GAL26CV12

GAL®26CV12 Device Datasheet
September 2010
All Devices Discontinued!
Product Change Notifications (PCNs) have been issued to discontinue all devices in this
data sheet.
The original datasheet pages have not been modified and do not reflect those changes.
Please refer to the table below for reference PCN and current product status.
Product Line
GAL26CV12B
GAL26CV12C
Ordering Part Number
GAL26CV12B-10LP
GAL26CV12B-15LP
GAL26CV12B-20LP
GAL26CV12B-15LPI
GAL26CV12B-20LPI
GAL26CV12B-10LJ
GAL26CV12B-15LJ
GAL26CV12B-20LJ
GAL26CV12B-15LJI
GAL26CV12B-20LJI
GAL26CV12C-7LP
GAL26CV12C-10LPI
GAL26CV12C-7LJ
GAL26CV12C-10LJI
Product Status
Reference PCN
PCN#06-07
Discontinued
PCN#13-10
PCN#06-07
PCN#13-10
5555 N.E. Moore Ct.  Hillsboro, Oregon 97124-6421  Phone (503) 268-8000  FAX (503) 268-8347
Internet: http://www.latticesemi.com
GAL26CV12
High Performance E2CMOS PLD
Generic Array Logic™
Features
Functional Block Diagram
• HIGH PERFORMANCE E2CMOS® TECHNOLOGY
— 7.5 ns Maximum Propagation Delay
— Fmax = 142.8 MHz
— 4.5ns Maximum from Clock Input to Data Output
— TTL Compatible 16 mA Outputs
— UltraMOS® Advanced CMOS Technology
I/CLK
INPUT
RESET
8
I
OLMC
I/O/Q
OLMC
I/O/Q
8
• LOW POWER CMOS
— 90 mA Typical Icc
I
A
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• ACTIVE PULL-UPS ON ALL PINS
I
8
OLMC
I/O/Q
OLMC
I/O/Q
OLMC
I/O/Q
OLMC
I/O/Q
OLMC
I/O/Q
OLMC
I/O/Q
OLMC
I/O/Q
OLMC
I/O/Q
OLMC
I/O/Q
OLMC
I/O/Q
PROGRAMMABLE
AND-ARRAY
(122X52)
8
• E2 CELL TECHNOLOGY
— Reconfigurable Logic
— Reprogrammable Cells
— 100% Tested/100% Yields
— High Speed Electrical Erasure (<100ms)
— 20 Year Data Retention
I
I
I
• TWELVE OUTPUT LOGIC MACROCELLS
— Uses Standard 22V10 Macrocells
— Maximum Flexibility for Complex Logic Designs
I
10
12
12
10
I
• PRELOAD AND POWER-ON RESET OF REGISTERS
— 100% Functional Testability
8
I
• APPLICATIONS INCLUDE:
— DMA Control
— State Machine Control
— High Speed Graphics Processing
— Standard Logic Speed Upgrade
8
I
8
I
8
• ELECTRONIC SIGNATURE FOR IDENTIFICATION
I
PRESET
Description
Pin Configuration
The GAL26CV12, at 7.5 ns maximum propagation delay time,
combines a high performance CMOS process with Electrically
Erasable (E2) floating gate technology to provide the highest
performance 28-pin PLD available on the market. E2 technology
offers high speed (<100ms) erase times, providing the ability to
reprogram or reconfigure the device quickly and efficiently.
DIP
I/CLK
4
I
2
I/O/Q
I/O/Q
I
I/CLK
I
I
Expanding upon the industry standard 22V10 architecture, the
GAL26CV12 eliminates the learning curve typically associated with
using a new device architecture. The generic architecture provides
maximum design flexibility by allowing the Output Logic Macrocell
(OLMC) to be configured by the user. The GAL26CV12 OLMC is
fully compatible with the OLMC in standard bipolar and CMOS
22V10 devices.
I
PLCC
28
25
I
VCC
7
GAL26CV12
23
9
Top View
21
I
I
Unique test circuitry and reprogrammable cells allow complete AC,
DC, and functional testing during manufacture. As a result, Lattice
Semiconductor delivers100% field programmability and functionality
of all GAL products. In addition, 100 erase/write cycles and data
retention in excess of 20 years are specified.
I
I/O/Q
I/O/Q
19
18
16
I/O/Q
I
14
I/O/Q
12
I
11
I
I
I/O/Q
I/O/Q
I
I/O/Q
Vcc
I/O/Q
I
I/O/Q
GAL
26CV12
I
I/O/Q
28
I
I
26
5
1
I
7
I
21
I/O/Q
I/O/Q
I/O/Q
I/O/Q
GND
GND
I
I/O/Q
I/O/Q
I
I/O/Q
I/O/Q
I
I/O/Q
I
I/O/Q
I
I
I/O/Q
14
15
I/O/Q
Copyright © 2000 Lattice Semiconductor Corp. All brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject
to change without notice.
