Package Reliability

Package Reliability
Vishay Siliconix
ENVIRONMENTAL AND PACKAGE TESTING DATA FOR MLP65
Stress
Sample Size
Device Hr./Cyc
Condition
Total Fails
Fail Percentage
85/85
165
51,700
85_C, 85%RH
0
0.00
BOND INT
600
450,000
200_C + N2
0
0.00
HAST
1,310
131,000
130_C, 85%RH
0
0.00
Solder Dunk
240
720
260_C, 10 SEC.
0
0.00
Pressure Pot
1,745
167,520
121_, 15 PSIG
0
0.00
Solderability
285
2,280
883 M2003
0
0.00
Temp Cycle
1,790
1,027,500
−65_C−150_C
0
0.00
Document Number: 73175
31-Jan-05
www.vishay.com
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