Package Reliability

Package Reliability
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Vishay Siliconix
ENVIRONMENTAL AND PACKAGE TESTING DATA FOR TSOP-6
STRESS
SAMPLE SIZE
DEVICE HR./CYC
CONDITION
TOTAL FAILS
BOND INT
40
20 000
200 °C + N2
0
FAIL PERCENTAGE
0
HAST
779
77 900
130 °C, 85 % RH
0
0
Pressure Pot
1011
97 056
121°, 15 PSIG
0
0
Solder DUNK
40
120
260 °C, 10 s
0
0
Solderability
15
120
883 M2003
0
0
Temp. Cycle
947
560 724
-55 °C to 150 °C
0
0
Revision: 22-Dec-15
Document Number: 72473
1
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