CPC1317 Single-Pole OptoMOS® Relay with Bidirectional Transient Protection INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) LED Current to Operate Rating 70 150 16 1 Units VP mArms / mADC mA Transient Protection Characteristics Peak Pulse Power 600W VWM 40.2V Features • Meets Requirements of EN50130-4 (Installation Class 3) • 3750Vrms Input/Output Isolation • 100% Solid State • Low Drive Power Requirements (TTL/CMOS Compatible) • No Moving Parts • High Reliability • Arc-Free With No Snubbing Circuits • No EMI/RFI Generation • Machine Insertable, Wave Solderable The relay output is constructed with efficient MOSFET switches and photovoltaic die that use IXYS Integrated Circuits Division's patented OptoMOS architecture. The input, a highly efficient GaAlAS infrared LED, controls the optically coupled output. The CPC1317 is available in an 8-pin, space-saving surface-mount package. Approvals • UL Certified Component: File E76270 • CSA Certified Component: Certificate 1172007 • EN/IEC 60950-1 Certified Component: TUV Certificate B 10 05 49410 006 Ordering Information Part # CPC1317P CPC1317PTR Applications • • • • • • • • • Description The CPC1317 is a single-pole, normally open (1-Form-A) solid state relay with bi-directional transient voltage suppressor (TVS) relay protection, which is designed to meet the requirements of EN50130-4 (installation class 3). Security Sensor Circuitry Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Aerospace Industrial Controls Description 8-Pin Flatpack (50/tube) 8-Pin Flatpack (1000/reel) Pin Configuration + Control – Control 1 8 2 7 3 6 4 5 TVS +/TVS -/+ Load Load Switching Characteristics of Normally Open Devices Form-A IF 90% 10% ILOAD ton Pb DS-CPC1317-R05 toff e3 www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION CPC1317 Absolute Maximum Ratings @ 25ºC Parameter SSR Output Blocking Voltage TVS Working Voltage, Maximum Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 SSR Output Power Dissipation 2 TVS Peak Pulse Power (IPP=9.3A, 10/1000s pulse) Isolation Voltage, Input to Output Operating Temperature Storage Temperature 1 Derate linearly 1.33 mW / ºC 2 Derate linearly 6.67 mW / ºC Ratings 70 40.2 5 50 1 150 400 600 Units VP V V mA A mW mW W 3750 -40 to +85 -40 to +125 Vrms °C °C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. SSR Electrical Characteristics @ 25ºC Parameter Output Characteristics Load Current Continuous Peak On-Resistance 1 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate 2 Input Dropout Current to Deactivate Input Voltage Drop Common Characteristics Capacitance, Input to Output 1 2 Conditions Symbol Min Typ Max Units t=10ms IL=150mA, IF=1mA VL=70VP IL ILPK RON ILEAK - 7 - 150 ±400 16 1 mArms / mADC mAP VL=50V, f=1MHz ton toff COUT - 25 2.5 2.5 - IL=150mA IF=5mA IF IF VF 0.1 0.9 1.2 1 1.4 mA mA V - CI/O - 3 - pF IF=5mA, VL=10V µA ms pF Measurement taken within 1 second of turn-on time. For applications requiring high temperature operation (> 60oC) a minimum LED drive current of 3mA is required. TVS Electrical Characteristics Parameter Clamping Voltage Reverse Breakdown Voltage Reverse Leakage Current 2 Conditions IPP=9.3A I=1mA VWM=40.2V Symbol VC VBR IL www.ixysic.com Min 44.4 - Typ - Max 66.5 5 Units V V A R05 INTEGRATED CIRCUITS DIVISION CPC1317 PERFORMANCE DATA* 15 10 5 20 15 10 5 0 0 75 80 85 90 95 Turn-On (Ps) 100 0.35 0.40 0.45 0.50 0.55 Turn-Off (ms) 0.60 35 25 6.9 7.0 7.1 7.2 On-Resistance (:) 7.3 7.4 Typical Blocking Voltage Distribution (N=50, TA=25ºC) 30 25 20 15 10 20 Device Count (N) Device Count (N) 15 10 5 0 1.6 1.3 1.2 IF=5mA IF=2mA IF=1mA 1.1 1.0 -40 -20 0.16 0.18 0.20 LED Current (mA) 0.22 84 485 480 800 600 400 80 0 100 5 10 15 LED Forward Current (mA) Turn-On Time (Ps) 0.20 0 20 40 60 Temperature (ºC) 80 100 20 Turn-Off Time vs. Temperature 700 400 300 200 IF=5mA 0 -40 