APW7506

APW7506
1.5MHz, 1.5A(peak) Synchronous Buck Regulator
Features
General Description
•
1.5A Output Peak Current
•
Wide 3V~5.5V Input Voltage
APW7506 is a 1.5MHz high efficiency monolithic synchronous buck regulator. Design with current mode scheme,
•
Fixed 1.5MHz Switching Frequency
•
Low Dropout Operating at 100% Duty Cycle
•
30µA Quiescent Current
•
Integrate Synchronous Rectifier
•
0.6V Reference Voltage
•
Current-Mode Operation with Internal
the APW7506 is stable with ceramic output capacitor. Input voltage from 3V to 5.5V makes the APW7506 ideally
suited for single Li-Ion battery powered applications. 100%
duty cycle provides low dropout operation, extending battery life in portable electrical devices. The internally fixed
1.5MHz operating frequency allows the using of small
surface mount inductors and capacitors. The synchronous switches included inside increase the efficiency
Compensation
- Stable with Ceramic Output Capacitors
- Fast Line Transient Response
and eliminate the need of an external Schottky diode.
The APW7506 is available in SOT-23-5/TSOT-23-5A
•
Short-Circuit Protection
packages.
•
Over-Temperature Protection with Hysteresis
•
Available in SOT-23-5/TSOT-23-5A Packages
•
Lead Free and Green Devices Available
(RoHS Compliant)
Applications
Pin Configuration
•
HD STB
•
BT Mouse
RUN 1
•
PND Instrument
GND 2
•
Portable Instrument
APW7506
SW 3
C1
4.7µF
(MLCC)
L1
2.2µH
4 VIN
VOUT
SW 3
C3
APW7506
1
RUN
FB 5
GND
2
R1
4 VIN
SOT-23-5/TSOT-23-5A
(Top View)
Simplified Application Circuit
VIN
5 FB
C2
10µF
(MLCC)
R2
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Jul., 2015
1
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APW7506
Ordering and Marking Information
Package Code
BT : TSOT-23-5A B : SOT-23-5
Operating Ambient Temperature Range
I : -40 to 85 oC
Handling Code
TR : Tape & Reel
Assembly Material
G : Halogen and Lead Free Device
APW7506
Assembly Material
Handling Code
Temperature Range
Package Code
APW7506 BT :
W56X
X - Date Code
APW7506 B :
W56X
X - Date Code
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Absolute Maximum Ratings (Note 1)
Symbol
VIN
Parameter
Input Bias Supply Voltage (VIN to GND)
RUN, FB, SW to GND Voltage
IOUT
Maximum Peak Current, 10ms pulse, 1% duty cycle
PD
Power Dissipation
Maximum Junction Temperature
TSTG
Storage Temperature
TSDR
Maximum Lead Soldering Temperature, 10 Seconds
Rating
Unit
-0.3 ~ 6
V
-0.3 ~ VIN+0.3
V
1.5
A
Internally Limited
W
150
o
-65 ~ 150
o
260
o
C
C
C
Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device
reliability.
Thermal Characteristics
Symbol
θJA
Parameter
Junction-to-Ambient Resistance in Free Air
Typical Value
Unit
(Note 2)
TSOT-23-5A
SOT-23-5
o
C/W
220
250
Note 2: θJA is measured with the component mounted on a high effective thermal conductivity test board in free air.
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Jul., 2015
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APW7506
Recommended Operating Conditions (Note 3)
Symbol
VIN
Parameter
Input Bias Supply Voltage (VIN to GND)
Range
Unit
3 ~ 5.5
V
VOUT
Converter Output Voltage
0.6 ~ VIN
V
IOUT
Converter Output Current
0 ~ 1.2
A
L1
Converter Output Inductor
1.0 ~ 10
µH
CIN
Converter Input Capacitor
4.7 ~100
µF
Converter Output Capacitor
4.7 ~100
µF
Ambient Temperature
-40 ~ 85
o
-40 ~ 125
o
C OUT
TA
TJ
Junction Temperature
C
C
Note 3: Refer to the typical application circuit
Electrical Characteristics
Unless otherwise specified, these specifications apply over V IN=3.6V and TA= 25 oC.
