Design Rules Flex-rigid 2F - xRi production according to IPC – 2223 Use A: Flex-to-install A cross-section: 2F - 2Ri F = flex Ri = rigid B TOP 1 2 3 4 BOTTOM D C G G top view 2F – xRi E K F symbol A B C D E F G K - outer layer: partially application of flexible solder mask inner layer: integrally moulded coverlay standard requirements description min. pad diameter via diameter distance Cu → outer layer to rigid flex intersection (bottom) distance Cu → inner layer to rigid flex intersection distance track / flex outline distance of exposed Cu - outlying of rigid-flex intersection distance exposed Cu / rigid flex intersection (top) Minimum width for „cut-in“ track width track spacing thickness Cu → see layer structure thickness of flex material (Polyimid) total thickness of pcb → see layer structure min. bending radius max. quantity of bending cycles (with min. bending radius) solderable surfaces combination with Microvia technology on request advanced requirements via diameter B + 400 µm ≥ 300 µm 200 µm ≥ 300 µm ≥ 500 µm ≥ 300 µm ≥ 300 µm ≥ 1000 µm 800 µm 2,0mm 1,0mm ≥ 150 µm 125 µm ≥ 150 µm 125 µm www.we-online.com 50 µm www.we-online.com 3 mm 100 chem. Ni/Au, chem. Ag - enhanced specifications on request – please ask us ! 19.04.2012 AS 1/1 www.we-online.com