V I S H AY I N T E R T E C H N O L O G Y, I N C . Multilayer Ceramic Chip Capacitors Multilayer Ceramic Chip Capacitors PRODUCTS: • • • • • • • • Basic Commodity (BME Technology) Commercial (NME Technology) Automotive Board Flex Sensitive, Including Polymer Termination Surface Arc-Over Prevention for High Voltages Non-Magnetic Series High Reliability, Medical, and Military/Aerospace RF Capacitors RESOURCES • For more information please visit http://www.vishay.com/capacitors/ceramic-multilayer-smd/ • For technical questions email [email protected] A WORLD OF SOLUTIONS SELECTOR GUIDE 1/18 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VMN-SG2120-1603 www.vishay.com V I S H AY I N T E R T E C H N O L O G Y, I N C . Multilayer Ceramic Chip Capacitors Series Case Size Description TC and Dielectric Voltage [Min. V] Capacitance [Max. V] [Min.] [Max.] Capacitors - MLCC VJ HVArc Guard® FEATURES • Surface-mount multilayer ceramic chip capacitors • Prevents surface arc-over in high-voltage applications • Higher capacitance and smaller case sizes • Voltage breakdown as much as twice that of competitors’ products • Available with polymer terminations in X7R for increased resistance to board flex cracking • Wet build process • Reliable Noble Metal Electrode (NME) system • Worldwide patent technology APPLICATIONS • DC/DC converters (buck and boost) • Voltage multipliers for flyback converters • Power supplies 390 pF 0805 1206 1210 C0G (NP0) 1000 1500 2220 2225 2500 0805 630 10 pF 2.7 nF 470 pF 470 pF 1206 1210 X7R 250 1000 220 pF 1812 FEATURES • Surface-mount multilayer ceramic chip capacitors • Manufactured with non-magnetic materials: Copper / AgPd • Safety screened for magnetic properties • Wet build process • Reliable Noble Metal Electrode (NME) system APPLICATIONS • Magnetic resonance imaging (MRI) • Medical test and diagnostic equipment • Navigation and electronic test equipment • Audio amplifiers 100 0603 10 0805 16 C0G (NP0) 1812 2220 X5R 0402 6.3 1.8 nF 0.5 pF 3.3 nF 10 nF 12 nF 10 nF 3000 10 pF 15 pF 39 nF 1000 100 pF 47 nF 120 pF 56 nF 16 27 nF 100 nF 6.3 120 nF 150 nF 22 nF 100 pF 22 nF 270 pF 100 nF 390 pF 390 nF 680 pF 1.0 µF 1.0 nF 1.0 µF 220 pF 270 nF 270 pF 1.0 µF 1000 10 nF 2.7 µF 3000 1.0 nF 2.2 µF 2225 2000 5.6 nF 4.7 µF 3640 500 15 nF 6.8 µF 0603 0805 1206 1808 6.3 100 10 200 16 1210 X7R 1825 2220 500 3000 1812 SELECTOR GUIDE 100 nF 500 2225 0603 82 nF 600 25 1825 0402 3.3 nF 180 pF 200 500 1206 1808 8.2 nF 270 nF 0402 1210 5.6 nF 47 nF 1808 VJ Non-Magnetic 1.5 nF 25 2/18 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VMN-SG2120-1603 www.vishay.com V I S H AY I N T E R T E C H N O L O G Y, I N C . Multilayer Ceramic Chip Capacitors Series VJ HIFREQ Series VJ QUAD HiFREQ Series VJ Safety Certified Capacitors Case Size Description FEATURES • Surface-mount multilayer ceramic chip capacitor • Made with a combination of design, materials, and tight process control to achieve very high field reliability • Available with tin-lead terminations (min.4 % lead) • Available with AgPd terminations for silver epoxy bonding • Available with non-magnetic copper terminations for reflow soldering • Excellent aging characteristics • Wet build process • Reliable Noble Metal Electrode (NME) system APPLICATIONS • Broadband wireless communication • Satellite communication • WiFi (802.11) and WiMax (802.16) • VolP networks and cellular base stations • Subscriber-based wireless devices FEATURES • Surface-mount multilayer ceramic chip capacitor for high-frequency applications • Case sizes 0505, 1111, 2525, and 3838 • Lead (Pb)-free termination code “X” • Available with tin-lead termination code “L” • Available with non-magnetic copper termination code “C” for reflow soldering • Excellent aging characteristics • Ultra-stable, high-Q dielectric material • Reliable Noble Metal Electrode (NME) system APPLICATIONS • MRI coils and generators • RF instruments • Lasers, CATV, UHF / microwave RF power amplifiers • Filter networks, timing circuits • Mixers, oscillators, impedance matching networks FEATURES • Surface-mount multilyer ceramic chip capacitor, saftey certified • Qualified to IEC 60384-14 • Wet build process • Reliable Noble Metal Electrode (NME) system APPLICATIONS • Power supplies • Facsimile and telephone • AC equipment and appliances • Lighting strike and voltage surge protection • EMI and AC line filtering • Isolators TC and Dielectric Voltage [Min. V] 0402 0603 [Min.] 200 HIFREQ C0G (NP0) [Max.] 82 pF 470 pF 25 0.1 pF 250 0805 1.5 nF 0505 200 250 0.1 pF 100 pF 1111 300 1500 0.2 pF 1000 pF 2525 300 3600 1.0 pF 2700 pF 3838 500 7200 1.0 pF 5100 pF 10 pF 220 pF 18 pF 470 pF 47 pF 1.0 nF 10 pF 390 pF 18 pF 470 pF 82 pF 1.0 nF 150 pF 1.2 nF HIFREQ C0G (NP0) 2008 2012 C0G (NP0) (X1 / Y2) 2220 2008 2012 C0G (NP0) (X2) 250 2008 2012 X7R (X1 / Y2) 250 2220 270 pF 4.7 nF 2008 82 pF 2.7 nF 