TMD2672

TMD2672
Digital Proximity Detector
General Description
The TMD2672 family of devices provides a complete proximity
detection system and digital interface logic in a single 8-pin
surface mount module. The devices are register-set and
pin-compatible with the TMD2671 series and includes new and
improved proximity detection features. The proximity
detection includes improved signal-to-noise and accuracy. A
proximity offset register allows compensation for optical
system crosstalk between the IR LED and the sensor. To prevent
false proximity data measurement readings, a proximity
saturation indicator bit signals that the internal analog circuitry
has reached saturation. Interrupts have been enhanced with
the addition of a sleep-on-interrupt feature that also allows for
a single cycle operation. The device internal state machine
provides the ability to put the device in a low-power mode in
between proximity measurements, providing very low average
power consumption.
The proximity detection system includes an LED driver and an
IR LED, which are factory trimmed to eliminate the need for
end-equipment calibration due to component variations.
Ordering Information and Content Guide appear at end of
datasheet.
ams Datasheet
[v1-00] 2015-Mar-23
Page 1
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TMD2672 − General Description
Key Benefits & Features
The benefits and features of the TMD2672 digital proximity
detector, are listed below:
Figure 1:
Added Value of Using TMD2672
Benefits
Features
• Digital Proximity Detector, LED Driver, and IR LED in a
Single Optical Module
• Eliminates need for customer
end-product calibration.
• Reduces the proximity noise
• Control of system crosstalk and offset
• Prevents false proximity detection in
bright light
• Selectable IR power-level without
external resistor
• Enables wide operating range
• Register Set- and Pin-Compatible with the TMD2671
Series
• Proximity Detection
- Reduced Proximity Count Variation (1)
- Programmable Offset Control Register (1)
- Saturation Indicator (1)
- Programmable Integration Time and Offset
- Current Sink Driver for IR LED
- 16,000:1 Dynamic Range
• Reduces external processor burden
• Maskable Proximity Interrupt
- Programmable Upper and Lower Thresholds with
Persistence Filter
• Enables dynamic power dissipation
control
• Power Management
- Low Power 2.2μA Sleep State with User-Selectable
Sleep-After-Interrupt Mode (1)
- 90μA Wait State with Programmable Wait Time from
2.7ms to > 8 seconds
• Industry standard two-wire interface
• I²C Fast Mode Compatible Interface
- Data Rates up to 400kbit/s
- Input Voltage Levels Compatible with VDD or 1.8V Bus
• Small foot-print module
• 3.94mm × 2.36mm × 1.35mm Package
Note(s) and/or Footnote(s):
1. New or improved feature
Applications
• Mobile Handset Touchscreen Control and Automatic
Speakerphone Enable
• Mechanical Switch Replacement
• Paper Alignment
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ams Datasheet
[v1-00] 2015-Mar-23
TMD2672 − General Description
End Products and Market Segments
• Mobile Handsets, Tablets, Laptops and HDTVs
• White Goods
• Toys
• Digital Signage
• Printing
Block Diagram
The functional blocks of this device for reference are
shown below:
Figure 2:
TMD2672 Block Diagram
LDR
VDD
Interrupt
Prox Control
LEDA
Prox
Integration
Prox
ADC
Lower Limit
Channel 0
LEDK
SCL
SDA
Wait Control
Channel 1
ams Datasheet
[v1-00] 2015-Mar-23
Upper Limit
Prox
Data
INT
I2C Interface
IR LED Constant
Current Sink
GND
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TMD2672 − Detailed Description
Detailed Description
A fully integrated proximity detection solution is provided with
an 850nm IR LED, LED driver circuit, and proximity detection
engine. An internal LED driver (LDR) pin, is externally connected
to the LED cathode (LEDK) to provide a controlled LED sink
current. This is accomplished with a proprietary current
calibration technique that accounts for all variances in silicon,
optics, package, and most important, IR LED output power. This
eliminates or greatly reduces the need for factory calibration
that is required for most discrete proximity sensor solutions.
The device is factory calibrated to achieve a proximity count
reading at a specified distance with a specific number of pulses.
In use, the number of proximity LED pulses can be programmed
from 1 to 255 pulses, which allows different proximity distances
to be achieved. Each pulse has a 16μs period, with a 7.2μs on
time.
The device provides a separate pin for level-style interrupts.
When interrupts are enabled and a pre-set value is exceeded,
the interrupt pin is asserted and remains asserted until cleared
by the controlling firmware. The interrupt feature simplifies and
improves system efficiency by eliminating the need to poll a
sensor for a proximity value. An interrupt is generated when the
value of a proximity conversion exceeds either an upper or
lower threshold. In addition, a programmable interrupt
persistence feature allows the user to determine how many
consecutive exceeded thresholds are necessary to trigger an
interrupt.
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ams Datasheet
[v1-00] 2015-Mar-23
TMD2672 − Pin Assignments
The TMD2672 pin assignments are described below:
Pin Assignments
Figure 3:
Pin Diagram (Top View)
Package Module-8:
Package drawing is not to scale
VDD 1
8 SDA
SCL 2
7 INT
GND 3
6 LDR
LEDA 4
5 LEDK
Figure 4:
Terminal Functions
Terminal
Type
Description
Name
No.
VDD
1
SCL
2
GND
3
Power supply ground. All voltages are referenced to GND.
LEDA
4
LED anode
LEDK
5
LED cathode. Connect to LDR pin when using internal LED driver circuit.
LDR
6
O
LED driver input for proximity IR LED, constant current source LED driver
INT
7
O
Interrupt - open drain (active low)
SDA
8
I/O
I²C serial data I/O terminal - serial data I/O for I²C
ams Datasheet
[v1-00] 2015-Mar-23
Supply voltage
I
I²C serial clock input terminal - clock signal for I²C serial data
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TMD2672 − Absolute Maximum Ratings
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. These are stress
ratings only. Functional operation of the device at these or any
other conditions beyond those indicated under Recommended
Operating Conditions is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute Maximum Ratings
Figure 5:
Absolute Maximum Ratings over Operating Free-Air Temperature Range (unless otherwise noted)
Symbol
VDD
Parameter
Min
Max
Unit
3.8
V
Supply voltage (1)
Input terminal voltage
-0.5
3.8
V
Output terminal voltage (except LDR)
-0.5
3.8
V
3.8
V
Output terminal voltage (LDR)
Tstg
Output terminal current (except LDR)
-1
20
mA
Storage temperature range
-40
85
°C
ESD tolerance, human body model
±2000
V
Note(s) and/or Footnote(s):
1. All voltages are with respect to GND.
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ams Datasheet
[v1-00] 2015-Mar-23
TMD2672 − Electrical Characteristics
All limits are guaranteed. The parameters with min and max
values are guaranteed with production tests or
SQC (Statistical Quality Control) methods.