LATTICE SEMICONDUCTOR CORP., 5555 Northeast Moore Ct., Hillsboro, Oregon 97124, U.S.A.
Tel. (503) 268-8000; 1-800-LATTICE; FAX (503) 268-8556; http://www.latticesemi.com
26cv12_03
1
June 2000
Specifications GAL26CV12
GAL26CV12 Ordering Information
Commercial Grade Specifications
Tpd (ns)
Tsu (ns)
Tco (ns)
Icc (mA)
7.5
6
4.5
130
GAL26CV12C-7LP1
130
GAL26CV12C-7LJ
10
10
7
8
Package
28-Pin Plastic DIP
28-Lead PLCC
1
130
GAL26CV12B-10LP
28-Pin Plastic DIP
130
GAL26CV12B-10LJ
28-Lead PLCC
1
13 0
GAL26CV12B-15LP
28-Pin Plastic DIP
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15
7
Ordering #
130
20
12
12
GAL26CV12B-15LJ
28-Lead PLCC
1
13 0
GAL26CV12B-20LP
28-Pin Plastic DIP
130
GAL26CV12B-20LJ
28-Lead PLCC
Industrial Grade Specifications
Tpd (ns)
10
15
20
Tsu (ns)
7
10
12
Tco (ns)
Icc (mA)
7
8
12
Ordering #
Package
1
150
GAL26CV12C-10LPI
28-Pin Plastic DIP
150
GAL26CV12C-10LJI
28-Lead PLCC
1
150
GAL26CV12B-15LPI
150
GAL26CV12B-15LJI
1
150
GAL26CV12B-20LPI
150
GAL26CV12B-20LJI
28-Pin Plastic DIP
28-Lead PLCC
28-Pin Plastic DIP
28-Lead PLCC
1. Discontinued per PCN #06-07. Contact Rochester Electronics for available inventory.
Part Number Description
XXXXXXXX _ XX
X
X X
GAL26CV12C Device Name
GAL26CV12B
Grade
Speed (ns)
L = Low Power Power
Blank = Commercial
I = Industrial
Package P = Plastic DIP
J = PLCC
2
Specifications GAL26CV12
Output Logic Macrocell (OLMC)
The GAL26CV12 has a product term for Asynchronous Reset (AR)
and a product term for Synchronous Preset (SP). These two product terms are common to all registered OLMCs. The Asynchronous
Reset sets all registered outputs to zero any time this dedicated
product term is asserted. The Synchronous Preset sets all registers
to a logic one on the rising edge of the next clock pulse after this
product term is asserted.
The output polarity of each OLMC can be individually programmed
to be true or inverting, in either combinatorial or registered mode.
This allows each output to be individually configured as either active
high or active low.
NOTE: The AR and SP product terms will force the Q output of the
flip-flop into the same state regardless of the polarity of the output.
Therefore, a reset operation, which sets the register output to a zero,
may result in either a high or low at the output pin, depending on
the pin polarity chosen.
A
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The GAL26CV12 has a variable number of product terms per
OLMC. Of the twelve available OLMCs, two OLMCs have access
to twelve product terms (pins 20 and 22), two have access to ten
product terms (pins 19 and 23), and the other eight OLMCs have
eight product terms each. In addition to the product terms available
for logic, each OLMC has an additional product term dedicated to
output enable control.
A R
D
Q
CLK
4 TO 1
MUX
Q
SP
2 TO 1
MUX
GAL26CV12 OUTPUT LOGIC MACROCELL (OLMC)
Output Logic Macrocell Configurations
Each of the Macrocells of the GAL26CV12 has two primary
functional modes: registered, and combinatorial I/O. The modes
and the output polarity are set by two bits (SO and S1), which are
normally controlled by the logic compiler. Each of these two primary
modes, and the bit settings required to enable them, are described
below and on the the following page.
NOTE: In registered mode, the feedback is from the /Q output of
the register, and not from the pin; therefore, a pin defined as
registered is an output only, and cannot be used for dynamic
I/O, as can the combinatorial pins.
COMBINATORIAL I/O
In combinatorial mode the pin associated with an individual OLMC
is driven by the output of the sum term gate. Logic polarity of the
output signal at the pin may be selected by specifying that the output
buffer drive either true (active high) or inverted (active low). Output
tri-state control is available as an individual product term for each
output, and may be individually set by the compiler as either “on”
(dedicated output), “off” (dedicated input), or “product term driven”
(dynamic I/O). Feedback into the AND array is from the pin side of
the output enable buffer. Both polarities (true and inverted) of the
pin are fed back into the AND array.