Symbol
Parameter
Test Conditions
APW7506
Unit
Min.
Typ.
Max.
3
-
5.5
V
SUPPLY VOLTAGE AND CURRENT
VIN
Input Voltage Range
IDD
Quiescent Current
VFB = 0.66V
-
30
50
µA
ISD
Shutdown Input Current
RUN = GND
-
-
0.5
µA
2.45
2.7
2.95
V
-
0.1
-
V
0.588
0.6
0.612
V
-2.5
-
+2.5
%
-50
-
50
nA
1.2
1.5
1.8
MHz
POWER-ON-RESET (POR)
Rising POR Threshold
POR Hysteresis
REFERENCE VOLTAGE
VREF
I FB
o
Reference Voltage
VIN=3V~5.5V, TA = -40~85 C
Output Voltage Accuracy
0A < IOUT < 1A
FB Input Current
INTERNAL POWER MOSFETS
FSW
Switching Frequency
VFB = 0.6V
Foldback Frequency
VFB = 0.1V
-
210
-
kHz
Foldback Threshold Voltage on FB
VFB Falling
-
0.2
-
V
-
50
-
mV
R P-FET
Foldback Hysteresis
High Side P-FET Switch ON Resistance
I SW =200mA
-
0.26
-
Ω
R N-FET
Low Side N-FET Switch ON Resistance
I SW =200mA
-
0.23
-
Ω
Minimum On-Time
-
-
100
ns
Maximum Duty Cycle
-
-
100
%
2.1
3.2
-
A
-
150
-
-
30
-
PROTECTION
ILIM
T OTP
Maximum Inductor Current-Limit
Over-Temperature Protection
I P-FET, VIN = 3.3V
T J Rising
(Note 4)
Over-Temperature Protection Hysteresis
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Jul., 2015
3
°C
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APW7506
Electrical Characteristics
Unless otherwise specified, these specifications apply over V IN=3.6V and TA= 25 oC.
Symbol
Parameter
Test Conditions
APW7506
Min.
Typ.
Max.
Unit
START-UP AND SHUTDOWN
TSS
Soft-Start Duration
(Note 4)
-
0.7
-
ms
RUN Input High Threshold
VIN = 3V~5.5V
-
-
1
V
RUN Input Low Threshold
VIN = 3V~5.5V
0.4
-
-
V
RUN Leakage Current
VRUN = 5V, VIN = 5V
-1
-
1
µA
Note 4: Guarantee by design, not production test.
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APW7506
Typical Operating Characteristics
Efficiency vs. Load Current
Efficiency vs. Load Current
100
100
VIN = 5V,
TA = 25oC
95
VOUT = 1.8V
85
80
75
VOUT = 1.2V
70
80
75
70
65
60
60
55
55
0.1
1
VOUT = 1.2V
50
0.001
10
0.01
0.1
1
Load Current, IOUT (A)
Load Current, IOUT (A)
Quiescent Current vs.
Junction Temperature
Reference Voltage vs.
Junction Temperature
10
0.606
45
Automatic Mode
VIN = 3.6V
0.605
Reference Voltage, VREF (V)
VIN = 3.6V,
Quiescent Current, IQ (µA)
85
65
0.01
VOUT = 1.8V
90
Efficiency (%)
Efficiency (%)
90
50
0.001
VIN = 3.3V,
TA = 25oC
95
40
35
30
25
20
0.604
0.603
0.602
0.601
0.600
0.599
0.598
0.597
0.596
0.595
0.594
15
-50
-25
0
25
50
75
100
-50
125
-25
Junction Temperature ( C)
Maximum Inductor Current-Limit, ILIM (A)
Switching Frequency, FSW (MHz)
VIN = 3.6V
1.7
1.6
1.5
1.4
1.3
1.2
0
25
50
75
100
125
75
100
125
4.0
VIN = 3.3V
3.8
3.6
3.4
3.2
3.0
2.8
2.6
2.4
-50
o
-25
0
25
50
75
100
125
o
Junction Temperature ( C)
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Jul., 2015
50
Maximum Inductor Current-Limit
vs. Junction Temperature
1.8
-25
25
Junction Temperature ( C)
Switching Frequency vs.
