20160325161519686

APW7504/A
1.5MHz, 1.5A Synchronous Buck Regulator
Features
General Description
•
1.5A Output Current
•
Wide 3V~5.5V Input Voltage
APW7504/A is a 1.5MHz high efficiency monolithic synchronous buck regulator. Design with current mode
•
Fixed 1.5MHz Switching Frequency
•
Low Dropout Operating at 100% Duty Cycle
•
30µA Quiescent Current
•
Synchronous Rectifier
•
0.6V Reference Voltage
•
<0.5µA Input Current During Shutdown
•
Short-Circuit Protection
•
Over-Temperature Protection
•
Available in TDFN2x2-6 Package
increase the efficiency and eliminate the need of an external Schottky diode.
•
Lead Free and Green Devices Available
The APW7504/A is available in TDFN2x2-6 package.
scheme, the APW7504/A is stable with ceramic output
capacitor. Input voltage from 3V to 5.5V makes the
APW7504/A ideally suited for single Li-Ion battery powered applications. 100% duty cycle provides low dropout
operation, extending battery life in portable electrical
devices. The internally fixed 1.5MHz operating frequency
allows the using of small surface mount inductors and
capacitors. The synchronous switches included inside
(RoHS Compliant)
Pin Configuration
Applications
•
HD STB
•
BT Mouse
•
PND Instrument
•
Portable Instrument
APW7504
PS 1
RUN 2
VIN 3
6 FB
5 GND
4 SW
TDFN2x2-6
(Top View)
APW7504A
NC 1
RUN 2
VIN 3
6 FB
5 GND
4 SW
TDFN2x2-6
(Top View)
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Jan., 2016
1
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APW7504/A
Simplified Application Circuit
APW7504
VIN
IIN
VIN
C1
4.7µF
(MLCC)
L1
2.2µH
VOUT
SW
C3
PS
R1
C2
10µF
(MLCC)
RUN
FB
GND
R2
R1 ≤ 1MΩ is recommended
R2 ≤ 200KΩ is recommended
C3 ≤ 47pF is recommended
L1
2.2µH
APW7504A
VIN
IIN
VIN
VOUT
SW
C1
4.7µF
(MLCC)
C3
R1
RUN
FB
GND
R2
C2
10µF
(MLCC)
R1 ≤ 1MΩ is recommended
R2 ≤ 200KΩ is recommended
C3 ≤ 47pF is recommended
Ordering and Marking Information
Function Code
APW7504
A : Force PWM Mode
Blank : Automatic Mode/Setting Version
Package Code
QB : TDFN2x2-6
Operating Ambient Temperature Range
I : -40 to 85 oC
Handling Code
TR : Tape & Reel
Assembly Material
G : Halogen and Lead Free Device
Assembly Material
Handling Code
Temperature Range
Package Code
Function Code
APW7504 QB :
W54
X
APW7504A QB :
X - Date Code
54A
X
X - Date Code
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Jan., 2016
2
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APW7504/A
Absolute Maximum Ratings (Note 1)
Sym bol
VIN
P arameter
Input Bias Sup ply Voltage (V IN to GND)
RUN, FB, SW to GND Voltage
PD
Po we r Dissipation
Maximum Junctio n Tempe rature
T STG
TSD R
Storag e Tempe rature
Maximum Lead S olde ring Temperature , 10 Se co nds
Ra ting
Unit
-0 .3 ~ 6
V
- 0.3 ~ V IN+0 .3
V
In te rnally Limited
W
150
o
-6 5 ~ 150
o
260
o
C
C
C
Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device
reliability.
Thermal Characteristics
Symbol
θJA
Parameter
Junction-to-Ambient Resistance in Free Air
Typical Value
(Note 2)
Unit
o
TDFN2x2-6
C/W
165
Note 2: θJA is measured with the component mounted on a high effective thermal conductivity test board in free air.
Recommended Operating Conditions
Symbol
VIN
Parameter
Input Bias Supply Voltage (VIN to GND)
(Note 3)
Range
Unit
3 ~ 5.5
V
VOUT
Converter Output Voltage
0.6 ~ VIN
V
IOUT
Converter Output Current
0 ~ 1.5
A
L1
Converter Output Inductor
1.0 ~ 10
µH
CIN
Converter Input Capacitor
4.7 ~100
µF
Converter Output Capacitor
4.7 ~100
µF
Ambient Temperature
