Wirelaid - Bypasses for high currents (PDF)

Bypasses for high Currents
Wirelaid® -
www.we-online.de
Partial high Current Solution, Technology, Applications
03.12.2014
Agenda
Introduction
Design
Thermal
Guide
Views
Preisvergleich,
thermische Betrachtung
WIRELAID
vs
Standard
www.we-online.de
Example of use
Cost Comparison
FAQ
Seite 2
Need to know
References
Perspective
03.12.2014
Introduction
Market requirements:
Currents (300A and more)
Logic (SMD, Fine Lines)
Use on one single PCB
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03.12.2014
Introduction
Principle

Use of wires to realize high current nets

Power and controllers on one single PCB or layer

Alternative to thick copper or Inlays @ low amount of layers
Technique

Welding of flat copper wires(1,4mm x 0,35mm) onto the treatment side (later inside) from
standard copper foils

After pressing, wires are inside the laminate, embedded in prepreg/raisin

Additional cross section under a conventional copper track

Outer layers keeps SMD cabability
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Introduction
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3D Feature
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
www.we-online.de
Seite 5
Deep milling through base material
Complex clearance without connectors
High cross sections @ small bending
radiuses(<1mm) possible
Secure and fully intergated 90° high
current application
03.12.2014
Introduction
For more intensive introduction, please use our web archive:
www.we-online.de
Seite 6


Video recordings
Presentationslides as pdf

By the way: for all web contents
03.12.2014
Agenda
Introduction
Design
Thermal
Guide
Views
Preisvergleich,
thermische Betrachtung
WIRELAID
vs
Standard
www.we-online.de
Example of use
Cost Comparison
FAQ
Seite 7
Need to know
References
Perspective
03.12.2014
WIRELAID versus Standard
Customer requirement: 20A @ 20K (35µm Base-Cu)
8,9mm
0,63mm²
4,5mm
1,9mm
With WIRELAID
saving of
78,7% width
WIRELAID
F14
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Cross section
wire
Cu over wire
(35µm Base-Cu)
Width standard track
(35µm Basis-Cu)
Reduction
of width
0,5mm²
1,9mm
8,9mm
78,7%
Seite 8
03.12.2014
Agenda
Introduction
Design
Thermal
Guide
Views
Preisvergleich,
thermische Betrachtung
WIRELAID
vs
Standard
www.we-online.de
Example of use
Cost Comparison
FAQ
Seite 9
Need to know
References
Perspective
03.12.2014
Design Guide NEU

Since electronica 2014 there is the
new
WIRELAID Design Guide 1.2
–
–
–
–

new: Nomenclature
new: Design notes for use of Wirelaid
layers
new: Cost comparison
new: Current feeding
english / french versions follows
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Design Guide: Nomenclature of WIRELAID Layer stack up

MLn Wire@a@b....@n
n = Number of layers
a, b, c…: Layers with wires
Outer Layer
Inner Layer
Example shows
a multilayer with
6 layers and
wires under
layer 1 and 6
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Example shows
a multilayer with
6 layers and
wires under
layer 2 and 5
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Design Guide: Outer layer? Inner layer?
Consideration 1:

More complex logic devices use SMD components like controllers or memories with
small pitches. To keep the SMD layers free for fine line structures, the wires are applied
in the inner layers. Requirements concerning EMC and multiple power supplies, using
the innerlayers, can be implemented with standard cores and copper thicknesses. The
number of layers is, compared with the normal multilayer setup, almost equal, have a
look at the stackup
ML6 Wire@2@5:
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Design Guide: Outer layer? Inner layer?
Consideration 2:

When cooling thru direct contact to the housing plays a roll or power semiconductors
like IGBTs or D²PACs are placed directly to the outer layer, then, a Wirelaid layer with
welded wire will be used. Look at the stackup
ML6 Wire@1@6.:
This should be the aim for more simple logic devices as well. Furthermore many vias/thru
holes can be saved and thereby costs, when the power components will be placed directly
onto the welding pad from Wirelaid
 For more simple devices it is possible to reduce the number of layers
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Seite 13
03.12.2014
Agenda
Introduction
Design
Thermal
Guide
Views
Preisvergleich,
thermische Betrachtung
WIRELAID
vs
Standard
www.we-online.de
Example of use
Cost Comparison
FAQ
Seite 14
Need to know
References
Perspective
03.12.2014
Example of Use


