IDT 843SDNAGLF

ICS843SDN
FEMTOCLOCK™ CRYSTAL-TO3.3V LVPECL CLOCK GENERATOR
General Description
Features
The ICS843SDN is a Gigabit Ethernet Clock
Generator and a member of the HiPerClocksTM
HiPerClockS™
family of high performance devices from IDT. The
ICS843SDN uses a 24MHz crystal to synthesize
120MHz. The ICS843SDN uses IDT’s 3rd generation
low phase noise VCO technology, and can achieve <1ps rms
phase jitter performance over the 12kHz – 20MHz integration
range. The ICS843SDN is packaged in a small 8-pin TSSOP,
making it ideal for use in systems with limited board space.
•
•
One differential 3.3V LVPECL output
•
•
•
•
Output frequency range: 116MHz – 150MHz
•
•
•
•
Full 3.3V supply mode
ICS
Crystal oscillator interface designed for 23.2MHz – 30MHz,
18pF parallel resonant crystal
VCO range: 580MHz – 750MHz
Output duty cycle range: 47% – 53%
RMS phase jitter @ 120MHz, using a 24MHz crystal
(12kHz – 20MHz): 0.81ps (typical)
0°C to 70°C ambient operating temperature
Industrial temperature information available upon request
Available in lead-free (RoHS 6) package
Table 1. Frequency Table - Typical Applications
Crystal Frequency (MHz)
Output Frequency (MHz)
25
125
24
120
Block Diagram
Pin Assignment
25MHz
XTAL_IN
OSC
XTAL_OUT
Phase
Detector
VCO
Q
nQ
÷5
÷25
(fixed)
IDT™ / ICS™ 3.3V LVPECL CLOCK GENERATOR
VCCA
VEE
XTAL_OUT
XTAL_IN
1
2
3
4
8
7
6
5
VCC
Q
nQ
nc
ICS843SDN
8 Lead TSSOP
4.40mm x 3.0mm x 0.925mm package body
G Package
Top View
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FEMTOCLOCK™CRYSTAL-TO-3.3V LVPECL CLOCK GENERATOR
Table 2. Pin Descriptions
Number
Name
Type
Description
1
VCCA
Power
Analog supply pin.
2
VEE
Power
Negative supply pin.
3, 4
XTAL_OUT
XTAL_IN
Input
Crystal oscillator interface. XTAL_IN is the input, XTAL_OUT is the output.
5
nc
Unused
No connect.
6, 7
nQ, Q
Output
Differential output pair. LVPECL interface levels.
8
VCC
Power
Core supply pin.
Absolute Maximum Ratings
NOTE: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.
These ratings are stress specifications only. Functional operation of product at these conditions or any conditions beyond
those listed in the DC Characteristics or AC Characteristics is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect product reliability.
Item
Rating
Supply Voltage, VCC
4.6V
Inputs, VI
-0.5V to VCC+ 0.5V
Outputs, IO
Continuos Current
Surge Current
50mA
100mA
Package Thermal Impedance, θJA
129.5°C/W (0 mps)
Storage Temperature, TSTG
-65°C to 150°C
DC Electrical Characteristics
Table 3A. Power Supply DC Characteristics, VCC = 3.3V ± 5%, VEE = 0V, TA = 0°C to 70°C
Symbol
Parameter
VCC
Core Supply Voltage
VCCA
Analog Supply Voltage
IEE
Power Supply Current
IDT™ / ICS™ 3.3V LVPECL CLOCK GENERATOR
Test Conditions
2
Minimum
Typical
Maximum
Units
3.135
3.3
3.465
V
VCC – 0.10
3.3
VCC
V
83
mA
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ICS843SDN
FEMTOCLOCK™CRYSTAL-TO-3.3V LVPECL CLOCK GENERATOR
Table 3B. LVPECL DC Characteristics, VCC = 3.3V ± 5%, VEE = 0V, TA = 0°C to 70°C
Symbol
Parameter
Test Conditions
VOH
Output High Current; NOTE 1
VOL
Output Low Current; NOTE 1
VSWING
Peak-to-Peak Output Voltage Swing
Minimum
Typical
Maximum
Units
VCC – 1.4
VCC – 0.9
µA
VCC – 2.0
VCC – 1.7
µA
0.6
1.0
V
Maximum
Units
30
MHz
Equivalent Series Resistance (ESR)
40
Ω
Shunt Capacitance
7
pF
NOTE 1: Outputs termination with 50Ω to VCC – 2V.
Table 4. Crystal Characteristics
Parameter
Test Conditions
Minimum
Mode of Oscillation
Typical
Fundamental
Frequency; NOTE 1
23.2
NOTE 1:Input frequency is limited to a range of 23.2MHz – 30MHz due to VCO range.