Electrical Characteristics
Figure 6:
Recommended Operating Conditions
Symbol
VDD
TA
Parameter
Min
Nom
Max
Unit
Supply voltage
2.6
3
3.6
V
Supply voltage accuracy, VDD total error including
transients
-3
3
%
Operating free-air temperature range (1)
-30
85
°C
Note(s) and/or Footnote(s):
1. While the device is operational across the temperature range, functionality will vary with temperature. Specifications are stated
only at 25°C unless otherwise noted.
Figure 7:
Operating Characteristics, VDD = 3V, TA = 25°C (unless otherwise noted)
Symbol
IDD
VOL
Parameter
Supply current
INT, SDA output low
voltage
Test Conditions
Min
Typ
Max
Active - LDR pulse off
195
250
Wait state
90
Sleep state - no I²C activity
2.2
Unit
μA
4
3mA sink current
0
0.4
6mA sink current
0
0.6
V
ILEAK
Leakage current, SDA,
SCL, INT pins
-5
5
μA
ILEAK
Leakage current, LDR
pin
-5
5
μA
VIH
SCL, SDA input high
voltage
VIL
SCL, SDA input low
voltage
ams Datasheet
[v1-00] 2015-Mar-23
TMD26721
0.7 VDD
TMD26723
1.25
V
TMD26721
0.3 VDD
TMD26723
0.54
V
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TMD2672 − Electrical Characteristics
Figure 8:
Proximity Characteristics, VDD = VLEDA = 3V, TA = 25°C, PEN = 1 (unless otherwise noted)
Symbol
IDD
ILEDA
Parameter
Supply current
Test Conditions
Min
LED On
Typ
Max
3
LED On, PDRIVE = 0
100
LED On, PDRIVE = 1
50
LED On, PDRIVE = 2
25
LED On, PDRIVE = 3
12.5
Unit
mA
LEDA current (1)
mA
PTIME
ADC conversion steps
1
256
steps
PTIME
ADC conversion time
PTIME = 0xFF
(= 1 conversion step)
2.58
2.9
ms
PTIME
ADC counts per step
PTIME = 0xFF
(= 1 conversion step)
0
1023
counts
0
255
pulses
2.73
PPULSE
LED pulses (5)
LED On
LED pulse width
PPULSE = 1, PDRIVE = 0
7.3
μs
LED pulse period
PPULSE = 2, PDRIVE = 0
16.0
μs
Proximity response, no
target (offset)
PPULSE = 8, PDRIVE = 0,
PGAIN = 4× (2)
100
counts
Prox count, 100mm target (3)
73mm × 83mm, 90%
reflective Kodak Gray Card,
PGAIN = 4×, PPULSE = 8,
PDRIVE = 0, PTIME = 0xFF (4)
450
520
590
counts
Note(s) and/or Footnote(s):
1. Value is factory-adjusted to meet the Prox count specification. Considerable variation (relative to the typical value) is possible after
adjustment.
2. Proximity offset varies with power supply characteristics and noise.
3. I LEDA is factory calibrated to achieve this specification. Offset and crosstalk directly sum with this value and is system dependent.
4. No glass or aperture above the module. Tested value is the average of 5 consecutive readings.
5. These parameters are ensured by design and characterization and are not 100% tested.
6. Proximity test was done using the following circuit. See “Application Information: Hardware” on page 31. section for recommended
application circuit.
Page 8
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ams Datasheet
[v1-00] 2015-Mar-23
TMD2672 − Electrical Characteristics
Figure 9:
Proximity Test Circuit
VDD
VDD
4
1
TMD2672
1 mF
GND
3
5
6
LEDA
LEDK
LDR
1 mF
22 mF
Figure 10:
IR LED Characteristics, VDD = 3V, TA = 25°C
Symbol
Parameter
Test Conditions
Min
Typ
Max
Unit
1.4
1.5
V
VF
Forward Voltage
IF = 20mA
VR
Reverse Voltage
IR = 10μA
5
V
PO
Radiant Power
IF = 20mA
4.5
mW
λp
Peak Wavelength
IF = 20mA
850
nm
Δλ
Spectral Radiation
Bandwidth
IF = 20mA
40
nm
TR
Optical Rise Time
IF = 100mA, T W = 125ns,
duty cycle = 25%
20
40
ns
TF
Optical Fall Time
IF = 100mA, T W = 125ns,
duty cycle = 25%
20
40
ns
Typ
Max
Unit
2.73
2.9
ms
256
steps
Figure 11:
Wait Characteristics, VDD = 3V, TA = 25°C, WEN = 1 (unless otherwise noted)
Parameter
Wait time
Wait steps
ams Datasheet
[v1-00] 2015-Mar-23
Test Conditions
Min
WTIME = 0xFF (= 1 wait step)
1
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TMD2672 − Electrical Characteristics
Figure 12:
AC Electrical Characteristics, VDD = 3V, TA = 25°C (unless otherwise noted)
Parameter (1)
Symbol
Test Conditions
Min
Typ
Max
Unit
400
kHz
f(SCL)
Clock frequency (I²C only)
t(BUF)
Bus free time between start and
stop condition
1.3
μs
t(HDSTA)
Hold time after (repeated) start
condition. After this period, the first
clock is generated.
0.6
μs
t(SUSTA)
Repeated start condition setup time
0.6
μs
t(SUSTO)
Stop condition setup time
0.6
μs
t(HDDAT)
Data hold time
0
μs
t(SUDAT)
Data setup time
100
ns
t(LOW)
SCL clock low period
1.3
μs
t(HIGH)
SCL clock high period
0.6
μs
0
tF
Clock/data fall time
300
ns
tR
Clock/data rise time
300
ns
Ci
Input pin capacitance
10
pF
Note(s) and/or Footnote(s):
