Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR CerDIP/SIDEBRAZE Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage Solderability 105 840 883 M2003 0 0.00 Temp Cycle 500 130,000 ā65_Cā150_C 0 0.00 Document Number: 72452 30-Jan-05 www.vishay.com 1