TVS Diode Arrays (SPA® Diodes) Ultra Low Capacitance Discrete TVS Series Ultra Low Capacitance Discrete TVS Series RoHS Pb GREEN ELV The Ultra Low Capacitance Discrete TVS series provides unidirectional and bidirectional ESD protection for the world’s most challenging high speed serial interfaces. Ultra low capacitance permits excellent signal integrity on the most challenging consumer electronics interfaces, such as USB 3.1, HDMI 2.0, DisplayPort, and V-by-One®. Providing in excess of 20kV contact ESD protection (IEC61000-4-2) while maintaining extremely low leakage and dynamic resistance, offered in the industry’s most popular footprints (0402 and 0201), the series sets higher standards for signal integrity and usability. Pinout Features • 0.25pF MAX unidirectional • Facilitates excellent signal integrity • ESD, IEC61000-4-2, • ELV Compliant • 0.13pF MAX bidirectional 0402 DFN 0201DFN 1 1 ±20kV contact, ±20kV air • Low clamping voltage of 10V @ IPP=2A (Bidirectional) (tP=8/20μs) 2 • Low profile 0201 and 0402 DFN packages 2 Applications Bottom View Functional Block Diagram • Ultra-high speed data lines • C onsumer, mobile and portable electronics • USB 3.1, 3.0, 2.0 • Tablet PC and external storage with high speed interfaces • HDMI 2.0, 1.4a, 1.3 1 • Halogen free, Lead free and RoHS compliant 1 • DisplayPort(TM) • Thunderbolt (Light Peak) • V-by-One® • Applications requiring high ESD performance in small packages • LVDS interfaces 2 Unidirectional 2 Bidirectional ©2016 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 05/12/16 SP1013 Description TVS Diode Arrays (SPA® Diodes) Ultra Low Capacitance Discrete TVS Series Thermal Information Absolute Maximum Ratings Symbol Parameter Value Parameter Rating Units -55 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) 260 °C Units IPP Peak Current (tp=8/20μs) TOP Operating Temperature -30 to 85 °C TSTOR Storage Temperature -55 to 150 °C 2.0 A Storage Temperature Range CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Unidirectional Electrical Characteristics - (TOP=25°C) Typ Max Units Input Capacitance Parameter @ VR = 0V, f = 3GHz Test Conditions Min 0.20 0.25 pF Breakdown Voltage VBR @ IT=1mA 9.00 V Reverse Working Voltage Reverse Leakage Current IL @ VRWM=5.0V 25 Clamping Voltage VCL @ IPP=2.0A 9.20 ESD Withstand Voltage IEC61000-4-2 (Contact) ±20 IEC61000-4-2 (Air) ±20 7.0 V 50 nA V kV Bidirectional Electrical Characteristics - (TOP=25°C) Parameter Test Conditions Min Typ Max Units 0.13 pF Input Capacitance @ VR = 0V, f = 3GHz 0.10 Breakdown Voltage VBR @ IT=1mA 9.80 Reverse Working Voltage -7.0 Reverse Leakage Current IL @ VRWM=5.0V 25 Clamping Voltage VCL @ IPP=2.0A 10.0 ESD Withstand Voltage IEC61000-4-2 (Contact) ±20 IEC61000-4-2 (Air) ±20 0 -5.0 S21 Insertion Loss (dB) S21 Insertion Loss (dB) 0 -5.0 -10.0 -15.0 -20.0 -25.0 -30.0 V 50 nA V kV -10.0 -15.0 -20.0 -25.0 -30.0 1.E+07 1.E+08 Frequency (Hz) ©2016 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 05/12/16 7.0 Insertion Loss Diagram - Bidirectional Insertion Loss Diagram - Unidirectional 1.E+06 V 1.E+09 1.E+10 1.E+06 1.E+07 1.E+08 1.E+09 1.E+10 Frequency (Hz) Ultra Low Capactance Discrete TVS series TVS Diode Arrays (SPA® Diodes) Ultra Low Capacitance Discrete TVS Series 1.0 1.0 0.8 0.8 0.6 0.6 0.4 0.4 0.2 0.2 0.0 -0.2 -0.4 SP1013 Device IV Curve - Bidirectional