Junction Temperature
-50
0
o
o
Junction Temperature ( C)
5
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APW7506
Typical Operating Characteristics
Maximum Inductor Current-Limit
vs. Supply Voltage
Switching Frequency vs.
Supply Voltage
Maximum Inductor Current-Limit, ILIM (A)
1.8
Switching Frequency, FSW (MHz)
TA = 25oC
1.7
1.6
1.5
1.4
1.3
1.2
3.0
3.5
4.0
4.5
5.0
TA = 25oC
3.8
3.6
3.4
3.2
3.0
2.8
2.6
2.4
3.0
5.5
3.5
4.0
4.5
5.0
5.5
Supply Voltage, VIN (V)
Supply Voltage, VIN (V)
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4.0
6
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APW7506
Operating Waveforms
Refer to the typical application circuit. The test condition is V IN=5V, VOUT=1.2V,TA= 25oC unless otherwise specified.
Soft-Start
Load Transient Response
VEN
1
VOUT
1
VOUT
2
IL
IOUT
3
2
No load, VPS=0V
IOUT =0.3A to 1.2A to 0.3A (rise / fall time = 0.5µs)
CH1: VEN, 5V/Div, DC
CH2: VOUT , 500mV/Div, DC
CH3: IL, 0.5A/Div, DC
TIME: 200µs/Div
CH1: VOUT , 100mV/Div, DC offset 1.2V
CH2: IOUT , 0.5A/Div, DC
TIME: 20µs/Div
Normal Operation
VOUT
1
IL
2
IOUT=1.2A
CH1: VOUT, 20mV/Div, DC offset 1.2V
CH2: IL, 0.5A/Div, DC
TIME: 500ns/Div
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APW7506
Pin Description
PIN
FUNCTION
NO.
NAME
1
RUN
Enable Control Input. Forcing this pin above 1.0V enables the device. Forcing this pin below 0.4V shuts it
down. In shutdown, all functions are disabled to decrease the supply current below 0.5µA. Do not leave
RUN pin floating.
2
GND
Power and Signal Ground.
3
SW
Switch Node Connected to Inductor. This pin connects to the drains of the internal main and synchronous
power MOSFETs switches.
4
VIN
Device and Converter Supply Pin. Must be closely decoupled to GND with a 4.7µF or greater ceramic
capacitor.
5
FB
Feedback Input Pin. The buck regulator senses feedback voltage via FB and regulates the FB voltage at
0.6V. Connecting FB with a resistor-divider from the output sets the output voltage of the buck converter.
Block Diagram
Current
Sense
Amplifier
RUN
VIN
Shutdown
Control
Logic Control
SW
OverTemperature
Protection
Gate
Driver
Current
-Limit
Slope
Compensation
ZeroCrossing
Comparator
∑
GND
Oscillator
ICMP
Error
Amplifier
FB
COMP
EAMP
SoftStart
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VREF
0.6V
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APW7506
Typical Application Circuit
IIN
VIN
L1
2.2µH
4
SW
VIN
VOUT
3
3 ~ 5.5V
C1
4.7µF
(MLCC)
C3
APW7506
1
RUN
FB
R1
5
GND
R1 ≤ 1MΩ is recommended
2
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Jul., 2015
0.6V~VIN
C2
0~1.2A
10µF
(MLCC)
R2
9
R2 ≤ 200kΩ is recommended
C1 closed to IC. Less than 2mm is recommended.
