REVISIONS LTR DESCRIPTION DATE APPROVED A Change minimum limit of dimension Q for case outline T. Changes in accordance with NOR 5962-R145-97. 96-11-27 Raymond Monnin B Add note 4/ to tWLQZ, tCDR, and tR in table I. Add note 5/ to tELQX, tWHQX, tOLQX, and tOHQZ in table I. Add case outline 8. Change dimensions b, c, L, and Q for case outline T. Add CAGE 01295 as source of supply for case outlines T and 8. Update boilerplate. Editorial changes throughout. 97-04-17 Raymond Monnin C Change minimum dimensions A, b, and E for case outline U. Add CAGE 65786 as a source of supply . Editorial changes throughout. ksr 97-10-24 Raymond Monnin D Change case outline 9 dimension A from .114 inches to .130 inches. glg 00-03-01 Raymond Monnin E Added low-power devices 09 - 14 to drawing. Removed CAGE 0EU86 for devices 05 - 08. - glg 00-11-22 Raymond Monnin F Changed minimum dimension b for package "U" from 0.015 inches to 0.012 inches. - glg 00-12-13 Raymond Monnin G Changed minimum dimension b for package "M" from 0.019 inches to 0.012 inches. Updated boilerplate paragraphs. ksr 02-02-12 Raymond Monnin H Table I; Changed the IOL from 8 mA to 6 mA VOL test. Added device types 15 and 16. Editorial changes throughout. -sld 04-05-25 Raymond Monnin J Add case outline 7. Add CAGE 0EU86 as source of supply for case outline 7. Editorial changes throughout. tcr 08-08-18 Robert M. Heber K Add device 17 and add case outline 6. Add CAGE 6S055 as source of supply for case outline 6. Some editorial changes. ksr 09-01-22 Robert M. Heber REV SHEET REV K K K K K K K K K K K K K K K K K K SHEET 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 REV K K K K K K K K K K K K K K SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 REV STATUS OF SHEETS PREPARED BY Jeff Bowling PMIC N/A STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY All DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A CHECKED BY Jeff Bowling APPROVED BY Michael. A. Frye DRAWING APPROVAL DATE 96-03-05 REVISION LEVEL K DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http://www.dscc.dla.mil/ MICROCIRCUITS, MEMORY, DIGITAL, CMOS, 512K X 8 STATIC RANDOM ACCESS MEMORY (SRAM), MONOLITHIC SILICON SIZE A CAGE CODE 67268 5962-95600 SHEET 1 OF DSCC FORM 2233 APR 97 32 5962-E130-09 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 5962 - 95600 Federal stock class designator \ RHA designator (see 1.2.1) 01 M X A Device type (see 1.2.2) Device class designator (see 1.2.3) Case outline (see 1.2.4) Lead finish (see 1.2.5) / \/ Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device types identify the circuit function as follows: Device type Generic number 1/ 01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16 17 Circuit function Data retention 512K X 8 CMOS SRAM 512K X 8 CMOS SRAM 512K X 8 CMOS SRAM 512K X 8 CMOS SRAM 512K X 8 CMOS SRAM 512K X 8 CMOS SRAM 512K X 8 CMOS SRAM 512K X 8 CMOS SRAM 512K X 8 CMOS Low Power SRAM 512K X 8 CMOS Low Power SRAM 512K X 8 CMOS Low Power SRAM 512K X 8 CMOS Low Power SRAM 512K X 8 CMOS Low Power SRAM 512K X 8 CMOS SRAM 512K X 8 CMOS SRAM 512K X 8 CMOS SRAM 512K X 8 CMOS SRAM Access time No No No No Yes Yes Yes Yes Yes Yes Yes Yes Yes No Yes No Yes 45 ns 35 ns 25 ns 20 ns 45 ns 35 ns 25 ns 20 ns 45 ns 35 ns 25 ns 20 ns 15 ns 15 ns 12 ns 12 ns 12 ns 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class M Q or V Device requirements documentation Vendor self-certification to the requirements for MIL-STD-883 compliant, nonJAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Certification and qualification to MIL-PRF-38535 1/ Generic numbers are listed on the Standard Microcircuit Drawing Source Approval Bulletin at the end of this document and will also be listed in MIL-HDBK-103 and QML-38535, as applicable (see 6.6.1 and 6.6.2 herein). STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95600 A REVISION LEVEL K SHEET 2 1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter X Y Z U T M N 9 8 7 6 Descriptive designator Terminals GDIP1-T32 or CDIP2-T32 See figure 1 See figure 1 See figure 1 See figure 1 See figure 1 See figure 1 See figure 1 See figure 1 See figure 1 See figure 1 32 32 32 32 36 36 36 32 36 36 44 Package style Dual-in-line TSOP package Leadless chip carrier SOJ package Flat pack SOJ package Leadless chip carrier Flat pack SOJ package SOJ package TSOP package 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 2/ Voltage on any input relative to VSS ...................................... For device 17 only .............................................................. Storage temperature range .................................................. Maximum power dissipation (PD).......................................... Lead temperature (soldering, 10 seconds)........................... Thermal resistance, junction-to-case (θJC): Case X................................................................................ Case Y................................................................................ Cases U, M, 8 and 7........................................................... Case T ................................................................................ Cases Z and N.................................................................... Case 9 ................................................................................ Case 6 ................................................................................ Junction temperature (TJ) ..................................................... For - 17 .............................................................................. Output current....................................................................... -0.5 V dc to +7.0 V dc -0.5 V dc to +6.0 V dc -65°C to +150°C 2.0 W +260°C See MIL-STD-1835 6°C/W 11°C/W 10°C/W 20°C/W 22°C/W 7 C/W +150°C 2/ +140C 2/ 40 mA 1.4 Recommended operating conditions. Supply voltage range (VCC)................................................... Supply voltage (VSS) ............................................................. Input high voltage range (VIH) Devices 01 - 08..................... Input high voltage range (VIH) Devices 09 - 13..................... Input high voltage range (VIH) Device 17.............................. Input low voltage range (VIL)................................................. Case operating temperature range (TC) ............................... 4.5 V dc to 5.5 V dc 0V 2.2 V dc to +6.0 V dc 2.2 V dc to VCC + 0.3 V dc 2.0 V dc to VCC + 0.5 V dc -0.5 V dc to +0.8 V dc 3/ -55°C to +125°C _____________ 2/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883. 3/ VIL minimum = -3.0 V dc for pulse width less than 20 ns. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95600 A REVISION LEVEL K SHEET 3 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of the documents are the issues of the documents cited in the solicitation. AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM) ASTM Standard F1192-00 - Standard Guide for the Measurement of Single Event Phenomena Induced by Heavy Ion Irradiation of Semiconductor Devices. (Applications for copies of ASTM publications should be addressed to: ASTM International, PO Box C700, 100 Barr Harbor Drive, West Conshohocken, PA 19428-2959; http://www.astm.org/.) ELECTRONICS INDUSTRIES ASSOCIATION (EIA) JEDEC Standard EIA/JESD78 - IC Latch-Up Test. (Applications for copies should be addressed to the Electronics Industries Association, 2500 Wilson Boulevard, Arlington, VA 22201; http://www.jedec.org/.) (Non-Government standards and other publications are normally available from the organizations that prepare or distribute the documents. These documents also may be available in or through libraries or other informational services.) 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95600 A REVISION LEVEL K SHEET 4 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Truth table. The truth table shall be as specified on figure 3. 3.2.4 Functional tests. Various functional tests used to test this device are contained in the appendix. If the test patterns cannot be implemented due to test equipment limitations, alternate test patterns to accomplish the same results shall be allowed. For device class M, alternate test patterns shall be maintained under document revision level control by the manufacturer and shall be made available to the preparing or acquiring activity upon request. For device classes Q and V alternate test patterns shall be under the control of the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the preparing or acquiring activity upon request. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 41 (see MIL-PRF-38535, appendix A). 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95600 A REVISION LEVEL K SHEET 5 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Delete the sequence specified as initial (preburn-in) electrical parameters through interim (postburn-in) electrical parameters of method 5004 and substitute lines 1 through 6 of table IIA herein. b. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015. (1) Dynamic burn-in (method 1015 of MIL-STD-883, test condition D; for circuit, see 4.2.1b herein). c. Interim and final electrical parameters shall be as specified in table IIA herein. 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table IIA herein. c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF38535, appendix B. 4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with MILPRF-38535 including groups A, B, C, D, and E inspections and as specified herein. Quality conformance inspection for device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4.1 Group A inspection. a. Tests shall be as specified in table IIA herein. b. Subgroups 5 and 6 of table I of method 5005 of MIL-STD-883 shall be omitted. c. For device class M, subgroups 7, 8A, and 8B tests shall be sufficient to verify the truth table. For device classes Q and V, subgroups 7, 8A, and 8B shall include verifying the functionality of the device. d. O/V (latch-up) tests shall be measured only for initial qualification and after any design or process changes which may affect the performance of the device. For device class M, procedures and circuits shall be maintained under document revision level control by the manufacturer and shall be made available to the preparing activity or acquiring activity upon request. For device classes Q and V, the procedures and circuits shall be under the control of the device manufacturer's TRB in accordance with MIL-PRF-38535 and shall be made available to the preparing activity or acquiring activity upon request. Testing shall be on all pins, on five devices with zero failures. Latch-up test shall be considered destructive. Information contained in JEDEC Standard EIA/JESD78 may be used for reference. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95600 A REVISION LEVEL K SHEET 6 TABLE I. Electrical performance characteristics. Test Operating supply current 1/ Symbol ICC1 Conditions -55C TC +125C VCC = 4.5 V to 5.5 V VSS = 0 V unless otherwise specified tAVAV = tAVAV (minimum), Group A subgroups Device types 1, 2, 3 01-08, 14 225 09-13 180 15, 16 90 VCC = 5.5 V, CE = WE = VIL, outputs open Limits Min Max 17 Standby power supply current (TTL) Standby power supply current (CMOS) ICC2 ICC3 Data retention voltage VDR Data retention current ICC4 CE VIH, all other inputs VIL or VIH, VCC = 5.5 V CE VCC - 0.2 V, VCC = 5.5 V, VIN 0.2 V or (VCC -0.2 V) CE VCC - 0.2 V, VIN VCC - 0.2 V or 0.2 V VCC = 2.0 V 1, 2, 3 1, 2, 3 Unit mA 110 01-08, 14 60 09-13, 15 - 17 30 01-04, 14 25 05-08 10 09-13, 15 - 17 20 1, 2, 3 05-13, 15, 17 1, 2, 3 05-08 2 09-13 4.5 15 7 17 12 mA mA 2 V mA Input leakage current, any input IILK VCC = 5.5 V, VIN = 0 V to 5.5 V 1, 2, 3 All 10 A Off-state output