1. Specified by design and characterization; not production tested.
Figure 13:
Parameter Measurement Information: Timing Diagrams
t(LOW)
t(R)
t(F)
VIH
SCL
VIL
t(HDSTA)
t(BUF)
t(HDDAT)
t(HIGH)
t(SUSTA)
t(SUSTO)
t(SUDAT)
VIH
SDA
VIL
P
Stop
Condition
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S
S
P
Start
Condition
ams Datasheet
[v1-00] 2015-Mar-23
TMD2672 − Typical Operating Characteristics
Typical Operating
Characteristics
Figure 14:
Spectral Responsivity
1
Ch 0
Normalized Responsivity
0.8
0.6
0.4
0.2
Ch 1
0
300
400
500
600
700
800
900 1000 1100
λ − Wavelength − nm
Figure 15:
Normalized Responsivity vs. Angular Displacement
1.0
Both Axes
Optical Axis
Normalized Responsivity
0.8
0.6
0.4
0.2
0
−90
ams Datasheet
[v1-00] 2015-Mar-23
-Q
+Q
−60
−30
0
30
60
Q − Angular Displacement − °
90
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TMD2672 − Typical Operating Characteristics
Figure 16:
Typical LDR Current vs. Voltage
160
140
PDRIVE = 00
LDR Current — mA
120
100
80
PDRIVE = 01
60
40
PDRIVE = 10
20
PDRIVE = 11
0
0
0.5
1
1.5
2
2.5
3
LDR Voltage − V
Figure 17:
Normalized IDD vs. VDD and Temperature
IDD — Active Current Normalized @ 3 V, 25C
110%
108%
106%
104%
0C
102%
100%
50C
25C
75C
98%
96%
94%
92%
2.7
2.8
2.9
3
3.1
3.2
3.3
VDD — V
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ams Datasheet
[v1-00] 2015-Mar-23
TMD2672 − Principles of Operation
Principles of Operation
System State Machine
An internal state machine provides system control of the
proximity detection and power management features of the
device. At power up, an internal power-on-reset initializes the
device and puts it in a low-power Sleep state.
When a start condition is detected on the I²C bus, the device
transitions to the Idle state where it checks the Enable register
(0x00) PON bit. If PON is disabled, the device will return to the
Sleep state to save power. Otherwise, the device will remain in
the Idle state until a proximity function is enabled. Once
enabled, the device will execute the Prox and Wait states in
sequence as indicated in Figure 18. Upon completion and
return to Idle, the device will automatically begin a new
prox-wait cycle as long as PON and PEN are enabled.
If the Prox function generates an interrupt and the
Sleep-After-Interrupt (SAI) feature is enabled the device will
transition to the Sleep state and remain in a low-power mode
until an I²C command is received.
See Interrupts for additional information.
Figure 18:
Simplified State Diagram
Sleep
I2C
Start
!PON
Idle
INT & SAI
PEN
!WEN
!PEN &
WEN
Prox
WEN
ams Datasheet
[v1-00] 2015-Mar-23
Wait
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TMD2672 − Principles of Operation
Proximity Detection
Proximity detection is accomplished by measuring the amount
of IR energy, from the internal IR LED, reflected off an object to
determine its distance. The internal proximity IR LED is driven
by the integrated proximity LED current driver as shown in
Figure 19.
Figure 19:
Proximity Detection
LEDA
IR
LED
PPULSE(r0x0E)
PDRIVE(r0x0F, b7:6)
POFFSET(r0x1E)
PTIME(r0x02)
LEDK
LDR
Prox LED
Current Driver
PVALID(r0x13, b1)
PSAT(r0x13, b6)
Prox Control
PDIODE(r0x0F, b5:4)
Object
Prox
Integration
Prox
ADC
Prox
Data
PDATAH(r0x019)
PDATAL(r0x018)
CH1
CH0
Background Energy
The LED current driver, output on the LDR terminal, provides a
regulated current sink that eliminates the need for an external
current limiting resistor. PDRIVE sets the drive current to one of
four selectable levels.
Referring to the Detailed State Machine figure, the LED current
driver pulses the IR LED as shown in Figure 20 during the Prox
Accum state. Figure 20 also illustrates that the LED On pulse has
a fixed width of 7.3μs and period of 16.0μs. So, in addition to
setting the proximity drive current, 1 to 255 proximity
pulses (PPULSE) can be programmed. When deciding on the
number of proximity pulses, keep in mind that the signal
increases proportionally to PPULSE, while noise increases by
the square root of PPULSE.
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ams Datasheet
[v1-00] 2015-Mar-23
TMD2672 − Principles of Operation
Figure 20:
Proximity LED Current Driver Waveform
Reflected IR LED +
Background Energy
LED On
Background
Energy
LED Off
7.3 ms
16.0 ms
IR LED Pulses
Figure 19 illustrates light rays emitting from the internal IR LED,
reflecting off an object, and being absorbed by the CH0 and
CH1 photodiodes. The proximity diode selector (PDIODE)
determines which of the two photodiodes is used for a given
proximity measurement. Note that neither photodiode is
selected when the device first powers up, so PDIODE must be
set for proximity detection to work.
Referring again to Figure 20, the reflected IR LED and the
background energy is integrated during the LED On time, then
during the LED Off time, the integrated background energy is
subtracted from the LED On time energy, leaving the IR LED
energy to accumulate from pulse to pulse. During LED On time
integration, the proximity saturation bit in the Status
register (0x13) will be set if the integrator saturates. This
condition can occur if the proximity gain is set too high for the
lighting conditions, such as in the presence of bright sunlight.
Once asserted, PSAT will remain set until a special function
proximity interrupt clear command is received from the host
(see Command Register)
After the programmed number of proximity pulses have been
generated, the proximity ADC converts and scales the proximity
measurement to a 16-bit value, then stores the result in two
8-bit proximity data (PDATAx) registers. ADC scaling is
controlled by the proximity ADC conversion time (PTIME) which
is programmable from 1 to 256 2.73ms time units. However,
depending on the application, scaling the proximity data will
equally scale any accumulated noise. Therefore, in general, it is
recommended to leave PTIME at the default value of one 2.73ms
ADC conversion time (0xFF).
ams Datasheet
[v1-00] 2015-Mar-23
Page 15
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TMD2672 − Principles of Operation
In many practical proximity applications, a number of optical
system and environmental conditions can produce an offset in
the proximity measurement result. To counter these effects, a
proximity offset (POFFSET) is provided which allows the
proximity data to be shifted positive or negative. Additional
information on the use of the proximity offset feature is
provided in available ams application notes.
Once the first proximity cycle has completed, the proximity
valid (PVALID) bit in the Status register will be set and remain
set until the proximity detection function is disabled (PEN).
For additional information on using the proximity detection
function behind glass and for optical system design guidance,
please see available ams application notes.
Page 16
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ams Datasheet
[v1-00] 2015-Mar-23
TMD2672 − Principles of Operation
Interrupts
The interrupt feature simplifies and improves system efficiency
by eliminating the need to poll the sensor for proximity values
outside a user-defined range. While the interrupt function is
always enabled and its status is available in the Status
register (0x13), the output of the interrupt state can be enabled
using the proximity interrupt enable (PIEN) field in the Enable
register (0x00).
Two 16-bit interrupt threshold registers allow the user to set
limits below and above a desired proximity range. An interrupt
can be generated when the proximity data (PDATA) falls below
the proximity interrupt low threshold (PILTx) or exceeds the
proximity interrupt high threshold (PIHTx).
