SCI-203

(17) GSM Band Low Pass Filter (SCI-203W/F)
FEATURES
• Passive integration on silicon substrate
• Low insertion loss in pass band
• Small size: 1.0 mm x 1.2 mm (wirebond)
1.0 mm x 1.2 mm (flip chip)
•
•
•
•
Eutectic Sn/Pb or lead-free solder bump
Low profile, 0.40 mm height
Directly attachable on PCB or flipped on PCB
Operating temperature: -40 to +85 ℃
• Storage temperature: -40 to +85 ℃
SCI-203W (Wirebond)
SCI-203F (Flip Chip)
DESCRIPTION
ELECTRICAL SPECIFICATIONS
STATS ChipPAC’s SCI-203W/F is a low pass filter
(LPF) for GSM band applications. The LPF has low
pass-band insertion loss and small size. It is composed
of 8.0 um Cu-plated inductors and Metal-InsulatorMetal capacitors which are fabricated on a silicon
substrate using STATS ChipPAC’s IPD (Integrated
Passive Device) process. The pad or bump size and
pitch of the LPF are selected so that the device can be
mounted directly on a PCB or laminate substrate using
conventional wire-bonding or surface mount
techniques. The low profile and small form-factor of the
device make it especially suitable for SiP applications.
(Test board loss 0.04 dB included)
Specification
Pass Band
Unit
MHz
Insertion Loss
dB
Return Loss
dB
Attenuation, 2f0
dB
Attenuation, 3f0
dB
Size
mm
Minimum
Typical
824
Maximum
915
0.6
20
20
20
1.0 x 1.2 (WB)
1.0 x 1.2 (FC)
DIMENSIONS
STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no
circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the
information at any time and without notice.
0
-10
-20
-30
-40
0
1
2
3
freq, GHz
4
Return Loss (dB)
Insertion Loss (dB)
TYPICAL CHARACTERISTICS
0
-10
-20
-30
-40
0
1
2
3
freq, GHz
4
TEST BOARD DRAWING
SCI-203W (Wirebond)
SCI-203F (Flip Chip)
Pad
SCI-203W Signal
1
Input
SCI-203F Signal
GND
2
GND
GND
3
Output
Input
4
GND
GND
5
GND
Output
NOTES
All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room
temperature. For best results, ground plane directly beneath the device should be in the top metal layer.
Refer to “Appendix A” for:
• Pad sizes and typical wirebond length used in the wirebonded IPD products.
• Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD
products.
www.statschippac.com
36
All rights reserved. Rev 02/2009