TMD4903

TMD4903
Color and Proximity Sensor Module
with mobeam™ Barcode Emulation
and IR Remote Control
General Description
The TMD4903 features ambient light and color (RGB) sensing,
proximity detection and IRBeam optical pattern generator
capable of mobeam™ barcode emulation and IR remote control.
In addition, the device integrates an IR LED and advanced LED
driver, all within a low-profile and small footprint,
2.0mm x 5.0mm x 1.0mm package.
The Proximity sensing function synchronizes IR emission and
detection to sense proximity events. The architecture of the
engine features self-maximizing dynamic range, ambient light
subtraction, advanced crosstalk cancelation, 14-bit data
output, 32-dataset FIFO, and interrupt-driven I²C
communication. Sensitivity, power consumption, and noise can
be optimized with adjustable IR LED timing and power. The
proximity engine recognizes detect/release events and
produces a configurable interrupt whenever proximity result
crosses upper or lower threshold settings.
The Ambient Light and Color Sensing function provides Red,
Green, and Blue (RGB) ambient light sensing with a Clear
reference (C). The color diode array has a UV/IR blocking filter
and parallel ADCs to produce simultaneous 16-bit results. This
architecture accurately measures ambient light and enables the
calculation of illuminance, chromaticity, and color temperature
to manage display appearance.
The IRBeam pattern generator supports mobeam™ barcode
emulation and IR remote control. The engine features RAM for
pattern storage and specialized control logic that is tailored to
repetitively broadcast a barcode pattern using the integrated
LED or an external LED with a low side driver. The IRBeam engine
features adjustable timing, looping, and IR intensity to
maximize successful transmission. IRBeam is designed to
support all requirements for 1-D barcode transmission over IR
to point-of-sale (POS) terminals as well as IR remote control.
Ordering Information and Content Guide appear at end of
datasheet.
ams Datasheet
[v1-12] 2015-May-14
Page 1
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TMD4903 − General Description
Key Benefits & Features
The benefits and features of TMD4903, Color and Proximity
Sensor Module with mobeam™ Barcode Emulation and IR
Remote Control are listed below:
Figure 1:
Added Value of Using TMD4903
Benefit
Feature
Proximity detection
•
•
•
•
•
•
Selectable direction sensitivity
Ambient light rejection
Advanced crosstalk compensation
AFE saturation flag
Programmable LED driver
Interrupt-Driven I²C communication
Ambient light and color sensing
•
•
•
•
•
•
Variable sensitivity
Designed to operate behind inked glass
UV/IR blocking filter
Programmable gain and integration time
6.7M:1 dynamic range by gain adjustment only
Interrupt-driven I²C communication
IRBeam pattern generator
• mobeam™ support
• Universal remote control support
• Interrupt-driven I²C communication
Integrated LED and driver
• Calibrated emission and response
• Invisible 950nm emission
Low supply voltage
• 1.8V operation
Applications
The TMD4903 applications include:
• Color sensing
• Ambient light sensing
• Cell phone touch screen disable
• Mechanical switch replacement
• 1D barcode emulation
• Universal remote control
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ams Datasheet
[v1-12] 2015-May-14
TMD4903 − General Description
Block Diagram
The functional blocks of this device for reference are
shown below:
Figure 2:
TMD4903 Block Diagram
I2C
256 Byte FIFO
(2048 Bit Pattern RAM)
!
"!
!
#
"!
ams Datasheet
[v1-12] 2015-May-14
TMD4903
Page 3
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TMD4903 − Pin Assignment
The device pin assignments are described below.
Pin Assignment
Figure 3:
Pin Diagram
R
Pin Description
Figure 4:
Pin Description
Pin Number
Pin Name
1
VDD
Supply voltage (1.8V)
2
SCL
I²C serial clock terminal
3
GND
Ground. All voltages are referenced to GND
4
LEDA
LED anode
5
LDR
LED driver (sinks current) and LED cathode (for direct access to LED)
6
GPIO
Open drain IRBeam output or alternate interrupt
7
INT
Interrupt. Open drain output and logic level output for external IR
LED circuit
8
SDA
I²C serial data I/O terminal
Page 4
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Description
ams Datasheet
[v1-12] 2015-May-14
TMD4903 − Absolute Maximum Ratings
Absolute Maximum Ratings
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. These are stress
ratings only. Functional operation of the device at these or any
other conditions beyond those indicated under Recommended
Operating Conditions is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Figure 5:
Absolute Maximum Ratings
Symbol
Min
Max
Units
Supply voltage
-0.3
2.2
V
LED anode supply
-0.3
3.6
V
VIO
Digital I/O terminal voltage
-0.3
3.6
V
VLDR
Terminal voltage
-0.3
3.6
V
VDD
VLEDA
Parameter
IIO
Output terminal current
-1
20
mA
Tstg
Storage temperature range
-40
85
ºC
ESDHBM
ESD tolerance, human body
model
±2000
Comments
see note (2)
V
Note(s) and/or Footnote(s):
1. All voltages with respect to GND
2. Measured with LDR = OFF or LDR = ON and LDRIVE = 310mA.
ams Datasheet
[v1-12] 2015-May-14
Page 5
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TMD4903 − Electrical Characteristics
The parameters with min and max values are guaranteed with
production tests or SQC (Statistical Quality Control) methods.
Electrical Characteristics
Figure 6:
Recommended Operating Conditions
Symbol
VDD
TA
Parameter
Min
Typ
Max
Units
Supply voltage
1.7
1.8
2.0
V
Operating free-air temperature (1)
-30
85
°C
Note(s) and/or Footnote(s):
1. While the device is operational across the temperature range, functionality will vary with temperature. Specifications are stated at
25°C, unless otherwise noted.
Figure 7:
Operating Characteristics, VDD = 1.8 V, TA = 25ºC (unless otherwise noted)
Symbol
fOSC
Parameter
Conditions
Min
Oscillator Frequency
Typ
Max
8.1
Active ALS state
(PON=AEN=1,
PEN=IBEN=0) (2)
90
150
Units
MHz
200
μA
IDD
Supply current (1)
Idle state
(PON=1,
AEN=PEN=IBEN=0) (3)
30
60
Sleep State (4)
0.4
5
VOL
INT, SDA, GPIO output low
voltage
ILEAK
Leakage current, SDA, SCL,
INT, GPIO, LDR pins
-5
VIH
SCL, SDA input high voltage
1.26
VIL
SCL, SDA input low voltage
6 mA sink current
0.6
V
5
μA
V
0.54
V
Note(s) and/or Footnote(s):
1. Values are shown at the VDD pin and do not include current through the IR LED.
2. This parameter indicates the supply current during periods of ALS integration. If Wait is enabled (WEN=1), the supply current is
lower during the Wait period.
3. Idle state occurs when PON=1 and all functions are not enabled.
4. Sleep state occurs when PON = 0 and I²C bus is idle. If Sleep state has been entered as the result of operational flow, SAI = 1, PON
will remain high.
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ams Datasheet
[v1-12] 2015-May-14
TMD4903 − Electrical Characteristics
Figure 8:
ALS/Color Operating Characteristics, VDD = 1.8 V, TA = 25ºC, AGAIN = 16x, ATIME = 0xF6 (unless
otherwise noted)
Parameter
Conditions
Integration time
step size(1), (2)
Dark ADC count value
(2)
Ee = 0 μW/ cm2
AGAIN: 64x
ATIME: 100ms (0xDC)
Min
Typ
Max
Units
2.68
2.78
2.90
ms
0
1
3
counts
AGAIN: 1/4x
0.0135
0.0175
AGAIN: 1x
0.058
0.067
AGAIN: 4x
0.237
0.263
AGAIN: 64x
3.75
4.37
Clear channel irradiance
responsivity
White LED, 2700K
8.94
10.28
11.62
counts/
(μW/ cm2)
Lux accuracy (3)
White LED, 2700K
90
100
110
%
ADC Noise (4)
AGAIN: 16x
Gain scaling, relative to
16x gain setting
x
0.005
% Full
Scale
Note(s) and/or Footnote(s):
1. Integration time is configured from 1 step (0xFF) to 256 steps (0x00) for a typical range of 2.78ms to 711.11ms. An ATIME setting of
0xFF results in a full-scale count value of 1024. Each additional integration step adds 1024 counts to full scale. To enable 16-bit ADC
range, 64 or more integration steps (177.8ms or more) are required (ATIME <= 0xC0).
2. The typical 3-sigma distribution is between 0 and 1 count for an AGAIN setting of 16x.
3. Lux accuracy is function of red, green, blue and clear channels, and not 100% production tested.
4. ADC noise is calculated as the standard deviation of 1000 data samples.
ams Datasheet
[v1-12] 2015-May-14
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TMD4903 − Electrical Characteristics
Figure 9:
Color Ratio Characteristics, VDD = 1.8V, TA = 25ºC
Ratio of Color to Clear Channel
Parameter
Color ADC count value
ratio: Color/Clear
Test Conditions
Red Channel
Green Channel
Blue Channel
Min
Max
Min
Max
Min
Max
White LED, 2700 K
45%
65%
19%
39%
15%
40%
λD = 465 nm (1)
0%
15%
10%
42%
70%
90%
λD = 525 nm (2)
4%
25%
60%
85%
10%
45%
λD = 615 nm (3)
80%
110%
0%
14%
5%
24%
Note(s) and/or Footnote(s):
1. The 465 nm input irradiance is supplied by an InGaN light-emitting diode with the following characteristics: dominant wavelength
λ D = 465 nm, spectral halfwidth Δλ½ = 22 nm.
2. The 525 nm input irradiance is supplied by an InGaN light-emitting diode with the following characteristics: dominant wavelength
λ D = 525 nm, spectral halfwidth Δλ½ = 35 nm.
3. The 615 nm input irradiance is supplied by an AlInGaP light-emitting diode with the following characteristics: dominant wavelength
λ D = 615 nm, spectral halfwidth Δλ½ = 15 nm.
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ams Datasheet
[v1-12] 2015-May-14
TMD4903 − Electrical Characteristics
Figure 10:
Proximity Operating Characteristics, VDD = 1.8 V, TA = 25ºC (unless otherwise noted)
Parameter
Conditions
Min
ADC conversion time step size
Typ
Max
20
Offset
(no target response) (1)
PGAIN = 2 (4x)
PGLDRIVE = 7 (150mA)
PGPULSE_LEN = 1 (8us)
No target present
After electrical calibration
Part to part variation (2)
PGAIN = 2 (4x)
PGLDRIVE = 1 (30mA)
PGPULSE_LEN = 1 (8us)
d=23mm round target
30mm target distance
After electrical calibration
Response, absolute (3)
PGAIN = 2 (4x)
PGLDRIVE = 7 (150mA)
PGPULSE_LEN = 1 (8us)
100x100mm, 90% reflective
Kodak gray card
100mm target distance
After electrical calibration
Noise/Signal (4)
PGAIN = 2 (4x)
PGLDRIVE = 2 (50mA)
PGPULSE_LEN = 1 (8us)
PGPULSE = 7 (8 pulses)
Unit
μs
16
36
counts
75
100
125
%
790
990
1190
counts
2
%
Note(s) and/or Footnote(s):
1. Offset varies with power supply characteristics and system noise.
2. Production tested result is the average of 5 readings expressed relative to a calibrated response.
3. Representative result by characterization. Device settings can vary from 1 to 64 pulse count, 4μs to 32μs pulse width, 10mA to 310mA
current setting, and 1x to 8x electrical gain. Refer to Figure 22 for device performance with different settings.
4. Production tested result is the range of 20 readings divided by the average response.
ams Datasheet
[v1-12] 2015-May-14
Page 9
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TMD4903 − Electrical Characteristics
Figure 11:
Proximity Test Circuit
22Ω
VDD
1µF
GND
4 LEDA
1
1µF
TMD4903
5
3
22µF
LDR
Figure 12:
Wait Characteristics, VDD = 1.8 V, TA = 25ºC, WEN = 1 (unless otherwise noted)
Parameter
Conditions
Wait step size
Min
Typ
Max
Units
2.68
2.78
2.90
ms
Long wait step size
33.3
ms
Figure 13:
IRBeam Operating Characteristics, VDD = 1.8 V, TA = 25ºC (unless otherwise noted)
Symbol
Parameter
Conditions
t(PBT min)
Minimum bit time
IBEN = 1
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Min
Typ
0.25
Max
Units
μs
ams Datasheet
[v1-12] 2015-May-14
TMD4903 − Timing Characteristics
Timing Characteristics
Figure 14:
AC Electrical Characteristics, VDD = 1.8 V, TA = 25ºC (unless otherwise noted)
Parameter
Description
Min
Typ
Max
Unit
400
kHz
fSCL (1)
Clock frequency (I²C only)
tBUF (1)
Bus free time between start and stop condition
1.3
μs
tHS;STA (1)
Hold time after (repeated) start condition.
After this period, the first clock is generated.
