Package Reliability www.vishay.com Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR TSOP-6 STRESS SAMPLE SIZE DEVICE HR./CYC CONDITION TOTAL FAILS BOND INT 40 20 000 200 °C + N2 0 FAIL PERCENTAGE 0 HAST 779 77 900 130 °C, 85 % RH 0 0 Pressure Pot 1011 97 056 121°, 15 PSIG 0 0 Solder DUNK 40 120 260 °C, 10 s 0 0 Solderability 15 120 883 M2003 0 0 Temp. Cycle 947 560 724 -55 °C to 150 °C 0 0 Revision: 22-Dec-15 Document Number: 72473 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000