Package Reliability

Package Reliability
Vishay Siliconix
ENVIRONMENTAL AND PACKAGE TESTING DATA FOR FLAT PACK (14, 16)
Stress
Sample Size
Device Hr./Cyc
Condition
Total Fails
Fail Percentage
Solderability
30
240
883 M2003
0
0.00
Temp Cycle
100
10,000
−65_C−150_C
0
0.00
Document Number: 72550
31-Jan-05
www.vishay.com
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