C3 ≤ 47pF is recommended
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APW7506
Function Description
Main Control Loop
tion to reduce the dominant switching losses. In PFM
The APW7506 is a constant frequency, synchronous rec-
operation, the inductor current may reach zero or reverse
on each pulse. A zero current comparator turn off the N-
tifier and current-mode switching regulator. In normal
operation, the internal P-channel power MOSFET is
FET, forcing DCM operation at light load. These controls
get very low quiescent current, help to maintain high effi-
turned on each cycle. The peak inductor current at which
ICMP turn off the P-FET is controlled by the voltage on the
ciency over the complete load range.
COMP node, which is the output of the error amplifier
(EAMP). An external resistive divider connected between
Slope Compensation and Inductor Peak Current
The APW7506 is a peak current mode PWM step down
converter. To prevent sub-harmonic oscillations, the
VOUT and ground allows the EAMP to receive an output
feedback voltage VFB at FB pin. When the load current
APW7506 sense the peak current and add slope compensation to stable the converter. It is accomplished in-
increases, it causes a slightly decrease in V FB relative to
the 0.6V reference, which in turn causes the COMP volt-
ternally by adding a compensating ramp to the inductor
current signal at duty cycles in excess of 40%. Normally,
age to increase until the average inductor current matches
the new load current.
Power-On-Reset (POR)
this results in a reduction of maximum inductor peak current for duty cycles > 40%. However, the APW7506 uses a
The APW7506 keeps monitoring the voltage on VIN pin to
prevent wrong logic operations which may occur when
special scheme that counteracts this compensating
ramp, which allows the maximum inductor peak current
VIN voltage is not high enough for the internal control
circuitry to operate. The VIN POR has a rising threshold
to remain unaffected throughout all duty cycles.
Adaptive Shoot-Through Protection
of 2.4V (typical) with 0.1V of hysteresis.
The gate driver incorporates adaptive shoot-through protection to high-side and low-side MOSFETs from conducting simultaneously and shorting the input supply.
Soft-Start
The APW7506 has a built-in soft-start to control the out-
This is accomplished by ensuring the falling gate has
turned off one MOSFET before the other is allowed to
put voltage rise during start-up. During soft-start, an internal ramp voltage, connected to the one of the positive
rise.
During turn-off the low-side MOSFET, the internal LGATE
inputs of the error amplifier, raises up to replace the reference voltage (0.6V typical) until the ramp voltage
voltage is monitored until it is below 1.5V threshold, at
which time the UGATE is released to rise after a constant
reaches the reference voltage. Then, the voltage on FB
regulated at reference voltage.
delay. During turn-off the high-side MOSFET, the UGATE
voltage is also monitored until it is above 1.5V threshold,
at which time the LGATE is released to rise after a constant delay.
Enable/Shutdown
Driving RUN to the ground places the APW7506 in shutdown mode. When in shutdown, the internal power
MOSFETs turn off, all internal circuitry shuts down and
the quiescent supply current reduces to 0.5µA maximum.
Pulse Frequency Modulation Mode (PFM)
The APW7506 is a fixed frequency, peak current mode
PWM step-down converter. At light loads, the APW7506
will automatically enter in pulse frequency mode opera-
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APW7506
Function Description (Cont.)
Over-Temperature Protection (OTP)
The over-temperature circuit limits the junction temperature of the APW7506. When the junction temperature exceeds 150 oC, a thermal sensor turns off the both power
MOSFETs, allowing the devices to cool. The thermal sensor allows the converters to start a soft-start process and
regulate the output voltage again after the junction temperature cools by 30oC. The OTP is designed with a 30oC
hysteresis to lower the average Junction Temperature
(TJ) during continuous thermal overload conditions, increasing the lifetime of the device.
