TVS Diode Arrays (SPA® Diodes) Enhanced ESD Diode Arrays Series Enhanced ESD Diode Arrays Series RoHS Pb GREEN ELV The Enhanced ESD Diode Arrays Series provides higher order ESD protection in signal-integrity-preserving unidirectional arrays for the world’s most challenging high speed serial interfaces. the SOD-883 standard packages minimizes trace layout complexity, saves significant PCB space, and improves reusability of the footprints. The nominal capacitance makes the devices applicable to the worlds’ fastest consumer serial interfaces. Pinout 1 2 3.G 4 5 10 9 8.G 7 6 1 ±22kV contact, ±22kV air • Low clamping voltage of 13V @ IPP=2.2A (tP=8/20μs) Functional Block Diagram 4 5 • ELV Compliant • Halogen free, Lead free and RoHS compliant Applications 1 2 • Ultra-high speed data lines • C onsumer, mobile and portable electronics • USB 3.1, 3.0, 2.0 • Tablet PC and external storage with high speed interfaces • HDMI 2.0, 1.4a, 1.3 • DisplayPort(TM) • V-by-One® • Thunderbolt (Light Peak) G, 3, 8 • Facilitates excellent signal integrity • Low profile 0402 DFN array packages Bottom View 2 • 0.30pF TYP capacitance • ESD, IEC61000-4-2, 2 3 1 Features • Applications requiring high ESD performance in small packages 3 ©2016 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 05/12/16 SP1013 Description TVS Diode Arrays (SPA® Diodes) Enhanced ESD Diode Arrays Series Absolute Maximum Ratings Symbol Thermal Information Parameter Rating Units -55 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) 260 °C Parameter Value Units IPP Peak Current (tp=8/20μs) 2.2 A Storage Temperature Range TOP Operating Temperature -30 to 85 °C TSTOR Storage Temperature °C -55 to 150 CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics - (TOP=25°C) Parameter Test Conditions Min Typ Max Units Input Capacitance @ VR = 0V, f = 3GHz 0.30 pF Breakdown Voltage VBR @ IT=1mA 8.80 V Reverse Leakage Current IL @ VRWM=5.0V 25 nA Clamping Voltage VCL @ IPP=2.2A 13.0 V Reverse Working Voltage 7.0 ESD Withstand Voltage IEC61000-4-2 (Contact) ±22 IEC61000-4-2 (Air) ±22 Insertion Loss Diagram V kV Device IV Curve 1.0 0 0.8 0.6 0.4 -10.0 0.2 Current (mA) S21 Insertion Loss (dB) -5.0 -15.0 -20.0 0.0 -0.2 -0.4 -0.6 -25.0 -0.8 -1.0 -30.0 1.E+06 1.E+07 1.E+08 Frequency (Hz) ©2016 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 05/12/16 1.E+09 1.E+10 -2 -1 0 1 2 3 4 5 Voltage (V) 6 7 8 9 10 TVS Diode Arrays (SPA® Diodes) Enhanced ESD Diode Arrays Series USB3.0 Eye Diagram SP1013 5.0 Gb/s, 1000mV differential, CPO Compliant Test Pattern Without Device With Device Soldering Parameters Pre Heat Pb – Free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds tP TP Temperature Reflow Condition Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 25 tS time to peak temperature Time Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Lead Plating Pre-Plated Frame Ramp-down Rate 6°C/second max Lead Material Copper Alloy Time 25°C to peak Temperature (TP) 8 minutes Max. Lead Coplanarity 0.004 inches(0.102mm) Do not exceed 260°C Substrate material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Product Characteristics Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Part Numbering System Part Marking System SP 0402 U – ELC – 02 E T G TVS Diode Arrays (SPA® Diodes) G= Green D T= Tape & Reel Size 0402 Directional U: Unidirectional Surge 4D Package E: 0402 DFN 0402 Number of Channels Ordering Information Part Number Package Marking Reel Quantity SP0402U-ELC-02ETG 0402 DFN Array I D 10000 ©2016 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 05/12/16 TVS Diode Arrays (SPA® Diodes) Enhanced ESD TOPDiode VIEW Arrays Series END VIEW-1 Package Dimensions — 0402 DFN Array SIDE VIEW-1 SIDE VIEW-2 Symbol Millimeters Min END VIEW-1 END VIEW-2 BOTTOM VIEW-1 Min Typ Max 0.33 - 0.55 0.013 0.015 0.022 0 - 0.05 0 - 0.002 0.13REF 0.25 0.005REF b 0.20 0.30 0.008 b’ 0.20 BOTTOM 0.30 VIEW-2 0.40 D 0.95 E 0.55 0.010 0.012 0.008 0.012 0.016 1.00 1.05 0.037 0.039 0.041 0.60 0.65 0.022 0.024 0.026 0.65BSC e’ SIDE VIEW-2 Inches Max A e SIDE VIEW-1 Typ A1 A3 TOP VIEW END VIEW-2 0.026BSC 0.675BSC 0.027BSC L 0.40 0.50 0.60 0.016 0.020 0.024 L1 0.10 0.15 0.20 0.004 0.006 0.008 SOLDERING PATTERN BOTTOM VIEW-2 BOTTOM VIEW-1 Embossed Carrier Tape & Reel Specification — 0402 DFN Array P1 P2 SOLDERING PATTERN P0 D0 E1 F W D1 T A0 K0 ©2016 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 05/12/16 B0 Symbol Millimeters A0 0.70+/-0.05 B0 1.15+/-0.05 D0 ø 1.50+/-0.10 D1 ø 0.40 +/-0.10 E1 1.75+/-0.10 F 3.50+/-0.10 K0 0.55+/-0.05 P0 4.00+/-0.10 P1 2.00+/-0.10 P2 2.00+/-0.05 W 8.00+0.30/-0.10 T 0.20+/-0.05