REGISTERED
In registered mode the output pin associated with an individual
OLMC is driven by the Q output of that OLMC’s D-type flip-flop.
Logic polarity of the output signal at the pin may be selected by
specifying that the output buffer drive either true (active high) or
inverted (active low). Output tri-state control is available as an
individual product term for each OLMC, and can therefore be
defined by a logic equation. The D flip-flop’s /Q output is fed back
into the AND array, with both the true and complement of the
feedback available as inputs to the AND array.
3
Specifications GAL26CV12
Registered Mode
AR
AR
Q
Q
D
A
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D
CLK
Q
CLK
SP
Q
SP
ACTIVE LOW
ACTIVE HIGH
S0 = 0
S1 = 0
S0 = 1
S1 = 0
Combinatorial Mode
ACTIVE LOW
ACTIVE HIGH
S0 = 0
S1 = 1
S0 = 1
S1 = 1
4
Specifications GAL26CV12
GAL26CV12 Logic Diagram/JEDEC Fuse Map
DIP & PLCC Package Pinouts
1
0
4
8
12
16
20
24
28
32
36
40
44
48
ASYNCHRONOUS RESET
(TO ALL REGISTERS)
0000
0052
.
.
.
0468
8
0520
.
.
.
0936
8
0988
.
.
.
1404
8
1456
.
.
.
1872
8
1924
.
.
.
.
2444
10
2496
.
.
.
.
.
3120
12
OLMC
3172
.
.
.
.
.
3796
12
OLMC
3848
.
.
.
.
4368
10
OLMC
4420
.
.
.
4836
8
4888
.
.
.
5304
8
5356
.
.
.
5772
8
OLMC
S0
6344
S1
6345
27
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2
28
OLMC
S0
6346
S1
6347
3
OLMC
S0
6348
S1
6349
4
OLMC
S0
6350
S1
6351
5
OLMC
S0
6352
S1
6353
6
8
9
S0
6354
S1
6355
S0
6356
S1
6357
S0
6358
S1
6359
10
OLMC
S0
6360
S1
6361
11
OLMC
S0
6362
S1
6363
12
OLMC
S0
6364
S1
6365
13
5824
.
.
.
6240
8
OLMC
S0
6366
S1
6367
14
6292
26
25
24
23
22
20
19
18
17
16
15
SYNCHRONOUS PRESET
(TO ALL REGISTERS)
6368, 6369 ...
Electronic Signature
... 6430, 6431
Byte 7 Byte 6 Byte 5 Byte 4 Byte 3 Byte 2 Byte 1 Byte 0
M
S
B
L
S
B
5
Specifications
SpecificationsGAL26CV12C
GAL26CV12
Absolute Maximum Ratings(1)
Recommended Operating Conditions
Supply voltage VCC ...................................... –0.5 to +7V
Input voltage applied .......................... –2.5 to VCC +1.0V
Off-state output voltage applied ......... –2.5 to VCC +1.0V
Storage Temperature ................................ –65 to 150°C
Ambient Temperature with
Power Applied ........................................... –55 to 125°C
Commercial Devices:
Ambient Temperature (TA) ............................. 0 to +75°C
Supply voltage (VCC)
with Respect to Ground ..................... +4.75 to +5.25V
Industrial Devices:
Ambient Temperature (TA) ........................... –40 to 85°C
Supply voltage (VCC)
with Respect to Ground ......................... +4.5 to +5.5V
A
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1. Stresses above those listed under the “Absolute Maximum
Ratings” may cause permanent damage to the device. These
are stress only ratings and functional operation of the device at
these or at any other conditions above those indicated in the operational sections of this specification is not implied (while programming, follow the programming specifications).
DC Electrical Characteristics
Over Recommended Operating Conditions (Unless Otherwise Specified)
SYMBOL
VIL
VIH
IIL1
IIH
VOL
VOH
IOL
IOH
IOS2
MIN.
TYP.3
MAX.
UNITS
Input Low Voltage
Vss – 0.5
—
0.8
V
Input High Voltage
2.0
—
Vcc+1
V
PARAMETER
CONDITION
Input or I/O Low Leakage Current
0V ≤ VIN ≤ VIL (MAX.)
