Reliability Report

AOS Semiconductor
Product Reliability Report
AOK20B120E2,
rev B
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
www.aosmd.com
1
This AOS product reliability report summarizes the qualification result for AOK20B120E2.
Accelerated environmental tests are performed on a specific sample size, and then followed by
electrical test at end point. Review of final electrical test result confirms that AOK20B120E2
passes AOS quality and reliability requirements. The released product will be categorized by the
process family and be routine monitored for continuously improving the product quality.
I. Reliability Stress Test Summary and Results
Test Item
HTGB
HTRB
HAST
H3TRB
Autoclave
Temperature
Cycle
HTSL
Power Cycling
Total
Sample
Size
Number
of
Failures
Reference
Standard
385 pcs
0
JESD22-A108
385 pcs
0
JESD22-A108
96 hours
924 pcs
0
JESD22-A110
1000 hours
924 pcs
0
JESD22-A101
96 hours
924 pcs
0
JESD22-A102
1000 cycles
924 pcs
0
JESD22-A104
1000 hours
924 pcs
0
JESD22-A103
6000 cycles
924 pcs
0
AEC Q101
Test Condition
Duration
Temp = 175°C ,
Vge=100% of Vgemax
Temp = 175°C ,
Vce=80% of Vcemax
130°C , 85%RH,
33.3 psia,
Vce = 80% of Vcemax up
to 42V
85°C , 85%RH,
Vce = 80% of Vcemax up
to 100V
121°C , 29.7psia,
RH=100%
-65°C to 150°C ,
air to air,
Temp = 175°C
Tj = 100°C
5min on / 5min off 
168 / 500 /
1000 hours
168 / 500 /
1000 hours
Resistance to
Temp = 270°C
15 seconds
30 pcs
0
Solder Heat
Note: The reliability data presents total of available generic data up to the published date.
JESD22-B106
II. Reliability Evaluation
FIT rate (per billion): 1.96
MTTF = 58227 years
The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in
sample size. Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one
failure per billion hours.
2
9
Failure Rate = Chi x 10 / [2 (N) (H) (Af)] = 1.96
9
MTTF = 10 / FIT = 58227 years
Chi²= Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from burn-in tests
H = Duration of burn-in testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
55 deg C
70 deg C
85 deg C
100 deg C
125 deg C
Af
758
256
95
38
9.7
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u =The use junction temperature in degree (Kelvin), K = C+273.16
k = Boltzmann’s constant, 8.617164 X 10-5eV / K
150 deg C
175 deg C
2.9
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