0.6
μs
tSU;STA (1)
Repeated start condition setup time
0.6
μs
tSU;STO (1)
Stop condition setup time
0.6
μs
tHD;DAT (1)
Data hold time
0
ns
tSU;DAT (1)
Data setup time
100
ns
tLOW (1)
SCL clock low period
1.3
μs
tHIGH (1)
SCL clock high period
0.6
μs
0
tF (1)
Clock/data fall time
300
ns
tR (1)
Clock/data rise time
300
ns
Ci (1)
Input pin capacitance
10
pF
Note(s) and/or Footnote(s):
1. Specified by design and characterization; not production tested.
Timing Diagram
Figure 15:
Timing Parameter Measurement Drawing
tHIGH
tR
tLOW
tF
VIH
SCL
VIL
tHD; STA
tSU; DAT
tHD; DAT
tSU; STA
tSU; STO
tBUF
SDA
VIH
VIL
STOP START
ams Datasheet
[v1-12] 2015-May-14
START
STOP
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TMD4903 − Typical Operating Characteristics
Typical Operating
Characteristics
Figure 16:
Spectral Responsivity
Spectral Responsivity
180%
Clear
Red
Green
Blue
IR
Normalized Responsivity
160%
140%
120%
100%
80%
60%
40%
20%
0%
300
400
500
600
700
800
900
1000
1100
λ - Wavelength - nm
Figure 17:
CRGB Responsivity vs. Angular Displacement
Normalized Angular Response
Normalized Response (%)
100%
90%
Green LED
All Channels
80%
70%
60%
50%
40%
30%
20%
10%
0%
-90
-75
-60
-45
-30
-15
0
15
30
45
60
75
90
Angle of Incident Light (degrees)
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ams Datasheet
[v1-12] 2015-May-14
TMD4903 − Typical Operating Characteristics
Figure 18:
Typical LDR Current vs. Voltage
Typical LDR Current vs. Voltage
0.35
310mA
290mA
0.3
270mA
250mA
LDR Current
0.25
230mA
210mA
0.2
190mA
170mA
150mA
0.15
130mA
110mA
0.1
90mA
70mA
0.05
50mA
30mA
0
10mA
0
0.5
1
1.5
2
2.5
3
3.5
LDR Voltage (V)
Temperature Coefficient - ppm/ºC
Figure 19:
Responsivity Temperature Coefficient
λ - Wavelength - nm
ams Datasheet
[v1-12] 2015-May-14
Page 13
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TMD4903 − Typical Operating Characteristics
Figure 20:
Illuminance (Lux) vs. Counts (Clear Channel)
Dynamic Range (ATIME = 100ms)
1000000
Illuminance (lux)
100000
10000
1000
100
1/4x
1x
10
4x
1
16x
64x
0.1
0.01
1
10
100
1000
10000
100000
Clear channel (counts)
Figure 21:
950nm LED Forward Voltage vs. Current
LED Forward Voltage
Forward Current (mA DC)
300
250
200
150
100
50
0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Forward Voltage (V)
Note(s) and/or Footnote(s):
1. The voltage on the LDR pin (VLEDA – VLED FORWARD) must be sufficiently large to guarantee proper operation of the regulated
current sink.
Page 14
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ams Datasheet
[v1-12] 2015-May-14
TMD4903 − Typical Operating Characteristics
Figure 22:
Proximity Response vs. Target Distance
PGAIN =2 (4x), PGLDRIVE = 7 (150mA), 100x100mm, 90% Reflective Kodak gray card
TMD4903 Proximity Response by Pulse Width
18000
4µs
8µs
16µs
32µs
16000
14000
Counts
12000
10000
8000
6000
4000
2000
0
0
5
10
15
20
Distance - cm
ams Datasheet
[v1-12] 2015-May-14
Page 15
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TMD4903 − I²C Protocol
I²C Protocol
The device uses I²C serial communication protocol for
communication. The device supports 7-bit chip addressing and
both standard and full-speed clock frequency modes. Read and
Write transactions comply with the standard set by Philips (now
NXP).
Internal to the device, an 8-bit buffer stores the register address
location of the desired byte to read or write. This buffer
auto-increments upon each byte transfer and is retained
between transaction events (I.e. valid even after the master
issues a STOP command and the I²C bus is released). During
consecutive Read transactions, the future/repeated I²C Read
transaction may omit the memory address byte normally
following the chip address byte; the buffer retains the last
register address +1.
All 16-bit fields have a latching scheme for reading and writing.
In general it is recommended to use I²C bursts whenever
possible, especially in this case when accessing two bytes of
one logical entity. When reading these fields, the low byte must
be read first, and it triggers a 16-bit latch that stores the 16-bit
field. The high byte must be read immediately afterwards. When
writing to these fields, the low byte must be written first,
immediately followed by the high byte. Reading or writing to
these registers without following these requirements will cause
errors.
I²C Write Transaction
A Write transaction consists of a START, CHIP-ADDRESSWRITE,
REGISTER-ADDRESS WRITE, DATA BYTE(S), and STOP. Following
each byte (9TH clock pulse) the slave places an
ACKNOWLEDGE/NOT- ACKNOWLEDGE (ACK/NACK) on the bus.
If NACK is transmitted by the slave, the master may issue a STOP.
I²C Read Transaction
A Read transaction consists of a START, CHIP-ADDRESSWRITE,
REGISTER-ADDRESS, RESTART, CHIP-ADDRESSREAD, DATA
BYTE(S), and STOP. Following all but the final byte the master
places an ACK on the bus (9TH clock pulse). Termination of the
Read transaction is indicated by a NACK being placed on the
bus by the master, followed by STOP.
The I²C bus protocol was developed by Philips (now NXP). For
a complete description of the I²C protocol, please review the
NXP I²C design specification.
Page 16
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ams Datasheet
[v1-12] 2015-May-14
TMD4903 − I²C Protocol
Figure 23:
Simplified State Diagram
(
#
/
&
#
!-!.
*
%&'
#
$
/
/
&
%&'
/
,
&
#
%&'
&
#
)*+
ams Datasheet
[v1-12] 2015-May-14
*
&
,
/
#
)*+
*
*
Page 17
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TMD4903 − I²C Protocol
Figure 24:
Detailed State Diagram
*78/9
:
0
%,//1'
#
SAI = 1?
#
+
#
2&3
+
)#
2/
2&
%*'
$
0
%45!'
,
66
2/
$#
#2&
#
)*+
%*'
#2/
,
( % #* '
$*$
#
2&
*
+
+
$#
$#
$
$#
EVALUATE :
INTERRUPT?
*
*#
$
*
*
*
#
Note(s) and/or Footnote(s):
1. While IRBeam is enabled (IBEN = 1), PROXIMITY is disabled automatically.
Page 18
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ams Datasheet
[v1-12] 2015-May-14
TMD4903 − Detailed Description
Detailed Description
Upon power-up, POR, the device initializes. During initialization
(typically 200μs), the device will deterministically send NAK on
I²C and cannot accept I²C transactions. All communication with
the device must be delayed, and all outputs from the device
must be ignored including interrupts. After initialization, the
device enters the SLEEP state. In this operational state the
internal oscillator and other circuitry are not active, resulting in
ultra-low power consumption. If I²C transaction occurs during
this state, the I²C core wake up temporarily to service the
communication. Once the Power ON bit, PON, is enabled, the
device enters the IDLE state in which the internal oscillator and
attendant circuitry are active, but power consumption remains
low. The first time the SLEEP state is exited and any functions
are enabled (PEN | AEN | IBEN = 1) an EXIT SLEEP pause occurs
followed by an immediate entry into the selected engines. If all
functions are disabled
(PEN = 0 & AEN = 0 & IBEN = 0), the device returns to the IDLE
state.
As depicted in Figure 23 and Figure 24, the proximity and CRGB
color sensing functions operate in parallel when enabled (PEN
| AEN = 1). The IRBeam pattern generator takes priority when
enabled (IBEN = 1).Proximity will not function, and ALS
integration only occurs while IRBeam is in standby. In addition,
when proximity or calibration is requested, it will temporarily
disable the proximity function. A simplified state diagram for
each function is depicted in Figure 24. Each function is
individually configured (e.g. Gain, ADC integration time, wait
time, persistence, thresholds, etc.).
Sleep After Interrupt Operation
If Sleep After Interrupt is enabled (SAI = 1), the state machine
will enter SLEEP when non-gesture interrupts occur. However
for IRBeam, the state machine remains active to continue to
support this function. Entering SLEEP does not automatically
change any of the register settings (E.g. PON bit is still high, but
the normal operational state is over-ridden by SLEEP state).
SLEEP state is terminated when the SAI bit is cleared.
ams Datasheet
[v1-12] 2015-May-14
Page 19
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TMD4903 − Register Description
The device is controlled and monitored by registers accessed
through the I²C serial interface. These registers provide for a
variety of control functions and can be read to determine results
of the ADC conversions. The register set is summarized in
Figure 25.
Register Description
Figure 25:
Control Register Map
Reset
Value
Address
Register Name
R/W
0x00 – 0x7F
RAM
R/W
Volatile Storage for Pattern data
0x00
0x80
ENABLE
R/W
Enables states and interrupts
0x00
0x81
ATIME
R/W
ADC integration time
0xFF
0x82
PTIME
R/W
Proximity sample time
0x00
0x83
WTIME
R/W
ALS wait time
0xFF
0x84
AILTL
R/W
ALS interrupt low threshold low byte
0x00
0x85
AILTH
R/W
ALS interrupt low threshold high byte
0x00
0x86
AIHTL
R/W
ALS interrupt high threshold low byte
0x00
0x87
AIHTH
R/W
ALS interrupt high threshold high byte
0x00
0x88
PILTL
R/W
Proximity interrupt low threshold low byte
0x00
0x89
PILTH
R/W
Proximity interrupt high threshold high byte
0x00
0x8A
PIHTL
R/W
Proximity interrupt low threshold low byte
0x00
0x8B
PIHTH
R/W
Proximity interrupt high threshold high byte
0x00
0x8C
PERS
R/W
ALS & Proximity interrupt persistence filters
0x00
0x8D
CFG0
R/W
Configuration register zero
0xA0
0x8E
PGCFG0
R/W
Proximity pulse width and count
0x4F
0x8F
PGCFG1
R/W
Proximity gain and LED current
0x80
0x90
CFG1
R/W
Configuration register one
0x00
0x91
REVID
R
Revision ID
0x22
0x92
ID
R
Device ID
0xB8
0x93
STATUS
R
Device status register one
0x00
0x94
CDATAL
R
Clear ADC low data register
0x00
0x95
CDATAH
R
Clear ADC high data register
0x00
0x96
RDATAL
R
Red ADC low data register
0x00
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Register Function
ams Datasheet
[v1-12] 2015-May-14
TMD4903 − Register Description
Register Name
R/W
0x97
RDATAH
R
Red ADC high data register
0x00
0x98
GDATAL
R
Green ADC low data register
0x00
0x99
GDATAH
R
Green ADC high data register
0x00
0x9A
BDATAL
R
Blue ADC low data register
0x00
0x9B
BDATAH
R
Blue ADC high data register
0x00
0x9C
PDATAL
R
Proximity ADC low data register
0x00
0x9D
PDATAH
R
Proximity ADC high data register
0x00
0x9E
STATUS2
R
Additional device status
0x00
0x9F
CFG2
R/W
Configuration register two
0x04
0xA0
ICONFIG
R/W
IRBeam configuration register one
0x00
0xA1
ICONFIG2
R/W
IRBeam configuration register two
0x00
0xA2
ISNL
R/W
IRBeam symbol loops
0x00
0xA3
ISOFF
R/W
IRBeam delay between symbol loops
0x00
0xA4
IPNL
R/W
IRbeam packet loops
0x00
0xA5
IPOFF
R/W
IRBeam delay between packet loops
0x00
0xA6
IBT
R/W
IRBeam time period
0x00
0xA7
ISLEN
R/W
IRBeam symbol length
0x00
0xA8
ISTATUS
R
IRBeam status
0x00
0xA9
ISTART
R/W
IRBeam start transmission
0x00
0xAB
CFG3
R/W
Configuration register three
0x00
0xAC
CFG4
R/W
Configuration register four
0x07
0xAD
CFG5
R/W
Configuration register five
0x08
0xB3
STATUS3
R
Status register three
0x00
0xBC
CONTROL
R/W
Control register
0x00
0xBD
AUXID
R
Auxiliary ID
0x00
0xC0
OFFSETNL
R/W
North channel offset low byte
0x00
0xC1
OFFSETNH
R/W
North channel offset high byte
0x00
0xC2
OFFSETSL
R/W
South channel offset low byte
0x00
0xC3
OFFSETSH
R/W
South channel offset high byte
0x00
0xC4
OFFSETWL
R/W
West channel offset low byte
0x00
ams Datasheet
[v1-12] 2015-May-14
Register Function
Reset
Value
Address
Page 21
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TMD4903 − Register Description
Register Name
R/W
0xC5
OFFSETWH
R/W
West channel offset high byte
0x00
0xC6
OFFSETEL
R/W
East channel offset low byte
0x00
0xC7
OFFSETEH
R/W
East channel offset high byte
0x00
0xD6
AZ_CONFIG
R/W
Configure CRGB autozero frequency
0xFF
0xD7
CALIB
R/W
Start offset calibration
0x00
0xD8
CALIBCFG0
R/W
Calibration configuration register zero
0x44
0xD9
CALIBCFG1
R/W
Calibration configuration register one
0x0C
0xDD
INTENAB
R/W
Interrupt enable
0x00
0xDE
INCLEAR
R/W
Interrupt clear
0x00
Page 22
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Register Function
Reset
Value
Address
ams Datasheet
[v1-12] 2015-May-14
TMD4903 − Register Description
Enable Register (ENABLE 0x80)
Enable has fields that power on the device and enable the
functions. Before enabling any functions, all of the bits
associated with each function must be set. Changing control
register values while operating may result in invalid results.