-40 ~ 85
o
-40 ~ 125
o
C OUT
TA
TJ
Junction Temperature
C
C
Note 3: Refer to the typical application circuit
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Jan., 2016
3
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APW7504/A
Electrical Characteristics
Unless otherwise specified, these specifications apply over VIN=3.6V and TA= 25 oC.
Sym bol
Parame ter
APW 7504 /A
Te st Conditions
Unit
Min.
Typ.
Max.
3
-
5.5
V
S UPPLY VOLTAGE AND CURRENT
VIN
Inp ut Vo ltage Range
IQ
Quiescent Curren t
VFB = 0.6 6V
-
30
60
µA
ISD
Shutdown Input Current
RUN = GND
-
-
0.5
µA
2.45
2.7
2.95
V
-
0.1
-
V
V
P OWER-ON- RE SET (POR)
Risin g POR Thre shold
P OR Hysteresis
REFERE NCE V OLTAGE
VR EF
I FB
Refer ence Volta ge
APW7 504/A
VIN=3V~5.5 V
0 .5 88
0.6
0 .6 12
Output Vo ltag e Accuracy
0A < IOUT < 1 A
-2.5
-
+2.5
%
-50
-
50
nA
FB Inpu t Curren t
INTERNAL POWER MOSFETS
F SW
Swi tchin g Fr eque ncy
1.2
1.5
1.9
MHz
Fo ldback Fre quen cy
VFB = 0.1 V
-
210
-
kHz
Fo ldback Thr esh old Voltage on FB
VFB Falli ng
-
0.2
-
V
-
50
-
mV
R P-FET
Fo ldback Hyste resis
Hig h Side P- FET Switch O N Resistan ce
ISW =200mA
-
0.22
-
Ω
R N-FET
L ow S ide N-FET S witch ON Resistance
ISW =200mA
-
0.17
-
Ω
Min imum On-Time
-
-
1 00
ns
Ma ximum Duty Cycl e
-
-
1 00
%
1.7
-
3
A
-
150
-
P ROTECTION
IL IM
T OTP
Ma ximum Inductor Curren t-L imit
IP-FET, VIN = 3.3V
Ove r-Tempe rature Protection
T J Rising
Ove r-Tempe rature Protection Hysteresis
(Note 4)
-
30
-
Soft-Start Dur ati on
(Note 4)
-
0.7
-
ms
RUN Inp ut High Thre sh old
VIN = 3V~5.5V
-
-
1
V
RUN Inp ut L ow Thresho ld
VIN = 3V~5.5V
0.4
-
-
V
RUN Leakag e Cu rrent
VRU N = 5V, VIN = 5V
-1
-
1
µA
PS In put Hig h Thre sh old
VIN = 3V~5.5V
-
-
2.5
V
PS In put L ow Thresh old
VIN = 3V~5.5V
0.4
-
-
V
(N ote 4)
°C
S TART-UP AND SHUTDOWN
tss
Note 4: Guarantee by design, not production test.
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Jan., 2016
4
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APW7504/A
Typical Operating Characteristics
Efficiency vs. Load Current
Efficiency vs. Load Current
100
100
VIN = 5V, Automatic Mode
TA = 25oC
95
VOUT = 1.8V
90
90
85
85
Efficiency (%)
Efficiency (%)
95
80
75
VOUT = 1.2V
70
75
60
60
55
55
0.1
1
VOUT = 1.2V
70
65
0.01
50
0.001
10
0.01
Efficiency vs. Load Current
1
10
Efficiency vs. Load Current
100
100
VOUT = 1.8V
90
VOUT = 1.8V
90
80
80
70
Efficiency (%)
Efficiency (%)
0.1
Load Current, IOUT (A)
Load Current, IOUT (A)
VOUT = 1.2V
60
50
40
30
70
VOUT = 1.2V
60
50
40
30
20
20
VIN = 5V, Force PWM Mode
TA = 25oC
10
0
0.001
0.01
0.1
1
VIN = 3.3V, Force PWM Mode
TA = 25oC
10
0
0.001
10
0.01
0.1
1
Load Current, IOUT (A)
Load Current, IOUT (A)
Quiescent Current vs.
Junction Temperature
Reference Voltage vs.
Junction Temperature
10
0.606
45
VIN = 3.6 V, Automatic Mode
0.605
Reference Voltage, VREF (V)
Quiescent Current, IQ (µA)
VOUT = 1.8V
80
65
50
0.001
VIN = 3.3V, Automatic Mode
TA = 25oC
40
35
30
25
20
VIN = 3.6V
0.604
0.603
0.602
0.601
0.600
0.599
0.598
0.597
0.596
0.595
0.594
15
-50
-25
0
25
50
75
100
-50
125
Junction Temperature ( C)
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Jan., 2016
-25
0
25
50
75
100
125
Junction Temperature (oC)
o
5
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APW7504/A
Typical Operating Characteristics
Maximum Inductor Current-Limit
vs. Junction Temperature
Maximum Inductor Current-Limit, ILIM (A)
Switching Frequency vs.
Junction Temperature
Switching Frequency, FSW (MHz)
1.8
