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TSL250RD,TSL251RD,
TSL260RD, TSL261RD
Light-to-Voltage Optical Sensors
General Description
The TSL250RD, TSL251RD, TSL260RD, and TSL261RD are
light-to-voltage optical sensors, each combining a photodiode
and a transimpedance amplifier on a single monolithic IC. The
TSL250RD and TSL260RD have an equivalent feedback
resistance of 16 MΩ and a photodiode measuring 1 square mm.
The TSL251RD and TSL261RD have an equivalent feedback
resistance of 8 MΩ and a photodiode measuring 0.5 square mm.
Output voltage is directly proportional to the light intensity
(irradiance) on the photodiode. These devices have improved
amplifier offset-voltage stability and low power consumption.
Ordering Information and Content Guide appear at end of
datasheet.
Key Benefits & Features
The benefits and features of TSL250RD, TSL251RD, TSL260RD,
and TSL261RD Light-to-Voltage Optical Sensors, are listed
below:
Figure 1:
Added Value of Using TSL250RD / TSL251RD / TSL260RD / TSL261RD
Benefits
Features
• Enables Extremely Fast Response to
Change
• Single Photo-Diode and Transimpedance Architecture
• Enables Fast Response to Visible Light in
Range of 400nm to 700nm Wavelengths
• Output Rise-Time Response, Typically
• 260μs (TSL250RD, TSL260RD)
• 70μs (TSL251RD, TSL261RD)
• High Irradiance Responsivity, Typically
• Provides for High Sensitivity to Detect a
Small Change in Light
• Reduces Board Space Requirements
while Simplifying Designs
• 64mV/(μW/cm2) @ λp = 640nm (TSL250RD)
• 58mV/(μW/cm2) @ λp = 940nm (TSL260RD)
• 5mm x 6.2mm SOIC (D) Package
• Monolithic Silicon IC Containing Photodiode, Operational
Amplifier, and Feedback Components
• Converts Light Intensity to a Voltage
• Single Voltage Supply Operation
• Low Dark (Offset) Voltage (10mV Max)
• Low Supply Current (1.1mA Typical)
ams Datasheet
[v1-00] 2016-Jun-07
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TSL250RD, TSL251RD, TSL260RD, TSL261RD − General Description
• Wide Supply-Voltage Range (2.7V to 5.5V)
• Low-Profile Surface-Mount Package:
• Clear Plastic for TSL250RD and TSL251RD
• Visible Light-Cutoff Filter Plastic for TSL260RD and
TSL261RD
• Lead (Pb) Free and RoHS Compliant Package
Functional Block Diagram
The functional blocks of this device are shown below:
Figure 2:
TSL250RD, TSL251RD, TSL260RD, and TSL261RD
ï
+
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Voltage
Output
ams Datasheet
[v1-00] 2016-Jun-07
TSL250RD, TSL251RD, TSL260RD, TSL261RD − Pin Assignments
Pin Assignments
The TSL250RD, TSL251RD, TSL260RD, and TSL261RD pin
assignments are described below:
Figure 3:
Pin Diagram of Package D 8-Lead SOIC (Top View)
NC 1
8 NC
NC 2
7 OUT
NC 3
6 VDD
GND 4
5 NC
Figure 4:
Terminal Functions
Terminal
Description
ams Datasheet
[v1-00] 2016-Jun-07
Name
No.
GND
4
Ground (substrate)
All voltages are referenced to GND.
VDD
6
Supply voltage
OUT
7
Output voltage
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TSL250RD, TSL251RD, TSL260RD, TSL261RD − Absolute Maximum Ratings
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. These are stress
ratings only. Functional operation of the device at these or any
other conditions beyond those indicated under Recommended
Operating Conditions is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute Maximum Ratings
Figure 5:
Absolute Maximum Ratings over Operating Free-Air Temperature Range (unless otherwise noted)
Symbol
VDD
IO
Parameter
Min
Supply voltage (1)
Output Current
Duration of short-circuit current at (or below) 25°C (2)
TA
TSTRG
Max
Unit
6
V
±10
mA
5
s
Operating free-air temperature range
-25
85
°C
Storage temperature range
-25
85
°C
260
°C
Solder conditions in accordance with JEDEC J-STD-020A,
maximum temperature (3)
Note(s):
1. All voltages are with respect to GND.
2. Output may be shorted to supply.
3. The device may be hand soldered provided that heat is applied only to the solder pad and no contact is made between the tip of
the solder iron and the device lead. The maximum time heat should be applied to the device is 5 seconds.