—
—
–100
μA
Input or I/O High Leakage Current
3.5V ≤ VIN ≤ VCC
—
—
10
μA
Output Low Voltage
IOL = MAX. Vin = VIL or VIH
—
—
0.5
V
Output High Voltage
IOH = MAX. Vin = VIL or VIH
2.4
—
—
V
Low Level Output Current
—
—
16
mA
High Level Output Current
—
—
–3.2
mA
–30
—
–130
mA
L-7
—
90
130
mA
L-10
—
90
150
mA
Output Short Circuit Current
COMMERCIAL
ICC
Operating Power
Supply Current
INDUSTRIAL
ICC
Operating Power
Supply Current
VCC = 5V VOUT = 0.5V TA = 25°C
VIL = 0.5V VIH = 3.0V ftoggle = 15MHz
Outputs Open
VIL = 0.5V VIH = 3.0V ftoggle = 15MHz
Outputs Open
1) The leakage current is due to the internal pull-up on all pins. See Input Buffer section for more information.
2) One output at a time for a maximum duration of one second. Vout = 0.5V was selected to avoid test problems caused by tester
ground degradation. Characterized but not 100% tested.
3) Typical values are at Vcc = 5V and TA = 25 °C.
6
Specifications
SpecificationsGAL26CV12C
GAL26CV12
AC Switching Characteristics
Over Recommended Operating Conditions (Unless Otherwise Specified)
PARAM
TEST
COND.1
IND
-7
-10
MIN.
MAX.
MIN. MAX.
UNITS
A
Input or I/O to Comb. Output
1
7.5
1
10
ns
A
Clock to Output Delay
1
4.5
1
7
ns
A
D LL
IS
C DE
O
N VIC
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ED
tpd
tco
tcf2
tsu1
tsu2
th
DESCRIPTION
COM
fmax3
twh
twl
ten
tdis
tar
tarw
tarr
tspr
—
Clock to Feedback Delay
—
2.5
—
2.5
ns
—
Setup Time, Input or Fdbk before Clk ↑
6
—
7
—
ns
—
Setup Time, SP before Clock ↑
6
—
7
—
ns
—
Hold Time, Input or Fdbk after Clk ↑
0
—
0
—
ns
A
Maximum Clock Frequency with
External Feedback, 1/(tsu + tco)
95.2
—
71.4
—
MHz
A
Maximum Clock Frequency with
Internal Feedback, 1/(tsu + tcf)
117.6
—
105
—
MHz
A
Maximum Clock Frequency with
No Feedback
142.8
—
105
—
MHz
—
Clock Pulse Duration, High
3.5
—
4
—
ns
—
Clock Pulse Duration, Low
3.5
—
4
—
ns
B
Input or I/O to Output Enabled
1
7.5
1
10
ns
C
Input or I/O to Output Disabled
1
7.5
1
9
ns
A
Input or I/O to Asynch. Reset of Reg.
1
9
1
13
ns
—
Asynchronous Reset Pulse Duration
7
—
8
—
ns
—
Asynch. Reset to Clk↑ Recovery Time
5
—
8
—
ns
—
Synch. Preset to Clk ↑ Recovery Time
5
—
10
—
ns
1) Refer to Switching Test Conditions section.
2) Calculated from fmax with internal feedback. Refer to fmax Specification section.
3) Refer to fmax Specification section.
Capacitance (TA = 25°C, f = 1.0 MHz)
SYMBOL
PARAMETER
MAXIMUM*
UNITS
TEST CONDITIONS
CI
Input Capacitance
8
pF
VCC = 5.0V, VI = 2.0V
CI/O
I/O Capacitance
8
pF
VCC = 5.0V, VI/O = 2.0V
*Characterized but not 100% tested.
7
Specifications
SpecificationsGAL26CV12B
GAL26CV12
Absolute Maximum Ratings(1)
Recommended Operating Conditions
Supply voltage VCC ...................................... –0.5 to +7V
Input voltage applied .......................... –2.5 to VCC +1.0V
Off-state output voltage applied ......... –2.5 to VCC +1.0V
Storage Temperature ................................ –65 to 150°C
Ambient Temperature with
Power Applied ........................................... –55 to 125°C
Commercial Devices:
Ambient Temperature (TA) ............................. 0 to +75°C
Supply voltage (VCC)
with Respect to Ground ..................... +4.75 to +5.25V
Industrial Devices:
Ambient Temperature (TA) ........................... –40 to 85°C
Supply voltage (VCC)
with Respect to Ground ......................... +4.5 to +5.5V
A
D LL
IS
C DE
O
N VIC
TI
N ES
U
ED
1. Stresses above those listed under the “Absolute Maximum
Ratings” may cause permanent damage to the device. These
are stress only ratings and functional operation of the device at
these or at any other conditions above those indicated in the operational sections of this specification is not implied (while programming, follow the programming specifications).
DC Electrical Characteristics
Over Recommended Operating Conditions (Unless Otherwise Specified)
SYMBOL
VIL
VIH
IIL1
IIH
VOL
VOH
IOL
IOH
IOS2
MIN.
