Reliability Report: LBA716 8 Pin DIP Qualification Report No.: 2012-001 Reliability Report Reliability Data for LBA716 8 Pin DIP Product Report Title: Reliability Data for LBA716 8 Pin DIP Product Report Number: 2012-001 Date: 1/13/2012 IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA Tel: 1-978-524-6700, Fax: 1-978-272-5273, WWW.IXYSIC.COM Page 1 of 4 Reliability Report: LBA716 8 Pin DIP Qualification Report No.: 2012-001 Introduction: This report summarizes the Reliability data of IXYS Integrated Circuits Division LBA716. The Reliability data presented here were collected during IXYS ICD’s product qualification and Reliability Monitor data. The purpose of this qualification was to verify IXYS ICD Quality and Reliability requirements as outlined in IXYS ICD internal specifications. The LBA716 is manufactured at IXYS ICD and assembled at ATEC in the Philippines. The process is IXYS ICD P30.1 and LBA716 is available in a 8 Pin DIP package type. Reliability Tests: Table 1 below provides the qualification tests that were performed. The stress tests and sample size are chosen based on the IXYS ICD internal specifications and with the approval of the product development team and quality assurance. Table 1: LBA716 Reliability Tests Product Package Stress Test LBA716 8 Pin DIP LBA716 8 Pin DIP LBA716 8 Pin DIP LBA716 8 Pin DIP LBA716 8 Pin DIP LBA716 8 Pin DIP Applicable Specs and Readpoints JESD22-A108 Stress # Lots Sample Size Conditions HTRB 125C, 80% 2 105 WVDC, 150 1000 hrs Thermal Shock Mil-Std-883, 1 55 0 to 100°C, M1011 10/10 dwells, 15 cycles Temp Cycle Mil-Std-883, N1010,-55 to 125°C, 1 55 “B” 10/10 dwells, 300 cycles MSL J-STD-020D.1 IR Reflow, 1 50 Level 1 Construction Die Coat, Die Mechanical De 1 5 Analysis Attach, Bondline, Cap, SEM Bond Quality ESD JESD22, 1 3 1.5kΩ, 100pF HBM A114-E IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA Tel: 1-978-524-6700, Fax: 1-978-272-5273, WWW.IXYSIC.COM Page 2 of 4 Total 255 55 55 50 5 3 Reliability Report: LBA716 8 Pin DIP Qualification Report No.: 2012-001 Reliability Test Results: The stress tests and associated results for LBA716 qualification are summarized in Table 2. The devices chosen for the qualification were from standard material manufactured through normal production test flow and electrically tested to datasheet limits prior to stressing. Then reliability stresses were conducted and electrically tested to datasheet limit at each interval and final readpoints. Table 2: LBA716 Reliability Test Results Product/ Package Stress/ Kits LBA716 8 Pin DIP LBA716 8 Pin DIP LBA716 8 Pin DIP HTRB TE2587 HTRB TE2885 Thermal Shock T50164 Temp Cycle T50164 MSL 1 T50164 LBA716 8 Pin DIP LBA716 8 Pin DIP LBA716 8 Pin DIP Readpoint Readpoint 2 Readpoint 3 1 / Reject/ / Reject/ / Reject/ SS SS SS 168 hrs. 500 hrs. 1000 hrs. 0/105 0/105 0/105 168 hrs. 500 hrs. 1000 hrs. 0/150 0/150 0/150 15 Cycles 0/55 300 Cycles 0/55 IR Reflow Level 1 0/50 Construction Die Coat Analysis 0/5 T50164 Die Attach 0/5 Comments Bondline, Bond Quality 0/5 ESD Testing Results: As part of this qualification, the product LBA716 was subjected to Human Body Model (HBM) ESD Sensitivity Classification testing using a KeyTek Zapmaster system. The results are summarized in Table 3. All samples were electrically tested to data sheet limits before and after ESD stressing and they passed after +/- 8000V zapping. ESD Model HBM Table3: Product LBA716 ESD Characterization Results Kit Package ESD Test RC Highest Number Spec Network Passed LBA716 8 Pin Dip JESD22, 8000V 1.5kΩ, T50164 A114-E 100pF Class 3B IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA Tel: 1-978-524-6700, Fax: 1-978-272-5273, WWW.IXYSIC.COM Page 3 of 4 Reliability Report: LBA716 8 Pin DIP Qualification Report No.: 2012-001 FIT (Failure in Time) Rate of LBA716 Table 4 below summarizes the FIT rate from the HTRB data. Using the Reliability HTRB data, FIT rate was calculated based on the equivalent device hours at use condition of 40°C and stressed condition of 125°C at 0.7eV of activation. The FIT rate came out to be 14.13 FITs. Product/ Stress LBA716/ HTRB Table 4: LBA716 FIT Rate Summary Lot # of # of Hours Test Number Devices Failed Tested Temp (°°C) TE2885 255 0 1000 125 TE2587 Eq. Device Hours 65,128,521 Conclusion: The qualification of the product LBA716 has been successfully completed for the production release. IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA Tel: 1-978-524-6700, Fax: 1-978-272-5273, WWW.IXYSIC.COM Page 4 of 4 FITs @ 60% CL 14.13