Figure 26:
Enable Register
7
6
5
4
3
2
1
0
IBEN
Reserved
PIEN
AIEN
WEN
PEN
AEN
PON
Field
Bits
Description
IBEN
7
IRBeam Enable. When asserted, the LED driver pin (LDR) is controlled by the
IRBeam state machine. Proximity is suppressed. ALS continues in the
background except when IBUSY = 1 (ISTATUS register).
Reserved
6
Reserved. Bit must be set to 0.
PIEN
5
Proximity Interrupt Enable. When asserted permits proximity interrupts to
be generated, subject to the proximity thresholds and persistence filter.
AIEN
4
ALS Interrupt Enable. When asserted permits ALS interrupts to be
generated, subject to the ALS thresholds and persistence filter.
WEN
3
Wait Enable. This bit activates the wait feature. Writing a 1 activates the wait
timer. Writing a 0 disables the wait timer.
PEN
2
Proximity Enable. This bit activates the proximity function. Writing a 1
enables proximity. Writing a 0 disables proximity.
AEN
1
ALS Enable. This bit activates the ALS/Color functionality. Writing a 1
enables ALS/Color. Writing a 0 disables ALS/Color.
0
Power ON. This bit activates the internal oscillator to permit the timers and
ADC channels to operate. Writing a 1 activates the oscillator. Writing a 0
disables the oscillator and clears IBEN, PEN, and AEN. Only set this bit after all
other registers have been initialized by the host.
PON
ams Datasheet
[v1-12] 2015-May-14
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TMD4903 − Register Description
ALS Integration Time Register (ATIME 0x81)
Figure 27:
ALS Integration Time Register
7
6
5
4
3
2
1
0
ATIME
Field
Bits
Description
ALS Integration Time. Sets the internal integration time of ALS/Color analog to digital
converters in increments of 2.78ms. The power on reset value is 0xFF. The ADC
maximum count (or saturation) value depends on the integration time. It is the lesser
of either:
65535 (16-bit saturation) or
The result of equation: CountMAX = 1024 X CYCLES
ATIME
7:0
Page 24
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VALUE
INTEGRATION TIME
MAX COUNTS
0xFF
2.78ms
1024
0xF6
27.8ms
10240
0xDC
100ms
36864
…
2.78ms X (256 - ATIME)
…
0xC0
178ms
65535
0x00
711ms
65535
ams Datasheet
[v1-12] 2015-May-14
TMD4903 − Register Description
Proximity Sample Time Register (PTIME 0x82)
Figure 28:
Proximity Sample Time Register
7
6
5
4
3
2
1
0
PTIME
Field
Bits
Description
Proximity Sample Time. Sets the proximity sample rate. The power on reset value is
0x00. Proximity is executed once for each sample time.
PTIME
7:0
ams Datasheet
[v1-12] 2015-May-14
VALUE
SAMPLE TIME
FREQUENCY
0x00
2.78ms
360Hz
0x01
5.56ms
180Hz
0x03
11.1ms
90Hz
0x23
100ms
10Hz
…
2.78ms X (PTIME +1)
1/Proximity Sample Time
0xFF
711ms
1.41Hz
Page 25
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TMD4903 − Register Description
Wait Time Register (WTIME 0x83)
Figure 29:
Wait Time Register
7
6
5
4
3
2
1
0
WTIME
Field
Bits
Description
Wait Time. Sets the wait time between ALS cycles. Wait mode reduces current
consumption. It is set in 2.78ms increments unless the WLONG bit is asserted in which
case the wait times are 12x longer. The power on reset value is 0xFF. Wait time should be
configured before AEN is asserted.
WTIME
7:0
Page 26
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VALUE
WAIT TIME (WLONG=0)
WAIT TIME (WLONG=1)
0xFF
2.78ms
0.03sec
0xDC
100ms
1.20sec
…
2.78ms X (256 - WTIME)
33.3ms X (256 - WTIME)
0x6A
417ms
5.00sec
0x00
711ms
8.53sec
ams Datasheet
[v1-12] 2015-May-14
TMD4903 − Register Description
ALS Interrupt Threshold Registers (0x84 – 0x87)
ALS level detection uses data generated by the Clear Channel.
The ALS Interrupt Threshold registers provide 16-bit values to
be used as the high and low thresholds for comparison to the
16-bit CDATA values. If AIEN is enabled and CDATA is not
between AILT and AIHT for the number of consecutive samples
specified in APERS an interrupt is asserted on the interrupt pin.
Figure 30:
ALS Interrupt Threshold Registers
Field
Register
Bits
Description
0x84
7:0
ALS low threshold low byte
0x85
15:8
ALS low threshold high byte
0x86
7:0
ALS high threshold low byte
0x87
15:8
ALS high threshold high byte
AILT
AIHT
Proximity Interrupt Threshold Registers
(0x88 – 0x8B)
The Proximity Interrupt Threshold Registers set the high and
low trigger points for the comparison function which generates
an interrupt. If PDATA, the value generated by proximity
channel, crosses from above to below the lower threshold or
from below to above the upper threshold, an interrupt may be
signaled to the host processor. Interrupt generation is subject
to the value set in persistence filter (PPERS).
Figure 31:
Proximity Interrupt Threshold Registers
Field
Register
Bits
Description
0x88
7:0
Proximity low threshold low byte
0x89
15:8
Proximity low threshold high byte
0x8A
7:0
Proximity high threshold low byte
0x8B
15:8
Proximity high threshold high byte
PILT
PIHT
ams Datasheet
[v1-12] 2015-May-14
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TMD4903 − Register Description
Interrupt Persistence Register (PERS 0x8C)
Figure 32:
Interrupt Persistence Register
7
6
5
4
3
2
PPERS
Field
1
0
APERS
Bits
Description
Proximity Interrupt Persistence. Defines a filter for the number of consecutive
occurrences that PDATA must remain outside the threshold range between PILT and
PIHT before an interrupt is generated. Any sample that is inside the threshold range
resets the counter to 0.
VALUE
PPERS
7:4
CONSECUTIVE OCCURENCES OUT OF RANGE
0
Every proximity cycle generates an interrupt
1
Generate interrupt after every occurrence.
2
Generate interrupt after 2 occurrences.
...
Generate interrupt after PPERS occurrences.
15
Generate interrupt after 15 occurrences.
ALS Interrupt Persistence. Defines a filter for the number of consecutive occurrences
that CDATA must remain outside the threshold range between AILT and AIHT before an
interrupt is generated. Any sample that is inside the threshold range resets the counter
to 0.
VALUE
APERS
3:0
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CONSECUTIVE OCCURENCES OUT OF RANGE
0
Every ALS cycle generates an interrupt
1
Generate interrupt after every occurrence.
2
Generate interrupt after 2 occurrences.
3
Generate interrupt after 3 occurrences.
4
Generate interrupt after 5 occurrences.
5
Generate interrupt after 10 occurrences.
…
Generate interrupt after 5 X (APERS -3) occurrences.
14
Generate interrupt after 55 occurrences.
15
Generate interrupt after 60 occurrences.
ams Datasheet
[v1-12] 2015-May-14
TMD4903 − Register Description
Configuration Register Zero (CFG0 0x8D)
Figure 33:
Configuration Register Zero
7
6
Reserved
5
4
LOWPOWER_IDLE
Field
Bits
Reserved
7:6
LOWPOWER_IDLE
5
Reserved
4:3
WLONG
2
3
Reserved
2
WLONG
1
0
RAM_BANK
Description
Reserved
Low Power Idle. When asserted, the device will run in a low
power mode if all functions are in wait states or disabled.
Reserved
Wait Long Enable. When asserted, the wait cycles are increased
by a factor 12x.
RAM Bank Selection. Specifies the RAM bank to access for
IRBeam.
VALUE
RAM_BANK
1:0
RAM BANK ACCESS
0
Ram Bank 0 (lower 128 bytes)
1
Ram Bank 1 (upper 128 bytes)
2
Access is given to the 16 words at 0xB0…0xBF.
3
ams Datasheet
[v1-12] 2015-May-14
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TMD4903 − Register Description
Proximity Configuration Register Zero
(PGCFG0 0x8E)
PGCFG0 has fields that set the amount of time the LDR driver is
sinking current during a proximity pulse and set the maximum
number of pulses for each proximity sample.
Figure 34:
Proximity Configuration Register Zero
7
6
5
4
PGPULSE_LEN
Field
3
2
1
0
PPULSE
Bits
Description
Proximity Pulse Length. Sets the LED-ON pulse width during a Proximity
Pulse.
PGPULSE_LEN
PPULSE
Page 30
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7:6
5:0
VALUE
LED ON
0
4μs
1
8μs
2
16μs
3
32μs
Proximity Pulse Count. Specifies the maximum number of Proximity
pulses to be generated on LDR. The pulse count can be set between 1 and
64 pulses. The number of pulses is equal to the PPULSE value plus 1.
ams Datasheet
[v1-12] 2015-May-14
TMD4903 − Register Description
Proximity Configuration Register One
(PGCFG1 0x8F)
PGCFG1 has fields that set the electrical gain of the proximity
response and set the LED drive current during pulses.
Figure 35:
Proximity Configuration Register One
7
6
5
PGGAIN
Reserved
Field
Bits
4
3
2
1
0
PGLDRIVE
Reserved
Description
Proximity Gain Control.
PGGAIN
Reserved
VALUE
GAIN VALUE
0
1x Gain
1
2x Gain
2
4x Gain
3
8x Gain
7:6
5
Reserved. Bit must be set to 0.
Proximity LED Drive Strength. Configures nominal LED current linearly
in steps of 20mA (actual current depends on factory-configuration of
LED drive strength).
PGLDRIVE
Reserved
ams Datasheet
[v1-12] 2015-May-14
4:1
0
VALUE
LED STRENGTH
0
10mA
1
30mA
2
50mA
…
10mA + (20mA * PGLDRIVE)
14
290mA
15
310mA
Reserved. Bit must be set to 0.
Page 31
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TMD4903 − Register Description
Configuration Register One (CFG1 0x90)
CFG1 has fields that enable or disable the saturation interrupts
for Proximity and ALS and set the electrical gain of the ALS
response.
Figure 36:
Configuration Register One
7
6
5
PGSIEN
ASIEN
4
3
2
1
0
Reserved
AGAIN
Field
Bits
Description
PGSIEN
7
Proximity Saturation Interrupt Enable. When asserted permits proximity
saturation interrupts to be generated.
ASIEN
6
ALS Saturation Interrupt Enable. When asserted permits ALS saturation
interrupts to be generated.
Reserved
5:2
Reserved. Bits must be set to 0.
ALS and Color Gain Control.
AGAIN
FIELD VALUE
CRGB GAIN VALUE
0
1x Gain
1
4x Gain
2
16x Gain
3
64x Gain
1:0
Revision ID Register (REVID 0x91)
Figure 37:
Revision ID Register
7
6
5
4
3
2
Reserved
0
REV_ID
Field
Bits
Reserved
7:3
Reserved. Default value is 00100.
REV_ID
2:0
Wafer die revision level. Default value is 010.
Page 32
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1
Description
ams Datasheet
[v1-12] 2015-May-14
TMD4903 − Register Description
ID Register (ID 0x92)
Figure 38:
ID Register
7
6
5
4
3
2
1
ID
0
Reserved
Field
Bits
Description
ID
7:2
Device Identification = 101110
Reserved
1:0
Reserved. Default value is 00.
Status Register (STATUS 0x93)
The read-only Status Register provides the status of the device.
Figure 39:
Status Register
7
6
5
4
3
2
1
0
ASAT
PGSAT
PINT
AINT
IINT
Reserved
CINT
Reserved
Field
Bits
ASAT
7
ALS Saturation. If ASIEN is set, indicates ALS saturation. Check the STATUS2 register
to differentiate between analog or digital saturation.
PGSAT
6
Proximity Saturation. If PGSIEN is set, indicates analog saturation during a previous
proximity cycle. Check the STATUS2 register to differentiate between ambient or
reflected light saturation.
PINT
5
Proximity Interrupt. If PIEN is set, indicates that a proximity detect or release event
that met the programmed proximity thresholds (PILT or PIHT) and persistence (PPERS)
occurred.
AINT
4
ALS Interrupt. If ASIEN is set, indicates that an ALS event that met the programmed
ALS thresholds (AILT or AIHT) and persistence (APERS) occurred.
IINT
3
IRBeam Interrupt. If IIEN is set, indicates that the device is asserting an
end-of-transmission interrupt after transmitting a block of data. Bit is mirrored in the
ISTATUS register.
Reserved
2
Reserved.
CINT
1
Calibration Interrupt. Indicates that either calibration is finished or that one of
certain events have occurred during normal operation. If each function is enabled,
CINT will be asserted if too many zeroes occur too often in a period of samples, if the
proximity baseline has decreased, or if at least one offset register has been adjusted.