It is important to note that the thresholds are evaluated in
sequence, first the low threshold, then the high threshold. As a
result, if the low threshold is set above the high threshold, the
high threshold is ignored and only the low threshold is
evaluated.
To further control when an interrupt occurs, the device provides
an interrupt persistence feature. The persistence filter allows
the user to specify the number of consecutive out-of-range
proximity occurrences before an interrupt is generated. The
persistence filter register (0x0C) allows the user to set the
proximity persistence filter (PPERS) values. See the persistence
filter register for details on the persistence filter values. Once
the persistence filter generates an interrupt, it will continue
until a special function interrupt clear command is received
(see Command Register).
Figure 21:
Programmable Interrupt
PIHTH(r 0x0B), PIHTL(r 0x0A)
Upper Limit
Prox
Integration
Prox
ADC
Prox Persistence
Prox
Data
Lower Limit
Channel 0
Channel 1
ams Datasheet
[v1-00] 2015-Mar-23
PPERS(r 0x0C, b7:4)
PILTH(r 0x09), PILTL(r 0x08)
Page 17
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TMD2672 − Principles of Operation
State Diagram
The system state machine shown in Figure 18 provides an
overview of the states and state transitions that provide system
control of the device. This section highlights the programmable
features that affect the state machine cycle time, and provides
details to determine system level timing.
When the proximity detection feature is enabled (PEN), the
state machine transitions through the Prox Init, Prox Accum,
Prox Wait, and Prox ADC states. The Prox Init and Prox Wait times
are a fixed 2.73ms, whereas the Prox Accum time is determined
by the number of proximity LED pulses (PPULSE) and the Prox
ADC time is determined by the integration time (PTIME). The
formulas to determine the Prox Accum and Prox ADC times are
given in the associated boxes in Figure 22. If an interrupt is
generated as a result of the proximity cycle, it will be asserted
at the end of the Prox ADC state and transition to the Sleep state
if SAI is enabled.
When the power management feature is enabled (WEN), the
state machine will transition in turn to the Wait state. The wait
time is determined by WLONG, which extends normal operation
by 12× when asserted, and WTIME. The formula to determine
the wait time is given in the box associated with the Wait state
in Figure 22.
Figure 22:
Expanded State Diagram
Prox
Time: 2.73 ms
Sleep
Prox
Init
!PON
I2C Start
PEN
PPULSE: 0 ~ 255 pulses
Time: 16.0 μs/pulse
Range: 0 ~ 4.1 ms
Prox
Accum
Idle
INT & SAI
!WEN
Time: 2.73 ms
Prox
Wait
!PEN & WEN
PTIME: 1 ~ 256 steps
Time: 2.73 ms/step
Range: 2.73 ms ~ 699 ms
Prox
ADC
WEN
Wait
Time:
Range:
WTIME: 1 ~ 256 steps
WLONG = 0
WLONG = 1
2.73 ms/step
32.8 ms/step
2.73 ms ~ 699 ms
32.8 ms ~ 8.39s
Note: PON, PEN, WEN, and SAI are fields in the Enable register (0x00).
Page 18
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ams Datasheet
[v1-00] 2015-Mar-23
TMD2672 − Principles of Operation
Power Management
Power consumption can be managed with the Wait state
because the wait state consumes only 90μA of I DD current. An
example of the power management feature is shown in
Figure 23. With the assumptions provided in the example, the
average I DD is estimated to be 157μA.
Figure 23:
Power Management
System State
Machine State
Programmable
Parameter
Programmed
Value
Prox Init
Prox Accum
PPULSE
0x04
Duration
Typical
Current
2.73ms
0.195mA
0.064ms
Prox Accum − LED On
0.029ms (1)
103mA
Prox Accum − LED Off
0.035ms (2)
0.195mA
2.73ms
0.195mA
2.73ms
0.195mA
49.2ms
0.090mA
Prox Wait
Prox ADC
PTIME
0xFF
WTIME
0xEE
WLONG
0
Wait
Note(s) and/or Footnote(s):
1. Prox Accum - LED On time = 7.3μs per pulse × 4 pulses = 29.3μs = 0.029ms
2. Prox Accum - LED Off time = 8.7μs per pulse × 4 pulses = 34.7μs = 0.035ms
Average IDD Current = ((2.73 × 0.195) + (0.029 × 103) + (0.035 x 0.195) + (2 x 2.73 x0.195) + (49.2 × 0.090)) / 57.45≈ 157 μA
Keeping with the same programmed values as the example,
Figure 24 shows how the average IDD current is affected by the
Wait state time, which is determined by WEN, WTIME, and
WLONG. Note that the worst-case current occurs when the Wait
state is not enabled.
Figure 24:
Average IDD Current
WEN
WTIME
WLONG
Wait State
Average IDD Current
0
n/a
n/a
0ms
556μA
1
0xFF
0
2.73ms
440μA
1
0xEE
0
49.2ms
157μA
1
0x00
0
699ms
99μA
1
0x00
1
8389ms
90μA
ams Datasheet
[v1-00] 2015-Mar-23
Page 19
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TMD2672 − Principles of Operation
I²C Protocol
Interface and control are accomplished through an I²C serial
compatible interface (standard or fast mode) to a set of registers
that provide access to device control functions and output data.
The devices support the 7-bit I²C addressing protocol.
The I²C standard provides for three types of bus transaction:
read, write, and a combined protocol (Figure 25). During a write
operation, the first byte written is a command byte followed by
data. In a combined protocol, the first byte written is the
command byte followed by reading a series of bytes. If a read
command is issued, the register address from the previous
command will be used for data access. Likewise, if the MSB of
the command is not set, the device will write a series of bytes
at the address stored in the last valid command with a register
address. The command byte contains either control information
or a 5-bit register address. The control commands can also be
used to clear interrupts.
The I²C bus protocol was developed by Philips (now NXP). For
a complete description of the I²C protocol, please review the
NXP I²C design specification at
http://www.i2c-bus.org/references.
Figure 25:
I²C Protocols
1
7
1
1
S
Slave Address
W
A
8
Command Code
1
8
1
A
Data Byte
A
8
1
1
...
P
I2C Write Protocol
1
S
7
1
Slave Address
R
1
8
A
Data
1
A
Data
1
...
A
P
I2C Read Protocol
1
7
1
1
8
1
1
7
1
1
S
Slave Address
W
A
Command Code
A
Sr
Slave Address
R
A
8
Data
1
8
1
A
Data
A
1
...
P
I2C Read Protocol — Combined Format
A
N
P
R
S
Sr
W
...
