Package Reliability

Package Reliability
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Vishay Siliconix
ENVIRONMENTAL AND PACKAGE TESTING DATA FOR POWERPAK® MLP4535
STRESS
SAMPLE SIZE
DEVICE HRS./CYC
CONDITION
TOTAL FAILS
FAIL PERCENTAGE
Bond Integrity
80
40 000
200 °C + N2
0
0.00
HAST
328
32 800
130 °C, 85 % RH
0
0.00
Pressure Pot
328
31 488
121°C, 15 PSIG
0
0.00
Solder Dunk
164
492
260 °C, 10 s
0
0.00
Temp. Cycle
328
328 000
-65 °C to +150 °C
0
0.00
Document Number: 66924
1
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Revision: 31-Oct-14