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ams Datasheet
[v1-00] 2016-Jun-07
T S L 2 5 0 R D, T S L 2 5 1 R D, T S L 2 6 0 R D, T S L 2 6 1 R D − Electrical Characteristics
All limits are guaranteed. The parameters with min and max values are guaranteed with production tests or
SQC (Statistical Quality Control) methods.
Electrical Characteristics
Figure 6:
Recommended Operating Conditions
Symbol
Parameter
VDD
Min
Supply voltage
TA
Operating free-air temperature
Nom
Max
Unit
2.7
5.5
V
0
70
°C
Figure 7:
Electrical Characteristics, VDD = 5V, TA = 25°C, RL=10kΩ (unless otherwise noted) (1) (2) (3) (4)
λp = 640nm
Symbol
VD
VOM
Parameter
Test Conditions
TSL260RD
Unit
TSL261RD
Typ
Max
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
10
0
5
10
0
5
10
0
5
10
3
3.3
3
3.3
3
3.3
1.5
2
1
2
Ee = 0
0
5
Maximum output
voltage
VDD = 4.5V
3
3.3
1.5
2
Ee = 124 μW/‘
TSL251RD
Min
Dark voltage
Ee = 31 μW/cm2
VO
TSL250RD
λp = 940nm
V
2.5
2.5
Output voltage
V
Ee = 34 μW/cm2
Ee = 132 μW/cm2
ams Datasheet
[v1-00] 2016-Jun-07
mV
3
1
2
3
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T S L 2 5 0 R D , T S L 2 5 1 R D , T S L 2 6 0 R D , T S L 2 6 1 R D − Electrical Characteristics
λp = 640nm
Symbol
Parameter
Test Conditions
TSL250RD
Min
Re
Irradiance
responsivity
Temperature
coefficient of
output voltage
(VO)
Typ
Max
TSL251RD
Min
Typ
Max
TSL260RD
Min
Typ
Max
TSL261RD
Min
Typ
Unit
Max
64
16
58
15
mV/
(μW/cm2)
2
2
8
8
mV/°C
TA = 0°C to 70°C, (5)
0.1
0.1
0.4
0.4
%/°C
Ee = 31 μW/cm2
1.1
See note (4)
VO = 2V @ 25°C
1.7
Ee = 124 μW/cm2
IDD
λp = 940nm
1.1
1.7
Supply current
mA
Ee = 34 μW/cm2
Ee = 132 μW/cm2
1.1
1.7
1.1
1.7
Note(s):
1. Measurements are made with RL = 10kΩ between output and ground.
2. Optical measurements are made using small-angle incident radiation from an LED optical source.
3. The 640nm input irradiance Ee is supplied by an AlInGaP LED with peak wavelength λ p = 640nm.
4. The 940nm input irradiance Ee is supplied by a GaAs LED with peak wavelength λp = 940nm.
5. Irradiance responsivity is characterized over the range V O = V D to 3V. The best-fit straight line of Output Voltage V O versus irradiance Ee over this range will typically have a positive extrapolated V O
value for Ee = 0.
6. The temperature coefficient of output voltage measurement is made by adjusting irradiance such that V O is approximately 2V at 25°C and then with irradiance held constant, measuring VO while
varying the temperature between 0°C and 70°C.