150 pF 5.6 nF 270 pF 12 nF 2012 X7R (X2) 2220 SELECTOR GUIDE [Max. V] Capacitance 3/18 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VMN-SG2120-1603 www.vishay.com V I S H AY I N T E R T E C H N O L O G Y, I N C . Multilayer Ceramic Chip Capacitors Series VJ…SE Source Energy Capacitor (SEC) VJ Controlled Discharge Capacitor (CDC) VJ 31/34 Automotive Series Case Size Description FEATURES • Surface-mount multilayer ceramic chip capacitor • Low-electrostrictive ceramic formulation for repeated charge and discharge cycles • High pulse discharge currents • Made with a combination of design, materials, and tight process control to achieve very high field reliability • Available with tin-lead terminations (min. 4% lead) • Excellent reliability and high-voltage performance • Wet build process • Reliable Noble Metal Electrode (NME) system APPLICATIONS • Power supplies • Converter • Voltage multiplier FEATURES • Surface-mount multilyer ceramic chip capacitor with integrated resistor • Low-electrostrictive ceramic formulation for repeated charge and discharge cycles • High pulse discharge currents • Made with a combination of design, materials, and tight process control to achieve very high field reliability • Available with tin-lead terminations (min. 4% lead) • Excellent reliability and high-voltage performance • Wet build process • Reliable Noble Metal Electrode (NME) system APPLICATIONS • Detonation devices (munitions, pyrotechnic, blasting) • Down hole drilling • Electronic fuzing FEATURES • Surface-mount multilayer ceramic chip capacitors • AEC-Q200-qualified with PPAP available • C0G (NP0) offers ultra-stable dielectric and low power dissipation factor • X7R operating temperature up to +150 °C, above +125 °C with derating • X8R maintains capacitance at high temperature • AgPd terminations available for silver epoxy bonding • Polymer terminations in C0G (NP0)/X7R/X8R available for increased resistance to board flex cracking for size 0603 and larger • Wet build process • Reliable Noble Metal Electrode (NME) system APPLICATIONS • Timing and tuning circuits • Filtering and decoupling • Sensor and scanner applications • Power supplies TC and Dielectric Voltage [Min.] [Max.] 1812 4.7 nF 27 nF 1825 10 nF 56 nF 2225 18 nF 100 nF 3040 33 nF 220 nF 3640 47 nF 330 nF 4044 100 nF 560 nF 33 nF 220 nF 47 nF 330 nF 100 nF 560 nF X7R [Min. V] 1000 [Max. V] 1500 3040 3640 X7R (Y5P) 1000 1500 4044 0402 25 100 0603 200 0805 500 1206 C0G (NP0) 50 1210 630 220 pF 1.0 pF 1.0 nF 3.9 nF 10 nF 100 pF 12 nF 1812 3000 12 pF 22 nF 0402 100 120 pF 0603 200 0805 1206 X7R 16 500 630 1812 330 pF 50 470 nF 390 pF 330 pF 0603 100 25 1206 1210 4/18 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 1.0 µF 10 nF 0402 X8R 47 nF 150 nF 220 pF 1210 0805 SELECTOR GUIDE Capacitance 50 470 pF 6.8 nF 33 nF 100 nF 1.0 nF 220 nF 10 nF 390 nF VMN-SG2120-1603 www.vishay.com V I S H AY I N T E R T E C H N O L O G Y, I N C . Multilayer Ceramic Chip Capacitors Series VJ 31X RoHS Automotive Series GA.. 34G Automotive Series AgPd Termination Case Size Description FEATURES • Surface-mount multilayer ceramic chip capacitors • AEC-Q200-qualified with PPAP available • Compliant with ELV directive • C0G (NP0) offers ultra-stable dielectric and low power dissipation factor • X7R operating temperature up to +150 °C, above +125 °C with derating • X8R maintains capacitance at high temperature • Polymer terminations in C0G(NP0)/X7R/X8R available for increased resistance to board flex cracking for size 0603 and larger • Wet build process • Reliable Noble Metal Electrode (NME) system APPLICATIONS • Timing and tuning circuits • Filtering and decoupling • Sensor and scanner applications • Power supplies FEATURES • Surface-mount multilayer ceramic chip capacitors • AgPd termination for conductive epoxy assembly • AEC-Q200-qualified with PPAP available • Compliant with ELV directive • Vishay “Green” product • C0G (NP0) offers ultra-stable dielectric and low power dissipation factor • X7R operating temperature up to +150 °C, above +125 °C with derating • X8R maintains capacitance at high temperature • Wet build process • Reliable Noble Metal Electrode (NME) system APPLICATIONS • Timing and tuning circuits • Filtering and decoupling • Sensor and scanner applications • Power supplies TC and Dielectric 0402 0603 0805 1206 1210 1812 0402 0603 0805 1206 1210 1812 0402 0603 0805 1206 1210 Voltage [Min. V] [Max. V] 25 100 200 500 C0G (NP0) X7R Capacitance 50 16 50 630 3000 100 200 250 1000 630 100 X8R 25 50 0402 25 0805 C0G 1206 (NP0) 500 50 1210 630 1.0 pF 100 pF 12 pF 120 pF 330 pF 220 pF 390 pF 10 nF 330 pF 470 pF 1.0 nF 10 nF 1.0 nF 3.9 nF 10 nF 12 nF 22 nF 47 nF 150 nF 470 nF 1.0 µF 6.8 nF 33 nF 100 nF 220 nF 220 nF 220 pF 1.0 pF 1.0 nF 3.9 nF 10 nF 100 pF 12 nF 3000 12 pF 22 nF 0402 100 120 pF 0603 200 1812 0805 1206 X7R 16 250 1210 630 1812 