IX2204

Reliability Report-IX2204NE
Qualification No: 2013-007
Reliability Report
Reliability Data for IX2204NE
Report Title: Reliability Data for IX2204NE
Report Number: 2013-007
Date:
11/14/13
IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA
Tel: 1-978-524-6700, Fax: 1-978-524-4700, Toll Free: 1-800-272-5273, WWW.IXYSIC.COM
Page 1 of 5
Reliability Report-IX2204NE
Qualification No: 2013-007
Introduction:
This report summarizes the Reliability data of IXYS Integrated Circuits Division
IX2204NE. The Reliability data presented here were collected during IXYS product
qualification. The purpose of this qualification was to verify the IXYS Quality and
Reliability requirements as outlined in IXYS internal specifications. The IX2204NE silicon
is manufactured at IXYS IC Division using the P32 process and assembled at Greatek in
Taiwan.
Reliability Tests:
Table 1 below provides the qualification tests that were performed. The stress tests and
sample size are chosen based on the IXYS internal specification and with the approval of
the product development team and quality assurance.
Table 1: Product IX2204NE Reliability Tests
Stress
Test
Applicable
Specs
Stress
Conditions
Mil-Std-883 125°C, 80%
1000hrs
JESD22130°C, 85%
A110-C
18.8PSI, 96hrs
Thermal
Mil-Std-883, 0 to 100°C, 10/10
Shock (T/S) M1011
dwells, 15 cycles
Temp Cycle Mil-Std-883, -55 to 125°C, 10/10
(T/C)
N1010, “B” dwells,
300 cycles
MSL
J-STDIR Reflow,
020D.1
Level 1
Hot
JESD22125C, 1000 hrs
Storage
A103-C
ESD
JESD22,
1.5kΩ, 100pF
HBM
A114-E
HTRB
HAST
Product/
Package
IX2204NE
16L SOICN
IX2204NE
16L SOICN
IX2204NE
16L SOICN
IX2204NE
16L SOICN
IX2204NE
16L SOICN
IX2204NE
16L SOICN
IX2204NE
16L SOICN
Number Sample Total
of Lots Size (SS) SS
3
467
1
110,
110, 112
77, 78, 78
78, 78, 78
55
2
55
110
1
50
50
1
50
50
1
15
15
6
IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA
Tel: 1-978-524-6700, Fax: 1-978-524-4700, Toll Free: 1-800-272-5273, WWW.IXYSIC.COM
Page 2 of 5
332
55
Reliability Report-IX2204NE
Qualification No: 2013-007
Reliability Test Results:
The stress tests and associated results for the product IX2204NE qualification are
summarized in Table 2. The devices chosen for the qualification were from standard
material manufactured through normal production test flow and electrically tested to
datasheet limits prior to stressing. Then reliability stresses were conducted and electrically
tested to datasheet limit at each interval and final readpoints.
Table 2: Product IX2204NE Reliability Test Results
Stress Test
HTRB
HTRB
HTRB
Product/Kit
Number
IX2204NE
GGE0013
IX2204NE
GGE0023
IX2204NE
GGE0012
HAST
IX2204NE
HAST
GGE0010
IX2204NE
GGE0013
Readpoint
/ (Reject/
SS)
1000 hrs.
0/110
1000 hrs.
0/110
1000 hrs.
0/112
96 hrs.
0/77
96 hrs
0/78
HAST
HAST
IX2204NE
GGE0012
IX2204NE
GGE0023
HAST
IX2204NE
GGE0031
HAST
IX2204NE
GGE0031
Thermal Shock IX2204NE
GGE0023
Temp Cycle
IX2204NE
GGE0023
Temp Cycle
IX2204NE
GGE0031
96 hrs
0/78
96 hrs
0/78
96 hrs
0/78
96 hrs
0/78
15 cycles
0/55
300 cycles
0/55
300 cycles
0/55
IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA
Tel: 1-978-524-6700, Fax: 1-978-524-4700, Toll Free: 1-800-272-5273, WWW.IXYSIC.COM
Page 3 of 5
Reliability Report-IX2204NE
Qualification No: 2013-007
Stress Test
MSL
Hot Storage
Product/Kit
Number
IX2204NE
GGE0024
IX2204NE
GGE0023
Readpoint
/ (Reject/
SS)
Level 1
0/50
1000 hrs
0/50
ESD Testing Results:
As part of this qualification, the product IX2204NE was subjected to Human Body Model
(HBM) ESD Sensitivity Classification testing using a KeyTek Zapmaster system. The
results are summarized in Table 3. All samples were electrically tested to data sheet limits
before and after ESD stressing and they passed after +/-700V testing.
Table3: Product IX2204NE ESD Characterization Results
ESD
Product/Kit Package
ESD Test
RC
Highest
Class
Model Number
Spec
Network Passed
HBM IX2204NE
16L SOICN
JESD22,
700V
1B
1.5kΩ,
GGE0013
A114-E
100pF
FIT (Failure in Time) Rate on the Product IX2204NE:
Table 4 summarizes the number of devices used for the product IX2204NE reliability stress
with associated failures. Using the HTRB data, FITs were calculated based on the
Acceleration Factor (AF) and equivalent device hours at 0.7eV of activation energy for
125°C test temperature and 40°C use temperature. For HAST stress, FITs were calculated
based on the Acceleration Factor (AF) and equivalent device hours at 0.7eV activation
energy for 130°C test temperature and 40°C use temperature. The calculated FITs from the
reliability stress came out to be 10.85 and 14.33 for HTRB and HAST, respectively.
IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA
Tel: 1-978-524-6700, Fax: 1-978-524-4700, Toll Free: 1-800-272-5273, WWW.IXYSIC.COM
Page 4 of 5
Reliability Report-IX2204NE
Qualification No: 2013-007
Table 4: Product IX2204NE FIT Rate Summary
Qual# Stress Product/Kit # of
# of Hours Act.
Acc.
Number
Devices Fails Tested Energy Factor
1
1
HTRB IX2204NE
GGE0010
GGE0013
GGE0012
332
HAST IX2204NE
GGE0010
GGE0013
GGE0012
GGE0023
GGE0031
467
0
1000
Equivalent
Dev. Hours
FIT Rate
@ 60%
CL
84,794,781
10.85
1.4318E 64,189,811
+03
14.33
0.7
255.41
0
96
0.7
Conclusion:
The qualification of the product IX2204NE has been successfully completed for the
production release.
APPROVAL:
Prepared by:
_Martha W. Brandt*__________________________________11/15/13_
Martha W. Brandt
Date
Quality Engineer
Approved by:
_Jose Pinales*_______________________________________11/25/13_
Jose Pinales
Date
Product Engineer
Approved by:
_Ronald P. Clark*___________________________________11/22/13_
Ronald P. Clark
Date
Director of Quality
Approved by:
_James Archibald*___________________________________11/22/13_
James Archibald
Date
Director of Engineering
*Signature on File
IXYS Integrated Circuits Division, 78 Cherry Hill Drive, Beverly, MA 01915, USA
Tel: 1-978-524-6700, Fax: 1-978-524-4700, Toll Free: 1-800-272-5273, WWW.IXYSIC.COM
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