leakage current IOLK VCC = 5.5 V, VIN = 0 V to 5.5 V 1, 2, 3 All 10 A Output high voltage VOH IOUT = -4.0 mA, VCC = 4.5 V, VIL = 0.8 V, VIH = 2.2 V 1, 2, 3 All Output low voltage VOL IOUT = 6.0 mA, VCC = 4.5 V, VIL = 0.8 V, VIH = 2.2 V 1, 2, 3 All 0.4 V Input capacitance CIN VIN = 0 V, see 4.4.1e f = 1.0 MHz, TA = +25°C, 4 All 12 pF Output capacitance COUT VOUT = 0 V, see 4.4.1e f = 1.0 MHz, TA = +25°C, 4 All 14 pF 7,8A,8B All Functional testing See 4.4.1c 2.4 V See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95600 A REVISION LEVEL K SHEET 7 TABLE I. Electrical performance characteristics - continued. Test Chip enable access time Read cycle time Address access time Output hold after address change Chip enable to output active 4/ 5/ Symbol tELQV Conditions -55°C TC +125°C VCC = 4.5 V to 5.5 V VSS = 0 V unless otherwise specified See figure 5 2/ 3/ Device types 9,10,11 01,05,09 45 02,06,10 35 03,07,11 25 04,08,12 20 13,14 15 15 - 17 12 9,10,11 tAVAV 9,10,11 tAVQV 9,10,11 tAVQX tELQX Limits Group A subgroups 9,10,11 Min 01,05,09 45 02,06,10 35 03,07,11 25 04,08,12 20 13,14 15 15 - 17 12 Unit Max ns 01,05,09 45 02,06,10 35 03,07,11 25 04,08,12 20 13,14 15 15 - 17 12 01-08 3 09-14, 15 - 17 2 01-08 3 09-14, 15 - 17 2 ns ns ns ns See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95600 A REVISION LEVEL K SHEET 8 TABLE I. Electrical performance characteristics - continued. Test Chip disable to output inactive 4/ 5/ Output enable to output valid Symbol tEHQZ tOLQV Conditions -55°C TC +125°C VCC = 4.5 V to 5.5 V VSS = 0 V unless otherwise specified See figure 5 2/ 3/ See figure 5 2/ Group A subgroups Device types 9,10,11 9,10,11 Output enable to output in low Z 4/ 5/ tOLQX 9,10,11 Output enable to output in high Z 4/ 5/ tOHQZ 9,10,11 Write cycle time 9,10,11 tAVAV Limits Unit Min Max 01,05,09 0 20 02,06,10 0 15 03,07,11 0 10 04,08,12 0 8 13,14 0 7 15 - 17 0 6.5 01,05,09 25 02,06,10 15 03,07,11 12 04,08,12 10 13,14 8 15 - 17 7 All ns ns 0 ns 01,05,09 0 20 02,06,10 0 15 03,07,11 0 10 04,08,12 0 8 13,14 0 7 15 - 17 0 6.5 01,05,09 45 02,06,10 35 03,07,11 25 04,08,12 20 13,14 15 15 - 17 12 ns ns See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95600 A REVISION LEVEL K SHEET 9 TABLE I. Electrical performance characteristics - continued. Test Write pulse width Chip enable to end of write Data setup to end of write Symbol tWLWH tWLEH Conditions -55°C TC +125°C VCC = 4.5 V to 5.5 V VSS = 0 V unless otherwise specified See figure 5 2/ Device types 9,10,11 01,05,09 35 02,06,10 30 03,07,11 20 04,08,12 17 13,14 15 15 - 17 12 01,05,09 35 02,06,10 30 03,07,11 20 04,08,12 17 13,14 15 15 - 17 12 01,05,09 25 02,06,10 20 03,07,11 12 04,08,12 10 13,14 7 15 - 17 6.5 9,10,11 tELWH tELEH 9,10,11 tDVWH tDVEH Limits Group A subgroups Data hold after end of write 4/ tWHDX tEHDX 9,10,11 Address valid to end of write tAVWH tAVEH 9,10,11 All Min Unit Max ns ns ns 0 ns 01,05,09 35 ns 02,06,10 30 03,07,11 20 04,08,12 17 13,14 15 15 - 17 12 See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95600 A REVISION LEVEL K SHEET 10 TABLE I. Electrical performance characteristics - continued. Test Symbol Address setup to beginning of write tAVWL tAVEL Address hold after end of write Write enable to output disable 4/ 5/ Output active after end of write 4/ 5/ Chip select to data retention time 4/ Operation recovery time 4/ Conditions -55°C TC +125°C VCC = 4.5 V to 5.5 V VSS = 0 V unless otherwise specified Group A subgroups Device types Limits Min Unit Max 9,10,11 All 0 ns tWHAX tEHAX 9,10,11 01-12 1 ns 13,14, 15 - 17 0 tWLQZ 9,10,11 01,05,09 0 30 02,06,10 0 25 03,07,11 0 10 04,08,12 0 8 13,14 0 7 15 - 17 0 6.5 See figure 5 2/ tWHQX 9,10,11 All ns 0 ns 0 ns tCDR See figure 5 2/ 9,10,11 tR CE VCC - 0.2 V, VIN VCC - 0.2 V or VIN 0.2 V 05-13, 15 - 17 9,10,11 05-08, 17 tAVAV ns 09-13 10 ms 1/ ICC is dependent upon output loading and cycle rate. The specified values apply with output(s) unloaded. 2/ AC measurements assume signal transition times of 5 ns or less, timing reference levels of 1.5 V, input pulse levels of 0 V to 3.0 V, output loading of 30 pF load capacitance, unless otherwise specified. Output timing reference is 1.5 V. See figure 4. 3/ For read cycles, WE is high for entire cycle. 4/ Parameter, if not tested, shall be guaranteed to the limits specified in table I. 5/ Measured 500 mV from steady-state output voltage(200 mV for device types 09-13). Load capacitance is 5.0 pF. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95600 A REVISION LEVEL K SHEET 11 Case Y Symbol Millimeters Inches Symbol Millimeters Inches Min Max Min Max A1 2.21 3.00 .087 .118 e A2 1.27 1.78 .050 .070 L 0.51 1.40 .020 .055 A3 0.43 1.52 .017 .060 L1 0.51 0.76 .020 .030 b 0.20 0.61 .008 .024 P --- 0.10 --- .004 b2 0.13 0.20 .005 .008 R 0.10 --- .004 --- c --- 0.25 --- .010 R1 0.10 0.36 .004 .014 D 41.40 42.42 .820 .840 R2 0.25 0.51 .010 .020 E 10.64 10.85 .419 .427 N 32 E1 14.20 14.40 .559 .567 Min Max 1.27 BSC Min Max .050 BSC NOTE: The U.S. Government preferred system of measurement is the metric SI system. However, since this item was originally designed using inch-pound units of measurement, in the event of conflict between the metric and inch-pound units, the inch-pound units shall take precedence. FIGURE 1. Case outlines. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95600 A REVISION LEVEL K SHEET 12 Case Z Symbol Millimeters Inches Min Max Min Max A 2.03 2.54 .080 .100 A1 1.37 1.68 .054 .066 B 0.56 0.71 .022 .028 D 20.70 21.21 .815 .835 D1 18.80 19.30 .740 .760 E 11.18 11.68 .440 .460 e 1.27 BSC .050 BSC L 2.54 REF .100 REF N 32 P --- R 0.15 --- 0.23 REF .006 .009 REF NOTE: The U.S. Government preferred system of measurement is the metric SI system. However, since this item was originally designed using inch-pound units of measurement, in the event of conflict between the metric and inch-pound units, the inch-pound units shall take precedence. FIGURE 1. Case outlines - continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95600 A REVISION LEVEL K SHEET 13 Case U Symbol Millimeters Inches Min Max Min Max A 2.92 4.06 .115 .160 A1 1.37 1.91 .054 .075 A2 0.64 1.60 .025 .063 b 0.30 0.71 .012 .028 D 20.70 21.21 .815 .835 D1 18.80 19.30 .740 .760 E 10.62 11.68 .418 .460 E2 9.42 10.41 .371 .410 e 1.27 BSC .050 BSC L 1.27 1.78 .050 .070 L2 2.92 3.43 .115 .135 N 32 P --- 0.10 --- .004 NOTE: The U.S. Government preferred system of measurement is the metric SI system. However, since this item was originally designed using inch-pound units of measurement, in the event of conflict between the metric and inch-pound units, the inch-pound units shall take precedence. FIGURE 1. Case outlines - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95600 A REVISION LEVEL K SHEET 14 Case outline T Symbol Millimeters Inches Min Max Min Max A 2.44 3.18 .096 .125 b 0.38 0.56 .015 .022 c 0.08 0.23 .003 .009 D 23.11 23.62 .910 .930 D1 21.34 21.84 .840 .860 E 12.83 13.08 .505 .515 E2 9.78 10.08 .385 .397 e 1.27 BSC L 6.35 N 36 Q 0.51 .050 BSC 9.40 .250 .370 1.14 .020 .045 NOTE: The U.S. Government preferred system of measurement is the metric SI system. However, since this item was originally designed using inch-pound units of measurement, in the event of conflict between the metric and inch-pound units, the inch-pound units shall take precedence. FIGURE 1. Case outlines - continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95600 A REVISION LEVEL K SHEET 15 Case outline M Symbol Millimeters Inches Min Max Min Max A 3.56 4.06 .140 .160 A1 1.37 1.91 .054 .075 A2 0.64 1.60 .025 .063 b 0.30 0.71 .012 .028 D 23.11 23.85 .910 .939 D1 21.34 21.84 .840 .860 E 11.02 11.68 .434 .460 E2 9.50 10.41 .374 .410 e 1.27 BSC .050 BSC L 1.27 1.78 .050 .070 L2 2.92 3.43 .115 .135 N 36 P --- 0.10 --- .004 NOTE: The U.S. Government preferred system of measurement is the metric SI system. However, since this item was originally designed using inch-pound units of measurement, in the event of conflict between the metric and inch-pound units, the inch-pound units shall take precedence. FIGURE 1. Case outlines - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95600 A REVISION LEVEL K SHEET 16 Case N Symbol Millimeters Inches Min Max Min Max A 2.03 2.54 .080 .100 A1 1.37 1.68 .054 .066 b 0.56 0.71 .022 .028 D 23.11 23.62 .910 .930 D1 21.34 21.84 .840 .860 E 11.30 11.68 .445 .460 e 1.27 BSC L .050 BSC 2.54 TYP L2 2.92 N 36 P --- R .100 TYP 3.43 .115 .135 0.15 --- .006 0.23 TYP .009 TYP NOTE: The U.S. Government preferred system of measurement is the metric SI system. However, since this item was originally designed using inch-pound units of measurement, in the event of conflict between the metric and inch-pound units, the inch-pound units shall take precedence. FIGURE 1. Case outlines - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95600 A REVISION LEVEL K SHEET 17 Case 9 Millimeters Symbol Inches Min Max Min Max A 2.44 3.30 .096 .130 b 0.20 0.48 .008 .019 c 0.08 0.20 .003 .008 D 20.73 21.29 .816 .838 D1 18.85 19.25 .742 .758 E 10.64 11.68 .419 .460 E2 8.76 10.85 .345 .427 e 1.27 BSC L 7.37 N 32 .050 BSC 7.87 .290 .310 Q 0.61 0.97 .024 .038 NOTES: 1. The U.S. Government preferred system of measurement is the metric SI system. However, since this item was originally designed using inch-pound units of measurement, in the event of conflict between the metric and inch-pound units, the inch-pound units shall take precedence. 2. Dimension E2 does not apply to optional configuration. FIGURE 1. Case outlines - continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95600 A REVISION LEVEL K SHEET 18 Case 8 Symbol Millimeters Inches Min Max Min Max A1 2.03 2.79 .080 .110 A2 1.47 1.98 .058 .078 B1 0.64R 0.89R .025R .035R b 0.41 0.58 .016 .023 c 0.15 0.33 .006 .013 D 22.99 23.75 .905 .935 E 10.54 11.05 .415 .435 E1 11.30 REF E2 9.17 e e1 N .445 REF 9.93 .361 .391 1.27 BSC .050 BSC 21.59 BSC .850 BSC 36 NOTE: The U.S. Government preferred system of measurement is the metric SI system. However, since this item was originally designed using inch-pound units of measurement, in the event of conflict between the metric and inch-pound units, the inch-pound units shall take precedence. FIGURE 1. Case outlines - continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95600 A REVISION LEVEL K SHEET 19 Case 7 Symbol Millimeters Inches Min Max Min Max 2.92 3.68 .115 .145 A1 .63 1.14 .025 .045 b 0.38 0.51 .015 .020 C 0.15 0.30 .006 .012 A D 23.39 23.85 .921 .939 D2 21.46 21.71 .845 .855 E 10.54 10.92 .415 .430 e 1.27 BSC eA 9.42 R .050 BSC 9.83 .371 .76 TYP .387 .030 TYP NOTE: The U.S. Government preferred system of measurement is the metric SI system. However, since this item was originally designed using inch-pound units of measurement, in the event of conflict between the metric and inch-pound units, the inch-pound units shall take precedence. FIGURE 1. Case outlines - continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95600 A REVISION LEVEL K SHEET 20 Case 6 (see notes) Symbol Millimeters Millimeters Symbol Min Max A 2.986 3.842 E2 b 0.300 0.400 e b2 0.150 0.250 f c 0.050 --- L D 18.215 18.615 M D1 16.60 17.00 N E 9.96 10.36 Min Max 5.280 5.680 0.80 BSC 0.406 0.597 0.839 NOM (ref) 11.735 11.938 44 NOTES: 1. Index area: a notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the area shown. The manufacturer's identification shall not be used as pin one identification mark. FIGURE 1. Case outlines. – continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95600 A REVISION LEVEL K SHEET 21 Device types Case outlines All X, Y, Z, U, 9 T, M, N, 8, 7 Terminal symbol Terminal number Case outlines X, Y, Z, U, 9 Terminal number T, M, N, 8, 7 Terminal symbol 1 2 3 A18 A16 A14 A0 A1 A2 19 20 21 I/O5 I/O6 I/O7 NC A10 A11 4 A12 A3 22 CE A12 5 A7 A4 23 A10 A13 6 A6 CE 24 OE A14 7 8 9 10 A5 A4 A3 A2 I/O1 I/O2 VCC VSS 25 26 27 28 A11 A9 A8 A13 I/O5 I/O6 VCC VSS 11 A1 I/O3 29 WE I/O7 12 A0 I/O4 30 A17 I/O8 13 I/O0 WE 31 A15 OE 14 I/01 A5 32 VCC A15 15 I/02 A6 33 --- A16 16 17 18 VSS I/O3 I/O4 A7 A8 A9 34 35 36 ------- A17 A18 NC NC = No connection Device Type Case Outline Terminal Number 1 Terminal Symbol A0 Terminal Number 12 Terminal Symbol VSS All 6 Terminal Number 23 Terminal Symbol A10 Terminal Number 34 Terminal Symbol VSS 2 A1 13 NC 24 A11 35 NC 3 A2 14 NC 25 A12 36 NC 4 A3 15 I/O2 26 A13 37 I/O6 5 A4 16 I/O3 27 A14 38 I/O7 6 CE 17 WE 28 NC 39 OE A5 29 I/O4 40 NC I/O5 41 A15 7 I/O0 8 9 10 11 18 I/O1 19 A6 30 NC 20 A7 31 NC 42 A16 NC 21 A8 32 NC 43 A17 VCC 22 A9 33 VCC 44 A18 NC = No connection FIGURE 2. Terminal connections. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95600 A REVISION LEVEL K SHEET 22 Mode I/O Power OE CE WE X H X Standby High Z Standby H L H Output deselect High Z Active L L H Read DOUT Active X L L Write DIN Active H = Logic "1" state L = Logic "0" state X = Don't care FIGURE 3. Truth table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95600 A REVISION LEVEL K SHEET 23 NOTES: 1. Use these output load circuits or equivalent for testing. 2. Including scope and jig. 3. Minimum of 5 pF for tELQX, tEHQZ, tOLQX, tOHQZ, tWLQZ, and tWHQX. AC test conditions Input pulse levels GND to 3.0 V Input rise, fall times 5 ns Input timing reference levels 1.5 V Output reference levels 1.5 V FIGURE 4. Output load circuits. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95600 A REVISION LEVEL K SHEET 24 READ CYCLE NO. 1 ( WE HIGH, CE LOW) READ CYCLE NO. 2 ( WE HIGH) FIGURE 5. Timing waveforms. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95600 A REVISION LEVEL K SHEET 25 WRITE CYCLE NO. 1 ( WE CONTROLLED) WRITE CYCLE NO. 2 ( CE CONTROLLED) FIGURE 5. Timing waveforms - continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95600 A REVISION LEVEL K SHEET 26 Data Retention Waveform FIGURE 5. Timing waveforms - continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95600 A REVISION LEVEL K SHEET 27 TABLE IIA. Electrical test requirements. 1/ 2/ 3/ 4/ 5/ 6/ 7/ Line no. Subgroups (in accordance with MIL-STD-883, TM 5005, table I) Test requirements Subgroups (in accordance with MIL-PRF-38535, table III) Device class M Device class Q Device class V 1 Interim electrical parameters (see 4.2) 2 Static burn-in (method 1015) 3 Same as line 1 4 Dynamic burn-in (method 1015) 5 Same as line 1 6 Final electrical parameters (see 4.2) 1*, 2, 3, 7*, 8A, 8B, 9, 10, 11 1*, 2, 3, 7*, 8A, 8B, 9, 10, 11 1*, 2, 3, 7*, 8A, 8B, 9, 10, 11 7 Group A test requirements (see 4.4) 1, 2, 3, 4**, 7, 8A, 8B, 9, 10, 11 1, 2, 3, 4**, 7, 8A, 8B, 9, 10, 11 1, 2, 3, 4**, 7, 8A, 8B, 9, 10, 11 8 Group C end-point electrical parameters (see 4.4) 2, 3, 7, 8A, 8B 1, 2, 3, 7, 8A, 8B 1, 2, 3, 7, 8A, 8B, 9, 10, 11 9 Group D end-point electrical parameters (see 4.4) 2, 3, 8A, 8B 2, 3, 8A, 8B 2, 3, 8A, 8B 10 Group E end-point electrical parameters (see 4.4) 1, 7, 9 1, 7, 9 1, 7, 9 1, 7, 9 Not required Not required Required Required Required 1*, 7* Required 1*, 7* Blank spaces indicate tests are not applicable. Any or all subgroups may be combined when using high-speed testers. Subgroups 7, 8A, and 8B functional tests shall verify the truth table. * indicates PDA applies to subgroup 1 and 7. ** see 4.4.1e. indicates delta limit (see table IIB) shall be required where specified, and the delta values shall be computed with reference to the previous interim electrical parameters (see line 1). 7/ See 4.4.1d. 1/ 2/ 3/ 4/ 5/ 6/ TABLE IIB. Delta limits at +25°C. Device types Parameter 1/ All ICC3 standby +10% IILK, IOLK +10% 1/ The above parameter shall be recorded before and after the required burn-in and life tests to determine the delta. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95600 A REVISION LEVEL K SHEET 28 4.4.1 Group A inspection Continued. e. Subgroup 4 (CIN and COUT measurements) shall be measured only for initial qualification and after any process or design changes which may affect input or output capacitance. Capacitance shall be measured between the designated terminal and GND at a frequency of 1 MHz. Sample size is 15 devices with no failures, and all input and output terminals tested. 4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein. 4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883: a. Test condition D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. b. TA = +125°C, minimum. c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with MILPRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MILSTD-883. 4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein. 4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). a. End-point electrical parameters shall be as specified in table IIA herein. b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All device classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25°C 5°C, after exposure, to the subgroups specified in table IIA herein. 4.5 Delta measurements for device class V. Delta measurements, as specified in table IIA, shall be made and recorded before and after the required burn-in screens and steady-state life tests to determine delta compliance. The electrical parameters to be measured, with associated delta limits are listed in table IIB. The device manufacturer may, at his option, either perform delta measurements or within 24 hours after burn-in perform final electrical parameter tests, subgroups 1, 7, and 9. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing. 6.1.2 Substitutability. Device class Q devices will replace device class M devices. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95600 A REVISION LEVEL K SHEET 29 6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus (DSCC) when a system application requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.4 Comments. Comments on this drawing should be directed to DSCC-VA , Columbus, Ohio 43218-3990, or telephone (614) 692-0547. 