50 390 pF 100 X8R 470 nF 25 1206 1210 5/18 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 1.0 µF 10 nF 330 pF 0603 0805 330 pF 47 nF 150 nF 220 pF 0402 SELECTOR GUIDE [Max.] 220 pF 100 200 0603 [Min.] 50 470 pF 6.8 nF 33 nF 100 nF 1.0 nF 220 nF 10 nF 220 nF VMN-SG2120-1603 www.vishay.com V I S H AY I N T E R T E C H N O L O G Y, I N C . Multilayer Ceramic Chip Capacitors Case Size Series Description VJ OMD (Open-Mode Design) Commercial Series FEATURES • Surface-mount multilayer ceramic chip capacitors • Reduce risk of shorts or leakage in board-flexsensitive applications • Polymer terminations available for intensive board flex requirements • AgPd terminations available for silver epoxy bonding • High voltage breakdown compared to standard design • Wet build process • Reliable Noble Metal Electrode (NME) system APPLICATIONS • Demanding boardflex applications • Input/output filter capacitors • Snubber capacitor applications • Power supplies TC and Dielectric SELECTOR GUIDE FEATURES • Surface-mount multilayer ceramic chip capacitor • Excellent reliability and thermal shock performance • High voltage breakdown compared to standard design • High-reliability serial electrode design • Protective surface coating may be required to prevent arcing over • Wet build process • Reliable Noble Metal Electrode (NME) system APPLICATIONS • Input filter capacitors • Output filer capacitors • Snubber capacitors reduce MOSFET voltage spikes • Filtering for switching power supplied • For lighting and other AC applications please contact : [email protected] [Min. V] [Max. V] 1206 1500 1210 2000 1808 1812 C0G (NP0) 50 1000 2225 0805 630 1206 16 1210 1812 [Min.] X7R 630 50 2000 3000 [Max.] 4.7 nF 10 pF 8.2 nF 18 nF 15 pF 2220 1808 Capacitance 3000 1825 270 pF 33 nF 39 nF 47 nF 470 pF 220 nF 270 pF 680 nF 390 pF 1.0 µF 220 pF 18 nF 100 pF 1.2 µF 100 2000 5.6 nF 1.5 µF 2220 50 3000 1.0 nF 2225 100 2000 5.6 nF 1825 HV…HV High-Voltage Series Voltage 1812 180 pF 1825 330 pF X7R 3000 390 pF 2225 470 pF THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 3.9 nF 10 nF 5000 2220 6/18 1.8 µF 15 nF VMN-SG2120-1603 www.vishay.com V I S H AY I N T E R T E C H N O L O G Y, I N C . Multilayer Ceramic Chip Capacitors Series VJ Commercial Series Case Size Description FEATURES • Surface-mount multilayer ceramic chip capacitors • C0G (NP0) offers ultra-stable dielectric and low power dissipation • Polymer terminations available with C0G (NP0)/ X7R for board flex requirements for size 0603 and larger • AgPd terminations available for silver epoxy bonding • Wet build process • Reliable Noble Metal Electrode (NME)system APPLICATIONS • Timing and tuning circuits • Filtering and decoupling • Sensor and scanner applications • Surge suppression • Power supplies TC and Dielectric 0402 Voltage [Min. V] [Max. V] 25 100 0603 200 0805 500 1206 1210 1808 630 C0G (NP0) 50 1812 1825 2220 2225 0402 0603 16 1206 X7R 1812 2220 50 2225 25 3640 X8R Dielectric VJ High Temperature FEATURES • Surface-mount multilayer ceramic chip capacitors • High Q at high frequencies • Low ESR and dissipation factor • AgPd terminations available for silver epoxy bonding • Wet build process • Reliable Noble Metal Electrode (NME) system APPLICATIONS • Timing and tuning circuits • Filtering and decoupling • Sensor applications FEATURES • Surface-mount multilayer ceramic chip capacitors • High-operating-temperature dielectric • Maintains capacitance at high temperature • AgPd terminations available for silver epoxy bonding • Wet build process • Reliable Noble Metal Electrode (NME) system APPLICATIONS • High-temperature modules 0603 1.0 pF High-Q C0G (NP0) 56 pF 12 nF 18 pF 10 nF 22 nF 39 nF 1000 270 pF 100 120 pF 250 1000 47 nF 56 nF 47 nF 150 nF 330 pF 470 nF 1.0 µF 390 pF 1.0 µF 470 pF 270 nF 1.0 nF 1.0 µF 10 nF 2.7 µF 500 15 nF 2.2 µF 1000 33 nF 4.7 µF 500 27 nF 6.8 µF 100 pF 1.0 pF 200 220 pF 330 pF 0402 0603 4.7 nF 39 pF 50 0805 1.0 nF 10 nF 100 100 6.8 nF 33 nF 470 pF 0805 X8R 25 100 nF 1206 1.0 nF 220 nF 10 nF 220 nF 50 1210 SELECTOR GUIDE 220 pF 100 pF 50 25 1825 [Max.] 500 630 1210 1808 1000 [Min.] 200 0805 VJ High Q Dielectric Commercial Series Capacitance 7/18 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VMN-SG2120-1603 www.vishay.com V I S H AY I N T E R T E C H N O L O G Y, I N C . Multilayer Ceramic Chip Capacitors Series VJ Hi-Rel Series Case Size Description FEATURES • MIL-PRF-55681-qualified production line • Available with group A and C screening • Available with only group A screening • Available with only voltage conditioning • Available with tin-lead terminations (min. 4 % lead) • AgPd terminations available for silver epoxy bonding • Customized testing and certification available • Wet build process • Reliable Noble Metal Electrode (NME) system APPLICATIONS • System-critical medical applications • Mission-critical military