VIN = 3.6V
1.7
1.6
1.5
1.4
1.3
1.2
-50
-25
0
25
50
75
100
3.2
VIN = 3.3V
3.0
2.8
2.6
2.4
2.2
2.0
1.8
1.6
-50
125
-25
0
Maximum Inductor Current-Limit, ILIM (A)
Switching Frequency, FSW (MHz)
TA = 25oC
1.7
1.6
1.5
1.4
1.3
1.2
3.0
3.5
4.0
4.5
5.0
3.0
75
100
125
TA = 25oC
2.8
2.6
2.4
2.2
2.0
1.8
3.0
5.5
3.5
Supply Voltage, VIN (V)
4.0
4.5
5.0
5.5
Supply Voltage, VIN (V)
Reference Voltage vs.
Junction Temperature
Quiescent Current vs.
Junction Temperature
0.606
45
VIN = 3.6 V, Automatic Mode
0.605
Reference Voltage, VREF (V)
Quiescent Current, IQ (µA)
50
Maximum Inductor Current-Limit
vs. Supply Voltage
Switching Frequency vs.
Supply Voltage
1.8
25
Junction Temperature (oC)
Junction Temperature (oC)
40
35
30
25
20
VIN = 3.6V
0.604
0.603
0.602
0.601
0.600
0.599
0.598
0.597
0.596
0.595
0.594
15
-50
-25
0
25
50
75
100
-50
125
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Jan., 2016
-25
0
25
50
75
100
125
Junction Temperature (oC)
Junction Temperature (oC)
6
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APW7504/A
Operating Waveforms
Load Transient Response
Soft-Start
VRUN
1
VOUT
1
VOUT
2
IOUT
IL
3
2
No load, VPS=0V
IOUT =0.3A to 1.5A to 0.3A (rise / fall time = 0.5µs)
CH1: VRUN, 5V/Div, DC
CH2: VOUT, 500mV/Div, DC
CH3: IL, 0.5A/Div, DC
TIME: 200 s/Div
CH1: VOUT , 100mV/Div, DC offset 1.2V
CH2: IOUT , 0.5A/Div, DC
TIME: 20µs/Div
Normal Operation
VOUT
1
IL
2
IOUT=1.5A
CH1: VOUT, 20mV/Div, DC offset 1.2V
CH2: IL, 0.5A/Div, DC
TIME: 500ns/Div
Copyright  ANPEC Electronics Corp.
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APW7504/A
Pin Description
PIN
NO.
FUNCTION
NAME
TDFN2x2-6
1
PS
(APW7504)
2
RUN
3
VIN
4
SW
5
GND
6
FB
Pulse Frequency Mode Select. Pulling this pin to logic high forces Buck converter to enter
PWM mode. Pulling it low places the IC into automatic mode which depends on the output load
current to operate in either PFM(Pulse Frequency Modulation) or PWM mode automatic
switching. Do not leave PS pin floating.
Enable Control Input. Forcing this pin above 1.0V enables the device. Forcing this pin below
0.4V shuts it down. In shutdown, all functions are disabled to decrease the supply current
below 0.5µA. Do not leave RUN pin floating.
Device and Converter Supply Pin. Must be closely decoupled to GND with a 4.7µF or greater
ceramic capacitor.
Switch Node Connected to Inductor. This pin connects to the drains of the internal main and
synchronous power MOSFETs switches.
Power and Signal Ground.
Feedback Input Pin. The buck regulator senses feedback voltage via FB and regulates the FB
voltage at 0.6V. Connecting FB with a resistor-divider from the output sets the output voltage of
the buck converter.
Block Diagram
Current Sense
Amplifier
RUN
VIN
Shutdown
Control
Logic Control
SW
OverTemperature
Protection
Gate
Driver
Current
-Limit
Slope
Compensation
∑
Zero-Crossing
Comparator
Oscillator
GND
PS (for APW7504 only)
Error
Amplifier
ICMP
COMP
FB
EAMP
SoftStart
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Jan., 2016
VREF
0.6V
8
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APW7504/A
Typical Application Circuit
APW7504
L1
2.2µH
IIN
VIN
VOUT
SW
VIN
C1
4.7µF
(MLCC)
C2
10µF
(MLCC)
C3
PS
R1
RUN
FB
GND
R1 ≤ 1MΩ is recommended
R2
R2 ≤ 200KΩ is recommended
C1 closed to IC. Less than 2mm is recommended
C3 ≤ 47pF is recommended
APW7504A
VIN
L1
2.2µH
IIN
VOUT
SW
VIN
C1
4.7µF
(MLCC)
C3
R1
RUN
C2
10µF
(MLCC)
FB
GND
R2
R1 ≤ 1MΩ is recommended
R2 ≤ 200KΩ is recommended
