ROHM DAN222TL

Data Sheet
Band Switching Diode
DAN222
Applications
Ultra high speed switching
Dimensions (Unit : mm)
Land size figure (Unit : mm)
1.0
0.5 0.5
0.3±0.1
0.05
Features
1) Ultra small mold type. (EMD3)
2) High reliability.
0.7
1.6±0.2
0.15±0.05
0.7
0.1Min
EMD3
0.6
1.3
0.6
0.55±0.1
0.5
0.5
1.0±0.1
Construction
Silicon epitaxial planar
0.7
0~0.1
(1)
(2)
0.2±0.1
-0.05
1.6±0.2
0.8±0.1
(3)
0.7±0.1
Structure
ROHM : EMD3
JEDEC : SOT-416
JEITA : SC-75A
dot (year week factory)
Taping specifications (Unit : mm)
φ1.55±0.1
φ1.5 0.1
00
2.0±0.05
0.3±0.1
8.0±0.2
0~0.1
1.8±0.2
1.8±0.1
5.5±0.2
3.5±0.05
1.75±0.1
4.0±0.1
φ0.5±0.1
0.9±0.2
Absolute maximum ratings (Ta=25°C)
Parameter
Reverse voltage (repetitive peak)
Reverse voltage (DC)
Forward current (single)
Average rectified forward voltage (single)
Surge current (t=1us)
Power dissipation
Junction temperature
Storage temperature
Rated in slash put frequency
Electrical characteristics (Ta=25°C)
Parameter
Symbol
VRM
VR
IFM
Io
Isurge
Pd
Tj
Tstg
f
Limits
Unit
80
80
300
100
4
150
150
55 to 150
100
V
V
mA
mA
A
mW
°C
°C
MHz
Typ.
Max.
-
-
1.2
V
Reverse current
IR
-
-
0.1
μA
VR=70V
Capacitance between terminals
Ct
-
-
3.5
pF
Reverse recovery time
trr
-
-
4
ns
VR=6V , f=1MHz
VR=6V , IF=5mA , RL=50Ω
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© 2011 ROHM Co., Ltd. All rights reserved.
1/2
Unit
Conditions
Symbol
VF
Min.
Forward voltage
IF=100mA
2011.06 - Rev.B
Data Sheet
DAN222
Ta=150℃
Ta=125℃
f=1MHz
Ta=150℃
Ta=25℃
1
CAPACITANCE BETWEEN
TERMINALS:Ct(pF)
Ta=25℃
10
Ta=75℃
100
Ta=25℃
10
Ta=25℃
1
0.1
0.01
0.1
0
100 200 300 400 500 600 700 800 900 1000
10
20
30
40
50
60
70
80
0
REVERSE VOLTAGE : VR(V)
V R-IR CHARACTERISTICS
FORWARD VOLTAGE : VF(mV)
VF-IF CHARACTERISTICS
Ta=25℃
IF=100mA
n=30pcs
Ta=25℃
VR=80V
n=10pcs
REVERSE CURRENT : IR(nA)
90
930
920
910
80
70
60
50
40
AVE:9.655nA
30
8
20
7
6
5
4
AVE:1.17pF
3
2
1
0
0
VF DISPERSION MAP
IR DISPERSION MAP
20
Ct DISPERSION MAP
5
Ifsm
15
8.3ms
10
5
AVE:3.50A
0
Ta=25℃
VR=6V
IF=5mA
RL=50Ω
n=10pcs
9
8
7
6
PEAK SURGE
FORWARD CURRENT : I FSM(A)
REVERSE RECOVERY TIME:trr(ns)
10
1cyc
5
4
3
2
1
Ifsm
4
8.3ms
2
1
0
1
IFSM DISRESION MAP
trr DISPERSION MAP
10
1
0.1
1
10
TIME:t(ms)
IFSM-t CHARACTERISTICS
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© 2011 ROHM Co., Ltd. All rights reserved.
100
9
100
Rth(j-c)
Mounted on epoxy board
IM=1mA
IF=10mA
10
1ms
time
8
7
6
5
3
0.1
1
10
100
TIME:t(s)
Rth-t CHARACTERISTICS
2/2
AVE:0.97kV
2
0
0.01
AVE:2.54kV
4
1
300us
1
0.001
100
10
Rth(j-a)
ELECTROSTATIC
DDISCHARGE TEST ESD(KV)
TRANSIENT
THAERMAL IMPEDANCE:Rth (℃/W)
PEAK SURGE
FORWARD CURRENT : IFSM(A)
t
10
NUMBER OF CYCLES
IFSM-CYCLE CHARACTERISTICS
1000
Ifsm
8.3ms
1cyc
3
AVE:1.93ns
0
100
20
Ta=25℃
VR=6V
f=1MHz
n=10pcs
9
10
AVE:921.7mV
900
5
10
15
REVERSE VOLTAGE : VR(V)
VR-Ct CHARACTERISTICS
10
100
950
940
1
CAPACITANCE BETWEEN
TERMINALS:Ct(pF)
0
FORWARD VOLTAGE : V F(mV)
10
1000
0.1
PEAK SURGE
FORWARD CURRENT : I FSM(A)
Ta=125℃
10000
Ta=75℃
REVERSE CURRENT : IR(nA)
FORWARD CURRENT : I F(mA)
100
1000
C=200pF
R=0Ω
C=100pF
R=1.5kΩ
ESD DISPERSION MAP
2011.06 - Rev.B
Notice
Notes
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© 2011 ROHM Co., Ltd. All rights reserved.
R1120A