and aerospace applications TC and Dielectric Voltage [Min. V] 0402 10 0805 16 500 2225 16 X5R 6.3 0402 0603 10 1206 200 1812 500 25 2220 22 nF 100 pF 33 nF 120 pF 39 nF 27 nF 47 nF 120 nF 150 nF 100 pF 22 nF 270 pF 100 nF 150 pF 390 nF 1.0 nF X7R 1825 3.3 nF 10 nF SELECTOR GUIDE 270 nF 1.0 µF 2.2 µF 4.7 µF 3640 FEATURES • Surface-mount multilayer ceramic chip capacitors • Federal stock control number CAGE CODE 2770A • MIL-PRF-55681-qualified products • High reliabilty tested per MIL-PRF-55681 • Available with tin-lead terminations (min. 4 % lead) • Available with lead (Pb)-free terminations • Available with AgPd terminations for silver epoxy bonding • Wet build process • Reliable Noble Metal Electrode (NME) system APPLICATIONS • Avionic systems • Sonar systems • Satellite systems • Missiles applications • Geographical information systems • Global positioning systems 1.0 µF 2.7 µF 2225 MIL-PRF-55681 (CDR) 3.3 nF 39 pF 680 pF 16 1210 1808 6.3 100 0805 1.5 nF 1.0 pF 10 nF 2220 0603 180 nF 22 pF 25 1825 [Max.] 600 C0G (NP0) 1812 0402 [Min.] 200 500 1206 1808 [Max. V] 100 0603 1210 Capacitance 15 nF 6.8 µF CDR01 (0805) BP 100 10 pF 180 pF BX 50 120 pF 4.7 nF CDR02 (1805) BP 100 220 pF 270 pF BX 50 3.9 nF 22 nF CDR03 (1808) BP 100 330 pF 1.0 nF BX 50 12 nF 68 nF CDR04 (1812) BP 100 1.2 nF 3.3 nF BX 50 39 nF 180 nF BX 50 390 nF 470 nF CDR06 (2225) 100 50 CDR31 (0805) BP 1.0 pF 680 pF BX 470 pF 18 nF CDR32 (1206) BP 1.0 pF 2.2 nF BX 4.7 nF 39 nF CDR33 (1210) BP CDR34 (1812) BP CDR35 (1825) BX 1.0 nF 3.3 nF 15 nF 100 nF 2.2 nF 10 nF BX 27 nF 180 nF BP 4.7 nF 22 nF 56 nF 470 nF BX 50 8/18 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 100 VMN-SG2120-1603 www.vishay.com V I S H AY I N T E R T E C H N O L O G Y, I N C . Multilayer Ceramic Chip Capacitors Series MIL-PRF-123 DSCC 03029 SELECTOR GUIDE Description FEATURES • Space-level reliability • Military-qualified products • Federal stock control number, CAGE CODE 2770A • High reliability tested per MIL-PRF-123 • Lead-bearing (min. 4 %) termination finish “Z” • Guarded termination finish “S” • Wet build process • Reliable Noble Metal Electrode (NME) system • Material categorization: for definitions of compliance APPLICATIONS • Space systems • Satellite systems • Avionic systems • Sonar systems • Missiles applications • Global positioning systems FEATURES • Surface-mount multilayer ceramic chip capacitors • Made with a combination of design, materials, and tight process control to achieve very high field reliability • US defense supply center approved • Federal stock control number CAGE CODE 2770A • Available with tin-lead terminations (min. 4 % lead) • Available with AgPd terminations for silver epoxy bonding • Excellent aging characteristic • Wet build process • Reliable Noble Metal Electrode (NME) system APPLICATIONS • Broadband wireless communication • Satellite communication • WiFi (802.11) and WiMax (802.16) • Subscriber-based wireless devices • Microwave systems Case Size TC and Dielectric CKS51 (0805) Voltage [Max. V] [Min.] [Max.] BP 100 1.0 pF 680 pF CKS55 (1206) BP 100 1.0 pF 2200 pF CKS52 (1210) BP 100 300 pF 3300 pF CKS53 (1808) BP 100 300 pF 1000 pF CKS56 (1812) BP 100 1200 pF 10 000 pF CKS57 (1825) BP 100 3600 pF 22 000 pF CKS54 (2225) BP 50 1100 pF 10 000 pF CKS51 (0805) BX 100 330 pF 18 000 pF CKS55 (1206) BX 100 4700 pF 39 000 pF CKS52 (1210) BX 100 5600 pF 100 000 pF CKS53 (1808) BX 100 5600 pF 100 000 pF CKS56 (1812) BX 100 27 000 pF 56 000 pF CKS57 (1825) BX 100 56 000 pF 470 000 pF BP 100 1.0 pF 180 pF 0402 BR [Min. V] Capacitance 10 nF 6.3 50 BX 9/18 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 100 pF 8.2 nF VMN-SG2120-1603 www.vishay.com V I S H AY I N T E R T E C H N O L O G Y, I N C . Multilayer Ceramic Chip Capacitors Series DSCC 03028 DSCC 05001 DSCC 05002 SELECTOR GUIDE Case Size Description FEATURES • Surface-mount multilayer ceramic chip capacitors • Made with a combination of design, materials, and tight process control to achieve very high field reliability • US defense supply center approved • Federal stock control number CAGE CODE 2270A • Available with tin-lead terminations (min. 4 % lead) • Available with AgPd terminations for silver epoxy bonding • Excellent aging characteristic • Wet build process • Reliable Noble Metal Electrode (NME) system APPLICATIONS • Broadband wireless communication • Satellite communication • WiFi (802.11) and WiMax (802.16) • Subscriber-based wireless devices • Microwave systems FEATURES • Surface-mount multilayer ceramic chip capacitors • Made with a combination of design, materials, and tight process control to achieve very high field reliability • US defense supply center approved • Federal stock control number CAGE CODE 2270A • Available with tin-lead terminations (min. 4 % lead) • Available with AgPd terminations for silver epoxy bonding • Excellent aging