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ams Datasheet
[v1-00] 2016-Jun-07
T S L 2 5 0 R D, T S L 2 5 1 R D, T S L 2 6 0 R D, T S L 2 6 1 R D − Electrical Characteristics
Figure 8:
Dynamic Characteristics, VDD = 5V, TA = 25°C, RL=10kΩ (unless otherwise noted) (see Figure 9)
λp = 640nm
Symbol
Parameter
Test Conditions
TSL250RD
Min
Typ
Max
λp = 940nm
TSL251RD
Min
Typ
Max
TSL260RD
Min
Typ
Max
TSL261RD
Min
Typ
Unit
Max
tr
Output pulse rise
time
VO(peak) = 2V
260
70
260
70
μs
tr
Output pulse fall
time
VO(peak) = 2V
260
70
260
70
μs
Vn
Output noise
voltage
Ee = 0
f = 1000Hz
0.8
0.7
0.8
0.7
μV --------------( Hz )
ams Datasheet
[v1-00] 2016-Jun-07
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TSL250RD, TSL251RD, TSL260RD, TSL261RD − Parameter Measurement Information
Parameter Measurement
Information
Figure 9:
Switching Times
VDD
Pulse
Generator
Ee
2
Input
LED
(see Note 1)
ï
3
tf
tr
Output
+
90%
RL
TSL2xxRD
1
Output
(see Note 2)
TEST CIRCUIT
10%
90%
10%
VOLTAGE WAVEFORM
Note(s):
1. The input irradiance is supplied by a pulsed light-emitting diode with tr < 1μs, tf < 1μs.
2. The output waveform is monitored on an oscilloscope with the following characteristics: t r < 100ns, Zi ≥ 1MΩ, C i ≤ 20pF.
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ams Datasheet
[v1-00] 2016-Jun-07
TSL250RD, TSL251RD, TSL260RD, TSL261RD − Typical Characteristics
Typical Characteristics
Figure 10:
Output Voltage vs. Irradiance (TSL250RD, TSL251RD)
Output Voltage (VO ï VD) — V
10
VDD = 5 V
Op = 640 nm
RL = 10 k
TA = 25qC
1
TSL251RD
TSL250RD
0.1
0.01
0.1
1
10
100
1000
Ee — Irradiance — W/cm2
Figure 11:
Output Voltage vs. Irradiance (TSL260RD, TSL261RD)
Output Voltage (VO ï VD) — V
10
VDD = 5 V
Op = 940 nm
RL = 10 k
TA = 25qC
1
TSL261RD
TSL260RD
0.1
0.01
0.1
1
10
100
1000
Ee — Irradiance — W/cm2
ams Datasheet
[v1-00] 2016-Jun-07
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TSL250RD, TSL251RD, TSL260RD, TSL261RD − Typical Characteristics
Figure 12:
Photodiode Spectral Responsivity (TSL250RD, TSL251RD)
1.2
TA = 25qC
Relative Responsivity
1.0
0.8
0.6
0.4
TSL250RD
TSL251RD
0.2
0
300
400
500
600 700 800 900
O ï Wavelength ï nm
1000 1100
Figure 13:
Photodiode Spectral Responsivity (TSL260RD, TSL261RD)
1
TA = 25qC
Relative Responsivity
0.8
0.6
0.4
TSL260RD
TSL261RD
0.2
0
600
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700
800
900
1000
O ï Wavelength ï nm
1100
ams Datasheet
[v1-00] 2016-Jun-07
TSL250RD, TSL251RD, TSL260RD, TSL261RD − Typical Characteristics
Figure 14:
Maximum Output Voltage vs. Supply Voltage
VOM — Maximum Output Voltage — V
5
RL = 10 k:
TA = 25qC
4
3
2
1
0
2.5
3
3.5
4
4.5
VDD ï Supply Voltage ï V
5
5.5
Figure 15:
Supply Current vs. Output Voltage
1.4
IDD — Supply Current — mA
VDD = 5 V
RL = 10 k
TA = 25qC
1.2
1
0.8
0.6
0.4
0
ams Datasheet
[v1-00] 2016-Jun-07
1
2
3
VO ï Output Voltage ï V
4
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TSL250RD, TSL251RD, TSL260RD, TSL261RD − Typical Characteristics
Figure 16:
Normalized Output Voltage vs. Angular Displacement
0.8
Optical Axis
VO — Output Voltage — Normalized
1
0.6
0.4
0.2
Angular Displacement is
Equal for Both Aspects
0
ï90
Page 12
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ï60
ï30
0
30
60
ï Angular Displacement ï q
90
ams Datasheet
[v1-00] 2016-Jun-07
TSL250RD, TSL251RD, TSL260RD, TSL261RD − Application Information
Application Information
Power Supply Considerations
For optimum device performance, power-supply lines should
be decoupled by a 0.01μF to 0.1μF capacitor with short leads
connected between V DD and GND mounted close to the device
package.