Permanent current charge
Maximum temperature
Previous:
After:
70 A
80C°
8 Layers, 6 Innelayers at 105µm Cu
4 Layers Wirelaid ML4 Wire@2
Cost advantage thru lower layer number and thin copper foils
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Seite 15
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Cost comparison: conventional solution
Initial situation
A multilayer PCB with 6 layers at 105 micron copper, takes the high current part. The
logic is placed at a separate fine line module, connected by PCB connectors to the main
board
New solution with WIRELAID
Due to the possibility of fine line structures together at the assembly layers, the logic
module can be completely integrated. All kind of connection technologies, as well as
every other assembly costs for the module integration, can be cancelled.
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Cost comparison 1: PCB level
6-layer: inner 210µm / outer 70µm  WIRELAID
Saving from 2 layers
Number of wires per manufacturing panel up to equal costs
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Seite 17
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Cost comparison 2: System level
Conventional solution
Power PCB ML6, 105µm,
logic module & connectors
New solution
WIRELAID PCB
ML6 Wire@1
Mainboard
Logic module
Connectors
Initials assembly
Stencils
AOI test
Testcosts
Set up costs per order
Stock and logistics
In practice:1/2 of the costs. Impressing as well is the high potential of savings at the Initials, which, seen absolutely, are decisive
especially at lower volumes.
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Frequently asked questions from customer point of view

FAQ WIRELAID – Everydays exemplary experiences
1. Hot spots at wire transitions?
2. How can I realize power feeds in and out?
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FAQ – Everydays experiences
Hot Spots t wire transitions? No
–
–

Increasing current densities
Distances determined by wires and design rules
Problem analysation
–
Thermographic analyse
–
Background:
• Power drop at ohmic resistor
– @ P = I² x R, higher current density S
–
Solution: Due to the high local heat capacity, not hot spot occurs (spreading)
Valid relation:
www.we-online.de
I [A] = 9,1 [mm²]
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0,68
*
ΔT [K]0,43
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FAQ: Power feeding through power elements

Up to 50 A: SMD Power elements
–
–
–
–
–
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over 50 A: Press-Fit Powerelements
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
No pad drilling
Ideal for WIRELAID
Standard assembling and soldering
Available is reel with suction cap
In- and external thread M3 or M4
Solderless, high reliable connections
In- and external thread up to M10
Retention force by IEC 352-5
Respect drill spec for pressfittechnolgy!
No drill into WIRELAID wires!
More Infos:
we-online.com/powerelements
www.we-online.de
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FAQ: Power feeding through power elements

Press-Fit Powerelements
Drill spezification:
–
Chemical surfaces
–
HAL Surface
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FAQ: Power feeding through power elements


Press-Fit Powerelements WIRELAID wires has not to be
drilled !
Cross section comparison:
–
Welding area at wire / Pad: ca.  1mm
–
Connection in plated drill:
Dia  1,45mm,* Wire thickness 0,35mm
Cross section drill
 1,45mm, 25µm Cu plating in drill:
–
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 0,8mm²
 0,6mm²
 0,11mm²
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

03.12.2014
Agenda
Introduction
Design
Thermal
Guide
Views
Preisvergleich,
thermische Betrachtung
WIRELAID
vs
Standard
www.we-online.de
Example of use
Cost Comparison
FAQ
Seite 24
Need to know
References
Perspective
03.12.2014
Thermal View (TRM Software © Adam Research)
Servo driver 75A
 Layout Wirelaid
 ML4 Wire@2@3
IL70µm, AL 35µm Cu Base
Servo driver75A
 Layout conventionel
 ML6, je 70µm Cu Base
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Thermal View (TRM Software © Adam Research)
Setting the simulation area after :
• Current density S
• Electrical conductivity σ (Sigma)
• Thermal conductivity λ (Lambda)
• Layer Stack Up
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Thermal View (TRM Software © Adam Research)
Simulation result, Driver Servo
Motor 75 A
 Layout WIRELAID
 Tmax 33,8°C
Real IR Masuring Driver Servo
Motor 75A
 Layout conventionel
 Tmax: 35,3°C
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03.12.2014
Thermal View (TRM Software © Adam Research)
Real IR Measuring Driver Servo Motor 75 A
 Layout Wirelaid
 Tmax: 27,4°C
Due to the WIRELAID setup, at better performance,
a core (2layers) and base copper could be saved
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Thermal View: Demonstrator