Check the CALIBSTAT register to identify the triggering event(s).
Reserved
0
Reserved.
ams Datasheet
[v1-12] 2015-May-14
Description
Page 33
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TMD4903 − Register Description
CRGB Data Registers (0x94 − 0x9B)
Red, green, blue, and clear data are stored as 16-bit values. The
read sequence must read byte pairs (low followed by high)
starting on an even address boundary (0x94, 0x96, 0x98, or
0x9A) inside the CRGB Data Register block. In addition, reading
the Clear channel data low byte (0x94) latches all 8 data bytes.
Reading these 8 bytes consecutively (0x94 - 0x9A) ensures that
the data is concurrent.
Figure 40:
CRGB Data Registers
Field
Register
Bits
Description
0x94
7:0
Clear channel data low byte
0x95
15:8
Clear channel data high byte
0x96
7:0
Red channel data low byte
0x97
15:8
Red channel data high byte
0x98
7:0
Green channel data low byte
0x99
15:8
Green channel data high byte
0x9A
7:0
Blue channel data low byte
0x9B
15:8
Blue channel data high byte
CDATA
RDATA
GDATA
BDATA
Page 34
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ams Datasheet
[v1-12] 2015-May-14
TMD4903 − Register Description
Proximity Data Registers (0x9C – 0x9D)
Proximity data is stored as a 14-bit value (two bytes). PDATA has
a two-byte latch like 16-bit fields. Reading the low byte first
latches the high byte.
Proximity detection uses an Automatic Pulse Control (APC)
mechanism that adjusts the number of pulses per measurement
based on the magnitude of the reflected IR signal. As the
magnitude of the signal increases, the number of pulses
decreases. Proximity detection uses a 10-bit ADC that is
extended to a 14-bit dynamic range for PDATA using the
following formula:
PDATA = ADCvalue x (16 / proximity pulses)
PDATA is the average response of the non-masked proximity
photodiodes. If one or more photodiodes are masked
(CFG2 register 0x9F), the proximity response will remain the
same since it is an average of the active photodiodes. PDATA is
therefore proportional to the reflected energy per pulse,
independent of the number of pulses used.
Figure 41:
Proximity Data Register
Field
Register
Bits
Description
0x9C
7:0
Proximity data low byte
0x9D
13:8
Proximity data high byte
PDATA
ams Datasheet
[v1-12] 2015-May-14
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TMD4903 − Register Description
Status Register Two (STATUS2 0x9E)
Figure 42:
Status Register Two
7
6
5
4
3
2
1
0
PVALID
AVALID
Reserved
ASAT_
DIGITAL
ASAT_
ANALOG
PGSAT_
ADC
PGSAT_
REFLECTIVE
PGSAT_
AMBIENT
Field
Bits
Description
PVALID
7
Proximity Valid. Indicates that the proximity state has completed a
cycle since either an assertion of PEN or the last readout of PDATA.
AVALID
6
ALS Valid. Indicates that the ALS state has completed a cycle since
either an assertion of AEN or the last readout of at least one the
CDATAL register.
Reserved
5
Reserved.
ASAT_DIGITAL
4
ALS Digital Saturation. Indicates that the maximum counter value
has been reached. Maximum counter value depends on integration
time set in the ATIME register.
ASAT_ANALOG
3
ALS Analog Saturation. Indicates that the intensity of ambient
light has exceeded the maximum integration level for the ALS
analog circuit.
PGSAT_ADC
2
Proximity ADC Saturation. Indicates that the maximum ADC value
has occurred.
PGSAT_REFLECTIVE
1
Proximity Reflective Saturation. Indicates that the intensity of
reflected light has exceeded the maximum integration level for the
proximity analog circuit.
PGSAT_AMBIENT
0
Proximity Ambient Saturation. Indicates that the intensity of
ambient light has exceeded the maximum integration level for the
proximity analog circuit.
Page 36
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ams Datasheet
[v1-12] 2015-May-14
TMD4903 − Register Description
Configuration Register Two (CFG2 0x9F)
Figure 43:
Configuration Register Two
7
6
5
4
3
2
PMASK_E
PMASK_W
PMASK_S
PMASK_N
AMASK
1
0
Reserved
Field
Bits
PMASK_E
7
Proximity Mask East. Writing a 1 disables the East photodiode.
PMASK_W
6
Proximity Mask West. Writing a 1 disables the West photodiode.
PMASK_S
5
Proximity Mask South. Writing a 1 disables the South photodiode.
PMASK_N
4
Proximity Mask North. Writing a 1 disables the North photodiode.
AMASK
3
ALS Mask. Writing a 1 reduces the ALS gain by a factor of the ALS
photodiode pixels. Only the center 2x2 array of pixels remains enabled out
of the 4x4 array. Reduces ALS sensitivity for measurement of maximum
ambient light levels.
Reserved
2:0
ams Datasheet
[v1-12] 2015-May-14
Description
Reserved.
Page 37
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TMD4903 − Register Description
IRBeam Configuration Register (ICONFIG 0xA0)
Figure 44:
IRBeam Configuration Register
7
6
Reserved
5
4
3
IIEN
SLEW
Reserved
2
1
0
ISQZT
Field
Bits
Description
Reserved
7:6
IIEN
5
IRBeam Interrupt Enable. When asserted permits IRBeam interrupts to be
generated.
SLEW
4
Slew Rate Control. Must be set to 1. Slew rate is used to maintain LED pulse
symmetry.
Reserved
3
Reserved
Reserved
IRBeam Symbol Quiet Zone Time. Defines the delay between symbols as a
multiple of fundamental bit-times (IBT), calculated as follows:
tISQZT = nISQZT X tIBT
ISQZT
Page 38
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VALUE
QUIET ZONE DURATION
0
0 bit-times (Not activated)
1
5 bit-times
2
9 bit-times
…
nISQZT = 2ISQZT + 1 + 1
6
129 bit-times
7
257 bit-times
2:0
ams Datasheet
[v1-12] 2015-May-14
TMD4903 − Register Description
IRBeam Configuration Register Two
(ICONFIG2 0xA1)
Figure 45:
IRBeam Configuration Register Two
7
6
Reserved
5
IINVERT
Field
Bits
Reserved
7:6
IINVERT
5
4
3
IOUTPUT
2
1
0
IRCDCMODE
IDUTY
Description
Reserved.
IRBeam Invert. If asserted, the IRBeam output is inverted.
IRBeam Output Pin. Define which output pin used for IRBeam.
IOUTPUT
IRCDCMODE
VALUE
IRBEAM OUTPUT PIN
0
LDR
1
LDR (digital mode)
2
INT
3
GPIO
4:3
2
IRBeam Remote Control DC Mode. If asserted, the pattern is
transmitted in DC mode without carrier modulation. Timing is still
defined by the IBT register.
IRBeam Duty Cycle. Define the IRBeam duty cycle.
IDUTY
ams Datasheet
[v1-12] 2015-May-14
VALUE
IRBEAM DUTY CYCLE
0
50%
1
37.5%
2
25%
3
12.5%
1:0
Page 39
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TMD4903 − Register Description
IRBeam Symbol Looping Register (ISNL 0xA2)
Figure 46:
IRBeam Symbol Looping Register
7
6
5
4
3
2
1
0
ISNL
Field
ISNL
Bits
7:0
Description
IRBeam Symbol Looping. Sets the number of times that a Symbol is repeated in
each Packet. A Symbol is a single IRBeam data transmission. The following
equation describes the number of Symbols per Packet as a function of ISNL:
nSymbol Repetitions = ISNL + 1
IRBeam Inter-Symbol OFF Register
(ISOFF 0xA3)
Figure 47:
IRBeam Inter-Symbol OFF Register
7
6
5
4
3
2
1
0
ISOFF
Field
ISOFF
Page 40
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Bits
Description
7:0
Inter-Symbol Delay Time. Defines the delay (LED OFF) between Symbols within
Packets, tISDT, which can range from 4.25μs to 127.75μs. The minimum permitted
register value is 8. The following equation describes the time delay as a function
of ISOFF and IBT:
tISDT = [(2 X ISOFF) + 1] X tIBT
ams Datasheet
[v1-12] 2015-May-14
TMD4903 − Register Description
IRBeam Packet Looping Register (IPNL 0xA4)
Figure 48:
IRBeam Packet Looping Register
7
6
5
4
3
2
1
0
IPNL
Field
IPNL
Bits
7:0
Description
IRBeam Packet Looping. Sets the number of times that a Packet is repeated.
Each packet consists of repeated transmission of a Symbol. The following
equation describes the number of Packet repetitions as a function of IPNL:
nPacket Repetitions = IPNL + 1
IRBeam Inter-Packet OFF Register (IPOFF 0xA5)
Figure 49:
IRBeam Inter-Packet OFF Register
7
6
5
4
3
2
1
0
IPOFF
Field
IPOFF
Bits
7:0
Description
Inter-Packet Delay Time. Defines the delay (LED OFF) between Packet
repetitions, tIPDT, which can range from 10μs to 255.25μs. The minimum
permitted register value is 8. The following equation describes the time delay as
a function of IPOFF and IBT:
tISDT = [(2 X IPOFF) + 1] X tIBT
ams Datasheet
[v1-12] 2015-May-14
Page 41
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TMD4903 − Register Description
IRBeam Bit Time Register (IBT 0xA6)
Figure 50:
IRBeam Bit Time Register
7
6
5
4
3
2
Reserved
1
0
IBT
Field
Bits
Reserved
7:6
Reserved.
5:0
IRBeam Bit Time. Defines the fundamental IRBeam bit-time, tIBT, which can
range from 0.25μs to 64μs. The IRBeam bit time is set by the following equation:
IBT
Description
tIBT = (IBT + 1) X 0.25μs
IRBeam Symbol Length Register (ISLEN 0xA7)
Figure 51:
IRBeam Symbol Length Register
7
6
5
4
3
2
1
0
ISLEN
Field
ISLEN
Bits
Description
7:0
IRBeam Symbol Length. Defines the length of the IRBeam Symbol in bytes. The
minimum length is 2 bytes, meaning the minimum register value is 1. The
following equation describes the length of the Symbol in bytes:
lSymbol = ISLEN + 1
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TMD4903 − Register Description
IRBeam Status Register (ISTATUS 0xA8)
Figure 52:
IRBeam Status Register
7
6
5
4
3
2
Reserved
1
0
IINT
IBUSY
Field
Bits
Description
Reserved
7:2
IINT
1
IRBeam Interrupt. If IIEN is set, indicates that the device is asserting an
end-of-transmission interrupt after transmitting a block of data. Bit is mirrored
in the STATUS register.
IBUSY
0
IRBeam Busy. Indicates an IRBeam transmission is in progress.
Reserved.
IRBeam Start Register (ISTART 0xA9)
Figure 53:
IRBeam Start Register
7
6
5
4
Reserved
3
2
1
0
ISTARTREMCON
ISTARTMOBEAM
Field
Bits
Reserved
7:2
ISTARTREMCON
1
IRBeam Start Remote Control. Write 1 to start the remote control
machine, executing from address 0. Transmission can be stopped by
writing a 0 to this bit.
ISTARTMOBEAM
0
IRBeam Start mobeam. Write 1 to start a mobeam transmission.
Transmission can be stopped by writing a 0 to this bit.
ams Datasheet
[v1-12] 2015-May-14
Description
Reserved.
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TMD4903 − Register Description
Configuration Register Three (CFG3 0xAB)
Figure 54:
Configuration Register Three
7
6
5
4
Reserved
LTF_USEPROX
Reserved
SAI
Field
Bits
Reserved
7
3
2
1
0
Reserved
Description
Reserved.
Use Proximity Photodiodes for ALS Measurement. Connects the IR-sensitive
proximity photodiodes to the ALS engine in order to collect ALS data in the IR
band. The data registers contain the following channel data depending on the
LTF_USEPROX setting.
16-bit Output Registers
LTF_USEPROX
Reserved
6
5
LTF_USEPROX
High
Low
0
1
0x95
0x94
Clear
North
0x97
0x96
Red
South
0x99
0x98
Green
West
0x9B
0x9A
Blue
East
Reserved.
Sleep After Interrupt. Powers down the device at the end of a proximity/ALS
cycle if an interrupt has been generated. Note that SAI does not modify any
register bits directly, it rather uses the interrupt signal to turn off the oscillator. The
only way to "wake up" the device from SAI-sleep is by clearing the SAI_ACTIVE
flag.
SAI
4
PON
SAI
INT (Low Active)
0
Reserved
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3:0
Oscillator
Off
1
0
On
1
1
1
On
1
1
0
Off (sleep after interrupt)
Reserved.
ams Datasheet
[v1-12] 2015-May-14
TMD4903 − Register Description
Configuration Register Four (CFG4 0xAC)
Figure 55:
Configuration Register Four
7
6
5
4
ALS_INT_
DIRECT
ALS_INT_
DIRECT_GPIO
PROX_INT_
DIRECT
PROX_INT_
DIRECT_GPIO
Field
3
2
1
0
Reserved
Bits
Description
ALS_INT_DIRECT
7
ALS Interrupt Direct. If asserted, then the INT pin shows the ALS state
directly and it is not necessary to clear the interrupt. If the CLEAR data
exits the threshold range from within, the INT pin is asserted. The
interrupt pin is de-asserted when the CLEAR data re-enters the
threshold range. As long as the CLEAR data is within the thresholds,
the INT pin is not asserted.
