Reliability Report-IXD_630 Series VIS Foundry Process CU05UMS12010 Qualification No: 2012-016 Reliability Report Reliability Data for IXD_630 Series VIS Foundry Process CU05UMS12010 Report Title: Reliability Data for IXD_630 Series VIS Foundry Process CU05UMS12010 Report Number: 2012-016 Date: 6/20/12 IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA Tel: 1-978-524-6700, Fax: 1-978-27-CLARE, WWW.IXYSIC.COM Page 1 of 7 Reliability Report-IXD_630 Series VIS Foundry Process CU05UMS12010 Qualification No: 2012-016 Introduction: This report summarizes the Reliability data of IXYS Integrated Circuits Division IXD_630 Series. The Reliability data presented here were collected during IXYS IC Division product qualification. The purpose of this qualification was to verify IXYS IC Division Quality and Reliability requirements as outlined in IXYS IC Division internal specifications. The IXD_630 Series Gate Driver silicon is foundered at Vanguard International Semiconductor, Corp. (VIS) and assembled at Fastech in the Philippines. The VIS process is CU05UMS12010. Reliability Tests: Table 1 below provides the qualification tests that were performed. The stress tests and sample size are chosen based on the IXYS IC Division internal specifications and with the approval of the product development team and quality assurance. Table 1: Product Family IXD_630 Series Reliability Tests Stress Test HTRB Applicable Stress Specs Conditions JESD22-A108 125C, 80% WVDC, 1000 hrs Thermal Mil-Std-883, Shock (T/S) M1011 0 to 100°C, 10/10 dwells, 15 cycles Temp Cycle Mil-Std-883, (T/C) N1010, “B” -55 to 125°C, 10/10 dwells, 300 cycles High Temp JESD22-A103C125°C, 1000hrs Storage Product/ Package IXDD609CI 5L TO-220 IXDD609PI 8 Pin DIP IXDD614CI 5L TO-220 IXDD614YI 5L TO-263 IXDN614YI 5L TO-263 IXDD609CI 5L TO-220 IXDD614CI 5L TO-220 IXDD614YI 5L TO-263 IXDN614YI 5L TO-263 IXDD609CI 5L TO-220 IXDD614CI 5L TO-220 IXDD614YI 5L TO-263 IXDN614YI 5L TO-263 IXDD609CI 5L TO-220 Number Sample Total of Lots Size (SS) SS 1 45 45 1 6 110 55 110 330 6 55 330 6 50 300 IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA Tel: 1-978-524-6700, Fax: 1-978-27-CLARE, WWW.IXYSIC.COM Page 2 of 7 Reliability Report-IXD_630 Series VIS Foundry Process CU05UMS12010 Qualification No: 2012-016 Stress Test MSL Applicable Stress Specs Conditions J-STD-020D.1 IR Reflow, Level 1 ESD HBM JESD22, A114-E 1.5kΩ, 100pF Product/ Package IXDD614CI 5L TO-220 IXDD614YI 5L TO-263 IXDD609CI 5L TO-220 IXDD630YI 5L TO-263 IXDD609CI 5L TO-220 Number Sample Total of Lots Size (SS) SS 4 50 200 2 9 18 Reliability Test Results: The stress tests and associated results for the product family IXD_630 Series qualification are summarized in Table 2. The devices chosen for the qualification were from standard material manufactured through normal production test flow and electrically tested to datasheet limits prior to stressing. Then reliability stresses were conducted and electrically tested to datasheet limit at each interval and final readpoints. Table 2: Product Family IXD_630 Series Reliability Test Results Stress Test Product/Kit Number HTRB IXDD609CI C00154 1108 HTRB IXDD609PI C00039 1023 Thermal Shock IXDD614CI FFE049 Thermal Shock IXDD614CI C00044 1021 Thermal Shock IXDD614YI C00043 1021 Thermal Shock IXDN614YI FFE047 1149 Thermal Shock IXDD614YI FFE048 1149 Readpoint / (Reject/ SS) 1000 hrs. Qual Lot#1 Data 0/45 1000 hrs. Qual Lot#1 Data Comments 0/110 15 Cycles Qual Lot#1 Data 0/55 15 Cycles Qual Lot#2 Data 0/55 15 Cycles Qual Lot#3Data 0/55 15 Cycles Qual Lot#4Data 0/55 15 Cycles 0/55 Qual Lot#5 Data IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA Tel: 1-978-524-6700, Fax: 1-978-27-CLARE, WWW.IXYSIC.COM Page 3 of 7 Reliability Report-IXD_630 Series VIS Foundry Process CU05UMS12010 Qualification No: 2012-016 Stress Test Readpoint / (Reject/ SS) 15 Cycles Product/Kit Number Thermal Shock IXDD609CI