C1 closed to IC. Less than 2mm is recommended
C3 ≤ 47pF is recommended
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APW7504/A
Function Description
Main Control Loop
Over-Temperature Protection (OTP)
The APW7504/A is a constant frequency, synchronous
The over-temperature circuit limits the junction tempera-
rectifier and current-mode switching regulator. In normal
operation, the internal P-channel power MOSFET is
ture of the APW7504/A. When the junction temperature
exceeds 150oC, a thermal sensor turns off the both power
turned on each cycle. The peak inductor current at which
ICMP turn off the P-FET is controlled by the voltage on the
MOSFETs, allowing the devices to cool. The thermal sensor allows the converters to start a soft-start process and
COMP node, which is the output of the error amplifier
(EAMP). An external resistive divider connected between
regulate the output voltage again after the junction temperature cools by 30oC. The OTP is designed with a 30oC
VOUT and ground allows the EAMP to receive an output
feedback voltage VFB at FB pin. When the load current
hysteresis to lower the average Junction Temperature
(TJ) during continuous thermal overload conditions, in-
increases, it causes a slightly decrease in VFB relative to
the 0.6V reference, which in turn causes the COMP volt-
creasing the lifetime of the device.
age to increase until the average inductor current matches
the new load current.
Enable/Shutdown
Driving RUN to the ground places the APW7504/A in shutdown mode. When in shutdown, the internal power
MOSFETs turn off, all internal circuitry shuts down and
the quiescent supply current reduces to 0.5µA maximum.
Pulse Frequency Modulation Mode (PFM)
The APW7504/A is a fixed frequency, peak current mode
PWM step-down converter. At light loads, the APW7504
will automatically enter in pulse frequency mode operation to reduce the dominant switching losses. In PFM
operation, the inductor current may reach zero or reverse
on each pulse. A zero current comparator turn off the NFET, forcing DCM operation at light load. These controls
get very low quiescent current, help to maintain high efficiency over the complete load range.
Slope Compensation and Inductor Peak Current
The APW7504/A is a peak current mode PWM step down
converter. To prevent sub-harmonic oscillations, the
APW7504/A sense the peak current and add slope compensation to stable the converter. It is accomplished internally by adding a compensating ramp to the inductor
current signal at duty cycles in excess of 40%. Normally,
this results in a reduction of maximum inductor peak current for duty cycles > 40%. However, the APW7504/A uses
a special scheme that counteracts this compensating
ramp, which allows the maximum inductor peak current
to remain unaffected throughout all duty cycles.
Copyright  ANPEC Electronics Corp.
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APW7504/A
Application Information
Input Capacitor Selection
shown in “Typical Application Circuits”. A suggestion of
Because buck converters have a pulsating input current,
a low ESR input capacitor is required. This results in the
maximum value of R2 is 200kΩ to keep the minimum
current that provides enough noise rejection ability through
best input voltage filtering, minimizing the interference
with other circuits caused by high input voltage spikes.
the resistor divider. The output voltage can be calculated
as below:
R1 
R1 