5 10 15 LED Forward Current (mA) 800 IF=5mA 600 500 400 IF=1mA 300 100 -20 465 0 IF=1mA 500 0.15 -40 470 Turn-On Time vs. Temperature 0.25 90 475 20 600 0.30 86 87 88 89 Blocking Voltage (VP) 460 0 20 40 60 Temperature (ºC) 85 Typical Turn-Off Time vs. LED Forward Current 1000 LED Current to Operate vs. Temperature (IL=100mA) 0.35 0.14 200 0 10 1200 Turn-On Time (Ps) IF=50mA IF=20mA IF=10mA 1.4 15 Typical Turn-On Time vs. LED Forward Current LED Forward Voltage vs. Temperature 1.5 20 0 0.12 1.22 1.23 1.24 1.25 LED Forward Voltage Drop (V) Turn-Off Time (Ps) 1.21 25 5 0 Turn-Off Time (Ps) Device Count (N) 5 6.8 Typical IF for Switch Operation (N=50, IL=100mA, TA=25ºC) 5 LED Forward Voltage (V) 10 0.65 30 LED Current (mA) 15 0 105 Typical LED Forward Voltage Drop (N=50, IF=5mA, TA=25ºC) 35 Typical On-Resistance Distribution (N=50, IL=100mA, TA=25ºC) 20 Device Count (N) 20 Typical Turn-Off Time (N=50, IF=5mA, IL=100mA, TA=25ºC) 25 Device Count (N) Device Count (N) 25 Typical Turn-On Time (N=50, IF=5mA, IL=100mA, TA=25ºC) -20 0 20 40 60 Temperature (ºC) 80 100 200 -40 -20 0 20 40 60 Temperature (ºC) 80 100 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R05 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1317 PERFORMANCE DATA* 155 10 9 8 7 0.15 145 140 135 130 6 125 5 -40 120 -20 0 20 40 60 Temperature (ºC) 80 100 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Leakage Current vs. Temperature Measured Between Pins 5 & 6 (VL=70V) 0.00 -0.05 -0.10 -0.20 -1.5 92 10 800 86 Load Current (mA) 1000 88 8 6 4 20 40 60 Temperature (ºC) 80 2 -40 100 TVS Diode Breakdown Voltage vs. Temperature (Pins 7 & 8) 25 52 Leakage Current (nA) 51 50 49 48 47 46 45 -40 -20 0 20 40 60 Temperature (ºC) 80 0 20 40 60 Temperature (ºC) 80 1.5 200 0 10Ps 100Ps 1ms 10ms 100ms Time 100 TVS Diode Leakage vs. Temperature (Pins 7 & 8) (VL=40V) 1s 10s 100s 80 100 TVS Derating Curve 120 100 20 15 10 5 0 -40 100 -20 1.0 400 Peak Pulse Power (% PPP @ 25ºC) 0 -0.5 0.0 0.5 Load Voltage (V) 600 0 -20 -1.0 Energy Rating Curve 12 Leakage Current (PA) Blocking Voltage (VP) 0.05 94 84 -40 TVS Breakdown Voltage (V) 0.10 -0.15 Blocking Voltage vs. Temperature (Pins 5 & 6) 90 Typical Load Current vs. Load Voltage (IF=1mA, TA=25ºC) 0.20 150 Load Current (mA) On-Resistance (:) 11 Load Current (A) 12 Maximum Load Current vs. Temperature (IF=1mA) On-Resistance vs. Temperature (IF=1mA, IL=50mA) -20 0 20 40 60 Temperature (ºC) 80 100 80 60 40 20 0 -40 -20 0 20 40 60 Temperature (ºC) PPP - Peak Pulse Current (% IPP) TVS Pulse Waveform 10/1000 (Ps) 110 100 90 80 70 60 50 40 30 20 10 0 1 10 100 1000 104 Time (Ps) 105 106 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION CPC1317 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC1317P MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time CPC1317P 260ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb R05 e3 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1317 MECHANICAL DIMENSIONS CPC1317P 0 MIN / 0.102 MAX (0 MIN / 0.004 MAX) 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 7.620 ± 0.254 (0.300 ± 0.010) 9.398 ± 0.127 (0.370 ± 0.005) Pin 1 2.286 MAX. (0.090 MAX.) PCB Land Pattern 2.54 (0.10) 0.635 ± 0.127 (0.025 ± 0.005) 0.203 ± 0.013 (0.008 ± 0.0005) 9.652 ± 0.381 (0.380 ± 0.015) 8.70 (0.3425) 1.55 (0.0610) 0.65 (0.0255) 2.159 ± 0.025 (0.085 ± 0.001) 0.457 ± 0.076 (0.018 ± 0.003) 0.864 ± 0.120 (0.034 ± 0.004) Dimensions mm (inches) CPC1317PTR Tape & Reel 2.00 (0.079) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) Embossment W = 16.00 (0.63) 7.50 (0.295) Bo = 10.30 (0.406) K0 = 2.70 (0.106) K1 = 2.00 (0.079) Embossed Carrier 4.00 (0.157) Ao = 10.30 (0.406) P = 12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS-CPC1317-R05 ©Copyright 2012, IXYS Integrated Circuits Division OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/16/2012