TYP.3
MAX.
UNITS
Input Low Voltage
Vss – 0.5
—
0.8
V
Input High Voltage
2.0
—
Vcc+1
V
PARAMETER
CONDITION
Input or I/O Low Leakage Current
0V ≤ VIN ≤ VIL (MAX.)
—
—
–100
μA
Input or I/O High Leakage Current
3.5V ≤ VIN ≤ VCC
—
—
10
μA
Output Low Voltage
IOL = MAX. Vin = VIL or VIH
—
—
0.5
V
Output High Voltage
IOH = MAX. Vin = VIL or VIH
2.4
—
—
V
Low Level Output Current
—
—
16
mA
High Level Output Current
—
—
–3.2
mA
–30
—
–130
mA
L-10/-15/-20
—
90
130
mA
L-15/-20
—
90
150
mA
Output Short Circuit Current
COMMERCIAL
ICC
Operating Power
Supply Current
INDUSTRIAL
ICC
Operating Power
Supply Current
VCC = 5V VOUT = 0.5V TA = 25°C
VIL = 0.5V VIH = 3.0V ftoggle = 15MHz
Outputs Open
VIL = 0.5V VIH = 3.0V ftoggle = 15MHz
Outputs Open
1) The leakage current is due to the internal pull-up on all pins. See Input Buffer section for more information.
2) One output at a time for a maximum duration of one second. Vout = 0.5V was selected to avoid test problems caused by tester
ground degradation. Characterized but not 100% tested.
3) Typical values are at Vcc = 5V and TA = 25 °C.
8
Specifications
SpecificationsGAL26CV12B
GAL26CV12
AC Switching Characteristics
Over Recommended Operating Conditions
PARAMETER
COM / IND
COM / IND
-10
-15
-20
MIN. MAX.
MIN. MAX.
MIN. MAX.
DESCRIPTION
UNITS
A
Input or I/O to Combinatorial Output
3
10
3
15
3
20
ns
A
Clock to Output Delay
2
7
2
8
2
12
ns
A
D LL
IS
C DE
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N VIC
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ED
tpd
tco
tcf2
tsu1
tsu2
th
TEST
COND.1
COM
fmax3
twh
twl
ten
tdis
tar
tarw
tarr
tspr
—
Clock to Feedback Delay
—
2.5
—
2.5
—
10
ns
—
Setup Time, Input or Feedback before Clock ↑
7
—
10
—
12
—
ns
—
Setup Time, SP before Clock ↑
10
—
10
—
12
—
ns
—
Hold Time, Input or Feedback after Clock ↑
0
—
0
—
0
—
ns
A
Maximum Clock Frequency with
External Feedback, 1/(tsu + tco)
71.4
—
55.5
—
41.6
—
MHz
A
Maximum Clock Frequency with
Internal Feedback, 1/(tsu + tcf)
105
—
80
—
45.4
—
MHz
A
Maximum Clock Frequency with
No Feedback
105
—
83.3
—
62.5
—
MHz
—
Clock Pulse Duration, High
4
—
6
—
8
—
ns
—
Clock Pulse Duration, Low
4
—
6
—
8
—
ns
B
Input or I/O to Output Enabled
3
10
3
15
3
20
ns
C
Input or I/O to Output Disabled
3
10
3
15
3
20
ns
A
Input or I/O to Asynchronous Reset of Register
3
13
3
20
3
25
ns
—
Asynchronous Reset Pulse Duration
8
—
10
—
15
—
ns
—
Asynchronous Reset to Clock Recovery Time
8
—
10
—
15
—
ns
—
Synchronous Preset to Clock Recovery Time
10
—
10
—
12
—
ns
1) Refer to Switching Test Conditions section.
2) Calculated from fmax with internal feedback. Refer to fmax Specification section.
3) Refer to fmax Specification section.
Capacitance (TA = 25°C, f = 1.0 MHz)
SYMBOL
PARAMETER
MAXIMUM*
UNITS
TEST CONDITIONS
CI
Input Capacitance
8
pF
VCC = 5.0V, VI = 2.0V
CI/O
I/O Capacitance
8
pF
VCC = 5.0V, VI/O = 2.0V
*Characterized but not 100% tested.