AC Electrical Characteristics
Table 5. AC Characteristics, VCC = 3.3V ± 5%, VEE = 0V, TA = 0°C to 70°C
Parameter
Symbol
fOUT
Output Frequency
tjit(Ø)
RMS Phase Jitter, Random;
NOTE 1
tR / tF
Output Rise/Fall Time
odc
Output Duty Cycle
Test Conditions
Minimum
Typical
116
120MHz,
(Integration Range: 12kHz – 20MHz)
20% to 80%
Maximum
Units
150
MHz
0.81
ps
100
600
ps
47
53
%
NOTE 1: Please refer to Phase Noise Plot.
IDT™ / ICS™ 3.3V LVPECL CLOCK GENERATOR
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FEMTOCLOCK™CRYSTAL-TO-3.3V LVPECL CLOCK GENERATOR
Typical Phase Noise at 120MHz
Noise Power
dBc
Hz
120MHz
RMS Phase Jitter (Random)
12kHz to 20MHz = 0.81ps (typical)
Offset Frequency (Hz)
IDT™ / ICS™ 3.3V LVPECL CLOCK GENERATOR
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FEMTOCLOCK™CRYSTAL-TO-3.3V LVPECL CLOCK GENERATOR
Parameter Measurement Information
2V
2V
VCC
Noise Power
Phase Noise Plot
SCOPE
Qx
VCCA
Phase Noise Mask
LVPECL
nQx
VEE
f1
3.3V LVPECL Output Load AC Test Circuit
f2
RMS Jitter = Area Under the Masked Phase Noise Plot
-
-1.3V ± 0.165V
Offset Frequency
RMS Phase Jitter
nQ
nQ
80%
80%
Q
VSW I N G
➤
➤
Q
20%
20%
tF
tR
➤
➤
Output Duty Cycle/Pulse Width/Period
IDT™ / ICS™ 3.3V LVPECL CLOCK GENERATOR
Output Rise/Fall Time
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FEMTOCLOCK™CRYSTAL-TO-3.3V LVPECL CLOCK GENERATOR
Application Information
Power Supply Filtering Technique
As in any high speed analog circuitry, the power supply pins are
vulnerable to random noise. To achieve optimum jitter
performance, power supply isolation is required. The ICS843SDN
provides separate power supplies to isolate any high switching
noise from the outputs to the internal PLL. VCC and VCCA should
be individually connected to the power supply plane through vias,
and 0.01µF bypass capacitors should be used for each pin. Figure
1 illustrates this for a generic VCC pin and also shows that VCCA
requires that an additional 10Ω resistor along with a 10µF bypass
capacitor be connected to the VCCA pin.
3.3V
VCC
.01µF
10Ω
.01µF
10µF
VCCA
Figure 1. Power Supply Filtering
Crystal Input Interface
The ICS843SDN has been characterized with 18pF parallel
resonant crystals. The capacitor values, C1 and C2, shown in
Figure 2 below were determined using a 25MHz, 18pF parallel
resonant crystal and were chosen to minimize the ppm error. The
optimum C1 and C2 values can be slightly adjusted for different
board layouts.
XTAL_IN
C1
27p
X1
18pF Parallel Crystal
XTAL_OUT
C2
27p
Figure 2. Crystal Input Interface
IDT™ / ICS™ 3.3V LVPECL CLOCK GENERATOR
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FEMTOCLOCK™CRYSTAL-TO-3.3V LVPECL CLOCK GENERATOR
LVCMOS to XTAL Interface
The XTAL_IN input can accept a single-ended LVCMOS signal
through an AC coupling capacitor. A general interface diagram is
shown in Figure 3. The XTAL_OUT pin can be left floating. The
input edge rate can be as slow as 10ns. For LVCMOS signals, it is
recommended that the amplitude be reduced from full swing to half
swing in order to prevent signal interference with the power rail and
to reduce noise. This configuration requires that the output
VCC
impedance of the driver (Ro) plus the series resistance (Rs) equals
the transmission line impedance. In addition, matched termination
at the crystal input will attenuate the signal in half. This can be
done in one of two ways. First, R1 and R2 in parallel should equal
the transmission line impedance. For most 50Ω applications, R1
and R2 can be 100Ω. This can also be accomplished by removing
R1 and making R2 50Ω.
