Design Rules Flex-Rigid xRi - 2F - xRi Application according to IPC 2223 Use A: Flex-to-install Label UL 94 V-0: according to prior agreement Cross-section: 2Ri – 2F – 2Ri F = flex A Ri = rigid B TOP 1 2 3 4 5 6 H BOTTOM D C C F G top view xRi - 2F - xRi F R≥1mm E K F If possible - insertion of wide copper tracks for tear protection On flex inner layer PI Coverlayer is integrally moulded symbol standard requirements description A B C D E F min. pad diameter teardrops recommended ! via diameter distance Cu → outer layer to rigid flex intersection (bottom) distance Cu → inner layer to rigid flex intersection distance track / flex outline distance of Cu – milled contour G distance via pad-> rigid-flex intersection H K - length of flex area Minimum width for „cut-in“ track width track spacing thickness Cu → see layer structure thickness of flex material (Polyimide) total thickness of pcb → see layer structure min. bending radius (for typ. 100 bendings) solderable surfaces blind microvia- and buried via- technology on request advanced requirements via diameter B + 400 µm ≥ 300 µm 200 µm ≥ 300 µm ≥ 500 µm ≥ 300 µm ≥ 300 µm as agreed on ≥ 1500 µm individually ≥ 5mm ≥ 2,5mm 2,0mm 1,0mm ≥ 150 µm 125 µm ≥ 150 µm 125 µm On request 50 µm on request On request 3 mm ENIG, immersion Ag - Enhanced specifications on request – please ask us ! Rev. 19.04.2012 AS 1/1 www.we-online.com