9
Specifications GAL26CV12
Switching Waveforms
INPUT or
I/O FEEDBACK
INPUT or
I/O FEEDBACK
VALID INPUT
VALID INPUT
ts u
th
t pd
CLK
COMBINATORIAL
OUTPUT
tc o
A
D LL
IS
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REGISTERED
OUTPUT
Combinatorial Output
1 / fm a x
(external fdbk)
Registered Output
INPUT or
I/O FEEDBACK
t dis
t en
OUTPUT
CLK
1/ f max (internal fdbk)
Input or I/O to Output Enable/Disable
tsu
t cf
REGISTERED
FEEDBACK
fmax with Feedback
tw l
tw h
CLK
1 / fm a x
(w/o fdbk)
Clock Width
INPUT or
I/O FEEDBACK
DRIVING SP
INPUT or
I/O FEEDB ACK
DRIVI NG AR
tsu
t spr
th
tarw
CLK
CLK
tarr
tco
R E G I S T ER E D
OUTPUT
REGISTERED
OUTPUT
tar
Synchronous Preset
Asynchronous Reset
10
Specifications GAL26CV12
fmax Definitions
CL K
CLK
LOGIC
ARR AY
LOGIC
ARRAY
R EG I S T E R
REGISTER
tc o
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ts u
fmax with External Feedback 1/(tsu+tco)
t cf
t pd
Note: fmax with external feedback is calculated from measured tsu and tco.
fmax with Internal Feedback 1/(tsu+tcf)
CLK
LOGIC
ARRAY
Note: tcf is a calculated value, derived by subtracting tsu from the period of fmax w/internal
feedback (tcf = 1/fmax - tsu). The value of tcf is
used primarily when calculating the delay from
clocking a register to a combinatorial output
(through registered feedback), as shown above.
For example, the timing from clock to a combinatorial output is equal to tcf + tpd.
REGISTER
tsu + th
fmax with No Feedback
Note: fmax with no feedback may be less
than 1/(twh + twl). This is to allow for a
clock duty cycle of other than 50%.
Switching Test Conditions
Input Pulse Levels
Input Rise and
Fall Times
GND to 3.0V
C-7/-10/-15
1.5ns 10% – 90%
B-10/-15/-20
3ns 10% – 90%
Input Timing Reference Levels
+5V
R1
1.5V
Output Timing Reference Levels
1.5V
Output Load
See Figure
FROM OUTPUT (O/Q)
UNDER TEST
3-state levels are measured 0.5V from steady-state active
level.
GAL26CV12 Output Load Conditions (see figure)
Test Condition
A
B
C
TEST POINT
R2
R1
R2
CL
300Ω
390Ω
50pF
Active High
∞
390Ω
50pF
Active Low
300Ω
390Ω
50pF
Active High
∞
390Ω
5pF
Active Low
300Ω
390Ω
5pF
C L*
*C L INCLUDES TEST FIXTURE AND PROBE CAPACITANCE
11
Specifications GAL26CV12
Electronic Signature
Output Register Preload
An electronic signature is provided in every GAL26CV12 device.
It contains 64 bits of reprogrammable memory that can contain
user-defined data. Some uses include user ID codes, revision
numbers, or inventory control. The signature data is always available to the user independent of the state of the security cell.
When testing state machine designs, all possible states and state
transitions must be verified in the design, not just those required
in normal machine operation. This is because certain events may
occur during system operation that throw the logic into an illegal
state (power-up, line voltage glitches, brown-outs, etc.). To test a
design for proper treatment of these conditions, a way must be
provided to break the feedback paths, and force any desired (i.e.,
illegal) state into the registers. Then the machine can be sequenced
and the outputs tested for correct next state conditions.
Security Cell
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A security cell is provided in every GAL26CV12 device to prevent
unauthorized copying of the array patterns. Once programmed,
this cell prevents further read access to the functional bits in the
device. This cell can only be erased by re-programming the device, so the original configuration can never be examined once this
cell is programmed. The Electronic Signature is always available
to the user, regardless of the state of this control cell.
The GAL26CV12 device includes circuitry that allows each registered output to be synchronously set either high or low. Thus, any
present state condition can be forced for test sequencing. If necessary, approved GAL programmers capable of executing test
vectors perform output register preload automatically.
Input Buffers
Latch-Up Protection
GAL26CV12 devices are designed with TTL level compatible input buffers. These buffers have a characteristically high impedance,
and present a much lighter load to the driving logic than bipolar TTL
logic.
GAL26CV12 devices are designed with an on-board charge pump
to negatively bias the substrate. The negative bias minimizes the
potential for latch-up caused by negative input undershoots. Additionally, outputs are designed with n-channel pull-ups instead of
the traditional p-channel pull-ups in order to eliminate latch-up due
to output overshoots.
The input and I/O pins also have built-in active pull-ups. As a result,
floating inputs will float to a TTL high (logic 1). However, Lattice
Semiconductor recommends that all unused inputs and tri-stated
I/O pins be connected to an adjacent active input, Vcc, or ground.
Doing so will tend to improve noise immunity and reduce Icc for the
device.
