Package Reliability www.vishay.com Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR POWERPAK® MLP4535 STRESS SAMPLE SIZE DEVICE HRS./CYC CONDITION TOTAL FAILS FAIL PERCENTAGE Bond Integrity 80 40 000 200 °C + N2 0 0.00 HAST 328 32 800 130 °C, 85 % RH 0 0.00 Pressure Pot 328 31 488 121°C, 15 PSIG 0 0.00 Solder Dunk 164 492 260 °C, 10 s 0 0.00 Temp. Cycle 328 328 000 -65 °C to +150 °C 0 0.00 Document Number: 66924 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Revision: 31-Oct-14