Page 20
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Acknowledge (0)
Not Acknowledged (1)
Stop Condition
Read (1)
Start Condition
Repeated Start Condition
Write (0)
Continuation of protocol
Master-to-Slave
Slave-to-Master
ams Datasheet
[v1-00] 2015-Mar-23
TMD2672 − Principles of Operation
Register Set
The device is controlled and monitored by data registers and a
command register accessed through the serial interface. These
registers provide for a variety of control functions and can be
read to determine results of the ADC conversions. The Register
Set is summarized in Figure 26.
Figure 26:
Register Address
Address
Register Name
R/W
----
COMMAND
W
0x00
ENABLE
0x02
Register Function
Reset Value
Specifies register address
0x00
R/W
Enables states and interrupts
0x00
PTIME
R/W
Proximity ADC time
0xFF
0x03
WTIME
R/W
Wait time
0xFF
0x08
PILTL
R/W
Proximity interrupt low threshold low byte
0x00
0x09
PILTH
R/W
Proximity interrupt low threshold high byte
0x00
0x0A
PIHTL
R/W
Proximity interrupt high threshold low byte
0x00
0x0B
PIHTH
R/W
Proximity interrupt high threshold high byte
0x00
0x0C
PERS
R/W
Interrupt persistence filter
0x00
0x0D
CONFIG
R/W
Configuration
0x00
0x0E
PPULSE
R/W
Proximity pulse count
0x00
0x0F
CONTROL
R/W
Control register
0x00
0x11
REVISION
R
Die revision number
0x12
ID
R
Device ID
0x13
STATUS
R
Device status
0x00
0x18
PDATAL
R
Proximity ADC low data register
0x00
0x19
PDATAH
R
Proximity ADC high data register
0x00
0x1E
POFFSET
R/W
Proximity Offset register
0x00
Rev Num.
ID
The mechanics of accessing a specific register depends on the
specific protocol used. See the section on I²C protocols on the
previous pages. In general, the Command register is written first
to specify the specific control/status register for following
read/write operations.
ams Datasheet
[v1-00] 2015-Mar-23
Page 21
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TMD2672 − Principles of Operation
Command Register
The Command Register specifies the address of the target
register for future write and read operations.
Figure 27:
Command Register
7
6
COMMAND
5
4
3
TYPE
Field
Bits
COMMAND
7
2
1
0
ADD
Description
Select Command Register. Must write as 1 when addressing Command Register.
Selects type of transaction to follow in subsequent data transfers:
Field Value
TYPE
Description
00
Repeated byte protocol transaction
01
Auto-increment protocol transaction
10
Reserved - Do not use
11
Special function - See description below
6:5
Transaction type 00 will repeatedly read the same register with each data access.
Transaction type 01 will provide an auto-increment function to read successive
register bytes.
Address Register/Special Function Register. Depending on the transaction type,
see above, this field either specifies a special function command or selects the
specific control-status-register for following write and read transactions:
Field Value
ADD
4:0
Description
00000
Normal - no action
00101
Proximity interrupt clear
Proximity Interrupt Clear clears any pending proximity interrupt. This special
function is self clearing.
Page 22
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ams Datasheet
[v1-00] 2015-Mar-23
TMD2672 − Principles of Operation
Enable Register (0x00)
The Enable Register is used to power the device on/off, enable
functions, and interrupts.
Figure 28:
Enable Register
7
6
5
4
3
2
1
0
Reserved
SAI
PIEN
Reserved
WEN
PEN
Reserved
PON
Field
Bits
Reserved
7
Reserved. Write as 0.
SAI
6
Sleep After Interrupt. 0 = not enabled, 1 = enabled
PIEN
5
Proximity Interrupt Mask. When asserted, permits proximity interrupts to be
generated.
Reserved
4
Reserved. Write as 0.
WEN
3
Wait Enable. This bit activates the wait feature. Writing a 1 activates the wait timer.
Writing a 0 disables the wait timer.
PEN
2
Proximity Enable. This bit activates the proximity function. Writing a 1 enables
proximity. Writing a 0 disables proximity.
Reserved
1
Reserved. Write as 0.
PON
0
Power ON. This bit activates the internal oscillator to permit the timers and ADC
channel to operate. Writing a 1 activates the oscillator. Writing a 0 disables the
oscillator.
Description
Proximity Time Control Register (0x02)
The Proximity Timing Register controls the integration time of
the proximity ADC in 2.73ms increments. Upon power up, the
Proximity Time Register is set to 0xFF. It is recommended that
this register be programmed to a value of 0xFF (1 integration
cycle).
Figure 29:
Proximity Time Control Register
Field
Bits
PTIME
7:0
ams Datasheet
[v1-00] 2015-Mar-23
Description
Value
INTEG_CYCLES
Time
Max Count
0xFF
1
2.73ms
1023
Page 23
Document Feedback
TMD2672 − Principles of Operation
Wait Time Register (0x03)
Wait time is set 2.73ms increments unless the WLONG bit is
asserted, in which case the wait times are 12× longer. WTIME is
programmed as a 2’s complement number. Upon power up, the
Wait Time Register is set to 0xFF.
Figure 30:
Proximity Time Control Register
Field
WTIME
Bits
Description
Register Value
Wait Time
Time (WLONG = 0)
Time (WLONG = 1)
0xFF
1
2.72ms
0.032 sec
0xB6
74
200ms
2.4 sec
0x00
256
700ms
8.3 sec
7:0
Note(s) and/or Footnote(s):
1. The Proximity Wait Time Register should be configured before PEN is asserted.
Proximity Interrupt Threshold Register
(0x08 - 0x0B)
The Proximity Interrupt Threshold Registers provide the values
to be used as the high and low trigger points for the comparison
function for interrupt generation. If the value generated by
proximity channel crosses below the lower threshold specified,
or above the higher threshold, an interrupt is signaled to the
host processor.
Figure 31:
Proximity Interrupt Threshold Register
Register
Address
Bits
PILTL
0x08
7:0
Proximity low threshold lower byte
PILTH
0x09
7:0
Proximity low threshold upper byte
PIHTL
0x0A
7:0
Proximity high threshold lower byte
PIHTL
0x0B
7:0
Proximity high threshold upper byte
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Description
ams Datasheet
[v1-00] 2015-Mar-23
TMD2672 − Principles of Operation
Persistence Register (0x0C)
The Persistence Register controls the filtering interrupt
capabilities of the device. Configurable filtering is provided to
allow interrupts to be generated after each ADC integration
cycle or if the ADC integration has produced a result that is
outside of the values specified by threshold register for some
specified amount of time.
Figure 32:
Persistence Register
7
6
5
4
3
2
PPERS
Field
1
0
Reserved
Bits
Description
Proximity Interrupt Persistence. Controls rate of proximity interrupt to the host
processor.