Short-Circuit Protection
When the output is shortened to the ground, the frequency
of the oscillator is reduced to about 210kHz, 1/7 of the
nominal frequency. This frequency foldback ensures that
the inductor current has more time to decay, thereby preventing runaway. The oscillator’s frequency will progressively increase to 1.5MHz when VFB or VOUT rises above
0V.
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APW7506
Application Information
Input Capacitor Selection
shown in “Typical Application Circuits ”. A suggestion of
Because buck converters have a pulsating input current,
a low ESR input capacitor is required. This results in the
maximum value of R2 is 200kΩ to keep the minimum
current that provides enough noise rejection ability through
best input voltage filtering, minimizing the interference
with other circuits caused by high input voltage spikes.
the resistor divider. The output voltage can be calculated
as below:
R1 
R1 


VOUT = VREF ⋅  1 +
 = 0.6 ⋅ 1 +

R2 
R2 


Also, the input capacitor must be sufficiently large to stabilize the input voltage during heavy load transients. For
good input voltage filtering, usually a 4.7 µF input capacitor is sufficient. It can be increased without any limit for
VOUT
better input-voltage filtering. Ceramic capacitors show
better performance because of the low ESR value, and
R1≤1MΩ
they are less sensitive against voltage transients and
spikes compared to tantalum capacitors. Place the input
FB
R2 ≤ 200kΩ
APW7506
capacitor as close as possible to the input and GND pin of
the device for better performance.
GND
Inductor Selection
Output Capacitor Selection
For high efficiencies, the inductor should have a low DC
The current-mode control scheme of the APW7506 allows the use of tiny ceramic capacitors. The higher ca-
resistance to minimize conduction losses. Especially at
high-switching frequencies, the core material has a
pacitor value provides the good load transients response.
higher impact on efficiency. When using small chip
inductors, the efficiency is reduced mainly due to higher
Ceramic capacitors with low ESR values have the lowest
output voltage ripple and are recommended. If required,
inductor core losses. This needs to be considered when
selecting the appropriate inductor. The inductor value de-
tantalum capacitors may be used as well. The output
ripple is the sum of the voltages across the ESR and the
termines the inductor ripple current. The larger the inductor value, the smaller the inductor ripple current and the
ideal output capacitor.
lower the conduction losses of the converter. Conversely,
larger inductor values cause a slower load transient
∆VOUT
response. A reasonable starting point for setting ripple
current, ∆IL, is 40% of maximum output current. The rec-

V
VOUT ⋅ 1 − OUT
VIN

≅
FSW ⋅ L


 
1
 ⋅  ESR +

8 ⋅ FSW ⋅ COUT





When choosing the input and output ceramic capacitors,
ommended inductor value can be calculated as below:
choose the X5R or X7R dielectric formulations. These
dielectrics have the best temperature and voltage char-


V
VOUT 1 − OUT 
VIN 

L≥
FSW ⋅ ∆IL
acteristics of all the ceramics for a given value and size.
VIN
IL(MAX) = IOUT(MAX) + 1/2 x ∆IL
IIN
IP-FET
To avoid the saturation of the inductor, the inductor should
IL
be rated at least for the maximum output current of the
converter plus the inductor ripple current.
CIN
Output Voltage Setting
P-FET
VOUT
SW
N-FET
In the adjustable version, the output voltage is set by a
resistive divider. The external resistive divider is con-
IOUT
ESR
COUT
nected to the output, allowing remote voltage sensing as
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APW7506
Application Information (Cont.)
Output Capacitor Selection (Cont.)
