Datasheet

AOB12T60P/AOTF12T60P
600V,12A N-Channel MOSFET
General Description
Product Summary
• Trench Power AlphaMOS-II technology
• Low RDS(ON)
• Low Ciss and Crss
• High Current Capability
• RoHS and Halogen Free Compliant
VDS @ Tj,max
700V
IDM
48A
RDS(ON),max
< 0.52Ω
Applications
Qg,typ
33nC
Eoss @ 400V
4.4µJ
100% UIS Tested
100% Rg Tested
• General Lighting for LED and CCFL
• AC/DC Power supplies for Industrial, Consumer, and
Telecom
Top View
D
TO-263
D2PAK
TO-220F
D
G
D
G
S
S
G
S
AOB12T60P
AOTF12T60P
Orderable Part Number
Package Type
Form
Minimum Order Quantity
AOB12T60PL
AOTF12T60P
AOTF12T60PL
TO-263 Green
TO-220F Pb Free
TO-220F Green
Tape & Reel
Tube
Tube
800
1000
1000
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Drain-Source Voltage
Symbol
VDS
Gate-Source Voltage
VGS
TC=25°C
Continuous Drain
Current
Pulsed Drain Current
Avalanche Current C
AOB12T60P
TC=100°C
C
L=1mH
ID
AOTF12T60P AOTF12T60PL
600
±30
12
9
V
12*
12*
9*
9*
IDM
48
Units
V
A
IAR
12
A
Repetitive avalanche energy C
EAR
72
mJ
Single pulsed avalanche energy G
MOSFET dv/dt ruggedness
Peak diode recovery dv/dt J
TC=25°C
Power Dissipation B Derate above 25°C
Junction and Storage Temperature Range
Maximum lead temperature for soldering
purpose, 1/8" from case for 5 seconds
EAS
750
50
15
50
0.4
-55 to 150
mJ
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient A,D
dv/dt
PD
TJ, TSTG
TL
Symbol
RθJA
RθCS
Maximum Case-to-sink A
Maximum Junction-to-Case
RθJC
* Drain current limited by maximum junction temperature.
Rev.3.0: May 2014
250
2
V/ns
35
0.3
300
AOB12T60P
W
W/°C
°C
°C
AOTF12T60P AOTF12T60PL
Units
65
65
65
°C/W
0.5
0.5
-2.5
-3.6
°C/W
°C/W
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Page 1 of 7
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
Conditions
Min
ID=250µA, VGS=0V, TJ=25°C
600
Typ
Max
Units
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
BVDSS
/∆TJ
Breakdown Voltage Temperature
Coefficient
IDSS
Zero Gate Voltage Drain Current
ID=250µA, VGS=0V, TJ=150°C
700
ID=250µA, VGS=0V
0.58
VDS=600V, VGS=0V
1
10
Gate-Body leakage current
VDS=0V, VGS=±30V
VDS=5V, ID=250µA
RDS(ON)
VGS=10V, ID=6A
gFS
Forward Transconductance
VDS=40V, ID=6A
VSD
Diode Forward Voltage
IS=1A,VGS=0V
IS
ISM
±100
nA
5
V
0.44
0.52
Ω
1
V
Maximum Body-Diode Continuous Current
12
A
Maximum Body-Diode Pulsed Current C
48
A
Coss
Output Capacitance
Co(er)
Effective output capacitance, energy
related H
Crss
Effective output capacitance, time
related I
Reverse Transfer Capacitance
Rg
Gate resistance
Gate Source Charge
11
0.73
S
2028
pF
71
pF
52
pF
94
pF
VGS=0V, VDS=100V, f=1MHz
13
pF
f=1MHz
2.2
Ω
VGS=0V, VDS=100V, f=1MHz
VGS=0V, VDS=0 to 480V, f=1MHz
SWITCHING PARAMETERS
Qg
Total Gate Charge
Qgs
3
µA
4.1
DYNAMIC PARAMETERS
Input Capacitance
Ciss
Co(tr)
V/ oC
VDS=480V, TJ=125°C
Gate Threshold Voltage
Static Drain-Source On-Resistance
IGSS
VGS(th)
V
33
VGS=10V, VDS=480V, ID=12A
50
nC
13
nC
Qgd
Gate Drain Charge
10
nC
tD(on)
Turn-On DelayTime
52
ns
tr
Turn-On Rise Time
72
ns
tD(off)
Turn-Off DelayTime
VGS=10V, VDS=300V, ID=12A,
RG=25Ω
66
ns
tf
trr
42
ns
Body Diode Reverse Recovery Time
IF=12A,dI/dt=100A/µs,VDS=100V
483
Qrr
Body Diode Reverse Recovery Charge IF=12A,dI/dt=100A/µs,VDS=100V
ns
µC
Turn-Off Fall Time
7
A. The value of R θJA is measured with the device in a still air environment with T A =25°C.
B. The power dissipation PD is based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper
dissipation limit for cases where additional heatsinking is used.
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C, Ratings are based on low frequency and duty cycles to keep
initial TJ =25°C.
D. The R θJA is the sum of the thermal impedance from junction to case R θJC and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300 ms pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedance which is measured with the device mounted to a large heatsink, assuming
a maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse rating.