PPERS
Reserved
Field Value
Meaning
0000
----
0001
1
1 proximity value out of range
0010
2
2 consecutive proximity values out of range
....
....
....
1111
15
15 consecutive proximity values out of range
7:4
3:0
Interrupt Persistence Function
Every proximity cycle generates an interrupt
Default setting is 0x00.
Configuration Register (0x0D)
The Configuration Register sets the wait long time.
Figure 33:
Enable Register
7
6
5
4
3
2
Reserved
1
0
WLONG
Reserved
Field
Bits
Reserved
7:2
WLONG
1
Wait Long. When asserted, the wait cycles are increased by a factor 12× from that
programmed in the WTIME register.
Reserved
0
Reserved. Write as 0.
ams Datasheet
[v1-00] 2015-Mar-23
Description
Reserved. Write as 0.
Page 25
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TMD2672 − Principles of Operation
Proximity Pulse Count Register (0x0E)
The Proximity Pulse Count Register sets the number of
proximity pulses that will be transmitted. PPULSE defines the
number of pulses to be transmitted at a 62.5kHz rate.
Figure 34:
Proximity Pulse Count Register
7
6
5
4
3
2
1
0
PPULSE
Field
Bits
Description
PPULSE
7:0
Proximity Pulse Count. Specifies the number of proximity pulses to be generated.
Page 26
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ams Datasheet
[v1-00] 2015-Mar-23
TMD2672 − Principles of Operation
Control Register (0x0F)
The Control Register provides four bits of control to the analog
block. These bits control the diode drive current and diode
selection functions.
Figure 35:
Control Register
7
6
PDRIVE
Field
5
4
3
PDIODE
2
1
PGAIN
Bits
0
Reserved
Description
Proximity LED Drive Strength
PDRIVE (1)
Field Value
LED STRENGTH - PDL = 0
LED STRENGTH - PDL = 1
00
100mA
11.1mA
01
50mA
5.6mA
10
25mA
2.8mA
11
12.5mA
1.4mA
7:6
Proximity Diode Selector
Field Value
PDIODE
Diode Selection
00
Proximity uses neither diode
01
Proximity uses the CH0 diode
10
Proximity uses the CH1 diode
11
Reserved - Do not write
5:4
Proximity Gain
PGAIN
Reserved
Field Value
Proximity Gain Value
00
1× gain
01
2× gain
10
4× gain
11
8× gain
3:2
1:0
Reserved
Note(s) and/or Footnote(s):
1. LED STRENGTH values (italic) are nominal operating values. Specifications can be found in the Proximity Characteristics table.
ams Datasheet
[v1-00] 2015-Mar-23
Page 27
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TMD2672 − Principles of Operation
Revision Register (0x11)
The Revision Register shows the silicon revision number. It is a
read-only register and shows the revision level of the silicon
used internally.
Figure 36:
Revision Register
7
6
5
4
3
2
Reserved
1
0
DIE_REV
Field
Bits
Description
Reserved
7:4
Reserved
Bits read as 0
DIE_REV
3:0
Die revision number
Die revision number
ID Register (0x12)
The ID Register provides the value for the part number. The ID
Register is a read-only register.
Figure 37:
ID Register
7
6
5
4
3
2
1
0
ID
Field
Bits
ID
7:0
Description
0x32 = TMD26721
Part number identification
0x3B = TMD26723
Page 28
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ams Datasheet
[v1-00] 2015-Mar-23
TMD2672 − Principles of Operation
Status Register (0x13)
The Status Register provides the internal status of the device.
This register is read only.
Figure 38:
Status Register
7
6
5
4
3
2
Reserved
PSAT
PINT
Field
Bits
Reserved
7
Reserved
PSAT
6
Proximity Saturation. Indicates that the proximity measurement saturated.
PINT
5
Proximity Interrupt. Indicates that the device is asserting a proximity interrupt.
Reserved
4:2
PVALID
1
Proximity Valid. Indicates that the proximity channel has completed an integration
cycle after PEN has been asserted.
Reserved
0
Reserved
Reserved
1
0
PVALID
Reserved
Description
Reserved. Bits read as 0.
Proximity Data Register (0x18 - 0x19h)
Proximity data is stored as a 16-bit value. To ensure the data is
read correctly, a two-byte I²C read transaction should be
utilized with auto increment protocol bits set in the Command
Register. With this operation, when the lower byte register is
read, the upper eight bits are stored into a shadow register,
which is read by a subsequent read to the upper byte. The upper
register will read the correct value even if the next ADC cycle
ends between the reading of the lower and upper registers.
Figure 39:
PDATA Registers
Register
Address
Bits
PDATAL
0x18
7:0
Proximity data low byte
PDATAH
0x19
7:0
Proximity data high byte
ams Datasheet
[v1-00] 2015-Mar-23
Description
Page 29
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TMD2672 − Principles of Operation
Proximity Offset Register (0x1E)
The 8-bit Proximity Offset Register provides compensation for
proximity offsets caused by device variations, optical crosstalk,
and other environmental factors. Proximity offset is a
sign-magnitude value where the sign bit, bit 7, determines if
the offset is negative (bit 7 = 0) or positive (bit 7 = 1). At power
up, the register is set to 0x00. The magnitude of the offset
compensation depends on the proximity gain (PGAIN),
proximity LED drive strength (PDRIVE), and the number of
proximity pulses (PPULSE). Because a number of environmental
factors contribute to proximity offset, this register is best suited
for use in an adaptive closed-loop control system. See available
ams application notes for proximity offset register application
information.
Figure 40:
Proximity Offset Register
7
6
SIGN
Bits
SIGN
7
Page 30
Document Feedback
4
3
2
1
0
MAGNITUDE
Field
MAGNITUDE
5
6:0
Description
Proximity Offset Sign. The offset sign shifts the proximity data negative when
equal to 0 and positive when equal to 1.
Proximity Offset Magnitude. The offset magnitude shifts the proximity data
positive or negative, depending on the proximity offset sign. The actual amount of
the shift depends on the proximity gain (PGAIN), proximity LED drive strength
(PDRIVE), and the number of proximity pulses (PPULSE).
ams Datasheet
[v1-00] 2015-Mar-23
TMD2672 − Application Information: Hardware
Application Information:
Hardware
LED Driver Pin with Proximity Detection
In a proximity sensing system, the included IR LED can be pulsed
with more than 100mA of rapidly switching current, therefore,
a few design considerations must be kept in mind to get the
best performance. The key goal is to reduce the power supply
noise coupled back into the device during the LED pulses.
Averaging of multiple proximity samples is recommended to
reduce the proximity noise.