Current (mA) Current (mA) Device IV Curve - Unidirectional 0.0 -0.2 -0.4 -0.6 -0.6 -0.8 -0.8 -1.0 -1.0 -2 -1 0 1 2 3 4 5 6 7 8 9 -10 10 -8 -6 -4 Voltage (V) -2 0 2 4 6 8 10 Voltage (V) USB3.0 Eye Diagram 5.0 Gb/s, 1000mV differential, CPO Compliant Test Pattern Without Device With Device Soldering Parameters - Temperature Min (Ts(min)) Pre Heat Pb – Free assembly - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 25 tS time to peak temperature Peak Temperature (TP) 260 Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Lead Plating Pre-Plated Frame Ramp-down Rate 6°C/second max Lead Material Copper Alloy Time 25°C to peak Temperature (TP) 8 minutes Max. Lead Coplanarity 0.004 inches(0.102mm) Do not exceed 260°C Substrate material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 +0/-5 °C tP TP 150°C Temperature Reflow Condition Time Product Characteristics of 0402 DFN Package Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. ©2016 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 05/12/16 TVS Diode Arrays (SPA® Diodes) Ultra Low Capacitance Discrete TVS Series Package Dimensions — 0201 DFN Symbol SIDE VIEW TOP VIEW Min Max A 0.23 0.33 0.009 0.013 0.00 0.05 0.000 0.002 A3 SOLDERING PATTERN Inches Max A1 b SIDE VIEW Millimeters Min 0.100 ref. 0.2 0.004 ref. 0.3 0.008 0.012 D 0.55 0.65 0.022 0.026 E 0.25 0.35 0.010 0.014 e 0.35-0.40 BSC L1 0.12 0.23 0.005 0.014-0.016 BSC 0.009 L2 0.12 0.24 0.005 0.009 K 0.17 BSC 0.007 BSC M 0.32 0.013 N 0.24 0.009 P 0.14 0.006 BOTTOM VIEW Package Dimensions — 0402 DFN Symbol Millimeters Min Typ Max Min Typ Max A 0.33 - 0.55 0.013 - 0.022 A1 0 - 0.05 0.000 - 0.002 A3 TOP VIEW END VIEW-1 TOP VIEW END VIEW-2 b D END VIEW-2 END VIEW-1 E 0.13REF L 0.25 0.30 0.008 0.010 0.012 0.95 1.00 1.05 0.037 0.039 0.041 0.60 0.65 0.022 0.024 0.026 0.55 BOTTOM VIEW-2 BOTTOM VIEW-1 ©2016 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 05/12/16 0.65BSC 0.45 0.50 0.026BSC 0.55 SIDE VIEW-2 SIDE VIEW-1 BOTTOM VIEW-1 0.005REF 0.20 e SIDE VIEW-1 Inches SIDE VIEW-2 SOLDERING PATTERN BOTTOM VIEW-2 SOLDERING PATTERN 0.018 0.020 0.022 TVS Diode Arrays (SPA® Diodes) Ultra Low Capacitance Discrete TVS Series Part Numbering System Part Marking System SP xxxx X – ULC – 01 X T G TVS Diode Arrays (SPA® Diodes) C G= Green C C C T= Tape & Reel Size 0201 0402 Unidirectional Directional U: Unidirectional B: Bidirectional Bidirectional SP1013 Package U: 0201 DFN E: 0402 DFN Number of Channels Ultra LC Ordering Information Part Number Package Marking Reel Quantity SP0201U-ULC-01UTG 0201 DFN I C 15000 SP0201B-ULC-01UTG 0201 DFN C 15000 SP0402U-ULC-01ETG 0402 DFN I C 10000 SP0402B-ULC-01ETG 0402 DFN C 10000 Embossed Carrier Tape & Reel Specification — 0201 DFN P1 D0 P2 P0 E1 F W D1 T A0 K0 Symbol Millimeters A0 0.33 min/0.41 max B0 0.63 min/0.71 max D0 ø 1.50 +0.10/ -0 D1 ø 0.20 +/- 0.05 E1 1.75+/-0.10 F 3.50+/-0.05 K0 0.30 min/0.39 max P0 4.00+/-0.10 P1 2.00+/-0.10 P2 2.00+/-0.05 W 8.00+0.30/-0.10 T 0.13 min/0.25 max B0 Embossed Carrier Tape & Reel Specification — 0402 DFN P1 P2 P0 D0 E1 F W D1 T A0 K0 Symbol Millimeters A0 0.70+/-0.05 B0 1.15+/-0.05 D0 ø 1.50+/-0.10 D1 ø 0.40 +/-0.10 E1 1.75+/-0.10 F 3.50+/-0.10 K0 0.55+/-0.05 P0 4.00+/-0.10 P1 2.00+/-0.10 P2 2.00+/-0.05 W 8.00+0.30/-0.10 T 0.20+/-0.05 B0 ©2016 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 05/12/16