6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MILPRF-38535, MIL-HDBK-1331, and as follows. CIN, COUT GND ICC IILK IOLK TC VCC ............................. Input and bi-directional output, terminal-to-GND capacitance. ............................. Ground zero voltage potential. ............................. Supply current. ............................. Input leakage current. ............................. Output leakage current. ............................. Case temperature. ............................. Positive supply voltage. 6.5.1 Timing limits. The table of timing values shows either a minimum or a maximum limit for each parameter. Input requirements are specified from the external system point of view. Thus, address setup time is shown as a minimum since the system must supply at least that much time (even though most devices do not require it). On the other hand, responses from the memory are specified from the device point of view. Thus, the access time is shown as a maximum since the device never provides data later than that time. 6.6 Sources of supply. 6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535. The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and have agreed to this drawing. 6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DSCC-VA. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95600 A REVISION LEVEL K SHEET 30 APPENDIX A Appendix A forms a part of SMD 5962-95600 FUNCTIONAL ALGORITHMS A.1 SCOPE A.1.1 Scope. Functional algorithms are test patterns which define the exact sequence of events used to verify proper operation of a random access memory (RAM). Each algorithm serves a specific purpose for the testing of the device. It is understood that all manufacturers do not have the same test equipment; therefore, it becomes the responsibility of each manufacturer to guarantee that the test patterns described herein are followed as closely as possible, or equivalent patterns be used that serve the same purpose. Each manufacturer should demonstrate that this condition will be met. Algorithms shall be applied to the device in a topologically pure fashion. This appendix is a mandatory part of the specification. The information contained herein is intended for compliance. A.2 APPLICABLE DOCUMENTS. This section is not applicable to this appendix. A.3 ALGORITHMS A.3.1 Algorithm A (pattern 1). A.3.1.1 Checkerboard, checkerboard-bar. Step 1. Step 2. Step 3. Step 4. Load memory with a checkerboard data pattern by incrementing from location 0 to maximum. Read memory, verifying the output checkerboard pattern by incrementing from location 0 to maximum. Load memory with a checkerboard-bar pattern by incrementing from location 0 to maximum. Read memory, verifying the output checkerboard-bar pattern by incrementing from location 0 to maximum. A.3.2 Algorithm B (pattern 2). A.3.2.1 March. Step 1. Step 2. Step 3. Step 4. Step 5. Step 6. Step 7. Step 8. Step 9. Step 10. Step 11. Step 12. Step 13. Step 14. Step 15. Step 16. Step 17. Step 18. Load memory with background data, incrementing from minimum to maximum address locations (all "0's"). Read data in location 0. Write complement data to location 0. Read complement data in location 0. Repeat steps 2 through 4 incrementing X-fast sequentially for each location in the array. Read complement data in maximum address location. Write data to maximum address location. Read data in maximum address location. Repeat steps 6 through 8 decrementing X-fast sequentially for each location in the array. Read data in location 0. Write complement data to location 0. Read complement data in location 0. Repeat steps 10 through 12 decrementing X-fast sequentially for each location in the array. Read complement data in maximum address location. Write data to maximum address location. Read data in maximum address location. Repeat steps 14 through 16 incrementing X-fast sequentially for each location in the array. Read background data from memory, decrementing X-fast from maximum to minimum address locations. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95600 A REVISION LEVEL K SHEET 31 APPENDIX A – continued Appendix A forms a part of SMD 5962-95600 A.3.3 Algorithm C (pattern 3). A.3.3.1 XY March. Step 1. Step 2. Step 3. Step 4. Step 5. Step 6. Step 7. Step 8. Step 9. Step 10. Step 11. Step 12. Step 13. Step 14. Step 15. Step 16. Step 17. Step 18. Load memory with background data, incrementing from minimum to maximum address locations (all "0's"). Read data in location 0. Write complement data to location 0. Read complement data in location 0. Repeat steps 2 through 4 incrementing Y-fast sequentially for each location in the array. Read complement data in maximum address location. Write data to maximum address location. Read data in maximum address location. Repeat steps 6 through 8 decrementing X-fast sequentially for each location in the array. Read data in location 0. Write complement data to location 0. Read complement data in location 0. Repeat steps 10 through 12 decrementing Y-fast sequentially for each location in the array. Read complement data in maximum address location. Write data to maximum address location. Read data in maximum address location. Repeat steps 14 through 16 incrementing X-fast sequentially for each location in the array. Read background data from memory, decrementing Y-fast from maximum to minimum address locations. A.3.4 Algorithm D (pattern 4). A.3.4.1 CEDES - CE deselect checkerboard, checkerboard-bar. Step 1. Step 2. Step 3. Step 4. Step 5. Step 6. Load memory with a checkerboard data pattern by incrementing from location 0 to maximum. Deselect device, attempt to load memory with checkerboard-bar data pattern by incrementing from location 0 to maximum. Read memory, verifying the output checkerboard pattern by incrementing from location 0 to maximum. Load memory with a checkerboard-bar pattern by incrementing from location 0 to maximum. Deselect device, attempt to load memory with checkerboard data pattern by incrementing from location 0 to maximum. Read memory, verifying the output checkerboard-bar pattern by incrementing from location 0 to maximum. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95600 A REVISION LEVEL K SHEET 32 STANDARD MICROCIRCUIT DRAWING SOURCE APPROVAL BULLETIN DATE: 09-01-22 Approved sources of supply for SMD 5962-95600 are listed below for immediate acquisition only and shall be added to MIL-HDBK-103 and QML-38535, as applicable, during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next dated revisions of MIL-HDBK-103 and QML-38535. DSCC maintains an online database of all current sources of supply at http://www.dscc.dla.mil/Programs/Smcr/. Standard microcircuit drawing PIN 1/ 5962-9560001MXA Vendor CAGE number Vendor similar PIN 2/ 54230 EDI88512CA45CB 0EU86 AS5C4008CW-45 5962-9560001MYA 54230 EDI88512CA45B32B 5962-9560001MZA 0EU86 AS5C4008EC-45 54230 EDI88512CA45L32B 54230 EDI88512CA45NB 0EU86 AS5C4008ECJ-45 3/ CY7C1048-45FJMB 5962-9560001MUA 5962-9560001MTA 54230 EDI88512CA45F36B 0EU86 AS5C512K8F-45 3DTT2 P4C1049-45FSMB 54230 EDI88512CA45N36B 0EU86 AS5C512K8ECJ-45 0EU86 AS5C512K8EC-45 3DTT2 P4C1049-45L36MB 5962-9560001M7A 0EU86 AS5C512K8SOJ-45 5962-9560001M9A 54230 EDI88512CA45F32B 0EU86 AS5C4008F-45 5962-9560001MMA 5962-9560001MNA 5962-9560002MXA 54230 EDI88512CA35CB 0EU86 AS5C4008CW-35 5962-9560002MYA 54230 EDI88512CA35B32B 5962-9560002MZA 0EU86 54230 AS5C4008EC-35 EDI88512CA35L32B 5962-9560002MUA 54230 EDI88512CA35NB 0EU86 AS5C4008ECJ-35 3/ CY7C1048-35FJMB 5962-9560002MTA 5962-9560002MMA 54230 EDI88512CA35F36B 0EU86 AS5C512K8F-35 3DTT2 P4C1049-35FSMB 3/ SMJ684002-35HKEM 54230 EDI88512CA35N36B 0EU86 AS5C512K8ECJ-35 See footnotes at end of table. 1 of 9 STANDARD MICROCIRCUIT DRAWING SOURCE APPROVAL BULLETIN – continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number 5962-9560002MNA 0EU86 AS5C512K8EC-35 3DTT2 P4C1049-35L36MB 54230 EDI88512CA35F32B 0EU86 AS5C4008F-35 5962-9560002M7A 0EU86 AS5C512K8SOJ-35 5962-9560002M8A 3/ 5962-9560003MXA 54230 EDI88512CA25CB 0EU86 AS5C4008CW-25 5962-9560003MYA 54230 EDI88512CA25B32B 5962-9560003MZA 0EU86 AS5C4008EC-25 54230 EDI88512CA25L32B 54230 EDI88512CA25NB 0EU86 AS5C4008ECJ-25 3/ CY7C1048-25FJMB 5962-9560002M9A 5962-9560003MUA 5962-9560003MTA Vendor similar PIN 2/ SMJ684002-35HJAM 54230 EDI88512CA25F36B 0EU86 AS5C512K8F-25 3DTT2 P4C1049-25FSMB 3/ SMJ684002-25HKEM 54230 EDI88512CA25N36B 0EU86 AS5C512K8ECJ-25 0EU86 AS5C512K8EC-25 3DTT2 P4C1049-25L36MB 54230 EDI88512CA25F32B 0EU86 AS5C4008F-25 5962-9560003M7A 0EU86 AS5C512K8SOJ-25 5962-9560003M8A 3/ 5962-9560004MXA 54230 EDI88512CA20CB 0EU86 AS5C4008CW-20 54230 EDI88512CA20B32B 5962-9560003MMA 5962-9560003MNA 5962-9560003M9A 5962-9560004MYA See footnotes at end of table. 2 of 9 SMJ684002-25HJAM STANDARD MICROCIRCUIT DRAWING SOURCE APPROVAL BULLETIN – continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number 5962-9560004MZA 0EU86 54230 AS5C4008EC-20 EDI88512CA20L32B 5962-9560004MUA 54230 EDI88512CA20NB 0EU86 AS5C4008ECJ-20 5962-9560004MTA Vendor similar PIN 2/ 3/ CY7C1048-20FJMB 54230 EDI88512CA20F36B 0EU86 AS5C512K8F-20 3DTT2 P4C1049-20FSMB 3/ SMJ684002-20HKEM 54230 EDI88512CA20N36B 0EU86 AS5C512K8ECJ-20 0EU86 AS5C512K8EC-20 3DTT2 P4C1049-20L36MB 54230 EDI88512CA20F32B 0EU86 AS5C4008F-20 5962-9560004M7A 0EU86 AS5C512K8SOJ-20 5962-9560004M8A 3/ 5962-9560005MXA 54230 EDI88512LPA45CB 0EU86 AS5C4008CW-45L 5962-9560005MYA 54230 EDI88512LPA45B32B 5962-9560005MZA 0EU86 54230 AS5C4008EC-45L EDI88512LPA45L32B 5962-9560005MUA 54230 EDI88512LPA45NB 0EU86 AS5C4008ECJ-45L 3/ CY7C1048L-45FJMB 5962-9560004MMA 5962-9560004MNA 5962-9560004M9A 5962-9560005MTA SMJ684002-20HJAM 54230 EDI88512LPA45F36B 0EU86 AS5C512K8F-45L 3DTT2 P4C1049L-45FSMB See footnotes at end of table. 3 of 9 STANDARD MICROCIRCUIT DRAWING SOURCE APPROVAL BULLETIN – continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number 5962-9560005MMA 54230 EDI88512LPA45N36B 0EU86 AS5C512K8ECJ-45L 0EU86 AS5C512K8EC-45L 3DTT2 P4C1049L-45L36MB 5962-9560005M7A 0EU86 AS5C512K8SOJ-45L 5962-9560005M9A 54230 EDI88512LPA45F32B 0EU86 AS5C4008F-45L 54230 EDI88512LPA35CB 0EU86 AS5C4008CW-35L 5962-9560006MYA 54230 EDI88512LPA35B32B 5962-9560006MZA 0EU86 54230 AS5C4008EC-35L EDI88512LPA35L32B 5962-9560006MUA 54230 EDI88512LPA35NB 0EU86 AS5C4008ECJ-35L 3/ CY7C1048L-35FJMB 5962-9560005MNA 5962-9560006MXA 5962-9560006MTA 54230 EDI88512LPA35F36B 0EU86 AS5C512K8F-35L 3DTT2 P4C1049L-35FSMB 3/ 5962-9560006MMA 5962-9560006MNA 5962-9560006M9A Vendor similar PIN 2/ SMJ684002-35HKEM 54230 EDI88512LPA35N36B 0EU86 AS5C512K8ECJ-35L 0EU86 AS5C512K8EC-35L 3DTT2 P4C1049L-35L36MB 54230 EDI88512LPA35F32B 0EU86 AS5C4008F-35L 5962-9560006M8A 3/ SMJ684002-35HJAM 5962-9560006M7A 0EU86 AS5C512K8SOJ-35L 5962-9560007MXA 54230 EDI88512LPA25CB 0EU86 AS5C4008CW-25L See footnotes at end of table. 4 of 9 STANDARD MICROCIRCUIT DRAWING SOURCE APPROVAL BULLETIN – continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-9560007MYA 54230 EDI88512LPA25B32B 5962-9560007MZA 0EU86 AS5C4008EC-25L 54230 EDI88512LPA25L32B 54230 EDI88512LPA25NB 0EU86 AS5C4008ECJ-25L 3/ CY7C1048L-25FJMB 5962-9560007MUA 5962-9560007MTA 54230 EDI88512LPA25F36B 0EU86 AS5C512K8F-25L 3DTT2 P4C1049L-25FSMB 3/ 5962-9560007MMA 5962-9560007MNA 5962-9560007M9A SMJ684002-25HKEM 54230 EDI88512LPA25N36B 0EU86 AS5C512K8ECJ-25L 0EU86 AS5C512K8EC-25L 3DTT2 P4C1049L-25L36MB 54230 EDI88512LPA25F32B 0EU86 AS5C4008F-25L 5962-9560007M8A 3/ SMJ684002-25HJAM 5962-9560007M7A 0EU86 AS5C512K8SOJ-25L 5962-9560008MXA 54230 EDI88512LPA20CB 0EU86 AS5C4008CW-20L 5962-9560008MYA 54230 EDI88512LPA20B32B 5962-9560008MZA 0EU86 AS5C4008EC-20L 54230 EDI88512LPA20L32B 54230 EDI88512LPA20NB 0EU86 AS5C4008ECJ-20L 5962-9560008MUA 3/ 5962-9560008MTA 54230 EDI88512LPA20F36B 0EU86 AS5C512K8F-20L 3DTT2 P4C1049L-20FSMB 3/ 5962-9560008MMA 5962-9560008MNA CY7C1048L-20FJMB SMJ684002-20HKEM 54230 EDI88512LPA20N36B 0EU86 AS5C512K8ECJ-20L 0EU86 AS5C512K8EC-20L 3DTT2 P4C1049L-20L36MB See footnotes at end of table. 