SIDACtor ® Protection Thyristors Broadband Optimized™ Protection SDP TwinChip™ Series - 3x3 QFN Pb e3 RoHS Description The SDP TwinChip™ Series provides overvoltage protection on the secondary side of the coupling transformer used in xDSL driver circuits. This SDP0242Q12F provides a fast switching, robust, solution that is referenced to neither ground nor power. This prevents the surge events from the being dumped into these rails. The integrated TwinChip™ design reduces any negative solid-state effects on the broadband signals. Features & Benefits Agency Approvals Agency • Differential protection • Low insertion loss Agency File Number • 80A 8/20µs surge rating • Low E133083 • Low profile • Small 3x3mm footprint Pinout Designation Not Applicable • Designed for 16-24 V line drivers • 2nd level interconnect is Pb-free per IPC/JEDEC J-STD-609A.01 Applicable Global Standards Schematic Symbol • TIA-968-A • GR 1089 Intra-building • TIA-968-B • IEC 61000-4-5 • ITU K.20/21 Enhanced Level • YD/T 1082 • ITU K.20/21 Basic Level • YD/T 993 • YD/T 950 • GR 1089 Inter-building Electrical Characteristics Part Number SDP0242Q12FLRP Marking DP24F VDRM @ldrm=5µA VS @100V/µs V min V max 16 43 IH IS mA min mA max 30 800 IT VT @IT=2.2 amps A max V max pF min pF max 2.2 8 10 15 @1MHz, 2V bias Notes: - Absolute maximum ratings measured at TA= 25ºC (unless otherwise noted). - Devices are bi-directional (unless otherwise noted). © 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 08/07/14 1 SDP Twin Chip Series SIDACtor ® Protection Thyristors Broadband Optimized™ Protection Surge Ratings IPP Series F ITSM 2x10µs 1.2x50µs/8x20µs 10x700/5x310µs 10x1000µs 50 / 60 Hz A min A min A min A min A min 100 80 37.5 30 15 Notes: - Peak pulse current rating (IPP) is repetitive and guaranteed for the life of the product. - IPP ratings applicable over temperature range of -40ºC to +85ºC - The device must initially be in thermal equilibrium with -40°C < TJ < +150°C Thermal Considerations Package Symbol Parameter Value Unit 3x3 QFN TJ Junction Temperature -40 to +150 °C TSTG Storage Temperature Range -65 to +150 °C R0JA Thermal Resistance: Junction to Ambient 100 °C/W V-I Characteristics Capacitance and Bias Voltage 30 +I 25 Capacitance (pF) IT IS IH IDRM -V +V VT 20 15 10 VDRM VS 5 0 0.1 1 10 100 Bias Voltage (V) -I Normalized DC Holding Current vs. Case Temperature 2.0 12 1.8 10 IH 8 6 25 °C 4 IH (TC = 25ºC) 14 Ratio of Percent of VS Change – % Normalized VS Change vs. Junction Temperature 2 0 -4 -6 1.6 1.4 1.0 0.8 0.6 0.4 -8 -40 -20 0 -40 20 40 60 80 100 120 140 160 -20 0 20 40 60 80 100 120 140 160 Case Temperature (TC) - ºC Junction Temperature (TJ) – °C © 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 08/11/14 25°C 1.2 SDP Twin Chip Series SIDACtor ® Protection Thyristors Broadband Optimized™ Protection Soldering Parameters Pb-Free assembly (see Fig. 1) +150°C +200°C 60-180 secs. - Temperature Min (Ts(min)) Pre Heat - Temperature Max (Ts(max)) - Time (Min to Max) (ts) Average ramp up rate (Liquidus Temp (TL) to peak) 3°C/sec. Max. TS(max) to TL - Ramp-up Rate 3°C/sec. Max. Reflow - Temperature (TL) (Liquidus) +217°C - Temperature (tL) 60-150 secs. Peak Temp (TP) +260(+0/-5)°C Time within 5°C of actual Peak Temp (tp) 30 secs. Max. Ramp-down Rate 6°C/sec. Max. Time 25°C to Peak Temp (TP) 8 min. Max. Do not exceed +260°C Figure 1 TP tP Critical Zone TL to TP Ramp-up Temperature Reflow Condition TL TS(max) tL Ramp-down Preheat