The first recommendation is to use two power supplies; one for
the device V DD and the other for the IR LED. In many systems,
there is a quiet analog supply and a noisy digital supply. By
connecting the quiet supply to the V DD pin and the noisy supply
to the LEDA pin, the key goal can be met. Place a 1μF low-ESR
decoupling capacitor as close as possible to the V DD pin and
another at the LEDA pin, and at least 10μF of bulk capacitance
to supply the 100mA current surge. This may be distributed as
two 4.7μF capacitors.
Figure 41:
Proximity Sensing Using Separate Power Supplies
VBUS
Voltage
Regulator
LEDK
VDD
LDR
1 mF
C*
GND
TMD2672
RP
RP
RPI
INT
SCL
Voltage
Regulator
LEDA
10 mF
SDA
1 mF
* Cap Value Per Regulator Manufacturer Recommendation
If it is not possible to provide two separate power supplies, the
device can be operated from a single supply. A 22Ω resistor in
series with the V DD supply line and a 1μF low ESR capacitor
effectively filter any power supply noise. The previous capacitor
placement considerations apply.
ams Datasheet
[v1-00] 2015-Mar-23
Page 31
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TMD2672 − Application Information: Hardware
Figure 42:
Proximity Sensing Using Single Power Supply
VBUS
22 W
Voltage
Regulator
LEDK
VDD
10 mF
LDR
1 mF
GND
TMD2672
RP
RP
RPI
INT
SCL
LEDA
SDA
1 mF
V BUS in the above figures refers to the I²C bus voltage which is
either V DD or 1.8V. Be sure to apply the specified I²C bus voltage
shown in the Ordering Information table for the specific device
being used.
The I²C signals and the Interrupt are open-drain outputs and
require pull-up resistors. The pull-up resistor (RP) value is a
function of the I²C bus speed, the I²C bus voltage, and the
capacitive load. The ams EVM running at 400kbps, uses 1.5kΩ
resistors. A 10kΩ pull-up resistor (R PI) can be used for the
interrupt line.
Page 32
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ams Datasheet
[v1-00] 2015-Mar-23
TMD2672 − Application Information: Hardware
PCB Pad Layout
Suggested PCB pad layout guidelines for the surface mount
module are shown in Figure 43. Flash Gold is recommended
surface finish for the landing pads.
Figure 43:
Suggested Module PCB Layout
0.60 0.05
0.80 0.05
0.72 0.05
0.25 0.05
Note(s) and/or Footnote(s):
1. All linear dimensions are in mm.
2. This drawing is subject to change without notice.
ams Datasheet
[v1-00] 2015-Mar-23
Page 33
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TMD2672 − Package Information
Package Information
Figure 44:
Module Packaging Configuration
MODULE
Dual Flat No-Lead
TOP VIEW
SIDE VIEW
Detector
1.0
3.94
0.2
2.40
3.73
0.1
0.9
LED
1.18
0.58
BOTTOM VIEW
0.60
END VIEW
2.36 0.2
0.80
1.35
0.
0.25
2.10 0.1
0.72
RoHS
0.05
Green
Note(s) and/or Footnote(s):
1. All linear dimensions are in millimeters. Dimension tolerance is ± 0.05mm unless otherwise noted.
2. Contacts are copper with NiPdAu plating.
3. This package contains no lead (Pb).
4. This drawing is subject to change without notice.
Page 34
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ams Datasheet
[v1-00] 2015-Mar-23
TMD2672 − Carrier Tape & Reel Information
Carrier Tape & Reel Information
Figure 45:
Module Carrier Tape
TOP VIEW
8.00
1.75
4.00
1.50
2.00 0.05
B
5.50 0.05
+ 0.30
12.00
− 0.10
B
1.00
0.05
Unit Orientation
A
A
DETAIL B
DETAIL A
6 Max
8 Max
2.70
0.29
0.02
Ao
1.70
Ko
4.30
Bo
Note(s) and/or Footnote(s):
1. All linear dimensions are in millimeters. Dimension tolerance is ±0.10mm unless otherwise noted.
2. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly.
3. Symbols on drawing Ao, Bo, and Ko are defined in ANSI EIA Standard 481-B 2001.
4. Each reel is 330 millimeters in diameter and contains 2500 parts.
5. ams packaging tape and reel conform to the requirements of EIA Standard 481-B.
6. In accordance with EIA standard, device pin 1 is located next to the sprocket holes in the tape.
7. This drawing is subject to change without notice.
ams Datasheet
[v1-00] 2015-Mar-23
Page 35
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TMD2672 − Soldering & Storage Information
Soldering & Storage
Information
Soldering Information
The module has been tested and has demonstrated an ability
to be reflow soldered to a PCB substrate. The process,
equipment, and materials used in these test are detailed below.
The solder reflow profile describes the expected maximum heat
exposure of components during the solder reflow process of
product on a PCB. Temperature is measured on top of
component. The components should be limited to a maximum
of three passes through this solder reflow profile.
Figure 46:
Solder Reflow Profile
Parameter
Reference
Device
Average temperature gradient in preheating
Soak time
2.5°C/sec
tsoak
2 to 3 minutes
Time above 217°C (T1)
t1
Max 60 sec
Time above 230°C (T2)
t2
Max 50 sec
Time above Tpeak - 10°C (T3)
t3
Max 10 sec
Peak temperature in reflow
Tpeak
260°C
Temperature gradient in cooling
Max -5°C/sec
Figure 47:
Solder Reflow Profile Graph
Tpeak
Not to scale — for reference only
T3
T2
Temperature (C)
T1
Time (sec)
t3
t2
tsoak
Page 36
Document Feedback
t1
ams Datasheet
[v1-00] 2015-Mar-23
TMD2672 − Soldering & Storage Information
Storage Information
Moisture Sensitivity
Optical characteristics of the device can be adversely affected
during the soldering process by the release and vaporization of
moisture that has been previously absorbed into the package.
To ensure the package contains the smallest amount of
absorbed moisture possible, each device is dry-baked prior to
being packed for shipping. Devices are packed in a sealed
aluminized envelope called a moisture barrier bag with silica
gel to protect them from ambient moisture during shipping,
handling, and storage before use.
The Moisture Barrier Bags should be stored under the following
conditions:
• Temperature Range: < 40°C
• Relative Humidity: < 90%
• Total Time: No longer than 12 months from the date code
on the aluminized envelope if unopened.
Rebaking of the reel will be required if the devices have been
stored unopened for more than 12 months and the Humidity
Indicator Card shows the parts to be out of the allowable
moisture region.
Opened reels should be used within 168 hours if exposed to the
following conditions:
• Temperature Range: < 30°C
• Relative Humidity: < 60%
If rebaking is required, it should be done at 50°C for 12 hours.