5 of 9 STANDARD MICROCIRCUIT DRAWING SOURCE APPROVAL BULLETIN – continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-9560008M9A 54230 EDI88512LPA20F32B 0EU86 AS5C4008F-20L 5962-9560008M8A 3/ SMJ684002-20HJAM 5962-9560008M7A 0EU86 AS5C512K8SOJ-20L 5962-9560009QXA 0EU86 54230 AS5C4008CW-45L EDI88512LPA45CB 5962-9560009QZA 0EU86 54230 AS5C4008EC-45L EDI88512LPA45L32B 5962-9560009QUA 0EU86 54230 AS5C4008ECJ-45L EDI88512LPA45NB 5962-9560009MTA 3DTT2 P4C1049L-45FSMB 5962-9560009QTA 0EU86 54230 AS5C512K8F-45L EDI88512LPA45F36B 5962-9560009QMA 0EU86 54230 AS5C512K8ECJ-45L EDI88512LPA45N36B 5962-9560009QNA 0EU86 AS5C512K8EC-45L 5962-9560009MNA 3DTT2 P4C1049L-45L36MB 5962-9560009Q9A 0EU86 54230 AS5C4008F-45L EDI88512LPA45F32B 5962-9560009Q7A 0EU86 AS5C512K8SOJ-45L 5962-9560010QXA 0EU86 54230 AS5C4008CW-35L EDI88512LPA35CB 5962-9560010QZA 0EU86 54230 AS5C4008EC-35L EDI88512LPA35L32B 5962-9560010QUA 0EU86 54230 AS5C4008ECJ-35L EDI88512LPA35NB 5962-9560010QTA 0EU86 54230 AS5C512K8F-35L EDI88512LPA35F36B 5962-9560010MTA 3DTT2 P4C1049L-35FSMB 5962-9560010QMA 0EU86 54230 AS5C512K8ECJ-35L EDI88512LPA35N36B 5962-9560010QNA 0EU86 AS5C512K8EC-35L 5962-9560010MNA 3DTT2 P4C1049L-35L36MB 5962-9560010Q9A 0EU86 54230 AS5C4008F-35L EDI88512LPA35F32B 5962-9560010Q7A 0EU86 AS5C512K8SOJ-35L 5962-9560011QXA 0EU86 54230 AS5C4008CW-25L EDI88512LPA25CB 5962-9560011QZA 0EU86 54230 AS5C4008EC-25L EDI88512LPA25L32B 5962-9560011QUA 0EU86 54230 AS5C4008ECJ-25L EDI88512LPA25NB See footnotes at end of table. 6 of 9 STANDARD MICROCIRCUIT DRAWING SOURCE APPROVAL BULLETIN – continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor PIN 2/ 5962-9560011QTA 0EU86 54230 AS5C512K8F-25L EDI88512LPA25F36B 5962-9560011MTA 3DTT2 P4C1049L-25FSMB 5962-9560011QMA 0EU86 54230 AS5C512K8ECJ-25L EDI88512LPA25N36B 5962-9560011QNA 0EU86 AS5C512K8EC-25L 5962-9560011MNA 3DTT2 P4C1049L-25L36MB 5962-9560011Q9A 0EU86 54230 AS5C4008F-25L EDI88512LPA25F32B 5962-9560011Q7A 0EU86 AS5C512K8SOJ-25L 5962-9560012QXA 0EU86 54230 AS5C4008CW-20L EDI88512LPA20CB 5962-9560012QZA 0EU86 54230 AS5C4008EC-20L EDI88512LPA20L32B 5962-9560012QUA 0EU86 54230 AS5C4008ECJ-20L EDI88512LPA20NB 5962-9560012QTA 0EU86 54230 AS5C512K8F-20L EDI88512LPA20F36B 5962-9560012MTA 3DTT2 P4C1049L-20FSMB 5962-9560012QMA 0EU86 54230 AS5C512K8ECJ-20L EDI88512LPA20N36B 5962-9560012QNA 0EU86 AS5C512K8EC-20L 5962-9560012MNA 3DTT2 P4C1049L-20L36MB 5962-9560012Q9A 0EU86 54230 AS5C4008F-20L EDI88512LPA20F32B 5962-9560012Q7A 0EU86 AS5C512K8SOJ-20L 5962-9560013QXA 0EU86 54230 AS5C4008CW-15L EDI88512LPA15CB 5962-9560013QZA 0EU86 54230 AS5C4008EC-15L EDI88512LPA15L32B 5962-9560013QUA 0EU86 54230 AS5C4008ECJ-15L EDI88512LPA15NB 5962-9560013QTA 0EU86 54230 AS5C512K8F-15L EDI88512LPA15F36B 5962-9560013MTA 3DTT2 P4C1049L-15FSMB 5962-9560013QMA 0EU86 54230 AS5C512K8ECJ-15L EDI88512LPA15N36B 5962-9560013QNA 0EU86 AS5C512K8EC-15L 5962-9560013MNA 3DTT2 P4C1049L-15L36MB See footnotes at end of table. 7 of 9 similar STANDARD MICROCIRCUIT DRAWING SOURCE APPROVAL BULLETIN – continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor PIN 2/ 5962-9560013Q9A 0EU86 54230 AS5C4008F-15L EDI88512LPA15F32B 5962-9560013Q7A 0EU86 AS5C512K8SOJ-15L 5962-9560014QXA 0EU86 54230 AS5C4008CW-15 EDI88512CA15CB 5962-9560014QZA 0EU86 54230 AS5C4008EC-15 EDI88512CA15L32B 5962-9560014QUA 0EU86 54230 AS5C4008ECJ-15 EDI88512CA15NB 5962-9560014QTA 0EU86 54230 AS5C512K8F-15 EDI88512CA15F36B 5962-9560014MTA 3DTT2 P4C1049-15FSMB 5962-9560014QMA 0EU86 54230 AS5C512K8ECJ-15 EDI88512CA15N36B 5962-9560014QNA 0EU86 AS5C512K8EC-15 5962-9560014MNA 3DTT2 P4C1049-15L36MB 5962-9560014Q9A 0EU86 54230 AS5C4008F-15 EDI88512CA15F32B 5962-9560014Q7A 0EU86 AS5C512K8SOJ-15 5962-9560015QXA 0EU86 54230 AS5C4008CW-12L EDI88512LPA12CB 5962-9560015QZA 0EU86 54230 AS5C4008EC-12L EDI88512LPA12L32B 5962-9560015QUA 0EU86 54230 AS5C4008ECJ-12L EDI88512LPA12NB 5962-9560015QTA 0EU86 54230 AS5C512K8F-12L EDI88512LPA12F36B 5962-9560015MTA 3DTT2 P4C1049L-12FSMB 5962-9560015QMA 0EU86 54230 AS5C512K8ECJ-12L EDI88512LPA12N36B 5962-9560015QNA 0EU86 AS5C512K8EC-12L 5962-9560015MNA 3DTT2 P4C1049L-12L36MB 5962-9560015Q9A 0EU86 54230 AS5C4008F-12L EDI88512LPA12F32B 5962-9560015Q7A 0EU86 AS5C512K8SOJ-12L 5962-9560016QXA 0EU86 54230 AS5C4008CW-12 EDI88512CA12CB See footnotes at end of table. 8 of 9 similar STANDARD MICROCIRCUIT DRAWING SOURCE APPROVAL BULLETIN – continued. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor PIN 2/ similar 5962-9560016QZA 0EU86 54230 AS5C4008EC-12 EDI88512CA12L32B 5962-9560016QUA 0EU86 54230 AS5C4008ECJ-12 EDI88512CA12NB 5962-9560016QTA 0EU86 54230 AS5C512K8F-12 EDI88512CA12F36B 5962-9560016MTA 3DTT2 P4C1049-12FSMB 5962-9560016QMA 0EU86 54230 AS5C512K8ECJ-12 EDI88512CA12N36B 5962-9560016QNA 0EU86 AS5C512K8EC-12 5962-9560016MNA 3DTT2 P4C1049-12L36MB 5962-9560016Q9A 0EU86 54230 AS5C4008F-12 EDI88512CA12F32B 5962-9560016Q7A 0EU86 AS5C512K8SOJ-12 5962-9560017M6A 6S055 DPA71049D02A 5962-9560017M6C 6S055 DPA71049D02C 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the Vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. 3/ No longer available from an approved source. Vendor CAGE number Vendor name and address 54230 White Electronic Designs Corporation. 3601 East University Drive Phoenix, AZ 85034 0EU86 Austin Semiconductor 8701 Cross Park Drive Austin, TX 78754-4566 3DDT2 Pyramid Semiconductor Corporation 1340 Bordeaux Drive Sunnyvale, CA 94089 6S055 DPA Components International 2251 Ward Ave. Simi Valley, CA 93065 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in this information bulletin. 9 of 9