The maximum power dissipation on the device can be
shown as follow figure:
IL
0.8
Maximum Power Disspation (W)
ILIM
IPEAK
∆IL
IOUT
IP-FET
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-50 -25
0
25
50
75 100 125 150
Junction Temperature (oC)
Thermal Consideration
Layout Consideration
In most applications, the APW7506 does not dissipate
much heat due to its high efficiency. But, in applications
For all switching power supplies, the layout is an impor-
where the APW7506 is running at high ambient temperature with low supply voltage and high duty cycles, the heat
tant step in the design; especially at high peak currents
and switching frequencies. If the layout is not carefully
dissipated may exceed the maximum junction tempera-
done, the regulator might show noise problems and duty
cycle jitter.
ture of the part. If the junction temperature reaches approximately 150°C, both power switches will be turned
off and the SW node will become high impedance.
To avoid the APW7506 from exceeding the maximum junction temperature, the user will need to do some thermal
analysis. The goal of the thermal analysis is to deter-
1. The input capacitor should be placed close to the VIN
and GND. Connecting the capacitor and VIN/GND with
short and wide trace without any via holes for good
input voltage filtering. The distance between VIN/GND
t o capac i t or l e s s t h a n 2m m r e s p e c t i v e l y i s
recommended.
mine whether the power dissipated exceeds the maximum junction temperature of the part. The power dissi-
2. To minimize copper trace connections that can inject
noise into the system, the inductor should be placed
pated by the part is approximated:
as close as possible to the SW pin to minimize the
noise coupling into other circuits.
PD ≅ IOUT2 x (RP-FET x D+RN-FET x (1-D))
The temperature rise is given by:
3. The output capacitor should be place closed to converter VOUT and GND.
TR = (PD)(θJA)
4. Since the feedback pin and network is a high impedance circuit the feedback network should be routed
Where PD is the power dissipated by the regulator, D is
duty cycle of main switch
away from the inductor. The feedback pin and feedback network should be shielded with a ground plane
D = VOUT/VIN
The θJA is the thermal resistance from the junction of the
die to the ambient temperature. The junction temperature,
or trace to minimize noise coupling into this circuit.
5. A star ground connection or ground plane minimizes
TJ, is given by:
ground shifts and noise is recommended.
TJ = TA + TR
Where TA is the ambient temperature.
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APW7506
Layout Consideration (cont.)
Via to GND
R2
FB
VRUN
R1
L1
Via to V OUT
VOUT
SW
COUT
CIN
VIN
GND
APW7506 Layout Suggestion
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APW7506
Package Information
TSOT-23-5A
D
e
E
E1
SEE VIEW A
b
c
0.25
A
GAUGE PLANE
SEATING PLANE
A1
A2
e1
L
VIEW A
TSOT-23-5A
S
Y
M
B
O
L
MIN.
MAX.
MIN.
MAX.
MILLIMETERS
INCHES
A
0.70
1.00
0.028
0.039
A1
0.01
0.10
0.000
0.004
A2
0.70
0.90
0.028
0.035
b
0.30
0.50
0.012
0.020
c
0.08
0.22
0.003
0.009
D
2.70
3.10
0.106
0.122
E
2.60
3.00
0.102
0.118
E1
1.40
1.80
0.055
e
0.95 BSC
e1
0.071
0.037 BSC
1.90BSC
0.075 BSC
L
0.30
0.60
0
0°
8°
0.012
0°
0.024
8°
Note : 1. Followed from JEDEC TO-178 AA.
2. Dimension D and E1 do not include mold flash, protrusions or gate
burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per
side.
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Rev. A.2 - Jul., 2015
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APW7506
Package Information
SOT-23-5
D
e
E
E1
SEE
VIEW A
b
c
0.25
A
L
0
GAUGE PLANE
SEATING PLANE
A1
A2
e1
VIEW A
S
Y
M
B
O
L
SOT-23-5
INCHES
MILLIMETERS
MIN.
MAX.
MIN.
A
MAX.
1.45
0.057
A1
0.00
0.15
0.000
0.006
A2
0.90
1.30
0.035
0.051
0.020
b
0.30
0.50
0.012
c
0.08
0.22
0.003
0.009
D
2.70
3.10
0.106
0.122
0.118
0.071
E
2.60
3.00
0.102
E1
1.40
1.80
0.055
e
0.95 BSC
e1
1.90 BSC
0.037 BSC
0.075 BSC
L
0.30
0.60
0
0°
8°
0.012
0°
0.024
8°
Note : 1. Follow JEDEC TO-178 AA.