The Module has been assigned a moisture sensitivity level of
MSL 3.
ams Datasheet
[v1-00] 2015-Mar-23
Page 37
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TMD2672 − Ordering & Contact Information
Ordering & Contact Information
Figure 48:
Ordering Information
Device
Address
Leads
Interface Description
Ordering Number
TMD26721
0x39
Module-8
I²C Vbus = VDD Interface
TMD26721
TMD26723
0x39
Module-8
I²C Vbus = 1.8V Interface
TMD26723
TMD26725 (1)
0x29
Module-8
I²C Vbus = VDD Interface
TMD26725
TMD26727 (1)
0x29
Module-8
I²C Vbus = 1.8V Interface
TMD26727
Note(s) and/or Footnote(s):
1. Contact ams for availability.
Buy our products or get free samples online at:
www.ams.com/ICdirect
Technical Support is available at:
www.ams.com/Technical-Support
Provide feedback about this document at:
www.ams.com/Document-Feedback
For further information and requests, e-mail us at:
[email protected]
For sales offices, distributors and representatives, please visit:
www.ams.com/contact
Headquarters
ams AG
Tobelbaderstrasse 30
8141 Unterpremstaetten
Austria, Europe
Tel: +43 (0) 3136 500 0
Website: www.ams.com
Page 38
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ams Datasheet
[v1-00] 2015-Mar-23
TMD2672 − RoHS Compliant & ams Green Statement
RoHS Compliant & ams Green
Statement
RoHS: The term RoHS compliant means that ams AG products
fully comply with current RoHS directives. Our semiconductor
products do not contain any chemicals for all 6 substance
categories, including the requirement that lead not exceed
0.1% by weight in homogeneous materials. Where designed to
be soldered at high temperatures, RoHS compliant products are
suitable for use in specified lead-free processes.
ams Green (RoHS compliant and no Sb/Br): ams Green
defines that in addition to RoHS compliance, our products are
free of Bromine (Br) and Antimony (Sb) based flame retardants
(Br or Sb do not exceed 0.1% by weight in homogeneous
material).
Important Information: The information provided in this
statement represents ams AG knowledge and belief as of the
date that it is provided. ams AG bases its knowledge and belief
on information provided by third parties, and makes no
representation or warranty as to the accuracy of such
information. Efforts are underway to better integrate
information from third parties. ams AG has taken and continues
to take reasonable steps to provide representative and accurate
information but may not have conducted destructive testing or
chemical analysis on incoming materials and chemicals. ams AG
and ams AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited
information may not be available for release.
ams Datasheet
[v1-00] 2015-Mar-23
Page 39
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TMD2672 − Copyrights & Disclaimer
Copyrights & Disclaimer
Copyright ams AG, Tobelbader Strasse 30, 8141
Unterpremstaetten, Austria-Europe. Trademarks Registered. All
rights reserved. The material herein may not be reproduced,
adapted, merged, translated, stored, or used without the prior
written consent of the copyright owner.
Devices sold by ams AG are covered by the warranty and patent
indemnification provisions appearing in its General Terms of
Trade. ams AG makes no warranty, express, statutory, implied,
or by description regarding the information set forth herein.
ams AG reserves the right to change specifications and prices
at any time and without notice. Therefore, prior to designing
this product into a system, it is necessary to check with ams AG
for current information. This product is intended for use in
commercial applications. Applications requiring extended
temperature range, unusual environmental requirements, or
high reliability applications, such as military, medical
life-support or life-sustaining equipment are specifically not
recommended without additional processing by ams AG for
each application. This product is provided by ams AG “AS IS”
and any express or implied warranties, including, but not
limited to the implied warranties of merchantability and fitness
for a particular purpose are disclaimed.
ams AG shall not be liable to recipient or any third party for any
damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interruption of business or
indirect, special, incidental or consequential damages, of any
kind, in connection with or arising out of the furnishing,
performance or use of the technical data herein. No obligation
or liability to recipient or any third party shall arise or flow out
of ams AG rendering of technical or other services.
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ams Datasheet
[v1-00] 2015-Mar-23
TMD2672 − Document Status
Document Status
Document Status
Product Preview
Preliminary Datasheet
Datasheet
Datasheet (discontinued)
ams Datasheet
[v1-00] 2015-Mar-23
Product Status
Definition
Pre-Development
Information in this datasheet is based on product ideas in
the planning phase of development. All specifications are
design goals without any warranty and are subject to
change without notice
Pre-Production
Information in this datasheet is based on products in the
design, validation or qualification phase of development.
The performance and parameters shown in this document
are preliminary without any warranty and are subject to
change without notice
Production
Information in this datasheet is based on products in
ramp-up to full production or full production which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade
Discontinued
Information in this datasheet is based on products which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade, but these products have been superseded and
should not be used for new designs
Page 41
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TMD2672 − Revision Information
Revision Information
Changes from 149C (2012-Aug) to current revision 1-00 (2015-Mar-23)
Page
Content of TAOS datasheet was converted to the latest ams design
1. Page and figure numbers for the previous version may differ from page and figure numbers in the current revision
2. Correction of typographical errors is not explicitly mentioned.
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ams Datasheet
[v1-00] 2015-Mar-23
TMD2672 − Content Guide
Content Guide
ams Datasheet
[v1-00] 2015-Mar-23
1
2
2
3
3
General Description
Key Benefits & Features
Applications
End Products and Market Segments
Block Diagram
4
5
6
7
11
12
Detailed Description
Pin Assignments
Absolute Maximum Ratings
Electrical Characteristics
Parameter Measurement Information
Typical Operating Characteristics
14
14
15
17
18
19
20
21
22
23
23
24
24
25
25
26
27
28
28
29
29
30
Principles of Operation
System State Machine
Proximity Detection
Interrupts
State Diagram
Power Management
I²C Protocol
Register Set
Command Register
Enable Register (0x00)
Proximity Time Control Register (0x02)
Wait Time Register (0x03)
Proximity Interrupt Threshold Register
(0x08 - 0x0B)
Persistence Register (0x0C)
Configuration Register (0x0D)
Proximity Pulse Count Register (0x0E)
Control Register (0x0F)
Revision Register (0x11)
ID Register (0x12)
Status Register (0x13)
Proximity Data Register (0x18 - 0x19h)
Proximity Offset Register (0x1E)
31
31
33
Application Information: Hardware
LED Driver Pin with Proximity Detection
PCB Pad Layout
34
35
Package Information
Carrier Tape & Reel Information
36
36
37
37
Soldering & Storage Information
Soldering Information
Storage Information
Moisture Sensitivity
38
39
40
41
42
Ordering & Contact Information
RoHS Compliant & ams Green Statement
Copyrights & Disclaimer
Document Status
Revision Information
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