TS(min) tS 25 time to peak temperature (t 25ºC to peak) Time Environmental Specifications Physical Specifications Lead Material Copper Alloy Terminal Finish 100% Matte-Tin Plated Body Material UL recognized epoxy meeting flammability classification 94V-0 High Temp Voltage Blocking 80% Rated VDRM (VAC Peak ) +125°C or +150°C, 504 or 1008 hrs. MIL-STD-750 (Method 1040) JEDEC, JESD22-A-101 Temp Cycling -65°C to +150°C, 15 min. dwell, 10 up to 100 cycles. MIL-STD-750 (Method 1051) EIA/JEDEC, JESD22-A104 Biased Temp & Humidity 52 VDC (+85°C) 85%RH, 504 up to 1008 hrs. EIA/ JEDEC, JESD22-A-101 High Temp Storage +150°C 1008 hrs. MIL-STD-750 (Method 1031) JEDEC, JESD22-A-101 Low Temp Storage -65°C, 1008 hrs. Thermal Shock 0°C to +100°C, 5 min. dwell, 10 sec. transfer, 10 cycles. MIL-STD-750 (Method 1056) JEDEC, JESD22-A-106 Resistance to Solder Heat +260°C, 30 secs. MIL-STD-750 (Method 2031) Moisture Sensitivity Level 85%RH, +85°C, 168 hrs., 3 reflow cycles (+260°C Peak). JEDEC-J-STD-020, Level 1 Dimensions — 3x3 QFN TOP VIEW BOTTOM VIEW A C J E B Recommended solder pad layout (Reference Only) Dimensions A B C E F H J K1 K2 M1 M2 N1 N2 1.27mm 0.050” F 1.50mm 0.059” END VIEW SIDE VIEW H N2 N1 K1 K2 M1 © 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 08/07/14 2.54mm 0.100” M2 3 Inches Millimeters Min Max Min Max 0.114 0.114 0.077 0.013 0.078 0.037 0.002 0.006 0.006 0.028 0.013 0.097 0.084 0.122 0.122 0.081 0.017 0.082 0.041 0.006 0.001 0.001 0.031 0.017 0.101 0.088 2.900 2.900 1.950 0.335 1.980 0.950 0.050 0.150 0.150 0.700 0.330 2.470 2.130 3.100 3.100 2.050 0.435 2.080 1.050 0.150 0.250 0.250 0.800 0.430 2.570 2.230 SDP Twin Chip Series SIDACtor ® Protection Thyristors Broadband Optimized™ Protection Part Numbering Part Marking SDP xxx 2 Q12 F L RP Terminals on Back REEL PACK RoHS COMPLIANT TYPE SIDACtor DSL Protector MEDIAN VOLTAGE IPP RATING CONSTRUCTION VARIABLE PACKAGE TYPE DP24F XXXXX Part Marking Code (Refer to Electrical Characteristics Table) Date code Packing Options Package Type Q12 Description Quantity Added Suffix Industry Standard 3x3 QFN Tape and Reel 5000 RP EIA-481-D Tape and Reel dimensions Tape and Reel Specifications — 3x3 QFN Symbols C A D A B C D N W1 A0 B0 D0 D1 E1 E2 N W1 B Reel Dimension D0 P0 P2 T D1 CARRIER TAPE B0 W0 K0 P1 F E1 E2 W F A1 COVER TAPE K0 P0 P1 Tape Dimension Items CARRIER TAPE END P2 COVER TAPE T START W TRAILER 160mm MIN W0 LEADER 400mm MIN Description Inches Millimeters Min Max Min Reel Diameter N/A 12.992 N/A Drive Spoke Width 0.059 N/A 1.50 Arbor Hole Diameter 0.504 0.531 12.80 Drive Spoke Diameter 0.795 N/A 20.20 Hub Diameter 1.969 N/A 50.00 Reel Inner Width at Hub 0.488 0.567 12.40 Pocket Width at Bottom 0.126 0.134 3.20 Pocket Length at Bottom 0.126 0.134 3.20 Feed Hole Diameter 0.059 0.063 1.50 Pocket Hole Diameter 0.059 N/A 1.50 Feed Hole Position 1 0.065 0.073 1.65 Feed Hole Position 2 0.400 0.408 10.15 Feed Hole Center 0.215 0.219 5.45 Pocket Hole Center 2 Pocket Depth 0.039 0.051 1.00 Feed Hole Pitch 0.153 0.161 3.90 Component Spacing 0.311 0.319 7.90 Feed Hole Center 0.077 0.081 1.90 Pocket Hole Center 1 Carrier Tape Thickness 0.010 0.014 0.25 Embossed Carrier 0.453 0.484 11.50 Tape Width Cover Tape Width 0.358 0.366 9.10 Max 330.0 N/A 13.50 N/A N/A 14.40 3.40 3.40 1.60 N/A 1.85 10.35 5.55 1.30 4.10 8.10 2.06 0.35 12.30 9.30 Leader and Trailer dimension of the tape © 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 08/07/14 4 SDP Twin Chip Series