ALS_INT_DIRECT_GPIO
6
ALS Interrupt Direct on GPIO Pin. If asserted, the GPIO pin shows
the ALS interrupt state directly instead of the INT pin. This function
operates in the same manner otherwise as ALS_INT_DIRECT.
5
Proximity Interrupt Direct. If asserted, then the INT pin shows the
proximity state directly and it is not necessary to clear the interrupt. If
PDATA crosses the upper threshold from below, the INT pin is
asserted. The interrupt pin is only de-asserted when PDATA crosses
the lower threshold from above. As long as PDATA is below the lower
threshold, the INT pin is not asserted.
PROX_INT_DIRECT_GPIO
4
Proximity Interrupt Direct on GPIO Pin. If asserted, the GPIO pin
shows the proximity interrupt state directly instead of the INT pin. This
function operates in the same manner otherwise as
PROX_INT_DIRECT.
Reserved
3:0
PROX_INT_DIRECT
ams Datasheet
[v1-12] 2015-May-14
Reserved.
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TMD4903 − Register Description
Configuration Register Five (CFG5 0xAD)
Figure 56:
Configuration Register Five
7
6
Reserved
5
4
3
2
1
0
LONG_LTFSTOP_
DISCARD_ALS
Reserved
DISABLE_IR_
CORRECTION
PROX_FILTER_
DOWNSAMPLE
PROX_FILTER_
SIZE
PROX_
FILTER
Field
Bits
Reserved
7:6
Description
Reserved.
LONG_LTFSTOP_DISCARD_
ALS
5
Long Disruption Discard ALS. Aborts ALS integration that is
disrupted if the proximity state is entered (sensor field of view is
obstructed) or an IRBeam transmission is executed (long disruption
while LED is pulsed for an extended duration). Immediately after
proximity mode is exited or IRBeam transmission is complete, a new
ALS integration is started. When restarting ALS, this function ignores
wait configuration, which may cause more ALS measurements to
occur than expected.
Reserved
4
Reserved.
DISABLE_IR_CORRECTION
3
Disable IR Correction. Default is 1. If bit is 0, then calculate
IR=(R+G+B-C)/2 and store R'=R-IR, G', B', and C' in the color DATA
registers.
2
Proximity Filter Downsample. If PROX_FILTER = 1, then, if asserted,
PDATA and proximity interrupt check are performed only every n
proximity samples. If not asserted, then proximity filtering uses a
moving window: PDATA is updated every cycle and proximity
interrupt is checked every cycle.
PROX_FILTER_
DOWNSAMPLE
Proximity Filter Size. Determines the number of consecutive
proximity samples to average to filter out noise.
PROX_FILTER_SIZE
PROX_FILTER
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1
0
VALUE
FILTER
0
2 samples
Proximity Filter. If asserted, enables proximity filter functionality.
Depending on PROX_FILTER_SIZE, 2 or 4 consecutive proximity
samples are averaged.
ams Datasheet
[v1-12] 2015-May-14
TMD4903 − Register Description
Status Register Three (STATUS3 0xB3)
Figure 57:
Status Register Three
7
6
5
4
3
2
Reserved
Field
Bits
Reserved
7:2
1
0
SAI_ACTIVE
Reserved
Description
Reserved.
SAI_ACTIVE
1
Sleep-After-Interrupt Active. If SAI is set, indicates that the
oscillator has been stopped and the device is in sleep after an
interrupt. SAI_ACTIVE must be cleared (CONTROL 0xBC[0]:
CLEAR_SAI_ACTIVE) to clear SAI and resume chip operation.
Reserved
0
Reserved.
Control Register (CONTROL 0xBC)
Figure 58:
Control Register
7
6
5
4
3
2
1
Reserved
Field
Bits
Reserved
7:1
SAI_ACTIVE_CLEAR
ams Datasheet
[v1-12] 2015-May-14
0
0
SAI_ACTIVE_CLEAR
Description
Reserved.
Sleep-After-Interrupt Active Clear. If SAI is set and SAI_ACTIVE is true
(an Interrupt has occurred), asserting this pin clears the SAI_ACTIVE flag
and restarts the device oscillator to resume chip operation if functions
are enabled.
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TMD4903 − Register Description
Auxiliary ID Register (AUXID 0xBD)
Figure 59:
Auxiliary ID Register
7
6
5
4
3
Reserved
2
1
0
AUXID
Field
Bits
Description
Reserved
7:4
Reserved.
AUXID
3:0
Auxiliary ID. Value is 0000.
Proximity Offset Registers
(0xC0 − 0xC7)
Proximity offset values have a range of ±255 and are expressed
as 9-bit two’s-complement values. Do not program values
outside of this range. Only the lower 9 bits are significant, but
the high byte must only be programmed with values of 0x00
(indicates that the low byte has a positive value) or 0xFF
(indicates that the low byte has a negative value).
Figure 60:
Proximity Offset Registers
Field
Register
Bits
Description
0xC0
7:0
North channel offset low byte
0xC1
15:8
North channel offset high byte
0xC2
7:0
South channel offset low byte
0xC3
15:8
South channel offset high byte
0xC4
7:0
West channel offset low byte
0xC5
15:8
West channel offset high byte
0xC6
7:0
East channel offset low byte
0xC7
15:8
East channel offset high byte
OFFSETN
OFFSETS
OFFSETW
OFFSETE
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TMD4903 − Register Description
Autozero Configuration Register
(AZ_CONFIG 0xD6)
Figure 61:
Autozero Configuration Register
7
6
5
4
3
2
1
0
AZ_NTH_ITERATION
Field
Bits
Description
ALS Autozero Frequency. Sets the frequency at which the device
performs autozero of the ALS pulse counter.
AZ_NTH_ITERATION
VALUE
AUTOZERO FREQUENCY
0
Never
1
Every cycle
2
Every 2 cycles
…
Every (AZ_NTH_ITERATION) cycles
253
Every 253 cycles
254
Every 254 cycles
255
Only once (before 1st cycle)
7:0
Calibration Register (CALIB 0xD7)
Figure 62:
Calibration Register
7
6
5
4
3
2
Bits
Reserved
7:1
START_OFFSET_
CALIB
ams Datasheet
[v1-12] 2015-May-14
0
0
START_OFFSET
_CALIB
Reserved
Field
1
Description
Reserved.
Start Offset Calibration. Starts the proximity offset register calibration
routine. Results are stored in the Proximity Offset Registers (0xC0 – 0xC7).
The CALIB_FINISHED flag is asserted when calibration is complete and an
interrupt (CINT) is asserted if CIEN is set. Calibration can be stopped by
writing a 0 to this field.
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TMD4903 − Register Description
Calibration Configuration Register Zero
(CALIBCFG0 0xD8)
Figure 63:
Calibration Configuration Register Zero
7
6
5
4
3
2
Reserved
DCAVG_
AUTO_OFFSET_
ADJUST
Reserved
ELECTRICAL_
CALIBRATION
BINSRCH_
SKIP
1
0
DCAVG_ITERATIONS
Field
Bits
Reserved
7
Reserved.
DCAVG_AUTO_OFFSET_ADJUST
6
DC Averaging Auto Offset Adjust. If set, then during DC
averaging, whenever an ADC measurement is zero, the
appropriate offset register will be decreased and the
OFFSET_ADJUSTED flag is set. Note also that DC averaging
is not automatically restarted when this happens, so the
calculated baseline might be wrong. Software could restart
averaging in this case.
Reserved
5
Reserved.
4
Enable Electrical Calibration. When asserted the
calibration routine will perform an internal electrical
calibration to adjust the proximity offset registers to
remove electrical crosstalk – there is no optical response at
all for this routine. When not asserted, calibration will
measure both optical and electrical crosstalk during
calibration.
3
Binary Search Skip. When asserted the calibration routine
will skip the binary search step. It is useful if zeroes are
detected during the DC averaging process to manually
reset the baseline and reduce the likelihood of zero counts.
ELECTRICAL_CALIBRATION
BINSRCH_SKIP
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Description
ams Datasheet
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TMD4903 − Register Description
Field
Bits
Description
DC Averaging Iterations. Sets the number of proximity
results during calibration that are averaged after the binary
search is complete. During this period, whenever a result is
zero, the appropriate offset register is automatically
decremented. The default value is 4 (16 iterations).
DCAVG_ITERATIONS
ams Datasheet
[v1-12] 2015-May-14
VALUE
SAMPLES
0
Skip
1
2
2
4
…
nIterations = 2DCAVG_ITERATIONS
6
64
7
128
2:0
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TMD4903 − Register Description
Calibration Configuration Register One
(CALIBCFG1 0xD9)
Figure 64:
Calibration Configuration Register One
7
6
PXDCAVG_
AUTO_
GTHR
PROX_
AUTO_OFFSET_
ADJUST
Field
5
4
3
2
PXDCAVG_
AUTO_
BASELINE
Reserved
1
0
PXDCAVG_BASELINE_WINDOW
Bits
Description
7
Proximity Automatic Thresholds. When asserted, GTHR_IN
and GTHR_OUT are automatically written with a multiple of
the PBSLN every time PBSLN changes. The multiplication
factor is set in AUTO_GTHR_IN_MULT. PBSLN can only change
if PXDCAVG_AUTO_BASELINE is asserted and PBSLN_MEAS is
less than PBSLN.
PROX_AUTO_OFFSET_ADJUST
6
Proximity Auto Offset Adjust. If set, then during
proximity/gesture mode, whenever an ADC measurement is
zero, the appropriate offset register will be decreased. Will set
the OFFSET_ADJUSTED flag if it happens.
Reserved
5:4
PXDCAVG_AUTO_GTHR
PXDCAVG_AUTO_BASELINE
3
Reserved.
Proximity Automatic Baseline. When asserted,
PBSLN_MEAS is written to PBSLN whenever PBSLN_MEAS is
less than PBSLN. When this happens, the
BASELINE_ADJUSTED flag is raised. The default value is 1.
Prox Baseline Averaging Window. Sets the number of
proximity samples averaged to calculate PBSLN_MEAS, which
is updated at the end of each window. The default value is 16
samples.
PXDCAVG_BASELINE_WINDOW
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2:0
VALUE
SAMPLES
0
Skip
1
2
2
4
…
nIterations = 2PXDCAVG_BASELINE_WINDOW
6
64
7
128
ams Datasheet
[v1-12] 2015-May-14
TMD4903 − Register Description
Interrupt Enable Register (INTENAB 0xDD)
Figure 65:
Interrupt Enable Register
7
6
5
4
3
2
1
0
ASIEN
PGSIEN
PIEN
AIEN
IIEN
Reserved
CIEN
Reserved
Field
Bits
ASIEN
7
ALS Saturation Interrupt Enable. When asserted permits ALS
saturation interrupts to be generated. Bit is mirrored in the CFG1
register.
PGSIEN
6
Proximity Saturation Interrupt Enable. When asserted permits
proximity saturation interrupts to be generated. Bit is mirrored in the
CFG1 register.
PIEN
5
Proximity Interrupt Enable. When asserted permits proximity
interrupts to be generated, subject to the proximity thresholds and
persistence filter. Bit is mirrored in the ENABLE register.
AIEN
4
ALS Interrupt Enable. When asserted permits ALS interrupts to be
generated, subject to the ALS thresholds and persistence filter. Bit is
mirrored in the ENABLE register.
IIEN
3
IRBeam Interrupt Enable. When asserted permits IRBeam interrupts to
be generated. Bit is mirrored in the ICONFIG register.
Reserved
2
Reserved. Bit must be set to 0.
CIEN
1
Calibration Interrupt Enable. When asserted permits calibration
interrupts to be generated.
Reserved
0
Reserved.
ams Datasheet
[v1-12] 2015-May-14
Description
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TMD4903 − Register Description
Interrupt Clear Register (INTCLEAR 0xDE)
Figure 66:
Interrupt Clear Register
7
6
5
4
3
2
1
0
INTCLEAR_
ASAT
INTCLEAR_
PGSAT
INTCLEAR_
PINT
INTCLEAR_
AINT
INTCLEAR_
IINT
Reserved
INTCLEAR_
CINT
Reserved
Field
Bits
INTCLEAR_ASAT
7
Clear Interrupt: Analog Saturation. Clears the analog saturation
interrupt.
INTCLEAR_PGSAT
6
Clear Interrupt: Proximity Saturation. Clears the proximity saturation
interrupt.
INTCLEAR_PINT
5
Clear Interrupt: Proximity. Clears the proximity interrupt.
INTCLEAR_AINT
4
Clear Interrupt: ALS. Clears the ALS interrupt.
INTCLEAR_IINT
3
Clear Interrupt: IRBeam. Clears the IRBeam interrupt.
Reserved
2
Reserved. Bit must be set to 0.
INTCLEAR_CINT
1
Clear Interrupt: Calibration. Clears the calibration interrupt.
Reserved
0
Reserved.
