Package Reliability

Package Reliability
Vishay Siliconix
ENVIRONMENTAL AND PACKAGE TESTING DATA FOR TSSOP 14-28 LEAD
Stress
Sample Size
Device Hr./Cyc
Condition
Total Fails
Fail Percentage
BOND INT
160
80,000
200_C + N2
0
0.00
HAST
2,050
202,500
130_C, 85%RH
0
0.00
Pressure Pot
5,607
547,872
121_, 15 PSIG
0
0.00
Solder DUNK
590
1,830
260_C, 10SEC
0
0.00
Solderability
840
6,960
883 M2003
0
0.00
Temp Cycle
6,260
2,183,000
−65_C−150_C
0
0.00
Thermal Shock
850
8,500
−60_C−150_C
0
0.00
Document Number: 72447
29-Jan-05
www.vishay.com
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