Device Operational Details
The voltage developed at the output pin (OUT) is given by:
(EQ1)
V O = V D + (Re) (Ee)
where:
• V O is the output voltage
• V D is the output voltage for dark condition (E e = 0)
• R e is the device responsivity for a given wavelength of
light given in mV/(μW/cm2)
• E e is the incident irradiance in μW/cm2
V D is a fixed offset voltage resulting primarily from the input
offset voltage of the internal op amp. As shown in the equation
above, this voltage represents a constant, light-independent
term in the total output voltage VO. At low light levels, this offset
voltage can be a significant percentage of V O. For optimum
performance of any given device over the full output range, the
value of V D should be measured (in the absence of light) and
later subtracted from all subsequent light measurements
(see Figure 10 and Figure 11).
ams Datasheet
[v1-00] 2016-Jun-07
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TSL250RD, TSL251RD, TSL260RD, TSL261RD − Application Information
PCB Pad Layout
Suggested PCB pad layout guidelines for the D package is
shown in Figure 17.
Figure 17:
Suggested D Package PCB Layout
4.65
6.90
1.27
2.25
0.50
Note(s):
1. All linear dimensions are in millimeters.
2. This drawing is subject to change without notice.
Page 14
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ams Datasheet
[v1-00] 2016-Jun-07
TSL250RD, TSL251RD, TSL260RD, TSL261RD − Packaging Mechanical Data
This SOIC package consists of an integrated circuit mounted on
a lead frame and encapsulated with an electrically
nonconductive clear plastic compound. The photodiode area is
Packaging Mechanical Data
typically 1.02mm 2 for the TSL250RD and TSL260RD, and is
typically 0.514mm 2 for the TSL251RD and TSL261RD.
Figure 18:
Package D - Plastic Small-Outline IC Packaging Configuration
PACKAGE D
PLASTIC SMALL-OUTLINE
NOTE 2
TOP VIEW
2.12
0.250
BOTTOM VIEW
3.00 0.250
PIN 1
PIN 1
8 0.510
0.330
6 1.27
SIDE VIEW
2.8 TYP
CLEAR WINDOW
5.00
4.80
END VIEW
0.50
0.25
45
5.3
MAX
0.88 TYP TOP OF
SENSOR DIE
A
1.75
1.35
DETAIL A
4.00
3.80
6.20
5.80
RoHS
0.25
0.19
Green
Pb
1.27
0.41
0.25
0.10
Note(s):
1. All linear dimensions are in millimeters.
2. The center of the photo-active area is referenced to the upper left corner tip of the lead frame (Pin 1).
3. Package is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
4. This drawing is subject to change without notice.
ams Datasheet
[v1-00] 2016-Jun-07
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TSL250RD, TSL251RD, TSL260RD, TSL261RD − Packaging Mechanical Data
Figure 19:
Package D Carrier Tape
SIDE VIEW
Ko
2.11 0.10 [0.083 0.004]
0.292 0.013
[0.0115 0.0005]
END VIEW
TOP VIEW
1.50
8 0.1
[0.315 0.004]
4 0.1
[0.157 0.004]
2 0.05
[0.079 0.002]
1.75 0.10
[0.069 0.004]
B
5.50 0.05
[0.217 0.002]
12 + 0.3 ï 0.1
[0.472 + 0.12 ï 0.004]
A
A
B
DETAIL A
Ao
DETAIL B
6.45 0.10
[0.254 0.004]
Bo
5.13 0.10
[0.202 0.004]
Note(s):
1. All linear dimensions are in millimeters [inches].
2. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly.
3. Symbols on drawing Ao, Bo, and Ko are defined in ANSI EIA Standard 481-B 2001.
4. Each reel is 178 millimeters in diameter and contains 1000 parts.
5. ams packaging tape and reel conform to the requirements of EIA Standard 481-B.
6. This drawing is subject to change without notice.
Page 16
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ams Datasheet
[v1-00] 2016-Jun-07
TSL250RD, TSL251RD, TSL260RD, TSL261RD − Manufacturing Information
The Plastic Small Outline IC package (D) has been tested and
has demonstrated an ability to be reflow soldered to a PCB
substrate.
Manufacturing Information
The solder reflow profile describes the expected maximum heat
exposure of components during the solder reflow process of
product on a PCB. Temperature is measured on top of
component. The component should be limited to a maximum
of three passes through this solder reflow profile.