VCC
R1
Ro
0.1µf
50Ω
Rs
XTAL_IN
R2
Zo = Ro + Rs
XTAL_OUT
Figure 3. General Diagram for LVCMOS Driver to XTAL Input Interface
Termination for 3.3V LVPECL Outputs
The clock layout topology shown below is a typical termination for
LVPECL outputs. The two different layouts mentioned are
recommended only as guidelines.
transmission lines. Matched impedance techniques should be
used to maximize operating frequency and minimize signal
distortion. Figures 4A and 4B show two different layouts which are
recommended only as guidelines. Other suitable clock layouts may
exist and it would be recommended that the board designers
simulate to guarantee compatibility across all printed circuit and
clock component process variations.
FOUT and nFOUT are low impedance follower outputs that
generate ECL/LVPECL compatible outputs. Therefore, terminating
resistors (DC current path to ground) or current sources must be
used for functionality. These outputs are designed to drive 50Ω
3.3V
Zo = 50Ω
125Ω
FOUT
FIN
125Ω
Zo = 50Ω
Zo = 50Ω
FOUT
50Ω
1
RTT =
Z
((VOH + VOL) / (VCC – 2)) – 2 o
FIN
50Ω
Zo = 50Ω
VCC - 2V
RTT
84Ω
Figure 4A. 3.3V LVPECL Output Termination
IDT™ / ICS™ 3.3V LVPECL CLOCK GENERATOR
84Ω
Figure 4B. 3.3V LVPECL Output Termination
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FEMTOCLOCK™CRYSTAL-TO-3.3V LVPECL CLOCK GENERATOR
Schematic Example
Figure 5A shows an example of the ICS843SDN application
schematic. In this example, the device is operated at VCC = 3.3V.
The 18pF parallel resonant crystal is used. The C1 = 27pF and C2
= 27pF are recommended for frequency accuracy. For a different
board layout, the C1 and C2 values may be slightly adjusted for
optimizing frequency accuracy. Two examples of LVPECL
terminations are shown in this schematic. Additional approaches
are shown in the LVPECL Termination Application Note.
VCC
VCC
VCCA
R1
10
C4
10uF
VCC
C5
0.01u
U1
XTAL_OUT
XTAL_IN
1
2
3
4
VCCA
VEE
XTAL_OUT
XTAL_IN
VCC
Q
nQ
nc
3.3V
C3
0.01u
8
7
6
5
Q
nQ
Zo = 50 Ohm
R2
133
R3
133
+
Zo = 50 Ohm
-
VCC=3.3V
25MHz
R4
82.5
R5
82.5
F
p
8
1
C2
27pF
X1
C1
27pF
Zo = 50 Ohm
+
Zo = 50 Ohm
R6
50
Optional
Y-Termination
R7
50
R8
50
Figure 5A. ICS843SDN Schematic Example
IDT™ / ICS™ 3.3V LVPECL CLOCK GENERATOR
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FEMTOCLOCK™CRYSTAL-TO-3.3V LVPECL CLOCK GENERATOR
Schematic Example
Figure 5B shows an example of ICS843SDN P.C. board layout. The
crystal X1 footprint shown in this example allows installation of
either surface mount HC49S or through-hole HC49 package. The
footprints of other components in this example are listed in the
Table 6 There should be at least one decoupling capacitor per
power pin. The decoupling capacitors should be located as close
as possible to the power pins. The layout assumes that the board
has clean analog power ground plane.
Table 6. Footprint Table
Reference
Size
C1, C2
0402
C3
0805
C4, C5
0603
R2
0603
NOTE: Table 6 lists component sizes
shown in this layout example.
Figure 5B. ICS843SDN PC Board Layout Example
IDT™ / ICS™ 3.3V LVPECL CLOCK GENERATOR
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FEMTOCLOCK™CRYSTAL-TO-3.3V LVPECL CLOCK GENERATOR
Power Considerations
This section provides information on power dissipation and junction temperature for the ICS843SDN.
Equations and example calculations are also provided.
1.
Power Dissipation.
The total power dissipation for the ICS843SDN is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for VCC = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
•
Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 83mA = 287.60mW
•
Power (outputs)MAX = 30mW/Loaded Output pair
Total Power_MAX (3.3V, with all outputs switching) = 287.60mW + 30mW = 317.60mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the device.
The maximum recommended junction temperature for HiPerClockS devices is 125°C.
The equation for Tj is as follows: Tj = θJA * Pd_total + TA
Tj = Junction Temperature
θJA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θJA must be used. Assuming no air flow
and a multi-layer board, the appropriate value is 129.5°C/W per Table 7 below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 0.318W * 129.5°C/W = 111.2°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type
of board (multi-layer).
Table 7. Thermal Resistance θJA for 8 Lead TSSOP, Forced Convection
θJA by Velocity
Meters per Second
Multi-Layer PCB, JEDEC Standard Test Boards
IDT™ / ICS™ 3.3V LVPECL CLOCK GENERATOR
0
1
2.5
129.5°C/W
125.5°C/W
123.5°C/W
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FEMTOCLOCK™CRYSTAL-TO-3.3V LVPECL CLOCK GENERATOR
3. Calculations and Equations.
The purpose of this section is to derive the power dissipated into the load.