G. L=60mH, IAS=5A, VDD=150V, RG=25Ω, Starting TJ=25°C.
H. Co(er) is a fixed capacitance that gives the same stored energy as Coss while VDS is rising from 0 to 80% V(BR)DSS.
I. Co(tr) is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80% V(BR)DSS.
J. ISD≤ID, di/dt≤200A/µs, VDD=400V, TJ≤TJ(MAX).
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Rev.3.0: May 2014
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Page 2 of 7
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
100
25
VDS=40V
10V
-55°C
7V
20
10
6.5V
ID(A)
ID (A)
15
125°C
10
1
6V
25°C
5
VGS=5.5V
0
0.1
0
5
10
15
20
25
30
2
4
VDS (Volts)
Figure 1: On-Region Characteristics
Normalized On-Resistance
1.2
RDS(ON) (Ω)
8
10
3
1.5
0.9
VGS=10V
0.6
0.3
2.5
2
0
5
10
15
20
1
0.5
0
-100
25
ID (A)
Figure 3: On-Resistance vs. Drain Current and Gate
Voltage
1.2
1E+01
1.1
1E+00
IS (A)
1E+02
0
50
100
150
200
125°C
1E-01
0.9
1E-02
0.8
1E-03
0.7
-100
-50
Temperature (°C)
Figure 4: On-Resistance vs. Junction Temperature
1.3
1
VGS=10V
ID=6A
1.5
0
BVDSS (Normalized)
6
VGS(Volts)
Figure 2: Transfer Characteristics
25°C
1E-04
-50
0
50
100
150
200
TJ (°C)
Figure 5: Break Down vs. Junction Temperature
Rev.3.0: May 2014
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0.0
0.2
0.4
0.6
0.8
1.0
VSD (Volts)
Figure 6: Body-Diode Characteristics
Page 3 of 7
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
15
10000
1000
Capacitance (pF)
VGS (Volts)
Ciss
VDS=480V
ID=12A
12
9
6
Coss
100
Crss
10
3
0
1
0
12
24
36
48
60
0.1
1
10
100
1000
VDS (Volts)
Figure 8: Capacitance Characteristics
10
15
8
12
Current rating ID(A)
Eoss(uJ)
Qg (nC)
Figure 7: Gate-Charge Characteristics
6
Eoss
4
9
6
3
2
0
0
0
100
200
300
400
500
600
VDS (Volts)
Figure 9: Coss stored Energy
Rev.3.0: May 2014
0
25
50
75
100
125
150
TCASE (°C)
Figure 10: Current De-rating (Note F)
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Page 4 of 7
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
100
100
10µs
10µs
RDS(ON)
limited
10
10
1ms
DC
10ms
0.1
100µs
ID (Amps)
ID (Amps)
100µs
1
RDS(ON)
limited
1ms
1
10ms
DC
0.1s
1s
0.1
TJ(Max)=150°C
TC=25°C
TJ(Max)=150°C
TC=25°C
0.01
0.01
1
10
100
1000
VDS(Volts)
Figure 11: Maximum Forward Biased Safe Operating
Area for TO-263 (Note F)
1
10
100
1000
VDS(Volts)
Figure 12: Maximum Forward Biased Safe Operating
Area for TO-220F Pb Free (Note F)
100
10µs
RDS(ON)
limited
10
ID (Amps)
100µs
1ms
1
10ms
DC
0.1s
0.1
1s
TJ(Max)=150°C
TC=25°C
0.01
1
10
100
1000
VDS(Volts)
Figure 13: Maximum Forward Biased Safe Operating
Area for TO-220F Green (Note F)
Rev.3.0: May 2014
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Page 5 of 7
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
ZθJC Normalized Transient
Thermal Resistance
10
1
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
D=Ton/T
TJ,PK=TC+PDM.ZθJC.RθJC
RθJC=0.5°C/W
0.1
PD
0.01
Ton
Single Pulse
T
0.001
1E-05
0.0001
0.001
0.01
0.1
1
10
Pulse Width (s)
Figure 14: Normalized Maximum Transient Thermal Impedance for TO-263 (Note F)
ZθJC Normalized Transient
Thermal Resistance
10
1
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
D=Ton/T
TJ,PK=TC+PDM.ZθJC.RθJC
RθJC=2.5°C/W
0.1
PD
0.01
Single Pulse
Ton
T
0.001
1E-05
0.0001
0.001
0.01
0.1
1
10
Pulse Width (s)
Figure 15: Normalized Maximum Transient Thermal Impedance for TO-220F Pb Free (Note F)
ZθJC Normalized Transient
Thermal Resistance
10
1
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
D=Ton/T
TJ,PK=TC+PDM.ZθJC.RθJC
RθJC=3.6°C/W
0.1
PD
0.01
Single Pulse
Ton
T
0.001
1E-05
0.0001
0.001
0.01
0.1
1
10
100
Pulse Width (s)
Figure 16: Normalized Maximum Transient Thermal Impedance for TO-220F Green (Note F)
Rev.3.0: May 2014
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Page 6 of 7
Gate Charge Test Circuit & Waveform
Vgs
Qg
10V
+
+ Vds
VDC
-
Qgs
Qgd
VDC
-
DUT
Vgs
Ig
Charge
Resistive Switching Test Circuit & Waveforms
RL
Vds
Vds
Vgs
90%
+ Vdd
DUT
VDC
-
Rg
10%
Vgs
Vgs
td(on)
tr
td(off)
ton
tf
toff
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms
L
2
EAR= 1/2 LIAR
Vds
BVDSS
Vds
Id
+ Vdd
Vgs
Vgs
I AR
VDC
-
Rg
Id
DUT
Vgs
Vgs
Diode Recovery Test Circuit & Waveforms
Q rr = - Idt
Vds +
DUT
Vds -
Isd
Vgs
Ig
Rev.3.0: May 2014
Vgs
L
Isd
+ Vdd
t rr
dI/dt
I RM
Vdd
VDC
-
IF
Vds
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Page 7 of 7