VOUT = VREF ⋅  1 +
 = 0.6 ⋅ 1 +

R2 
R2 


Also, the input capacitor must be sufficiently large to stabilize the input voltage during heavy load transients. For
good input voltage filtering, usually a 4.7µF input capacitor is sufficient. It can be increased without any limit for
VOUT
better input-voltage filtering. Ceramic capacitors show
better performance because of the low ESR value, and
R1≤1MΩ
they are less sensitive against voltage transients and
spikes compared to tantalum capacitors. Place the input
FB
R2 ≤ 200kΩ
APW7504/A
capacitor as close as possible to the input and GND pin of
the device for better performance.
GND
Inductor Selection
Output Capacitor Selection
For high efficiencies, the inductor should have a low DC
The current-mode control scheme of the APW7504/A allows the use of tiny ceramic capacitors. The higher ca-
resistance to minimize conduction losses. Especially at
high-switching frequencies the core material has a higher
pacitor value provides the good load transients response.
impact on efficiency. When using small chip inductors,
the efficiency is reduced mainly due to higher inductor
Ceramic capacitors with low ESR values have the lowest
output voltage ripple and are recommended. If required,
core losses. This needs to be considered when selecting the appropriate inductor. The inductor value deter-
tantalum capacitors may be used as well. The output
ripple is the sum of the voltages across the ESR and the
mines the inductor ripple current. The larger the inductor
value, the smaller the inductor ripple current and the lower
ideal output capacitor.
the conduction losses of the converter. Conversely, larger
inductor values cause a slower load transient response.
∆VOUT
A reasonable starting point for setting ripple current, ∆IL,
is 40% of maximum output current. The recommended

V
VOUT ⋅ 1 − OUT
VIN

≅
FSW ⋅ L


 
1
 ⋅  ESR +

8 ⋅ FSW ⋅ COUT





When choosing the input and output ceramic capacitors,
inductor value can be calculated as below:
choose the X5R or X7R dielectric formulations. These
dielectrics have the best temperature and voltage char-