characteristic • Wet build process • Reliable Noble Metal Electrode (NME) system APPLICATIONS • Broadband wireless communication • Satellite communication • WiFi (802.11) and WiMax (802.16) • Subscriber-based wireless devices • Microwave systems FEATURES • Surface-mount multilayer ceramic chip capacitors • Made with a combination of design, materials, and tight process control to achieve very high field reliability • US defense supply center approved • Federal stock control number CAGE CODE 2270A • Available with tin-lead terminations (min. 4 % lead) • Available with AgPd terminations for silver epoxy bonding • Excellent aging characteristic • Wet build process • Reliable Noble Metal Electrode (NME) system APPLICATIONS • Broadband wireless communication • Satellite communication • WiFi (802.11) and WiMax (802.16) • Subscriber-based wireless devices • Microwave systems TC and Dielectric Voltage [Min. V] [Max. V] BP 0603 BR 6.3 Capacitance [Min.] [Max.] 1.0 pF 1.0 nF 100 pF 100 nF 100 BX 0805 BP 50 250 1.0 pF 100 pF 0603 BP 50 250 1.0 pF 100 pF 10/18 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VMN-SG2120-1603 www.vishay.com V I S H AY I N T E R T E C H N O L O G Y, I N C . Multilayer Ceramic Chip Capacitors Series DSCC 05003 DSCC 05006 DSCC 05007 SELECTOR GUIDE Description FEATURES • Surface-mount multilayer ceramic chip capacitors • Made with a combination of design, materials, and tight process control to achieve very high field reliability • US defense supply center approved • Federal stock control number CAGE CODE 2270A • Available with tin-lead terminations (min. 4 % lead) • Available with AgPd terminations for silver epoxy bonding • Excellent aging characteristic • Wet build process • Reliable Noble Metal Electrode (NME) system APPLICATIONS • Broadband wireless communication • Satellite communication • WiFi (802.11) and WiMax (802.16) • Subscriber-based wireless devices • Microwave systems FEATURES • Surface-mount multilayer ceramic chip capacitors • Made with a combination of design, materials, and tight process control to achieve very high field reliability • US defense supply center approved • Federal stock control number CAGE CODE 2270A • Available with tin-lead terminations (min. 4 % lead) • Available with AgPd terminations for silver epoxy bonding • Excellent aging characteristic • Wet build process • Reliable Noble Metal Electrode (NME) system APPLICATIONS • Broadband wireless communication • Satellite communication • WiFi (802.11) and WiMax (802.16) • Subscriber-based wireless devices • Microwave systems FEATURES • Surface-mount multilayer ceramic chip capacitors • Made with a combination of design, materials, and tight process control to achieve very high field reliability • US defense supply center approved • Federal stock control number CAGE CODE 2270A • Available with tin-lead terminations (min. 4 % lead) • Available with AgPd terminations for silver epoxy bonding • Excellent aging characteristic • Wet build process • Reliable Noble Metal Electrode (NME) system APPLICATIONS • Broadband wireless communication • Satellite communication • WiFi (802.11) and WiMax (802.16) • Subscriber-based wireless devices • Microwave systems Case Size TC and Dielectric 0402 BP Voltage [Min. V] [Max. V] [Min.] [Max.] 50 100 1.0 pF 27 pF 200 1.0 pF 3.3 nF BP 0805 BR Capacitance 10 220 nF 100 100 pF BX BP 1206 180 nF 16 200 1.0 pF BR 6.8 nF 560 nF 10 BX 11/18 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 100 820 pF 470 nF VMN-SG2120-1603 www.vishay.com V I S H AY I N T E R T E C H N O L O G Y, I N C . Multilayer Ceramic Chip Capacitors Series VJ....W1BC Basic Commodity Case Size Description FEATURES • Surface-mount multilayer ceramic chip capacitors • Ultra-stable dielectric C0G (NP0) • High capacitance per unit volume X5R/X7R/Y5V • 100 % matte tin terminations • Dry sheet technology process • Base Metal Electrode system (BME) APPLICATIONS • Consumer electronics • Telecommunications • Mobile applications • Data processing TC and Dielectric Voltage [Min. V] Capacitance [Max. V] 0402 0603 0805 C0G (NP0) 10 100 1206 47 nF 10 µF 0603 220 nF 22 µF 0805 X5R 6.3 50 1206 47 µF 1.5 µF 1210 4 0402 6.3 10 6.3 0402 6.3 Y5V 100 1.0 µF 150 pF 50 100 µF 16 0603 0201 10 10 µF 22 µF 50 High Q C0G (NP0) 47 µF 4.7 µF 10 nF 6.3 0402 22 µF 1.0 µF 100 1210 2.2 µF 10 µF 1.0 nF 10 1206 100 µF 220 µF 50 100 pF X7R 1210 0805 SELECTOR GUIDE 12 nF 0402 0603 FEATURES • Surface-mount multilayer ceramic chip capacitors • Ultra stable dielectric C0G (NP0) • High Q and low ESR at high frequency • 100 % matte tin terminations • Dry sheet technology process • Base Metal Electrode system (BME) APPLICATIONS • Mobile telecommunications • WLAN applications • RF modules • Tuner 3.3 nF 39 nF 1206 VJ....W1BC Ultra-High Q/ Low ESR, Basic Commodity 0.5 pF 1.5 pF 0805 FEATURES • Surface-mount multilayer ceramic