Package Reliability www.vishay.com Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR METAL CAN STRESS SAMPLE SIZE DEVICE HR./CYC CONDITION TOTAL FAILS BOND INT 130 30 000 200 °C + N2 0 0 Solderability 30 90 883 M2003 0 0 Temp. Cycle 628 426 000 -55 °C to 150 °C 0 0 Revision: 22-Dec-15 FAIL PERCENTAGE Document Number: 72454 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000