2. Dimension D and E1 do not include mold flash, protrusions or gate
burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil
per side.
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Jul., 2015
16
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APW7506
Carrier Tape & Reel Dimensions
P0
P2
P1
A
B0
W
F
E1
OD0
K0
A0
A
OD1 B
B
T
SECTION A-A
SECTION B-B
H
A
d
T1
Application
TSOT-23-5A
A
H
T1
C
d
D
W
E1
F
178.0±2.00
50 MIN.
8.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
8.0±0.30
1.75±0.10
3.5±0.05
P0
P1
P2
D0
D1
T
A0
B0
K0
1.0 MIN.
0.6+0.00
-0.40
3.20±0.20
3.10±0.20
1.50±0.20
4.0±0.10
4.0±0.10
2.0±0.05
1.5+0.10
-0.00
A
H
T1
C
d
D
W
E1
F
178.0±2.00
50 MIN.
8.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
8.0±0.30
1.75±0.10
3.5±0.05
P0
P1
P2
D0
D1
T
A0
B0
K0
2.0±0.05
1.5+0.10
-0.00
1.0 MIN.
0.6+0.00
-0.40
3.20±0.20
3.10±0.20
1.50±0.20
Application
SOT-23-5
4.0±0.10
4.0±0.10
(mm)
Devices Per Unit
Package Type
Unit
Quantity
TSOT-23-5A
Tape & Reel
3000
SOT-23-5
Tape & Reel
3000
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Jul., 2015
17
www.anpec.com.tw
APW7506
Taping Direction Information
TSOT-23-5A
USER DIRECTION OF FEED
SOT-23-5
USER DIRECTION OF FEED
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Jul., 2015
18
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APW7506
Classification Profile
Classification Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-120 seconds
3 °C/second max.
3 °C/second max.
183 °C
60-150 seconds
217 °C
60-150 seconds
See Classification Temp in table 1
See Classification Temp in table 2
Time (tP)** within 5°C of the specified
classification temperature (T c)
20** seconds
30** seconds
Average ramp-down rate (Tp to Tsmax)
6 °C/second max.
6 °C/second max.
6 minutes max.
8 minutes max.
Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
Average ramp-up rate
(Tsmax to TP)
Liquidous temperature (T L)
Time at liquidous (tL)
Peak package body Temperature
(Tp)*
Time 25°C to peak temperature
* Tolerance for peak profile Temperature (T p) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (t p) is defined as a supplier minimum and a user maximum.
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Jul., 2015
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APW7506
Classification Reflow Profiles (Cont.)
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)
Package
Thickness
<2.5 mm
≥2.5 mm
Volume mm
<350
235 °C
220 °C
3
Volume mm
≥350
220 °C
220 °C
3
Table 2. Pb-free Process – Classification Temperatures (Tc)
Package
Thickness
<1.6 mm
1.6 mm – 2.5 mm
≥2.5 mm
Volume mm
<350
260 °C
260 °C
250 °C
3
Volume mm
350-2000
260 °C
250 °C
245 °C
3
Volume mm
>2000
260 °C
245 °C
245 °C
3
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TCT
HBM
MM
Latch-Up
Method
JESD-22, B102
JESD-22, A108
JESD-22, A102
JESD-22, A104
MIL-STD-883-3015.7
JESD-22, A115
JESD 78
Description
5 Sec, 245°C
1000 Hrs, Bias @ Tj=125°C
168 Hrs, 100%RH, 2atm, 121°C
500 Cycles, -65°C~150°C
VHBM≧2KV
VMM≧200V
10ms, 1tr≧100mA
Customer Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Jul., 2015
20
www.anpec.com.tw