C00154 1108 0/55 Temp Cycle 300 Cycles Temp Cycle Temp Cycle Temp Cycle Temp Cycle Temp Cycle High Temp Storage High Temp Storage High Temp Storage High Temp Storage IXDD614CI FFE049 1149 IXDD614CI C00044 1021 IXDD614YI C00043 1021 IXDN614YI FFE047 1149 IXDD614YI FFE048 1149 IXDD609CI C00154 1108 IXDD614CI FFE049 1149 IXDD614CI C00044 1021 IXDD614YI C00043 1021 IXDN614YI FFE047 1149 Comments Qual Lot#6 Data Qual Lot#1 Data 0/55 300 Cycles Qual Lot#2 Data 0/55 300 Cycles Qual Lot#3 Data 0/55 300 Cycles Qual Lot#4 Data 0/55 300 Cycles Qual Lot#5 Data 0/55 300 Cycles Qual Lot#6 Data 0/55 1000 hrs. Qual Lot#1 Data 0/50 1000 hrs. Qual Lot#2 Data 0/50 1000 hrs. Qual Lot#3 Data 0/50 1000 hrs Qual Lot#4 Data 0/50 IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA Tel: 1-978-524-6700, Fax: 1-978-27-CLARE, WWW.IXYSIC.COM Page 4 of 7 Reliability Report-IXD_630 Series VIS Foundry Process CU05UMS12010 Qualification No: 2012-016 Stress Test Product/Kit Number High Temp Storage IXDD614YI FFE048 1149 High Temp Storage MSL IXDD609CI C00154 1108 IXDD630YI C00278 1133 MSL IXDD614CI C00044 1021 MSL IXDD614YI C00043 1021 Readpoint / (Reject/ SS) 1000 hrs Comments Qual Lot#5 Data 0/50 1000 hrs Qual Lot#6 Data 0/50 IR Reflow Level 1 0/50 IR Reflow Level 1 0/50 IR Reflow Level 1 Qual Lot#1 Data Qual Lot#2 Data Qual Lot#3 Data 0/50 MSL IXDD609CI C00154 1108 IR Reflow Level 1 Qual Lot#4 Data 0/50 ESD Testing Results: As part of this qualification, the product family IXD_630 Series was subjected to Human Body Model (HBM) ESD Sensitivity Classification testing using a KeyTek Zapmaster system. The results are summarized in Table 3. All samples were electrically tested to data sheet limits before and after ESD stressing and they passed after +/-3000V zapping. Table3: Product Family IXD_630 Series ESD Characterization Results ESD Product/Kit Package ESD Test RC Highest Class Model Number Spec Network Passed HBM IXDD630YI 5L TO-263 JESD22, 3000V 2 1.5kΩ, C00278 A114-E 100pF IXDD609CI 5L TO-220 C00154 IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA Tel: 1-978-524-6700, Fax: 1-978-27-CLARE, WWW.IXYSIC.COM Page 5 of 7 Reliability Report-IXD_630 Series VIS Foundry Process CU05UMS12010 Qualification No: 2012-016 FIT (Failure in Time) Rate on the Product Family IXD_630 Series: Table 4 summarizes the number of devices used for the product family IXD_630 Series reliability stress with associated failures. Using the HTRB data, FITs were calculated based on the Acceleration Factor (AF) and equivalent device hours at 0.7eV of activation energy for 125°C test temperature and 40°C use temperatures. The calculated FITs from the reliability stress came out to be 23.24 for HTRB. Table 4: Product Family IXD_630 Series FIT Rate Summary Qual# Stress Product/Kit # of # of Hours Act. Acc. Equivalent FIT Rate Number Devices Fails Tested Energy Factor Dev. Hours @ 60% CL 1 HTRB IXDD609CI C00154 1108 IXDD609PI C00039 1023 45 0 1000 0.7 39,587,925 1.4318E +03 110 Conclusion: The qualification of the product family IXD_630 Series has been successfully completed for the production release. The reliability and process data for VIS CU05UMS12010 can be found at S:/REED/Projects/New Process Information/Vanguard and can be supplied at customer request. IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA Tel: 1-978-524-6700, Fax: 1-978-27-CLARE, WWW.IXYSIC.COM Page 6 of 7 23.24 Reliability Report-IXD_630 Series VIS Foundry Process CU05UMS12010 Qualification No: 2012-016 APPROVAL: Prepared by: __Martha W. Brandt* Martha W. Brandt Quality Engineer Approved by: __Ronald P. Clark* Ronald P. Clark Director of Quality _6/20/12___ Date _6/21/12____ Date Approved by: _James Archibald* _6/21/12____ James Archibald Date Director of Development Engineering *Signature on File IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA Tel: 1-978-524-6700, Fax: 1-978-27-CLARE, WWW.IXYSIC.COM Page 7 of 7