Device Programming
GAL devices are programmed using a Lattice Semiconductorapproved Logic Programmer, available from a number of manufacturers (see the the GAL Development Tools section). Complete
programming of the device takes only a few seconds. Erasing of
the device is transparent to the user, and is done automatically as
part of the programming cycle.
I n p u t C u r r e n t (u A )
Typical Input Current
0
-20
-40
-60
0
1.0
2.0
3.0
In p u t V o lt ag e ( V o lt s)
12
4.0
5.0
Specifications GAL26CV12
Power-Up Reset
Vcc (min.)
Vcc
t su
t wl
CLK
t pr
Internal Register
Reset to Logic "0"
ACTIVE LOW
OUTPUT REGISTER
Device Pin
Reset to Logic "1"
ACTIVE HIGH
OUTPUT REGISTER
Device Pin
Reset to Logic "0"
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INTERNAL REGISTER
Q - OUTPUT
provide a valid power-up reset of the device. First, the VCC rise must
be monotonic. Second, the clock input must be at static TTL level
as shown in the diagram during power up. The registers will reset
within a maximum of tpr time. As in normal system operation, avoid
clocking the device until all input and feedback path setup times
have been met. The clock must also meet the minimum pulse width
requirements.
Circuitry within the GAL26CV12 provides a reset signal to all registers during power-up. All internal registers will have their Q outputs
set low after a specified time (tpr, 1μs MAX). As a result, the state
on the registered output pins (if they are enabled) will be either high
or low on power-up, depending on the programmed polarity of the
output pins. This feature can greatly simplify state machine design
by providing a known state on power-up. Because of the asynchronous nature of system power-up, some conditions must be met to
Input/Output Equivalent Schematics
PIN
PIN
Feedback
Vcc
Active Pull-up
Circuit
Active Pull-up
Circuit
(Vref Typical = 3.2V)
Vcc
ESD
Protection
Circuit
Vref
(Vref Typical = 3.2V)
Tri-State
Control
Vcc
Vcc
Vref
Data
Output
PIN
ESD
Protection
Circuit
PIN
Feedback
(To Input Buffer)
Typical Input
Typical Output
13
Specifications GAL26CV12
GAL26CV12C: Typical AC and DC Characteristic Diagrams
Normalized Tpd vs Vcc
1.2
1.2
1.1
1
0.9
Normalized Tsu
Normalized Tco
1.2
1.1
1
0.9
1.1
1
0.9
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Normalized Tpd
Normalized Tsu vs Vcc
Normalized Tco vs Vcc
0.8
0.8
4.75
5.00
5.25
5.50
0.8
4.50
4.75
5.00
5.25
5.50
4.50
5.00
5.25
Supply Voltage (V)
Supply Voltage (V)
Normalized Tpd vs Temp
Normalized Tco vs Temp
Normalized Tsu vs Temp
1.2
1.1
1
0.9
0.8
0.7
1.1
1
0.9
0.8
0.7
-25
0
25
50
75
100
-25
1.2
1.1
1
0.9
0.8
0
25
50
75
100
-55
125
-25
Delta Tpd vs # of Outputs
Switching
Delta Tco vs # of Outputs
Switching
0
Delta Tco (ns)
0
-0.25
-0.5
-0.75
-0.25
-0.5
-0.75
-1
-1
1
2
3
4
5
6
7
8
9
10 11 12
1
Number of Outputs Switching
2
3
4
5
6
7
8
9
10 11 12
Number of Outputs Switching
Delta Tpd vs Output Loading
Delta Tco vs Output Loading
12
RISE
8
FALL
Delta Tco (ns)
12
10
6
4
2
10
RISE
8
FALL
6
4
2
0
0
-2
-2
0
50
100
150
200
250
300
0
Output Loading (pF)
50
100
150
200
250
Output Loading (pF)
14
0
25
50
75
100
Temperature (deg. C)
Temperature (deg. C)
Temperature (deg. C)
Delta Tpd (ns)
1.3
0.7
-55
125
5.50
1.4
Normalized Tsu
1.3
1.2
Normalized Tco
1.3
-55
4.75
Supply Voltage (V)
Delta Tpd (ns)
Normalized Tpd
4.50
300
125
Specifications GAL26CV12
GAL26CV12C: Typical AC and DC Characteristic Diagrams
Vol vs Iol
Voh vs Ioh
3
5
2.5
4
4
1.5
1
3.75
Voh (V)
Voh (V)
2
Vol (V)
Voh vs Ioh
3
2
3.25
1
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0.5
3.5
0
0
20.00
40.00
60.00
80.00
100.00
3
0.00
30.00 40.00
50.00 60.00
0.00
2.00
3.00
Ioh(mA)
Normalized Icc vs Vcc
Normalized Icc vs Temp
Normalized Icc vs Freq.