LVPECL output driver circuit and termination are shown in Figure 6.
VCC
Q1
VOUT
RL
50Ω
VCC - 2V
Figure 6. LVPECL Driver Circuit and Termination
To calculate worst case power dissipation into the load, use the following equations which assume a 50Ω load, and a termination voltage
of VCC – 2V.
•
For logic high, VOUT = VOH_MAX = VCC_MAX – 0.9V
(VCC_MAX – VOH_MAX) = 0.9V
•
For logic low, VOUT = VOL_MAX = VCC_MAX – 1.7V
(VCC_MAX – VOL_MAX) = 1.7V
Pd_H is power dissipation when the output drives high.
Pd_L is the power dissipation when the output drives low.
Pd_H = [(VOH_MAX – (VCC_MAX – 2V))/RL] * (VCC_MAX – VOH_MAX) = [(2V – (VCC_MAX – VOH_MAX))/RL] * (VCC_MAX – VOH_MAX) =
[(2V – 0.9V)/50Ω] * 0.9V = 19.8mW
Pd_L = [(VOL_MAX – (VCC_MAX – 2V))/RL] * (VCC_MAX – VOL_MAX) = [(2V – (VCC_MAX – VOL_MAX))/RL] * (VCC_MAX – VOL_MAX) =
[(2V – 1.7V)/50Ω] * 1.7V = 10.2mW
Total Power Dissipation per output pair = Pd_H + Pd_L = 30mW
IDT™ / ICS™ 3.3V LVPECL CLOCK GENERATOR
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FEMTOCLOCK™CRYSTAL-TO-3.3V LVPECL CLOCK GENERATOR
Reliability Information
Table 8. θJA vs. Air Flow Table for a 8 Lead TSSOP
θJA vs. Air Flow
Meters per Second
Multi-Layer PCB, JEDEC Standard Test Boards
0
1
2.5
129.5°C/W
125.5°C/W
123.5°C/W
Transistor Count
The transistor count for ICS843SDN is: 2395
Package Outline and Package Dimensions
Package Outline - G Suffix for 8 Lead TSSOP
Table 9. Package Dimensions
All Dimensions in Millimeters
Symbol
Minimum
Maximum
N
8
A
1.20
A1
0.05
0.15
A2
0.80
1.05
b
0.19
0.30
c
0.09
0.20
D
2.90
3.10
E
6.40 Basic
E1
4.30
4.50
e
0.65 Basic
L
0.45
0.75
α
0°
8°
aaa
0.10
Reference Document: JEDEC Publication 95, MO-153
IDT™ / ICS™ 3.3V LVPECL CLOCK GENERATOR
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FEMTOCLOCK™CRYSTAL-TO-3.3V LVPECL CLOCK GENERATOR
Ordering Information
Table 10. Ordering Information
Part/Order Number
843SDNAGLF
843SDNAGLFT
Marking
SDNAL
SDNAL
Package
“Lead-Free” 8 Lead TSSOP
“Lead-Free” 8 Lead TSSOP
Shipping Packaging
Tube
2500 Tape & Reel
Temperature
0°C to 70°C
0°C to 70°C
NOTE: Parts that are ordered with an LF suffix to the part number are the Pb-Free configuration and are RoHS compliant.
While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes no responsibility for either its use or for
the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use
in normal commercial applications. Any other applications, such as those requiring extended temperature ranges, high reliability or other extraordinary environmental requirements
are not recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any
IDT product for use in life support devices or critical medical instruments.
IDT™ / ICS™ 3.3V LVPECL CLOCK GENERATOR
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FEMTOCLOCK™CRYSTAL-TO-3.3V LVPECL CLOCK GENERATOR
Contact Information:
www.IDT.com
www.IDT.com
Sales
Technical Support
800-345-7015 (inside USA)
+408-284-8200 (outside USA)
Fax: 408-284-2775
www.IDT.com/go/contactIDT
[email protected]
+480-763-2056
Corporate Headquarters
Integrated Device Technology, Inc.
6024 Silver Creek Valley Road
San Jose, CA 95138
United States
800-345-7015 (inside USA)
+408-284-8200 (outside USA)
© 2009 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. IDT and the IDT logo are trademarks of Integrated Device
Technology, Inc. Accelerated Thinking is a service mark of Integrated Device Technology, Inc. All other brands, product names and marks are or may be trademarks or registered
trademarks used to identify products or services of their respective owners.
Printed in USA