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Description
ams Datasheet
[v1-12] 2015-May-14
TMD4903 − Application Information
Application Information
Figure 67:
TMD4903 Typical Application Circuit
VBUS
VDD
VDD
VLED
VLED
22
VDD
4.7µF
GND
SCL
SDA
ams Datasheet
[v1-12] 2015-May-14
LEDA
"
% LDR
$
!
&
#
(
1µF
>4.7µF
INT
GPIO
'
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TMD4903 − Application Information
Figure 68:
TMD4903 Recommended Circuit Layout
Note(s) and/or Footnote(s):
1. For best performance, all components should be positioned as close as possible to the TMD4903. Traces and vias should be as large
as possible. The proximity of the capacitors is most important.
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TMD4903 − Application Information
Remote Control
General Description of RC Functionality
The TMD4903 is equipped with Remote Control functionality
which is used to generate and transmit patterns over IR for
electronic equipment (E.g. television, DVD, or audio receiver).
Virtually all protocols can be accommodated by the specialized
architecture of the Remote Control engine. The engine contains
256 bytes of pattern RAM and controls for carrier frequency,
duty cycle and pattern repetition to easily create and broadcast
a complete command waveform. The command waveform is
output on a device pin allowing direct control of an external
transistor and LED (pull-up resistor required). The integrated
LED may also be used to output the IR waveform.
Detailed Description of RC Functionality
Remote Control functionality uses a digital core that is
independent of the analog sensor operation. The logic internal
to the digital core is activated when IBEN=1. In this operational
mode the LDR pin is exclusively acquired; during this time
sensor functionality will not operate.
Most of the functional engines are controlled by dedicated
registers; however, some devices use a “shared register”
scheme. For example, this device uses address space: 0xA0 to
0xAF to also control mobeam operation. Because each
functional block serves a different purpose and utilizes
common on-chip resources, only one may be activated at a
time.
ams Datasheet
[v1-12] 2015-May-14
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TMD4903 − Application Information
Block Diagram of Remote Control Functionality
Figure 69:
Block Diagram of RC Functionality
VDD
VDD
OSCILLATOR
SCL
SDA
I2C
256 X 8-bit
Pattern RAM
Sensor
Engines
16 X 16-bit
Time Word RAM
INT
Control Registers
INT Flags
LEDA
LDR
Remote
Control
Engine
GPIO
Digital Core
GND
TMD4903
Block Diagram of RC Functionality: Resources associated with Remote Control.
There are many different remote control protocols currently in
use; and to meet the multitude of requirements the remote
control engine has been designed to be flexible. The remote
control engine consists of four major components: Pattern RAM,
Timeword RAM, control registers, and pattern output pin (or
integrated LED).
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TMD4903 − Application Information
Pattern RAM
The Pattern RAM is 256 bytes in length and is divided into two
banks with 128 bytes each. Both banks must be used to enable
all Pattern RAM. To access the Pattern RAM, write 0 or 1 to
RAM_BANK (0x8D<0>). Functionally, the RAM is split into the
MSB and LSB nibbles; each of which are used to index the
Timeword RAM table. The MSB is used for “pulses”, and the LSB
is used for “gaps”.
Figure 70:
Terminology of Pattern RAM
Terminology
Pulse
First of Repeat part
Second of Repeat part
LED Modulation
Gap
“Single” sub-pattern
“Repeated” sub-pattern
“Complete” Pattern
Terminology of Pattern RAM: Pulses/Gaps, and Single/Repeated/Complete Patterns are shown.
The pulse-gap pair defines when the LED is modulating or
deactivated, respectively. The control logic processes the RAM
locations sequentially until special operator values are
encountered.
ams Datasheet
[v1-12] 2015-May-14
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TMD4903 − Application Information
Figure 71:
Pattern RAM Table
Pattern RAM
Address (Bank 0)
Data (Pulse-Gap)
0
0x0 to 0xFF
1
0x0 to 0xFF
2
0x0 to 0xFF
3
0x0 to 0xFF
~
~
255
0x0 to 0xFF
Pattern RAM: Volatile memory used for storing pattern data.
Note(s) and/or Footnote(s):
1. T_DATA = 0xFE is a special instruction. The following value in RAM becomes
the start address of any repeated sub-pattern.
2. T_DATA = 0xFF is a special instruction. It identifies the end of the pattern.
There are two special values that control the flow of the pattern:
Stop and Repeat-destination. A Stop is signified by the value of
0xFF loaded into a pattern ram location. The value is analogous
to a null character at the end of a text file. Any remaining RAM
after the 0xFF operator is encountered is not executed and the
pattern is finished. The Repeat-destination operator is signified
by a value of 0xFE followed by the start address of any repeated
sub-pattern. This value is analogous to a “goto” statement. Once
this value is encountered instruction pointer to the pattern RAM
is changed to the address stored in the next pattern RAM
location. These data values will not be decoded by the logic as
a reference/pointer to the timeword table, that is, 0xFF will not
index timeword location 15 for pulse and gap.
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TMD4903 − Application Information
Timeword RAM
The Timeword RAM is a dedicated table that contains sixteen,
16-bit words which are used to set pulse and gap widths. The
pulse and gap widths are described as a multiple of carrier
periods, TCAR. For example, if the LED must modulate for 8
carrier periods, then be off for 15 carrier periods, index 0 could
be loaded with 0x0008 and index 1 could be loaded with
0x000F. A pattern RAM value of 0x01 would result in LED
activation for 8 TCARs, as stored in index 0, and a LED
deactivation for 15 TCARs.
Similarly to pattern RAM, the Timeword table also has a special
operator. If the timeword value is zero, then whatever state the
LED was in last (I.e. modulating or deactivated) will be
continued into the next pulse or gap defined in pattern RAM.
For example, if the RAM Pulse nibble (MSB) indexes a timeword
set to 5, and the gap (LSB) nibble indexes a timeword set to 0,
the LED will modulate for 5TCARs then instead of deactivating,
the modulation is continued into the next pulse in pattern RAM.
In this way pulses or gaps longer than 65535 TCAR s can be
generated.
Figure 72:
Timeword RAM Table
Timeword RAM
I2C Address (Bank 1)
T_INDEX
T_DATA
0
0 to 65535
0x01 8-bit MSB
0x00 8-bit LSB
1
0 to 65535
0x03 8-bit MSB
0x02 8-bit LSB
2
0 to 65535
0x05 8-bit MSB
0x04 8-bit LSB
3
0 to 65535
0x07 8-bit MSB
0x06 8-bit LSB
~
~
~
~
15
0 to 65535
0x0F 8-bit MSB
0x1E 8-bit LSB
Timeword RAM: Volatile memory used for storing 16-bit timing data.
The Timeword table is located in RAM bank two. Each 16-bit
word is accessible using two byte locations: MSB bytes are
stored in even addresses and LSBs are stored in odd addresses.
For example, if 0x2953 is to be stored at index 0, then 0x29 is
written to: bank 2, I²C address of 0x00, and 0x53 is written to
bank 2, I²C address of 0x01.
ams Datasheet
[v1-12] 2015-May-14
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TMD4903 − Application Information
Control Registers
The remote control engine has 19 fields that govern pattern
timing and flow, output selection, and report status. All
pertinent fields are listed in the figure below.
Figure 73:
Remote Control Registers and Fields
Register / Bit
Address
Description
ENABLE<PON>
0x80<0>
Power On
ENABLE<IBEN>
0x80<7>
IRBeam Enable
CFG0 <RAM_BANK>
0x8D<0>
RAM Bank Select
PGCFG1 <PGLDRIVE>
0x8F<4:0>
LED Drive Strength
STATUS <IINT>
0x93<3>
IRBeam Interrupt (mirrors ISTATUS<IINT>)
ICONFIG <IIEN>
0xA0<5>
IRBeam Interrupt Enable
ICONFIG2 <IINVERT>
0xA1<5>
IRBeam Polarity Inversion
ICONFIG2 <IOUTPUT>
0xA1<4:3>
ICONFIG2 <IRCDCMODE>
Output Select
0xA1<2>
DC Carrier Select
ICONFIG2 <IDUTY>
0xA1<1:0>
Duty Cycle Select
ISNL <ISNL>
0xA2<7:0>
Number of Repeated Sub-pattern Loops
ISOFF <ISOFF>
0xA3<7:0>
Pause between Sub-pattern Bursts
IPNL <IPNL>
0xA4<7:0>
Number of Complete Pattern Loops
IPOFF <IPOFF>
0xA5<7:0>
Pause between Pattern Bursts
IBT <IBT>
0xA6<5:0>
Carrier Selection Time
ISTATUS <IINT>
0xA8<1>
IRBeam Interrupt
ISTATUS <IBUSY>
0xA8<0>
IRBeam Busy
ISTART <ISTARTREMCON>
0xA9<1>
Remote Control Start Pattern Burst
INTCLEAR <INTCLEAR_IINT>
0xDE<3>
IRBeam Interrupt Clear
Pertinent Control Registers: Resources associated with Remote Control.
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[v1-12] 2015-May-14
TMD4903 − Application Information
Carrier frequency, Duty cycle, and Pause (the delay between
complete patterns) comprise the registers associated with
timing. Carrier periods are selectable in 250ns increments in
with register settings in the range of 8 to 255. Carrier
frequencies are in the range of 16 kHz to 460 kHz. Typical carrier
frequencies are listed in the table below. Protocols that do not
use carriers can also be accommodated by enabling the DC
Carrier Selection bit. The duty cycle of the carrier is selectable
as: 50%, 37%, 25%, and 12%. Note that these duty cycles do not
translate exactly to the actual LED duty cycle, depending on the
external circuit. Finally, if desired, complete pattern rebursts are
separated by a selectable delay of 0us to 2.55s, in 10us
increments.
Figure 74:
Carrier Frequencies
Desired Frequency (kHz)
Generated Frequency (kHz)
IBT
36
36.04
111
38
38.10
105
40
40.00
100
56
56.34
71
450
444.44
9
Carrier Frequencies: Typical carrier frequencies can be reproduced to closely match the desired value.
Controls associated with the output are:
Output select, Output Polarity Inversion, and LED Drive
Strength. Output Select is used to choose output on the
integrated LED or the GPIO pin. The polarity inversion control
inverts the waveform on both the LED and the GPIO pin if
enabled. The LED Drive Strength controls the current through
the integrated LED which effectively sets its intensity.
Controls associated with interrupts are:
Pattern Burst Interrupt Enable, Pattern Burst Interrupt flag,
Pattern Burst Interrupt Clear, Pattern Burst Interrupt Force, and
Pattern Burst Busy. Following an entire pattern burst, including
all repeats, loops, and delays, a pattern burst interrupt bit is set.
This bit is readable from two locations: STATUS register and
ISTATUS register. If the interrupt enable bit is set, then the INT
pin will also activate when the burst is finished. To clear the
interrupt, the host must write a zero to IRBeam Interrupt Clear
(0xDE<3>). For debugging purposes the interrupt bits and pin
can be forced to activate by setting the Pattern Burst Interrupt
Force bit. The Pattern Burst Busy bit is automatically set
whenever a pattern is actively being transmitted; it is reset once
the remote control engine returns to the IDLE state.
ams Datasheet
[v1-12] 2015-May-14
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TMD4903 − Application Information
Controls associated to define the number of complete pattern
loops and sub-pattern repeats are: Number of Repeated
Sub-pattern Loops and Number of Complete Pattern Loops.
As depicted below, the number of “run-once” pattern loops sets
the amount of additional iterations, up to 254. If the register is
set to 0xFF then the sub-pattern is continuously repeated until
the value is changed or IBEN bit is reset.
Figure 75:
Complete Pattern Loops
Protocols with No Repeated
Sub-Patterns
IDLE
START
Loop IPNL Times
“Run-once”
Subpattern
Pause
IDLE
Complete Pattern Loops: The red box represents a “run-once” pattern. The pattern begins at pattern ram
address 0x00 and bursts until the end of the pattern is encountered. The complete pattern can be reiterated 1 to
254 times, or continuously.
As depicted below, the number of repeated sub-pattern loops
sets the amount of additional “repeated part” burst iterations,
up to 254. If the register is set to 0xFF then the sub-pattern is
continuously repeated until the value is changed or IBEN bit is
reset.
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TMD4903 − Application Information
Figure 76:
Number of Repeated Sub-Pattern Loops
Protocols with Repeated
Sub-Patterns
Loop IPNL Times
Loop ISNL Times
IDLE
START
“Run-once”
Subpattern
Repeat
Subpattern
Pause
IDLE
Protocols with “Repeated” Sub-Patterns: The blue box represents a repeated part of a pattern. These
sub-patterns begin at an address within the red box and burst until the end of the pattern is encountered. The
repeated sub-pattern can be reiterated 1 to 254 times, or continuously.
Digital Logic
The Simplified Flow Diagram depicts the basic premise of how
an entire waveform is generated. Protocols of the form
described in Figure 75 and Figure 76 can be generated using
the mechanism depicted below. Any functionality show in the
red, blue, or green boxes can be activated or omitted via control
register settings or special operators in pattern RAM to produce
virtually any waveform.
