217 °C
60-150 seconds
See Classification Temp in table 1
See Classification Temp in table 2
Time (tP)** within 5°C of the specified
classification temperature (Tc)
20** seconds
30** seconds
Average ramp-down rate (Tp to Tsmax)
6 °C/second max.
6 °C/second max.
6 minutes max.
8 minutes max.
Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
Average ramp-up rate
(Tsmax to TP)
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body Temperature
(Tp)*
Time 25°C to peak temperature
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)
Package
Volume mm
Thickness
<350
<2.5 mm
235 °C
≥2.5 mm
220 °C
Table 2. Pb-free Process – Classification Temperatures (Tc)
Package
Thickness
<1.6 mm
1.6 mm – 2.5 mm
≥2.5 mm
Volume mm
<350
260 °C
260 °C
250 °C
3
3
Volume mm
≥350
220 °C
220 °C
Volume mm
350-2000
260 °C
250 °C
245 °C
3
3
Volume mm
>2000
260 °C
245 °C
245 °C
3
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TCT
HBM
MM
Latch-Up
Method
JESD-22, B102
JESD-22, A108
JESD-22, A102
JESD-22, A104
MIL-STD-883-3015.7
JESD-22, A115
JESD 78
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Mar., 2013
21
Description
5 Sec, 245°C
1000 Hrs, Bias @ Tj=125°C
168 Hrs, 100%RH, 2atm, 121°C
500 Cycles, -65°C~150°C
VHBM≧2KV
VMM≧200V
10ms, 1tr≧100mA
www.anpec.com.tw
APW7137
Customer Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Mar., 2013
22
www.anpec.com.tw