V
VOUT 1 − OUT 
V
IN


L≥
FSW ⋅ ∆IL
acteristics of all the ceramics for a given value and size.
VIN
IL(MAX) = IOUT(MAX) + 1/2 x ∆IL
IIN
IP-FET
To avoid the saturation of the inductor, the inductor should
IL
be rated at least for the maximum output current of the
converter plus the inductor ripple current.
CIN
Output Voltage Setting
P-FET
VOUT
SW
N-FET
In the adjustable version, the output voltage is set by a
resistive divider. The external resistive divider is con-
IOUT
ESR
COUT
nected to the output, allowing remote voltage sensing as
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Jan., 2016
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APW7504/A
Application Information (Cont.)
Output Capacitor Selection (Cont.)
The maximum power dissipation on the device can be
shown as the following figure:
IL
0.8
Maximum Power Disspation (W)
ILIM
IPEAK
∆IL
IOUT
IP-FET
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-50 -25
0
25
50
75 100 125 150
Junction Temperature (oC)
Thermal Consideration
Layout Consideration
In most applications, the APW504/A does not dissipate
much heat due to its high efficiency. But, in applications
For all switching power supplies, the layout is an impor-
where the APW7504/A is running at high ambient temperature with low supply voltage and high duty cycles, the
tant step in the design; especially at high peak currents
and switching frequencies. If the layout is not carefully
heat dissipated may exceed the maximum junction tem-
done, the regulator might show noise problems and duty
cycle jitter.
perature of the part. If the junction temperature reaches
approximately 150°C, both power switches will be turned
1. The input capacitor should be placed close to the VIN
and GND. Connecting the capacitor and VIN/GND with
off and the SW node will become high impedance.
To avoid the APW7504/A from exceeding the maximum
short and wide trace without any via holes for good
input voltage filtering. The distance between VIN/GND
junction temperature, the user will need to do some thermal analysis. The goal of the thermal analysis is to deter-
t o ca p a c i t or l e s s t h a n 2m m r e s pe c t i ve ly i s
recommended.
mine whether the power dissipated exceeds the maximum junction temperature of the part. The power dissi-
2. To minimize copper trace connections that can inject
noise into the system, the inductor should be placed
pated by the part is approximated:
as close as possible to the SW pin to minimize the
noise coupling into other circuits.
PD ≅ IOUT2 x (RP-FET x D+RN-FET x (1-D))
The temperature rise is given by:
3. The output capacitor should be place closed to VOUT
and GND.
TR = (PD)(θJA)
4. Since the feedback pin and network is a high impedance circuit the feedback network should be routed
Where PD is the power dissipated by the regulator, D is
duty cycle of main switch
away from the inductor. The feedback pin and feedback network should be shielded with a ground plane
D = VOUT/VIN
The θJA is the thermal resistance from the junction of the
die to the ambient temperature. The junction temperature,
or trace to minimize noise coupling into this circuit.
5. A star ground connection or ground plane minimizes
TJ, is given by:
ground shifts and noise is recommended.
TJ = TA + TR
Where TA is the ambient temperature.
Copyright  ANPEC Electronics Corp.
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APW7504/A
Package Information
TDFN2x2-6
A
b
E
D
D2
A1
A3
L
K
E2
Pin 1 Corner
e
TDFN2x2-6
S
Y
M
B
O
L
MIN.
MAX.
MIN.
MAX.
A
0.70
0.80
0.028
0.031
A1
0.00
0.05
0.000
0.002
MILLIMETERS
A3
INCHES
0.20 REF
0.008 REF
b
0.18
0.30
0.007
0.012
D
1.90
2.10
0.075
0.083
D2
1.00
1.60
0.039
0.063
0.083
0.039
E
1.90
2.10
0.075
E2
0.60
1.00
0.024
0.45
0.012
e
0.65 BSC
L
0.30
K
0.20
0.026 BSC
0.018
0.008
Note : 1. Followed from JEDEC MO-229 WCCC.
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Jan., 2016
13
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APW7504/A
Carrier Tape & Reel Dimensions
P0
P2
P1
A
B0
W
F
E1
OD0
K0
A0
A
OD1 B
B
T
SECTION A-A
SECTION B-B
H
A
d
T1
Application
TDFN2x2-6
A
H
178.0±2.00
50 MIN.
P0
P1
T1
8.4+2.00
-0.00
P2
4.0±0.10
4.0±0.10
2.0±0.05
C
13.0+0.50
-0.20
D0
1.5+0.10
-0.00
d
D
W
E1
F
1.5 MIN.
20.2 MIN.
8.0±0.20
1.75±0.10
3.5±0.05
D1
T
0.6+0.00
-0.40
A0
B0
K0
2.35 MIN
2.35 MIN
1.00±0.20
1.5 MIN.
(mm)
Devices Per Unit
Package Type
Unit
Quantity
TDFN2x2-6
Tape & Reel
3000
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Jan., 2016
14
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APW7504/A
Taping Direction Information
TDFN2x2-6
USER DIRECTION OF FEED
Classification Profile
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Jan., 2016
15
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APW7504/A
Classification Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-120 seconds
3 °C/second max.
3 °C/second max.
183 °C
60-150 seconds
217 °C
60-150 seconds
See Classification Temp in table 1
See Classification Temp in table 2
Time (tP)** within 5°C of the specified
classification temperature (Tc)
20** seconds
30** seconds
Average ramp-down rate (Tp to Tsmax)
6 °C/second max.
6 °C/second max.
6 minutes max.
8 minutes max.
Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
Average ramp-up rate
(Tsmax to TP)
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body Temperature
(Tp)*
Time 25°C to peak temperature
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)
Package
Thickness
<2.5 mm
≥2.5 mm
Volume mm
<350
235 °C
220 °C
3
Volume mm
≥350
220 °C
220 °C
3
Table 2. Pb-free Process – Classification Temperatures (Tc)
Package
Thickness
<1.6 mm
1.6 mm – 2.5 mm
≥2.5 mm
Volume mm
<350
260 °C
260 °C
250 °C
3
Volume mm
350-2000
260 °C
250 °C
245 °C
3
Volume mm
>2000
260 °C
245 °C
245 °C
3
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TCT
HBM
MM
Latch-Up
Method
JESD-22, B102
JESD-22, A108
JESD-22, A102
JESD-22, A104
MIL-STD-883-3015.7
JESD-22, A115
JESD 78
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Rev. A.4 - Jan., 2016
16
Description
5 Sec, 245°C
1000 Hrs, Bias @ Tj=125°C
168 Hrs, 100%RH, 2atm, 121°C
500 Cycles, -65°C~150°C
VHBM≧2KV
VMM≧200V
10ms, 1tr≧100mA
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APW7504/A
Customer Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838
Copyright  ANPEC Electronics Corp.
Rev. A.4 - Jan., 2016
17
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