chip capacitors • Ultra-stable dielectric C0G (NP0) • High Q and low ESR at high frequency • 100 % matte tin terminations • Dry sheet technology process • Base Metal Electrode system (BME) APPLICATIONS • Mobile telecommunications • WLAN applications • RF modules • Tuner [Max.] 1.0 nF 0603 VJ....W1BC High Q, Basic Commodity [Min.] 470 pF 0.5 pF 100 3.3 nF 25 33 pF 0.1 µF 0402 0603 UltraHigh Q C0G (NP0) 100 22 pF 50 47 pF 250 0805 12/18 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 0.3 pF 100 pF VMN-SG2120-1603 www.vishay.com V I S H AY I N T E R T E C H N O L O G Y, I N C . Multilayer Ceramic Chip Capacitors Case Size Series Description VJ0201...W1BC Ultra-Small Series, Basic Commodity FEATURES • Surface-mount multilayer ceramic chip capacitors • Ultra-small size • High capacitance per unit volume • 100 % matte tin terminations • Dry sheet technology process • Base Metal Electrode system (BME) APPLICATIONS • Microwave modules • Portable equipment (mobile phone, PDA) • RF modules VJ06C4...W1BC MLCC Chip Array, Basic Commodity SELECTOR GUIDE FEATURES • Surface-mount multilayer ceramic chip capacitors • 4 capacitors per unit • 100 % matte tin terminations • Dry sheet technology process • Base Metal Electrode system (BME) APPLICATIONS • Bypass for digital and analog singal lines • Computer motherboards and peripherals 0201 TC and Dielectric Voltage [Min. V] C0G (NP0) 16 X5R 6.3 Capacitance [Max. V] [Min.] [Max.] 0.5 pF 120 pF 50 2.2 µF 100 pF X7R C0G (NP0) 0612 10 10 nF 50 X7R 16 Y5V 50 10 pF 50 470 pF 180 pF 100 nF 13/18 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 10 nF VMN-SG2120-1603 www.vishay.com V I S H AY I N T E R T E C H N O L O G Y, I N C . Multilayer Ceramic Chip Capacitors PART NUMBERING / ORDERING INFORMATION VJ 0805 SERIES ID CASE CODE (5) Y 102 K X A A C 2L DIELECTRIC CAPACITANCE NOMINAL CODE TOLERANCE CODE (1) TERMINATION DC VOLTAGE RATING MARKING OPTION (2) PACKAGING PROCESS CODE (6) Expressed in picofarad (pF). The first two digits are significant, the third is a multiplier. An “R” indicates a decimal point. V = ± 0.05 pF B = ± 0.10 pF C = ± 0.25 pF D = ± 0.50 pF F=±1% G=±2% H=±3% J=±5% K = ± 10 % M = ± 20 % Z = - 20 %/+ 80 % X = Ni barrier 100 % matte tin plate finish Y = 6.3 VDC Q = 10 VDC J = 16 VDC X = 25 VDC Z = 35 VDC A = 50 VDC B = 100 VDC K = 150 VDC C = 200 VDC P = 250 VDC D = 300 VDC T = 400 VDC E = 500 VDC L = 630 VDC I = 800 VDC G = 1000 VDC R = 1500 VDC F = 2000 VDC O = 2500 VDC H = 3000 VDC W = 3600 VDC V = 4000 VDC M = 5000 VDC S = 7200 VDC S = 4 VDC only for VJ...W1BC series U = 250 VAC A = unmarked T = 7” reel / plastic tape 00, 54 = standard C = 7” reel / paper tape 31, 34, 31X, 34G = automotive VJ 0201 A= HV 0402 C0G (NP0) GA 0505 0603 06C4 Y = X7R (3) 0805 G = X5R 1111 1206 H = X8R 1210 1808 Q = high Q 1812 1825 2012 L= 2220 ultra-high Q, 2225 low ESR 2525 3640 Example: 0R3 = 0.3 pF 4R7 = 4.7 pF 102 = 1000 pF 473 = 47 000 pF B = polymer 100 % matte tin plate finish F, E = AgPd (4) L = Ni barrier tin / lead plate min. 4 % lead V = Y5V 2008 3040 (7) D = HIFREQ N= non-magnetic (7) C = copper barrier 100 % matte tin plate finish (non-magnetic) (7) 3838 4044 M = marking vendor ID + 2-character cap. code (size 0805 / 1206) O = 7” reel / flamed paper tape used for AgPd B = marking termination for automotive 0402 / 0603 / 0805 VJ....31 / VJ....31X J = 7” reel vendor ID + (low quantity) date code (size 0805 / E = 7” reel / 1206) plastic tape only used Q = marking automotive vendor ID VJ...31 / VJ...34 + tolerance + 3-character R= cap. code 11 1/4” / 13” reel / (size 0505 / plastic tape 1111 / 2525 / 3838) P= 11 1/4” / 13” reel / S = marking paper tape for safety caps I= 11 1/4” / 13” reel / flamed paper tape used for AgPd termination 0402 / 0603 / 0805 M= 11 1/4” / 13” reel / plastic tape only used automotive VJ...31 / VJ...34 4X, 5H = open mode HV = high voltage 5Z, 5ZL = HVArc Guard® X1, X2 = safety caps SE = Source Energy Capacitor (SEC) 8R = Controlled Discharge Capacitor (CDC) 2L, 2M, 2MP, 68, 5G = high-rel. W1BC = basic commodity W = waffle pack Notes (1) (2) (3) (4) (5) (6) (7) For details see individual datasheets Marking option is not available in process code W1BC Chip array size 0612 including 4 capacitors VJ06C4...W1BC, only Basic Commodity Series Termination code “E” for conductive epoxy assembly, contact [email protected] for availability Case size designator may be replaced by a four-digit drawing number Customer-specific process codes are also possible For non-magnetic termination, “C” is recommended for solder assembly, and “N” for conductive epoxy assembly SELECTOR GUIDE 14/18 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VMN-SG2120-1603 www.vishay.com V I S H AY I N T E R T E C H N O L O G Y, I N C . Multilayer Ceramic Chip Capacitors PART NUMBERING/ORDERING INFORMATION MILITARY PRODUCTS CDR31 MILITARY STYLE (1) BX 