left:
Multilayer 6 Layer
each 105µm Cu

right:
2 LayerML2 Wire@1@2
each 35µm Cu, Wires F14

Result at 50A:
Equal heating, measured with
OPTRIS IR Camera
Kindly supported by
Optris, Berlin
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The following is a short survey
Which statement applies to WIRELAID?
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Agenda
Introduction
Design
Thermal
Guide
Views
Preisvergleich,
thermische Betrachtung
WIRELAID
vs
Standard
www.we-online.de
Example of use
Cost Comparison
FAQ
Seite 31
Needs to know
References
Perspective
03.12.2014
Need to know: Manufacturing of WIRELAID foils
Manufacturing steps

current stage of evolution :
available are base materials and wires
with adapted surfaces and fillings in
proven combinations up to 180°C
PCB working temperatures
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Need to know: Application range of WIRELAID





The WIRELAID current capacity has
no typical lower limit
Also small, area sensitive devices
can benefit
Present applications realsizes up to
300 A
The upper boarder of the currents
limit only economic aspects
The upper limit is only fixed at
economic borders
Any Questions?
For more informations concerning higher currents, please contact
directly our product management: [email protected]
www.we-online.de
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Need to know: Supplier base: WIRELAID License partners
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


5 licensed german manufacturers
2 asian manufacturers for high
volumes
Currently negotiations with two
more potential asian partners
Welding machines:
–

6. Evolution variant for extended use
with other manufacturers
Series production of various
applications in the field of 10k / y
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§
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References: WIRELAID Qualifications



HTG Storage:
Bosch Norm BV Y273 R80029
1000h at 140°C
Humidity climate: IPC TM 650
1000h bei 85°C and 85% RH
TWT:
–
–



Corrosion: IPC612 B / TM 650
Testing for silver migration
Permanent shock: EN 60068 2-29
100000 Impulses (11ms) at max. 50G
Delamination: IPC 6012B
–

IPC 6012 B, 1000 Zyklen
BV Y273 R80029
Solder bath test 10s at 288°C
UL: Kategorie ZPMV2/8
–
Full Recognition with MOT and CTI in work
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References: WIRELAID Application Winderergy



Pitchadjustment
Previous: ML6
After:
ML4 wire@2@3
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Seite 36
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References: WIRELAID Apllication Industry



AC Servo Amplifier
Permanent current charge 50 A
Maximum Temperature
80C°
Previous:
2 PCBs, 6 Layer 70µm
After:
1 Leiterplatte, ML6 Wire @1 + 3D
Benefit: Manufacturing, assembly, test, stock and loss of single modules and PCB connectors
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Seite 37
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References: WIRELAID Application automotive

Vehicle Components Endurance Test Bench
Previous:
Combination of flat wire / connector PCB, 2 PCBs ML4
After:
1 PCB, ML4 Wire @1 + 3D
Benefits: Eliminating all manual operations, fully integrated PCB connection, more usable PCB space
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Seite 38
03.12.2014
References: WIRELAID Application E-Bike

Drive controll, charging electronics (picture is exemplary)
Previous:
ML6 70µm/4x210µm/70µm
After (in development):
ML6 Wire @2@3@4@5, each 70µm
Benefits: Reduction to 70µm Cu base on all layers, PCB with smaller dimensions, easy to manufacture
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Seite 39
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Perspective: Passive cooling
Measurement 1
without WIRELAID ML4
Heating chip of Tu = 20 ° C to Tmax = 55 ° C,
at nominal power dissipation (16,5W / cm²)?
15s image after operation
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Measurement 2
with WIRELAID ML4 wire @1@4
Heating chip of Tu = 20 ° C to Tmax = 38 ° C,
at nominal power dissipation (16,5W / cm²)
Image after 15s operating
Note the significant heat spreading over the horizontal wires
and the lower temperature after the measuring time Tmax
Much improved situation, and NO hot spot spot
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Perspective: Powerflex



Embedded wires through „Semiflex-Area“
Combination buckling and bending area
Signals and currents transported over buckling areas
We have now arrived at the end of the webinar.
You see, WIRELAID is an interesting tool in electronic
development and design. I hope you were able to gain
new knowledge or extend existing ones.
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Thank you for your attention
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