Reliability Report-CPC5712 Qualification No: 2008-003 Reliability Report Reliability Data for CPC5712 Report Title: Reliability Data for CPC5712 Report Number: 2008-003 Date: 9/5/08 IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA Tel: 1-978-524-6700, Fax: 1-978-524-4700, Toll Free: 1-800-272-5273, WWW.IXYSIC.COM Page 1 of 4 Reliability Report-CPC5712 Qualification No: 2008-003 Introduction: This report summarizes the Reliability data of IXYS IC Division CPC5712. The Reliability data presented here were collected during IXYS IC Division product qualification. The purpose of this qualification was to verify IXYS IC Division Quality and Reliability requirements as outlined in IXYS IC Division internal specifications. The CPC5712 silicon is foundered at X-Fab Semiconductor Foundries AG in Dresden, Germany using the C7A process and assembled at Millenium Microtech in Shanghai, China available on 16-Lead QSOP package. Reliability Tests: Table 1 below provides the qualification tests that were performed. The stress tests and sample size are chosen based on IXYS IC Division internal specifications and with the approval of the product development team and quality assurance. Table 1: Product CPC5712 Reliability Tests Stress Test Thermal Shock (T/S) Temp Cycle (T/C) Applicable Specs Mil-Std-883, M1011 Mil-Std-883, N1010, “B” ESD HBM JESD22, A114-E Stress Conditions Product/ Package 0 to 100°C, 10/10 CPC5712 dwells, 15 cycles 16L QSOP -55 to 125°C, 10/10 CPC5712 16L QSOP dwells, 300 cycles CPC5712 1.5kΩ, 100pF 16L QSOP Number Sample Total of Lots Size (SS) SS 2 55 110 2 55 110 1 8 8 Reliability Test Results: The stress tests and associated results for the product CPC5712 qualification are summarized in Table 2. The devices chosen for the qualification were from standard material manufactured through normal production test flow and electrically tested to datasheet limits prior to stressing. Then reliability stresses were conducted and electrically tested to datasheet limit at each interval and final readpoints. Table 2: Product CPC5712 Reliability Test Results Stress Test Product/Kit Number Thermal Shock CPC5712 ME0007 Readpoint / (Reject/ SS) 15 Cycles Comments Qual Lot#1 Data 0/55 IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA Tel: 1-978-524-6700, Fax: 1-978-524-4700, Toll Free: 1-800-272-5273, WWW.IXYSIC.COM Page 2 of 4 Reliability Report-CPC5712 Qualification No: 2008-003 Stress Test Product/Kit Number Thermal Shock CPC5712 ME0011 Temp Cycle Temp Cycle CPC5712 ME0007 CPC5712 ME0011 Readpoint / (Reject/ SS) 15 Cycles Comments Qual Lot#2 Data 0/55 300 Cycles Qual Lot#1 Data 0/55 300 Cycles Qual Lot#2 Data 0/55 ESD Testing Results: As part of this qualification, the product CPC5712 was subjected to Human Body Model (HBM) ESD Sensitivity Classification testing using a KeyTek Zapmaster system. The results are summarized in Table 3. All samples were electrically tested to data sheet limits before and after ESD stressing and they passed after +/-4000V testing. Table3: Product CPC5712 ESD Characterization Results ESD Product/Kit Package ESD Test RC Highest Class Model Number Spec Network Passed HBM CPC5712 16L QSOP JESD22, 4000V 3A 1.5kΩ, TE023 A114-E 100pF IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA Tel: 1-978-524-6700, Fax: 1-978-524-4700, Toll Free: 1-800-272-5273, WWW.IXYSIC.COM Page 3 of 4 Reliability Report-CPC5712 Qualification No: 2008-003 Conclusion: The qualification of the product CPC5712 has been successfully completed for the production release. Additional qualification reports are available through X-FAB Semiconductor and Millenium Microtech APPROVAL: Prepared by: _Martha W. Brandt*_________________________________9/5/08______ Martha W. Brandt Date Quality Engineer Approved by: _Ajit Patel*________________________________________9/5/08_______ Ajit Patel Date Product Engineer Approved by: _Ronald P. _Clark*___________________________________9/5/08_________ Ronald P. Clark Date Director of Quality Approved by: James Archibald*____________________________________9/5/08__________ James Archibald Date Director of Development Engineering *Signature on File IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA Tel: 1-978-524-6700, Fax: 1-978-524-4700, Toll Free: 1-800-272-5273, WWW.IXYSIC.COM Page 4 of 4