103 A K Z P A T DIELECTRIC CAPACITANCE DC VOLTAGE RATING TOLERANCE CODE TERMINATION FAILURE RATE MARKING OPTION PACKAGING BP BX Expressed in picofarad (pF). The first two digits are significant, the third is a multiplier. An “R” indicates a decimal point. Example: 4R7 = 4.7 pF 102 = 1000 pF A = 50 V B = 100 V C = ± 0.25 pF D = ± 0.50 pF F=±1% J=±5% K = ± 10 % M = ± 20 % M = Silver palladium M = 1.0 % P = 0.1 % R = 0.01 % S = 0.001 % A= Unmarked T = 7” reel / plastic tape CDR01 CDR02 CDR03 CDR04 CDR06 CDR31 CDR32 CDR33 CDR34 Y = Ni barrier 100 % tin plate matte finish W = Ni barrier 100 % tin plate matte finish Consult factory for failure rate status J = 7” reel (low qty.) C = 7” reel / paper tape R= 11 1/4” / 13” reel / plastic tape Z = Ni barrier 100 % tin/lead plate min. 4 % P= 11 1/4” / 13” reel / paper tape U = Ni barrier solder coated min. 4 % lead B = bulk Notes • For details of ratings, see individual datasheet PART NUMBERING/ORDERING INFORMATION DSCC PRODUCTS (1) 03028- BX 102 A K Z C J DSCC STYLE DIELECTRIC CAPACITANCE DC VOLTAGE RATING TOLERANCE CODE TERMINATION GROUP TESTING PACKAGING 03028030290500605007- BP BX BR Expressed in picofarad (pF). The first two digits are significant, the third is a multiplier. An “R” indicates a decimal point. Example: 4R7 = 4.7 pF 102 = 1000 pF X = 10 V Y = 16 V Z = 25 V A = 50 V B = 100 V C = 200 V C = ± 0.25 pF D = ± 0.50 pF F=±1% G=±2% J=±5% K = ± 10 % M = ± 20 % M = silver palladium C = Full group C L = 2000 h life test only M = 1000 h life test only H = Low-voltage humidity test only - = Group A test only T = 7” reel / plastic tape J = 7” reel (low qty.) C = 7” reel / paper tape O = 7” reel / flamed paper tape R = 11 1/4” / 13” reel / plastic tape P = 11 1/4” / 13” reel / paper tape I = 11 1/4” / 13” reel / flamed paper tape B = bulk Z = Ni barrier tin / lead plate min. 4 % lead U = Ni barrier solder coated min. 4 % lead Notes • For details of ratings, see individual datasheet SELECTOR GUIDE 15/18 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VMN-SG2120-1603 www.vishay.com V I S H AY I N T E R T E C H N O L O G Y, I N C . Multilayer Ceramic Chip Capacitors PART NUMBERING/ORDERING INFORMATION DSCC PRODUCTS 05001- (1) 4R7 A C Z C J DSCC STYLE CAPACITANCE DC VOLTAGE RATING TOLERANCE CODE TERMINATION GROUP TESTING PACKAGING 050010500205003- Expressed in picofarad (pF). The first two digits are significant, the third is a multiplier. An “R” indicates a decimal point. Example: 4R7 = 4.7 pF A = 50 V B = 100 V C = 200 V K = 250 V B = ± 0.10 pF C = ± 0.25 pF D = ± 0.50 pF F=±1% G=±2% J=±5% K = ± 10 % M = ± 20 % M = Silver palladium C = full group C L = 2000 h life test only M = 1000 h life test only H = low-voltage humidity test only - = group A test only T = 7” reel/plastic tape J = 7” reel/(low qty.) C = 7” reel/paper tape O = 7” reel/flamed paper tape R = 11 1/4”/13” reel/plastic tape P = 11 1/4”/13” reel/paper tape I = 11 1/4”/13” reel/ flamed paper tape B = Bulk Z = Ni barrier tin/lead plate min. 4 % lead Notes • For details of ratings, see individual datasheet • Contact [email protected] for availability PART NUMBERING / ORDERING INFORMATION MIL-PRF-123 M123A MILITARY STYLE MIL-PRF-123 10 BX B 103 K Z T SLASH SHEET DIELECTRIC DC VOLTAGE RATING CAPACITANCE TOLERANCE CODE TERMINATION PACKAGING BP BX B = 50 V C = 100 V Expressed in picofarad (pF). The first two digits are significant, the third is a multiplier. “R” denotes decimal place. Examples: 1R0 = 1.0 pF 103 = 10 000 pF 104 = 100 000 pF B = ± 0.10 pF C = ± 0.25 pF D = ± 0.50 pF F=±1% J=±5% K = ± 10 % M = ± 20 % For BP: B, C, D, J, K For BX: K, M Z = Ni barrier with tin / lead plate min. 4 % lead S = guarded termination Plastic tape: T = 7” reel R = 11 1/4” / 13” reel 10: 11: 12: 13: 21: 22: 23: CKS51 CKS52 CKS53 CKS54 CKS55 CKS56 CKS57 (0805) (1210) (1808) (2225) (1206) (1812) (1825) Low quantity: J = 7” reel Bulk packaging: B = bulk Notes • For details of ratings, see individual datasheet • Contact [email protected] for availability Notes (1) For details of ratings, see individual datasheet SELECTOR GUIDE 16/18 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VMN-SG2120-1603 www.vishay.com V I S H AY I N T E R T E C H N O L O G Y, I N C . Multilayer Ceramic Chip Capacitors Links and Promotional Information PRODUCT SHEETS RF Applications HiFREQ:............................................................................................................................................... www.vishay.com/doc?45071 QUAD HiFREQ:................................................................................................................................... www.vishay.com/doc?45221 COMMODITY APPLICATIONS: VJ....W1BC High Q:............................................................................................................................. www.vishay.com/doc?49751 