Typically, patterns are built by assembling pulses and gaps in a
particular order. To this end the length of time for each pulse
and gap, measured in multiples of carrier periods, as well as the
order of each pulse/gap pair are specified in the
equipment/button data. The remote control engine can directly
accept the data in this format. Pulse/Gap order is stored in
pattern RAM and pulse/gap time durations are stored in the
Timewords table.
ams Datasheet
[v1-12] 2015-May-14
Page 65
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TMD4903 − Application Information
Figure 77:
Simplified Flow Diagram
IDLE
N
Simplified Flow Diagram for Remote Control
(With Repeated Sub-Pattern)
START
?
Y
Set RAM Address to
0x00
Set RAM Address to
“Repeated” Start
Location
Burst “Pulse” for x
Carrier Periods
(LED ON)
Burst “Pulse” for x
Carrier Periods
(LED ON)
Burst “Gap” for y
Carrier Periods
(LED ON)
Delay
(0ms to 2.55s)
Burst “Gap” for y
Carrier Periods
(LED ON)
At the END of
Pattern
?
N
Go to next RAM
location
Decrement Loop
Counter
Decrement Repeat
Counter
Y
N
N
At the END of
Pattern
?
N
Y
Done Repeating
?
Y
Done Looping
?
Y
Interrupt
Go to next RAM
location
IDLE
Simplified Flow Diagram: The digital logic in the remote control engine has been tailored to fit the data format
and protocol specifications for IR remote control. “Press and Release” type buttons (E.g. Power) are generated
using the logic in the red box (logic in the blue box is not needed). “Press and Hold” type buttons (E.g. Volume+)
are generated using logic in both the red and blue boxes.
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TMD4903 − Application Information
The digital logic in the remote control engine has been tailored
to fit the data format and protocol specifications for IR remote
control. “Press and Release” type buttons (E.g. Power) are
generated using the logic in the red box. “Press and Hold” type
buttons (E.g. Volume+) are generated using logic in both the
red and blue boxes. Figure 78 depicts how a command pattern
with a repeated sub-pattern is created using the logic shown in
the Simplified Flow Diagram. All of the “run-once” sub-pattern
and the “first” instance of the “repeated” sub-pattern is actually
run by the logic in the red box. The second instance of the
“repeated” sub-pattern is run by the logic in the blue box.
Figure 78:
Pattern Generation by Logical Block
Pattern Generation by
Digital Logic Block
Second of Repeat part
LED Modulation
First of Repeat part
Generated by “red box logic”
Generated by “blue box logic”
“Complete” Pattern
Pattern Generation: All of the “one-time” sub-pattern and the “first” instance of the “repeated” sub-pattern is
actually run by the logic in the red box. The second instance of the “repeated” sub-pattern is run by the logic in
the blue box.
ams Datasheet
[v1-12] 2015-May-14
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TMD4903 − Application Information
Complete patterns can also be automatically reburst from
1 to 254 times or continuously. Complete patterns can also be
separated by a pause, or time delay, as generated by the logic
in the green block. The entire pattern consists of a multiple of
complete patterns and pause delays. During this length of time
the entire pattern is bursting the IBUSY bit is set. Upon
completion the IBUSY bit is cleared and the interrupts are set.
Figure 79:
Entire Pattern Waveform
Entire Pattern Waveform
Pause
Pause
Pause
“Entire” Pattern
Entire Pattern: Complete patterns can also be separated by a pause, or time delay, as generated by the logic in
the green block. The entire pattern consists of a multiple of complete patterns and pause delays. During the
length of time the entire pattern is bursting, the PBUSY bit is set.
Refer to the Remote Control Engine diagram which depicts the
how the engine functions in great detail.
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TMD4903 − Application Information
Figure 80:
Detailed Flow Diagram of the Remote Control Engine
START
Output
Pattern
PBEN = 1
IDLE
Remote
Control
Engine
START
?
Y
Start
Get MSB Nibble
from RAM Data
(RDATA-MSBn)
IBUSY = 1
COUNTERW = IPNL
TIME_INDEX =
MSB NIBBLE
COUNTERR = ISNL
Pause
(if any)
RAM_ADDRESS = 0
Get RAM Data Byte
(RDATAn)
N
Start
RDATAn == 0xFE
&&
COUNTERR >=0
?
Y
TDATAMSB ==
0
?
Y
RAM_ADDRESS =
START LOCATION OF
REPEATED PATTERN
TIMERP = IPOFF
Pause
(if any)
N
COUNTERW--
N
Activate Modulated
Output
N
Y
TIMERP > 0
Have TDATAMSB
carrier periods
been output
?
Y
RDATAn == 0xFF
?
Y
COUNTERW > 0
?
N
N
Get LSB Nibble from
RAM Data
(RDATA-LSBn)
Y
Delay 10us
TIME_INDEX =
LSB NIBBLE
Output
Pattern
IBUSY = 0
IINT = 1
TIMERP--
TDATALSB ==
0
?
Exit
COUNTERR
< 255
?
N
Y
N
IIEN == 1
?
Deactivate
Modulated Output
N
Y
Y
COUNTERR--
ASSERT INT PIN
N
RAM_ADDRESS++
Done
Repeated Sub-Pattern
Complete Waveform
Have TDATALSB
carrier periods
been output
?
Y
Exit
Remote Control Engine: Complete guide to the inner workings and use of the remote control functionality.
ams Datasheet
[v1-12] 2015-May-14
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TMD4903 − Application Information
Electrical and Optical Output
The electrical or optical output of the remote control engine
can be realized in three ways: use of the integrated top-facing
LED, use of the LDR pin to directly drive an external LED, or use
of the GPIO pin to drive an external FET and IR LED.
The LDR pin has a regulated current sink with selectable drive
value. This is an attractive way to use an external LED without
having an additional LED drive FET. If this method is to be used,
then LEDA must be disconnected from the circuit. Since the
cathode of the integrated LED is connected to the LDR pin
internal to the module any current that is sourced through LEDA
will reduce the current available on the external remote control
LED. When the remote control functionality is not used the
external LED must be electrically disconnected from the LDR
pin to prevent it from illuminating.
Figure 81:
External IR LED Using the LDR Pin
VLED
VBUS
VDD
VDD
1µF
GND
SCL
SDA
VDD
µP
22Ω
µP
4 LEDA
1
3
VLED
6 GPIO
TMD4903
7
2
5
1µF
>4.7µF
INT
LDR
8
Remote Control Circuit Option #1
Recommended Connection: Option number one.
If the LDR pin is not used as the pattern output, the GPIO pin
can be used. With this method both the LEDA and external
remote control IR LED may remain connected to the LED power
supply, but an additional FET is needed to drive the remote
control LED.
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TMD4903 − Application Information
Figure 82:
External IR LED Using the GPIO Pin
VBUS
VDD
VDD
VLED
22Ω
VDD
1µF
GND
SCL
SDA
1
1µF
5 LDR
3
VLED
4 LEDA
TMD4903
7
2
6
>4.7µF
INT
GPIO
8
Remote Control Circuit Option #2
Recommended Connection: Option number two.
Example Waveform and Device Setup
A practical example is included to describe how each register
is used and how to setup the device to burst a real waveform.
The physical waveform, as seen on an oscilloscope, is described
by the depiction in Figure 80. The Figure 83 depicts the
mechanics to precondition the remote control engine for
proper operation.
ams Datasheet
[v1-12] 2015-May-14
Page 71
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TMD4903 − Application Information
Figure 83:
Practical Example
Example
1. Carrier Frequency: 38kHz (TCAR = 26us)
Time Words Table
2. Duty Cycle = 25%
3. Non-repeat count=5 (LED ON-LED OFF)
334-177, 22-22, 22-60, 60-22, 22-1541
4. Repeat count=2 (LED ON-LED OFF)
334-88 22-3694
Run 2 times
5. Repeat compete pattern 3 times.
6. Delay 100us between complete patterns.
Pattern Table
ADDRESS
T_DATA
0
0x01
x01
1
2
0x22
0x23
3
0x32
32
4
5
0x24
0x05
6
7
8
9
0x26
0xFE
0x05
x05
0xFF
T_INDEX
T_DATA
0
1
2
3
4
5
6
334
177
22
60
1541
88
3694
0x01, 0x01
0x03, 0x00
0x05, 0x00
0x07, 0x00
0x09, 0x06
0x0B, 0x00
0x0D, 0x0E
0x00, 0x4E
0x02, 0xB1
0x04, 0x16
0x06, 0x3C
0x08, 0x05
0x0A, 0x58
0x0C, 0x6E
MSB points to index 0.
Index 0 data is 334. LED
will be on for 334 X TCAR
IDLE
START
LED ON for 344 TCAR
LED OFF for 177 TCAR
LED ON for 22 TCAR
LED OFF for 22 TCAR
LED ON for 22 TCAR
LED OFF for 60 TCAR
LED ON for 60 TCAR
LED OFF for 22 TCAR
LED ON for 22 TCAR
LED OFF for 1541 TCAR
LED ON for 334 TCAR
LED OFF for 88 TCAR
LED ON for 22 TCAR
LED OFF for 3694 TCAR
LED ON for 334 TCAR
LED OFF for 88 TCAR
LED ON for 22 TCAR
LED OFF for 3694 TCAR
LED ON for 334 TCAR
LED OFF for 88 TCAR
LED ON for 22 TCAR
LED OFF for 3694 TCAR
Delay 100us
LSB points to index 2.
Index 2 data is 22. LED
will be off for 22 X TCAR
Byte following “0xFE”
becomes the starting
address of the repeated
pattern.
STOP
LEDON for 572us
LEDOFF for 96ms
Carrier Frequency:
IBT = 0x68 (26us/250ns)
Duty Cycle:
ICONFIG2 = 0x02
“Repeated sub-pattern” Repeat count=2:
ISNL = 0x01
“Complete sub-pattern” Repeat count=3:
IPNL = 0x02
Delay 100us between complete patterns:
IPOFF = 0x0A (100us/10us)
To run two
times, must
repeat once.
To run
complete
pattern three
times, must
repeat twice.
Pattern
Delay 100us
Pattern
Delay 100us
START:
Write a 0x02 to ISTART.
Output:
I2C Address, Data
IDLE
Pause
Pause
Pause
Practical Example: Device registers and RAM are loaded with values to generate a real remote control waveform.
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TMD4903 − Application Information
Protocol Accommodation Checklist
The Remote Control pattern generation/transmission feature
can be configured to broadcast virtually all IR communication
protocols used for commanding consumer electronic devices.
There are many different remote control protocols currently in
use; and to meet the multitude of requirements the remote
control engine has been designed to be flexible. In general, a
protocol functions within the following transmission
specifications can be accommodated:
• Carrier periods are selectable in 250ns increments. Carrier
frequencies are in the range of 15.625 kHz to 460 kHz.
Protocols that do not use carriers can also be
accommodated.
• Duty cycle of the carrier is selectable: 50%, 37%, 25%, and
12%. Exact LED duty cycle depends on the external circuit.
• Pulse (LED on) and Gap (LED off) widths are a multiple of
carrier periods (TCAR). Pulse and Gap length is selectable
from 0 to 65535 carrier periods. Patterns with
exceptionally long pulses or gaps (I.e. longer than 65535
carrier periods) may be accommodated. This requires
setting contiguous pattern ram locations, but results in a
glitch-free long pulse/gap.
• A dedicated “time word” RAM table contains sixteen,
16-bit words which are used to set pulse and gap widths.
Simply stated, a pattern must contain sixteen or fewer
unique pulse/gap widths. Note: patterns containing more
than 16 unique pulse/gap widths may be accommodated
by using the 16-bit timewords as “building blocks” to form
longer pulse/gaps. For example, if a pattern has a
pulse/gap of both 3T CAR and 6T CAR, then only the 3T CAR
need be represented in the Time Word table; then the
6TCAR can be generated by indexing into the 3TCAR twice
(This requires the use of additional pattern RAM).
• A dedicated “pattern” RAM contains 256 bytes of data.
Each byte indexes into the Timeword table to form a
complete pulse and gap pair. A pattern that does not
contain a “repeated” sub-pattern must have 255 or fewer
pulse/gap pairs. A pattern that contains a “repeated”
sub-pattern must have 254 or fewer pulse/gap pairs, not
including the additional repetitions of the “repeated”
sub-pattern.
• Entire patterns can be reburst up to an additional 255
times and are separated by a selectable delay of 0us to
2.55s, in 10us increments.
ams Datasheet
[v1-12] 2015-May-14
Page 73
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TMD4903 − Package Drawings & Markings
Package Drawings & Markings
Figure 84:
TMD4903 Module Dimensions
7239,(:
/('
'(7(&725
3,1
6,'(9,(:
“
“
“
%277209,(:
;
;
;
;
;
RoHS
Green
;
Note(s) and/or Footnote(s):
1. All linear dimensions are in millimeters.
2. Dimension tolerances are ±0.05mm unless otherwise noted.
3. Contacts are copper with NiPdAu plating.
4. This package contains no lead (Pb).
5. This drawing is subject to change without notice.
6. Measurement guarantee by lot acceptance testing using 20 units.
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TMD4903 − PCB Pad Layout
PCB Pad Layout
Suggested PCB pad layout guidelines for the surface mount
module are shown. Flash Gold is recommended as a surface
finish for the landing pads.
