Package Reliability

Package Reliability
Vishay Siliconix
ENVIRONMENTAL AND PACKAGE TESTING DATA FOR LCC 20−28 LEAD
Stress
Sample Size
Device Hr./Cyc
Condition
Total Fails
Fail Percentage
85/85
3,086
2,570,580
85_C, 85%RH
0
0.00
BOND INT
1,130
763,750
200_C + N2
0
0.00
HAST
6,351
658,040
130_C, 85%RH
0
0.00
HIGH TEMP STORAGE
125
124,500
200_C
0
0.00
Pressure Pot
17,744
1,471,166
121_, 15 PSIG
0
0.00
Salt Atmosphere
800
21,720
883 M1009
0
0.00
Solder DUNK
20
60
260_C, 10SEC
0
0.00
Solderability
2,016
16,888
883 M2003
0
0.00
Temp Cycle
4,822
4,058,950
- 65_C - 150_C
0
0.00
Thermal Shock
9,731
1,141,740
- 60_C - 150_C
0
0.00
Document Number: 72549
30-Sep-03
www.vishay.com
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