Figure 20:
TSL2xxRD Solder Reflow Profile
Parameter
Reference
TSL2xxRD
Average temperature gradient in preheating
Soak time
2.5°C/s
tsoak
2 to 3 minutes
Time above 217°C
t1
Max 60 s
Time above 230°C
t2
Max 50 s
Time above Tpeak - 10°C
t3
Max 10 s
Tpeak
260°C
Peak temperature in reflow
Temperature gradient in cooling
Max -5°C/s
Figure 21:
TSL2xxRD Solder Reflow Profile Graph
Tpeak
Not to scale — for reference o
T3
T2
Temperature (5C)
T1
Time (s)
t3
t2
tsoak
t1
Note(s):
1. Not to scale - for reference only.
ams Datasheet
[v1-00] 2016-Jun-07
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TSL250RD, TSL251RD, TSL260RD, TSL261RD − Manufacturing Information
Moisture Sensitivity
Optical characteristics of the device can be adversely affected
during the soldering process by the release and vaporization of
moisture that has been previously absorbed into the package
molding compound. To prevent these adverse conditions, all
devices shipped in carrier tape have been pre-baked and
shipped in a sealed moisture-barrier bag. No further action is
necessary if these devices are processed through solder reflow
within 24 hours of the seal being broken on the
moisture-barrier bag.
However, for all devices shipped in tubes or if the seal on the
moisture barrier bag has been broken for 24 hours or longer, it
is recommended that the following procedures be used to
ensure the package molding compound contains the smallest
amount of absorbed moisture possible.
For Devices Shipped in Tubes:
1. Remove devices from tubes
2. Bake devices for 4 hours, at 90°C
3. After cooling, load devices back into tubes
4. Perform solder reflow within 24 hours after bake
Bake only a quantity of devices that can be processed through
solder reflow in 24 hours. Devices can be re-baked for 4 hours,
at 90°C for a cumulative total of 12 hours
(3 bakes for 4 hours at 90°C).
For Devices Shipped in Carrier Tape:
1. Bake devices for 4 hours, at 90°C in the tape
2. Perform solder reflow within 24 hours after bake
Bake only a quantity of devices that can be processed through
solder reflow in 24 hours. Devices can be re−baked for 4 hours
in tape, at 90°C for a cumulative total of 12 hours
(3 bakes for 4 hours at 90°C).
Page 18
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ams Datasheet
[v1-00] 2016-Jun-07
TSL250RD, TSL251RD, TSL260RD, TSL261RD − Ordering & Contact Information
Ordering & Contact Information
Figure 22:
Ordering Information
Ordering Code
Package
Type
Delivery Form
Delivery Quantity
TSL250RD-TR
SOIC-8
D
Tape & Reel
1000 pcs/reel
TSL251RD-TR
SOIC-8
D
Tape & Reel
1000 pcs/reel
TSL260RD-TR
SOIC-8
D
Tape & Reel
1000 pcs/reel
TSL261RD-TR
SOIC-8
D
Tape & Reel
1000 pcs/reel
Buy our products or get free samples online at:
www.ams.com/ICdirect
Technical Support is available at:
www.ams.com/Technical-Support
Provide feedback about this document at:
www.ams.com/Document-Feedback
For further information and requests, e-mail us at:
[email protected]
For sales offices, distributors and representatives, please visit:
www.ams.com/contact
Headquarters
ams AG
Tobelbaderstrasse 30
8141 Premstaetten
Austria, Europe
Tel: +43 (0) 3136 500 0
Website: www.ams.com
ams Datasheet
[v1-00] 2016-Jun-07
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TSL250RD, TSL251RD, TSL260RD, TSL261RD − RoHS Compliant & ams Green Statement
RoHS Compliant & ams Green
Statement
RoHS: The term RoHS compliant means that ams AG products
fully comply with current RoHS directives. Our semiconductor
products do not contain any chemicals for all 6 substance
categories, including the requirement that lead not exceed
0.1% by weight in homogeneous materials. Where designed to
be soldered at high temperatures, RoHS compliant products are
suitable for use in specified lead-free processes.
ams Green (RoHS compliant and no Sb/Br): ams Green
defines that in addition to RoHS compliance, our products are
free of Bromine (Br) and Antimony (Sb) based flame retardants
(Br or Sb do not exceed 0.1% by weight in homogeneous
material).
