(17) GSM Band Low Pass Filter (SCI-203W/F) FEATURES • Passive integration on silicon substrate • Low insertion loss in pass band • Small size: 1.0 mm x 1.2 mm (wirebond) 1.0 mm x 1.2 mm (flip chip) • • • • Eutectic Sn/Pb or lead-free solder bump Low profile, 0.40 mm height Directly attachable on PCB or flipped on PCB Operating temperature: -40 to +85 ℃ • Storage temperature: -40 to +85 ℃ SCI-203W (Wirebond) SCI-203F (Flip Chip) DESCRIPTION ELECTRICAL SPECIFICATIONS STATS ChipPAC’s SCI-203W/F is a low pass filter (LPF) for GSM band applications. The LPF has low pass-band insertion loss and small size. It is composed of 8.0 um Cu-plated inductors and Metal-InsulatorMetal capacitors which are fabricated on a silicon substrate using STATS ChipPAC’s IPD (Integrated Passive Device) process. The pad or bump size and pitch of the LPF are selected so that the device can be mounted directly on a PCB or laminate substrate using conventional wire-bonding or surface mount techniques. The low profile and small form-factor of the device make it especially suitable for SiP applications. (Test board loss 0.04 dB included) Specification Pass Band Unit MHz Insertion Loss dB Return Loss dB Attenuation, 2f0 dB Attenuation, 3f0 dB Size mm Minimum Typical 824 Maximum 915 0.6 20 20 20 1.0 x 1.2 (WB) 1.0 x 1.2 (FC) DIMENSIONS STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. 0 -10 -20 -30 -40 0 1 2 3 freq, GHz 4 Return Loss (dB) Insertion Loss (dB) TYPICAL CHARACTERISTICS 0 -10 -20 -30 -40 0 1 2 3 freq, GHz 4 TEST BOARD DRAWING SCI-203W (Wirebond) SCI-203F (Flip Chip) Pad SCI-203W Signal 1 Input SCI-203F Signal GND 2 GND GND 3 Output Input 4 GND GND 5 GND Output NOTES All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room temperature. For best results, ground plane directly beneath the device should be in the top metal layer. Refer to “Appendix A” for: • Pad sizes and typical wirebond length used in the wirebonded IPD products. • Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD products. www.statschippac.com 36 All rights reserved. Rev 02/2009