Figure 85:
Recommended PCB Pad Layout
;
;
;
;
;
;
;
Note(s) and/or Footnote(s):
1. All linear dimensions are in millimeters.
2. Dimension tolerances are ±0.05mm unless otherwise noted.
3. This drawing is subject to change without notice.
ams Datasheet
[v1-12] 2015-May-14
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TMD4903 − Mechanical Data
Mechanical Data
Figure 86:
Tape and Reel Mechanical Drawing
Note(s) and/or Footnote(s):
1. All linear dimensions are in millimeters. Dimension tolerance is ± 0.10 mm unless otherwise noted.
2. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly.
3. Symbols on drawing Ao, Bo, and Ko are defined in ANSI EIA Standard 481−B 2001.
4. Each reel is 330 millimeters in diameter and contains 5000 parts.
5. ams packaging tape and reel conform to the requirements of EIA Standard 481−B.
6. In accordance with EIA standard, device pin 1 is located next to the sprocket holes in the tape.
7. This drawing is subject to change without notice.
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TMD4903 − Soldering & Storage Information
Soldering & Storage
Information
Soldering Information
The module has been tested and has demonstrated an ability
to be reflow soldered to a PCB substrate.
The solder reflow profile describes the expected maximum heat
exposure of components during the solder reflow process of
product on a PCB. Temperature is measured on top of
component. The components should be limited to a maximum
of three passes through this solder reflow profile.
Figure 87:
Solder Reflow Profile
Parameter
Reference
Average temperature gradient in preheating
Device
2.5 °C/sec
tsoak
2 to 3 minutes
Time above 217 °C (T1)
t1
Max 60 sec
Time above 230 °C (T2)
t2
Max 50 sec
Time above Tpeak – 10 °C (T3)
t3
Max 10 sec
Tpeak
260 °C
Soak time
Peak temperature in reflow
Temperature gradient in cooling
Max -5 °C/sec
Figure 88:
Solder Reflow Profile Graph
NottoScale
Tpeak
T3
T2
Temperaturein°C
T1
Timeinseconds
ams Datasheet
[v1-12] 2015-May-14
t3
t2
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TMD4903 − Soldering & Storage Information
Storage Information
Moisture Sensitivity
Optical characteristics of the device can be adversely affected
during the soldering process by the release and vaporization of
moisture that has been previously absorbed into the package.
To ensure the package contains the smallest amount of
absorbed moisture possible, each device is baked prior to being
dry packed for shipping.
Devices are dry packed in a sealed aluminized envelope called
a moisture-barrier bag with silica gel to protect them from
ambient moisture during shipping, handling, and storage
before use.
Shelf Life
The calculated shelf life of the device in an unopened moisture
barrier bag is 12 months from the date code on the bag when
stored under the following conditions:
• Shelf Life: 12 months
• Ambient Temperature: <40°C
• Relative Humidity: <90%
Rebaking of the devices will be required if the devices exceed
the 12 month shelf life or the Humidity Indicator Card shows
that the devices were exposed to conditions beyond the
allowable moisture region.
Floor Life
The module has been assigned a moisture sensitivity level of
MSL 3. As a result, the floor life of devices removed from the
moisture barrier bag is 168 hours from the time the bag was
opened, provided that the devices are stored under the
following conditions:
• Floor Life: 168 hours
• Ambient Temperature: <30°C
• Relative Humidity: <60%
If the floor life or the temperature/humidity conditions have
been exceeded, the devices must be rebaked prior to solder
reflow or dry packing.
Rebaking Instructions
When the shelf life or floor life limits have been exceeded,
rebake at 50°C for 12 hours.
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TMD4903 − Ordering & Contact Information
Ordering & Contact Information
Figure 89:
Ordering Information
Ordering Code
Address
Interface
Delivery Form
TMD49033
0x39
I²C bus = 1.8V Interface
Tape & Reel
TMD49037 (1)
0x29
I²C bus = 1.8V Interface
Tape & Reel
Note(s) and/or Footnote(s):
1. Contact ams for availability.
Buy our products or get free samples online at:
www.ams.com/ICdirect
Technical Support is available at:
www.ams.com/Technical-Support
Provide feedback about this document at:
www.ams.com/Document-Feedback
For further information and requests, e-mail us at:
[email protected]
For sales offices, distributors and representatives, please visit:
www.ams.com/contact
Headquarters
ams AG
Tobelbaderstrasse 30
8141 Unterpremstaetten
Austria, Europe
Tel: +43 (0) 3136 500 0
Website: www.ams.com
ams Datasheet
[v1-12] 2015-May-14
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TMD4903 − RoHS Compliant & ams Green Statement
RoHS Compliant & ams Green
Statement
RoHS: The term RoHS compliant means that ams AG products
fully comply with current RoHS directives. Our semiconductor
products do not contain any chemicals for all 6 substance
categories, including the requirement that lead not exceed
0.1% by weight in homogeneous materials. Where designed to
be soldered at high temperatures, RoHS compliant products are
suitable for use in specified lead-free processes.
ams Green (RoHS compliant and no Sb/Br): ams Green
defines that in addition to RoHS compliance, our products are
free of Bromine (Br) and Antimony (Sb) based flame retardants
(Br or Sb do not exceed 0.1% by weight in homogeneous
material).
Important Information: The information provided in this
statement represents ams AG knowledge and belief as of the
date that it is provided. ams AG bases its knowledge and belief
on information provided by third parties, and makes no
representation or warranty as to the accuracy of such
information. Efforts are underway to better integrate
information from third parties. ams AG has taken and continues
to take reasonable steps to provide representative and accurate
information but may not have conducted destructive testing or
chemical analysis on incoming materials and chemicals. ams AG
and ams AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited
information may not be available for release.
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TMD4903 − Copyrights & Disclaimer
Copyrights & Disclaimer
Copyright ams AG, Tobelbader Strasse 30, 8141
Unterpremstaetten, Austria-Europe. Trademarks Registered. All
rights reserved. The material herein may not be reproduced,
adapted, merged, translated, stored, or used without the prior
written consent of the copyright owner.
Devices sold by ams AG are covered by the warranty and patent
indemnification provisions appearing in its General Terms of
Trade. ams AG makes no warranty, express, statutory, implied,
or by description regarding the information set forth herein.
ams AG reserves the right to change specifications and prices
at any time and without notice. Therefore, prior to designing
this product into a system, it is necessary to check with ams AG
for current information. This product is intended for use in
commercial applications. Applications requiring extended
temperature range, unusual environmental requirements, or
high reliability applications, such as military, medical
life-support or life-sustaining equipment are specifically not
recommended without additional processing by ams AG for
each application. This product is provided by ams AG “AS IS”
and any express or implied warranties, including, but not
limited to the implied warranties of merchantability and fitness
for a particular purpose are disclaimed.
ams AG shall not be liable to recipient or any third party for any
damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interruption of business or
indirect, special, incidental or consequential damages, of any
kind, in connection with or arising out of the furnishing,
performance or use of the technical data herein. No obligation
or liability to recipient or any third party shall arise or flow out
of ams AG rendering of technical or other services.
ams Datasheet
[v1-12] 2015-May-14
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TMD4903 − Document Status
Document Status
Document Status
Product Preview
Preliminary Datasheet
Datasheet
Datasheet (discontinued)
Page 82
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Product Status
Definition
Pre-Development
Information in this datasheet is based on product ideas in
the planning phase of development. All specifications are
design goals without any warranty and are subject to
change without notice
Pre-Production
Information in this datasheet is based on products in the
design, validation or qualification phase of development.
The performance and parameters shown in this document
are preliminary without any warranty and are subject to
change without notice
Production
Information in this datasheet is based on products in
ramp-up to full production or full production which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade
Discontinued
Information in this datasheet is based on products which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade, but these products have been superseded and
should not be used for new designs
ams Datasheet
[v1-12] 2015-May-14
TMD4903 − Revision Information
Revision Information
Changes from 1-11 (2015-Apr-23) to current revision 1-12 (2015-May-14)
Page
Updated Section title
Updated text under General Description
1
Updated Figure 1
2
Updated Applications
2
Updated Figure 2
3
Updated Figure 4
4
Updated Figure 5
5
Updated Figure 10
9
Updated title of Figure 20
14
Updated text under I2C Protocol section
16
Updated Figure 23
17
Updated Figure 24 and added a note under it
18
Updated text under Detailed Description
19
Updated Figure 25
20
Updated Figure 26
23
Updated text under ALS Interrupt Threshold Registers
27
Updated text under Proximity Interrupt Threshold Registers
27
Updated Figure 32
28
Updated FIgure 33
29
Updated Proximity Configuration Register Zero section
30
Updated text under Proximity Configuration Register One
31
Updated Figure 37
32
Updated Figure 38
33
Updated Figure 39
33
Updated text under CRGB Data Registers
34
Updated text under Proximity Data Registers
35
ams Datasheet
[v1-12] 2015-May-14
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TMD4903 − Revision Information
Changes from 1-11 (2015-Apr-23) to current revision 1-12 (2015-May-14)
Page
Updated Figure 47
40
Updated Figure 49
41
Updated Figure 54
44
Updated text under Proximity Offset Registers
48
Added Autozero Configuration Register
49
Updated Figure 63
50
Added Calibration Configuration Register One
52
Updated Figure 67
55
Updated Figure 89
79
Note(s) and/or Footnote(s):
1. Page and figure numbers for the previous version may differ from page and figure numbers in the current revision.
2. Correction of typographical errors is not explicitly mentioned.
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TMD4903 − Content Guide
Content Guide
1
2
2
3
General Description
Key Benefits & Features
Applications
Block Diagram
4
4
Pin Assignment
Pin Description
5
6
Absolute Maximum Ratings
Electrical Characteristics
11
11
Timing Characteristics
Timing Diagram
12
Typical Operating Characteristics
16
16
16
I²C Protocol
I²C Write Transaction
I²C Read Transaction
19
19
Detailed Description
Sleep After Interrupt Operation
20
23
24
25
26
27
27
Register Description
Enable Register (ENABLE 0x80)
ALS Integration Time Register (ATIME 0x81)
Proximity Sample Time Register (PTIME 0x82)
Wait Time Register (WTIME 0x83)
ALS Interrupt Threshold Registers (0x84 – 0x87)
Proximity Interrupt Threshold Registers
(0x88 – 0x8B)
Interrupt Persistence Register (PERS 0x8C)
Configuration Register Zero (CFG0 0x8D)
Proximity Configuration Register Zero
(PGCFG0 0x8E)
Proximity Configuration Register One
(PGCFG1 0x8F)
Configuration Register One (CFG1 0x90)
Revision ID Register (REVID 0x91)
ID Register (ID 0x92)
Status Register (STATUS 0x93)
CRGB Data Registers (0x94 − 0x9B)
Proximity Data Registers (0x9C – 0x9D)
Status Register Two (STATUS2 0x9E)
Configuration Register Two (CFG2 0x9F)
IRBeam Configuration Register (ICONFIG 0xA0)
IRBeam Configuration Register Two
(ICONFIG2 0xA1)
IRBeam Symbol Looping Register (ISNL 0xA2)
IRBeam Inter-Symbol OFF Register
(ISOFF 0xA3)
IRBeam Packet Looping Register (IPNL 0xA4)
IRBeam Inter-Packet OFF Register (IPOFF 0xA5)
IRBeam Bit Time Register (IBT 0xA6)
28
29
30
31
32
32
33
33
34
35
36
37
38
39
40
40
41
41
42
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[v1-12] 2015-May-14
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TMD4903 − Content Guide
42
43
43
44
45
46
47
47
48
48
53
54
IRBeam Symbol Length Register (ISLEN 0xA7)
IRBeam Status Register (ISTATUS 0xA8)
IRBeam Start Register (ISTART 0xA9)
Configuration Register Three (CFG3 0xAB)
Configuration Register Four (CFG4 0xAC)
Configuration Register Five (CFG5 0xAD)
Status Register Three (STATUS3 0xB3)
Control Register (CONTROL 0xBC)
Auxiliary ID Register (AUXID 0xBD)
Proximity Offset Registers
(0xC0 − 0xC7)
Autozero Configuration Register
(AZ_CONFIG 0xD6)
Calibration Register (CALIB 0xD7)
Calibration Configuration Register Zero
(CALIBCFG0 0xD8)
Calibration Configuration Register One
(CALIBCFG1 0xD9)
Interrupt Enable Register (INTENAB 0xDD)
Interrupt Clear Register (INTCLEAR 0xDE)
55
57
57
57
58
59
61
62
65
70
71
73
Application Information
Remote Control
General Description of RC Functionality
Detailed Description of RC Functionality
Block Diagram of Remote Control Functionality
Pattern RAM
Timeword RAM
Control Registers
Digital Logic
Electrical and Optical Output
Example Waveform and Device Setup
Protocol Accommodation Checklist
74
75
76
Package Drawings & Markings
PCB Pad Layout
Mechanical Data
77
77
78
78
78
78
78
Soldering & Storage Information
Soldering Information
Storage Information
Moisture Sensitivity
Shelf Life
Floor Life
Rebaking Instructions
79
80
81
82
83
Ordering & Contact Information
RoHS Compliant & ams Green Statement
Copyrights & Disclaimer
Document Status
Revision Information
49
49
50
52
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