Important Information: The information provided in this
statement represents ams AG knowledge and belief as of the
date that it is provided. ams AG bases its knowledge and belief
on information provided by third parties, and makes no
representation or warranty as to the accuracy of such
information. Efforts are underway to better integrate
information from third parties. ams AG has taken and continues
to take reasonable steps to provide representative and accurate
information but may not have conducted destructive testing or
chemical analysis on incoming materials and chemicals. ams AG
and ams AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited
information may not be available for release.
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ams Datasheet
[v1-00] 2016-Jun-07
TSL250RD, TSL251RD, TSL260RD, TSL261RD − Copyrights & Disclaimer
Copyrights & Disclaimer
Copyright ams AG, Tobelbader Strasse 30, 8141 Premstaetten,
Austria-Europe. Trademarks Registered. All rights reserved. The
material herein may not be reproduced, adapted, merged,
translated, stored, or used without the prior written consent of
the copyright owner.
Devices sold by ams AG are covered by the warranty and patent
indemnification provisions appearing in its General Terms of
Trade. ams AG makes no warranty, express, statutory, implied,
or by description regarding the information set forth herein.
ams AG reserves the right to change specifications and prices
at any time and without notice. Therefore, prior to designing
this product into a system, it is necessary to check with ams AG
for current information. This product is intended for use in
commercial applications. Applications requiring extended
temperature range, unusual environmental requirements, or
high reliability applications, such as military, medical
life-support or life-sustaining equipment are specifically not
recommended without additional processing by ams AG for
each application. This product is provided by ams AG “AS IS”
and any express or implied warranties, including, but not
limited to the implied warranties of merchantability and fitness
for a particular purpose are disclaimed.
ams AG shall not be liable to recipient or any third party for any
damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interruption of business or
indirect, special, incidental or consequential damages, of any
kind, in connection with or arising out of the furnishing,
performance or use of the technical data herein. No obligation
or liability to recipient or any third party shall arise or flow out
of ams AG rendering of technical or other services.
ams Datasheet
[v1-00] 2016-Jun-07
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TSL250RD, TSL251RD, TSL260RD, TSL261RD − Document Status
Document Status
Document Status
Product Preview
Preliminary Datasheet
Datasheet
Datasheet (discontinued)
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Product Status
Definition
Pre-Development
Information in this datasheet is based on product ideas in
the planning phase of development. All specifications are
design goals without any warranty and are subject to
change without notice
Pre-Production
Information in this datasheet is based on products in the
design, validation or qualification phase of development.
The performance and parameters shown in this document
are preliminary without any warranty and are subject to
change without notice
Production
Information in this datasheet is based on products in
ramp-up to full production or full production which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade
Discontinued
Information in this datasheet is based on products which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade, but these products have been superseded and
should not be used for new designs
ams Datasheet
[v1-00] 2016-Jun-07
TSL250RD, TSL251RD, TSL260RD, TSL261RD − Revision Information
Revision Information
Changes from 050K (2007-Oct) to current revision 1-00 (2016-Jun-07)
Page
Content of TAOS datasheet was converted to the latest ams design
Updated Key Benefits & Features
1
Added Ordering Information
19
Note(s):
1. Page and figure numbers for the previous version may differ from page and figure numbers in the current revision.
2. Correction of typographical errors is not explicitly mentioned.
ams Datasheet
[v1-00] 2016-Jun-07
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TSL250RD, TSL251RD, TSL260RD, TSL261RD − Content Guide
Content Guide
Page 24
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1
2
3
General Description
Key Benefits & Features
Functional Block Diagram
4
5
6
9
10
Pin Assignments
Absolute Maximum Ratings
Electrical Characteristics
Parameter Measurement Information
Typical Characteristics
14
14
14
15
Application Information
Power Supply Considerations
Device Operational Details
PCB Pad Layout
16
Packaging Mechanical Data
18
19
19
19
Manufacturing Information
Moisture Sensitivity
For devices shipped in tubes:
For devices shipped in carrier tape:
20
21
22
RoHS Compliant & ams Green Statement
Ordering & Contact Information
Copyrights & Disclaimer
ams Datasheet
[v1-00] 2016-Jun-07