Design Rules xRi-2F-xRi (two flex layers inside)

Design Rules
Flex-Rigid xRi - 2F - xRi
Application according to IPC 2223 Use A: Flex-to-install
Label UL 94 V-0: according to prior agreement
Cross-section: 2Ri – 2F – 2Ri
F = flex
A
Ri = rigid
B
TOP
1
2
3
4
5
6
H
BOTTOM
D
C
C
F
G
top view xRi - 2F - xRi
F
R≥1mm
E
K
F
If possible - insertion of wide copper tracks for tear protection
On flex inner layer PI Coverlayer is integrally moulded
symbol
standard
requirements
description
A
B
C
D
E
F
min. pad diameter teardrops recommended !  
via diameter
distance Cu → outer layer to rigid flex intersection (bottom)
distance Cu → inner layer to rigid flex intersection
distance track / flex outline
distance of Cu – milled contour
G
distance via pad-> rigid-flex intersection
H
K
-
length of flex area
Minimum width for „cut-in“
track width
track spacing
thickness Cu → see layer structure
thickness of flex material (Polyimide)
total thickness of pcb → see layer structure
min. bending radius (for typ. 100 bendings)
solderable surfaces
blind microvia- and buried via- technology on request
advanced
requirements
via diameter B + 400 µm
≥ 300 µm
200 µm
≥ 300 µm
≥ 500 µm
≥ 300 µm
≥ 300 µm
as agreed on
≥ 1500 µm
individually
≥ 5mm
≥ 2,5mm
2,0mm
1,0mm
≥ 150 µm
125 µm
≥ 150 µm
125 µm
On request
50 µm
on request
On request
3 mm
ENIG, immersion Ag
-
Enhanced specifications on request – please ask us ! 
Rev. 19.04.2012 AS
1/1
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