VJ....W1BC Ultra-High Q/Low ESR:.................................................................................................... www.vishay.com/doc?49022 VJ0201....W1BC:................................................................................................................................. www.vishay.com/doc?49706 VJ06C4....W1BC Chip Array:.............................................................................................................. www.vishay.com/doc?49714 HIGH-VOLTAGE APPLICATIONS: HVArc Guard®:..................................................................................................................................... www.vishay.com/doc?49667 BOARDFLEX SENSITIVE APPLICATIONS: VJ OMD Series:................................................................................................................................... www.vishay.com/doc?49614 AUTOMOTIVE APPLICATIONS: Automotive Instructional Guide:.......................................................................................................... www.vishay.com/doc?49794 TECH NOTES VISHAY BASIC COMMODITY SERIES: Test procedures and requirements:..................................................................................................... www.vishay.com/doc?28545 Soldering and footprint:....................................................................................................................... www.vishay.com/doc?45017 VISHAY VITRAMON: End Terminations:................................................................................................................................ www.vishay.com/doc?45063 Soldering recommendations:.............................................................................................................. www.vishay.com/doc?45034 LEAD (PB)-FREE INFORMATION How to get lead (Pb)-free:.................................................................................................................www.vishay.com/how/leadfree Capacitor lead (Pb)-free matrix:.......................................................................................................... www.vishay.com/doc?49322 SELECTOR GUIDE 17/18 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VMN-SG2120-1603 www.vishay.com V I S H AY I N T E R T E C H N O L O G Y, I N C . Multilayer Ceramic Chip Capacitors SEMICONDUCTORS PASSIVE COMPONENTS MOSFETs Segment Resistors and Inductors Segment MOSFETs Low-Voltage TrenchFET® Power MOSFETs Medium-Voltage Power MOSFETs High-Voltage Planar MOSFETs High-Voltage Superjunction MOSFETs Automotive-Grade MOSFETs ICs Power Management and Power Control ICs Smart Load Switches Analog Switches and Multiplexers Film Resistors Metal Film Resistors Thin Film Resistors Thick Film Resistors Power Thick Film Resistors Metal Oxide Film Resistors Carbon Film Resistors Wirewound Resistors Vitreous, Cemented, and Housed Resistors Braking and Neutral Grounding Resistors Custom Load Banks Power Metal Strip® Resistors Battery Management Shunts Crowbar and Steel Blade Resistors Thermo Fuses Chip Fuses Pyrotechnic Initiators/Igniters Variable Resistors Cermet Variable Resistors Wirewound Variable Resistors Conductive Plastic Variable Resistors Contactless Potentiometers Hall Effect Position Sensors Precision Magnetic Encoders Networks/Arrays Non-Linear Resistors NTC Thermistors PTC Thermistors Varistors Magnetics Inductors Wireless Charging Coils Transformers Connectors Diodes Segment Rectifiers Schottky Rectifiers Ultrafast Recovery Rectifiers Standard and Fast Recovery Rectifiers High-Power Rectifiers/Diodes Bridge Rectifiers Small-Signal Diodes Schottky and Switching Diodes Zener Diodes Tuner/Capacitance Diodes Bandswitching Diodes RF PIN Diodes Protection Diodes TVS Diodes or TRANSZORB® (unidirectional, bidirectional) ESD Protection Diodes (including arrays) Thyristors/SCRs Phase-Control Thyristors Fast Thyristors IGBTs Power Modules Input Modules (diodes and thyristors) Output and Switching Modules (contain MOSFETs, IGBTs, and diodes) Custom Modules Optoelectronic Components Segment Infrared Emitters and Detectors Optical Sensors Infrared Remote Control Receivers Optocouplers Phototransistor, Photodarlington Linear Phototriac High-Speed IGBT and MOSFET Driver Solid-State Relays LEDs and 7-Segment Displays Infrared Data Transceiver Modules Custom Products SELECTOR GUIDE Capacitors Segment Tantalum Capacitors Molded Chip Tantalum Capacitors Molded Chip Polymer Tantalum Capacitors Coated Chip Tantalum Capacitors Solid Through-Hole Tantalum Capacitors Wet Tantalum Capacitors Ceramic Capacitors Multilayer Chip Capacitors Multilayer Chip RF Capacitors Disc Capacitors Film Capacitors Power Capacitors Heavy-Current Capacitors Aluminum Capacitors ENYCAP™ Energy Storage Capacitors 18/18 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VMN-SG2120-1603 www.vishay.com