Solder profile for lead free reflow process Figure 1 Classification Reflow Profile for SMT components refer to IPC/JEDEC J-STD-020D Table 1 Classification Reflow Profiles Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Preheat Temperature Min (Tsmin) Temperature Max (Tsmax) Time (tsmin to tsmax) Time maintained above: Temperature (TL) Time (tL) Peak/Classification Temperature (Tp) Time within 5°C of actual Peak Temperature (tp) Ramp-Down Rate Time 25°C to Peak Temperature Pb-Free Assembly 3°C/second max. 150°C 200°C 60-120 seconds 217°C 60-150 seconds See Table 2 20-30 seconds (WE-GF/WE-LAN: 10 s; Tp=245°C) 6°C / sec max. 8 minutes max. refer to IPC/JEDEC J-STD-020D Table 2 Package Classification Reflow Temperature refer to IPC/JEDEC J-STD-020D Note: All temperatures refer to topside of the package, measured on the package body surface Recommended for all parts which are marked with the RoHS logo not otherwise specified in the latest revision of the product specification and Solder profile for wave soldering process Figure 2 Classification wave soldering profile for THT components refer to EN 61760-1:2006 T [°C] 300 Max. 10 sec, max. 5 sec each wave SnPb: 235-260°C 250 SnAgCu: 250-260°C 230 Second wave ∼ 3,5 K/s typisch First wave ∼ 2K/s ∆T < 150 K ∼ 5 K/s 150 130 120 100 typical 60 70 checked 85 120 approved 240 180 t [sec] TF Version 8 19.04.2013 MST Version 7 20.02.2013 HK name Version 6 update 26.03.2009 date