1.3
1.50
1.2
1.2
1.40
1.1
1
0.9
0.8
Normalized Icc
1.3
4.50
1.00
Ioh(mA)
0.7
1.1
1
0.9
0.8
4.75
5.00
5.25
5.50
-25
0
25
50
75
100
125
Temperature (deg. C)
0
10
Iik (mA)
6
4
2
20
30
40
50
0
60
0.00 0.50 1.00 1.50 2.00 2.50 3.00 3.50 4.00
Vin (V)
1.20
1.10
1.00
-2.00
-1.50
-1.00
Vik (V)
15
-0.50
0
25
50
75
Frequency (MHz)
Input Clamp (Vik)
Delta Icc vs Vin (1 input)
8
1.30
0.80
-55
10
4.00
0.90
0.7
Supply Voltage (V)
Delta Icc (mA)
10.00 20.00
Iol (mA)
Normalized Icc
Normalized Icc
0.00
0.00
100
Specifications GAL26CV12
GAL26CV12B: Typical AC and DC Characteristic Diagrams
Normalized Tpd vs Vcc
1.2
1.2
1.1
1
0.9
Normalized Tsu
Normalized Tco
1.2
1.1
1
0.9
1.1
1
0.9
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Normalized Tpd
Normalized Tsu vs Vcc
Normalized Tco vs Vcc
0.8
0.8
0.8
4.50
4.75
5.00
5.25
5.50
4.50
4.75
Supply Voltage (V)
1.2
1.2
1.1
1
0.9
0.8
0.7
5.25
4.50
5.50
-25
0
25
50
75
100
Normalized Tsu vs Temp
1
0.9
0.8
1.2
1.1
1
0.9
0.8
0.7
-55
-25
0
25
50
75
100
Delta Tpd vs # of Outputs
Switching
125
-55
-25
0
Delta Tco (ns)
0
-0.5
-1
-1.5
-2
-0.5
-1
-1.5
-2
3
4
5
6
7
8
9
10 11 12
1
Number of Outputs Switching
2
3
4
5
6
7
8
9
10 11 12
Number of Outputs Switching
Delta Tpd vs Output Loading
Delta Tco vs Output Loading
12
RISE
8
FALL
Delta Tco (ns)
12
10
6
4
2
10
RISE
8
FALL
6
4
2
0
0
-2
-2
0
50
100
150
200
250
300
Output Loading (pF)
0
50
100
150
200
250
Output Loading (pF)
16
25
50
75
100
Temperature (deg. C)
Delta Tco vs # of Outputs
Switching
0
Delta Tpd (ns)
1.3
Temperature (deg. C)
2
5.50
1.4
Temperature (deg. C)
1
5.25
Normalized Tco vs Temp
1.1
125
5.00
Supply Voltage (V)
0.7
-55
4.75
Supply Voltage (V)
Normalized Tsu
1.3
Normalized Tco
1.3
Delta Tpd (ns)
Normalized Tpd
Normalized Tpd vs Temp
5.00
300
125
Specifications GAL26CV12
GAL26CV12B: Typical AC and DC Characteristic Diagrams
Vol vs Iol
Voh vs Ioh
3
5
2.5
4.5
4
1.5
1
4.25
Voh (V)
Voh (V)
2
Vol (V)
Voh vs Ioh
3
2
3.75
1
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0.5
4
0
0
20.00
40.00
60.00
80.00
100.00
30.00 40.00
50.00 60.00
1.00
2.00
3.00
Ioh(mA)
Normalized Icc vs Vcc
Normalized Icc vs Temp
Normalized Icc vs Freq.
1.3
1.1
1
0.9
0.8
1.1
1
0.9
0.8
0.7
4.75
5.00
5.25
-25
0
25
50
75
100
125
Temperature (deg. C)
0
10
8
20
Iik (mA)
30
6
4
40
50
60
70
2
80
0
90
100
0.00 0.50 1.00 1.50 2.00 2.50 3.00 3.50 4.00
Vin (V)
1.00
0.90
-2.00
-1.50
-1.00
Vik (V)
17
-0.50
0
25
50
75
Frequency (MHz)
Input Clamp (Vik)
Delta Icc vs Vin (1 input)
10
1.10
0.80
-55
5.50
4.00
1.20
1.2
Supply Voltage (V)
Delta Icc (mA)
0.00
Ioh(mA)
Normalized Icc
Normalized Icc
10.00 20.00
Iol (mA)
1.2
4.50
3.5
0.00
Normalized Icc
0.00
0.00
100
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Notes
18